Claims
- 1. A method of producing a semiconductor laser device comprising:
- successively growing on a first conductivity type semiconductor substrate a first conductivity type cladding layer having a refractive index, an active layer having an energy band gap, a second conductivity type barrier layer having a larger energy band gap than that of said active layer, and a second conductivity type absorption layer having an energy band gap no larger than that of said active layer;
- producing an etching mask having a periodic stripe pattern along a cavity length direction on said absorption layer;
- etching and removing said absorption layer using said etching mask to produce grooves in said absorption layer;
- selectively growing a refractive index matching layer having a larger energy band gap than that of said active layer and a higher refractive index than that of said cladding layer, burying said grooves using said etching mask as a selective growth mask; and
- removing said mask and growing a second conductivity type cladding layer on said absorption layer and refractive index matching layer.
- 2. A method of producing a semiconductor laser device as defined in claim 3 comprising:
- successively growing p type InP as said first conductivity type cladding layer, In.sub.x Ga.sub.1-x As.sub.y P.sub.1-y as said active layer, n type InP as said barrier layer, and In.sub.x Ga.sub.1-x As.sub.y P.sub.1-y as said absorption layer on p type InP as said substrate;
- selectively growing In.sub.m Ga.sub.1-m As.sub.n P.sub.1-n , where x<m and y>n, as said refractive index matching layer; and
- growing n type InP as said second conductivity type cladding layer.
- 3. A method of producing a semiconductor laser device comprising:
- successively growing on a first conductivity type semiconductor substrate a first conductivity type cladding layer having a refractive index, an active layer having an energy band gap, a second conductivity type barrier layer having a larger energy band gap than that of said active layer, and a second conductivity type absorption layer having an energy band gap no larger than that of said active layer;
- producing an etching mask having a periodic stripe pattern along a cavity length direction on said absorption layer;
- etching and removing said absorption layer using said etching mask to produce grooves in said absorption layer penetrating said absorption layer and partially extending into said barrier layer to produce grooves in said absorption layer and said barrier layer; and
- removing said mask and growing a refractive index matching layer having a larger energy band gap than that of said active layer and a higher refractive index than that of said cladding layer, burying said grooves; and
- growing a second conductivity type cladding layer on said refractive index matching layer.
- 4. A method of producing a semiconductor laser device as defined in claim 3 comprising:
- successively growing op type InP as said first conductivity type cladding layer, In.sub.x Ga.sub.1-x As.sub.y P.sub.1-y as said active layer, n type InP as said barrier layer, In.sub.x Ga.sub.1-x As.sub.y P.sub.1-y as said absorption layer on p type InP as said substrate;
- growing In.sub.m Ga.sub.1-m As.sub.n P.sub.1-n, where x-m and y>n, as said refractive index matching layer; and
- growing n type InP as said second conductivity type cladding layer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-170469 |
Jun 1989 |
JPX |
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Parent Case Info
This application is a division of application Ser. No. 07/510,839, filed Apr. 18, 1990, now U.S. Pat. No. 5,093,835.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0173786 |
Jul 1987 |
JPX |
Non-Patent Literature Citations (1)
Entry |
"Proposal and Fabrication of a Gain-Coupled DFB Laser Diode", Japanese Association of Applied Physics, Autumn 1988, p. 834. |
Divisions (1)
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Number |
Date |
Country |
Parent |
510839 |
Apr 1990 |
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