Claims
- 1. A method of producing shaped drying filters which comprises forming a mixture consisting essentially of particles of silica gel and from 5 to 8 percent by weight based on the weight of the gel of a heat curable powder epoxy resin composition having a particle size of less than 70 microns and having a cure temperature of at least about 180.degree.C. and selected from the group consisting of:
- a. a powdered mixture comprising, as the epoxy resin component, a mixture of i) a solid condensate of epichlorohydrin and bisphenol A, and having an epoxy functionality of at least 1, a molecular weight of from about 900 to 10,000 and a softening point in the range of about 60.degree.-140.degree.C., and ii) a solid condensate of epichlorohydrin and a phenol-formaldehyde resin containing active --OH groups, and having an epoxy functionality of about 3-7, a molecular weight of about 500 to 1500 and a softening point in the range of about 300 to 120.degree.C.; and, as a hardener therefor, a solid anhydride or polyanhydride having a melting point about about 50.degree.C., and
- b. a powdered mixture comprising, as the epoxy resin component, a solid condensate of epichlorohydrin or glycerol dichlorohydrin with a dihydric phenol such as resorcinol or bisphenol A, and having an epoxy functionality of at least 1, a molecular weight in the range of about 65.degree.-130.degree.C.; and, as a hardener therefor, a solid condensate of trimellitic anhydride and a dihydric alcohol selected from the group consisting of diethylene to pentaethylene glycols, di- and tri-propylene glycol and C.sub.5 -C.sub.8 alkane 2.omega. diols; the mixture being formed at a first temperature below the cure temperature of the resin, compressing the mixture to form a shaped body, and heating the compressed mixture to said cure temperature to cure the said resin.
- 2. A process according to claim 1, wherein the powdered epoxy resin particles are given an electrostatic charge effective to cause the particles to adhere to the surface of the silica gel.
- 3. A process according to claim 2, wherein the electostatic charge is generated on said particles by frictional engagement with the silica gel particles during mixing.
- 4. A process according to claim 1, wherein the powdered epoxy resin particles have a particle size in the range 4-20 microns.
- 5. A process according to claim 1, wherein the silica gel is mixed with 65 percent by weight of the powdered epoxy resin composition, based on the weight of the silica gel.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2232533 |
Jul 1972 |
DT |
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Parent Case Info
This is a continuation application of abandoned patent application Ser. No. 373,017, filed June 25, 1973.
US Referenced Citations (4)
Non-Patent Literature Citations (1)
Entry |
Lee et al., Handbook of Epoxy Resins, McGraw-Hill Book Co., 1967, pp. 20-21. |
Continuations (1)
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Number |
Date |
Country |
Parent |
373017 |
Jun 1973 |
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