Patent Application
20170107145
The present invention relates to a method of producing an optical fiber using an ultraviolet curable resin, and an apparatus of producing the optical fiber.
An optical fiber is, generally, produced by coating of a resin on a surface of a bare optical fiber drawn from a preform (which is also referred to as an optical fiber preform). A coating is formed by: first, applying an ultraviolet curable resin onto an outer circumference of the bare optical fiber (which is also referred to as an optical fiber bare wire); and then irradiating the ultraviolet curable resin with ultraviolet light (UV light) to cure the ultraviolet curable resin. Moreover, the optical fiber on which the coating is formed is once wound around a bobbin, and there may be the cases of forming another further coating of the resin on the surface thereof. As a light source of UV light in a curing device for an optical fiber coating, use may be made of: a high pressure mercury lamp or a metal halide lamp, being an electrode lamp; or an H valve, a D valve, or the like, being a no-electrode lamp (an electrodeless lamp), or the like (hereinafter, described as a high pressure mercury lamp or the like).
Recently, in order to reduce power consumption in curing, attempts have been made on using, as the light source of UV light, an ultraviolet semiconductor light emitting element, such as an ultraviolet laser diode (UV-LD) or an ultraviolet light emitting diode (UV-LED) as the light source, in place of the conventional high pressure mercury lamp or the like.
For example, Patent Literature 1 discloses an ultraviolet irradiation device having: inside an ultraviolet irradiation unit, a light guide from a side of which can emit ultraviolet light; and a semiconductor light emitting element being an ultraviolet light source. According to this device, the ultraviolet light introduced into the light guide can emit the ultraviolet light from the side of the light guide in a linear shape. Thus, it is described that a sufficient accumulated-quantity of light can be obtained even when using a small number of ultraviolet light sources, and that curability of a coating resin and a device life can be improved.
Moreover, Patent Literature 2 discloses a method in which, when a semiconductor light emitting element having a single wavelength, in comparison with a high pressure mercury lamp or the like, which has a wide wavelength region, is used as a light source for curing a resin, curability of an optical fiber coating is improved, by using a material prepared by containing, into an ultraviolet curable resin composition, a photopolymerization initiator having an absorption region in a wavelength of light emitted from the semiconductor light emitting element.
However, when curing is made with a semiconductor light emitting element by using a resin composition containing a photopolymerization initiator or the like adapted for a wavelength of light emitted from the semiconductor light emitting element, it has been found to be difficult to achieve an elastic modulus (Young's modulus) with the same level, by curing an ultraviolet curable resin to the same level when using a high pressure mercury lamp or the like.
Thus, the present invention is contemplated for overcoming the above-described problems; and providing a method of producing an optical fiber according to which an optical fiber having a coating resin with a high elastic modulus can be obtained by using the semiconductor light emitting element as a light source for curing the resin. Moreover, the present invention is contemplated for providing an apparatus of producing the optical fiber for obtaining such an optical fiber.
That is, the present invention provides the following means:
(a) a resin application step of applying an ultraviolet curable resin, onto an outer circumference of an optical fiber;
(b) a heating step of heating the ultraviolet curable resin; and
(c) a light irradiation step of irradiating the ultraviolet curable resin with ultraviolet light emitted from a semiconductor light emitting element, in a state in which the ultraviolet curable resin is heated, to cure the ultraviolet curable resin into a coating resin.
(a) a resin applicator for applying an ultraviolet curable resin, onto an outer circumference of an optical fiber;
(b) a heater for heating the ultraviolet curable resin; and
(c) a light irradiator comprising one or a plurality of semiconductor light emitting elements, wherein the heated ultraviolet curable resin is irradiated with ultraviolet light emitted from the semiconductor light emitting element, to cure the ultraviolet curable resin into a coating resin.
In addition, the above-described expression “applying an (the) ultraviolet curable resin, onto an (the) outer circumference of an (the) optical fiber” includes both of a case where the ultraviolet curable resin is directly applied onto the outer circumference of an optical fiber bare wire, and a case where the ultraviolet curable resin is further applied onto the outer circumference of the optical fiber onto which the ultraviolet curable resin has been applied.
According to the method of producing an optical fiber of the present invention, an optical fiber having a coating resin with a high elastic modulus can be obtained by satisfactorily curing an ultraviolet curable resin in a manner similar to a case where the conventional high pressure mercury lamp or the like is used, even when a semiconductor light emitting element is used as a light source for curing the resin.
Other and further features and advantages of the invention will appear more fully from the following description, appropriately referring to the accompanying drawings.
Preferable embodiments of the method of producing an optical fiber and the apparatus of producing the optical fiber of the present invention are explained in detail, referring to the drawings.
First, explanation is made on an embodiment of an optical fiber produced by the method of producing an optical fiber according to the present invention.
The optical fiber bare wire 11 has: a core positioned in the center, to guide light; and a cladding surrounding the core. Moreover, the optical fiber bare wire 11 is formed of quartz-based glass, for example, and to the core, Ge (germanium), P (phosphorus) or the like may be added in order to increase a refractive index; and to the cladding, B (boron), F (fluorine) or the like may be added in order to decrease the refractive index.
A diameter of the optical fiber bare wire 11 is ordinarily 100 to 150 μm, and generally 124 to 126 μm. A thickness of the primary layer 12 is ordinarily 10 to 50 μm, and a thickness of the secondary layer 13 is ordinarily 10 to 50 μm. Moreover, a diameter of the optical fiber (an outer diameter of the secondary layer 13) is ordinarily 245 μm to 255 μm.
In order to hold characteristics and functions of the optical fiber, the primary layer 12 has a Young's modulus of preferably 0.2 MPa or more and 3 MPa or less, and more preferably 0.3 MPa or more and 2 MPa or less. The secondary layer 13 has a Young's modulus of preferably 500 MPa or more, more preferably 500 MPa or more and 2,000 MPa or less, and further preferably 800 MPa or more and 1,500 MPa or less.
Hereinafter, an ultraviolet curable resin is explained in more detail.
As the ultraviolet curable resin to be used as the coating resin of the optical fiber, use may be made, for example, of: an ultraviolet curable resin having at least two ethylenically unsaturated groups which are polymerized and cured with ultraviolet light; and use may be preferably made of: an oligomer.
The ultraviolet curable resin may contain, in addition to the oligomer, a dilution monomer, a photopolymerization initiator, a photosensitizer, a silane coupling agent, a chain transfer agent, and any of various additives. As the dilution monomer, use may be made of: monofunctional (meth)acrylate or polyfunctional (meth)acrylate. The dilution monomer means a monomer for diluting the ultraviolet curable resin.
Herein, the term “oligomer” means a polymer whose polymerization degree is 2 to 100.
As the oligomer, use may be made of: urethane (meth)acrylate, such as polyether-based urethane (meth)acrylate and polyester-based urethane (meth)acrylate, epoxy (meth)acrylate, or polyester (meth)acrylate. These may be used singly or in combination of two or more kinds thereof.
The polyether-based urethane (meth)acrylate means a compound having a polyether segment, (meth)acrylate, and a urethane bond, such as a reaction product among: a polyol having a polyether skeleton, an organic polyisocyanate compound, and a hydroxyalkyl (meth)acrylate. Moreover, the polyester-based urethane (meth)acrylate means a compound having a polyester segment, a (meth)acrylate, and a urethane bond, such as a reaction product among: a polyol having a polyester skeleton, an organic polyisocyanate compound, and a hydroxyalkyl (meth)acrylate.
In the present invention, the urethane (meth)acrylate is preferable. Flexibility and hardness are readily adjusted by using the urethane (meth)acrylate, and both of moderate flexibility and hardness can be satisfied.
In this specification, the term “(meth)acrylate” includes each of acrylate and methacrylate.
As the monofunctional (meth)acrylate or polyfunctional (meth)acrylate as the dilution monomer, the followings can be exemplified. Specific examples include di(meth)acrylate, such as butanediol di(meth)acrylate, hexanediol di(meth)acrylate, ethoxylated hexanediol di(meth)acrylate, propoxylated hexanediol di(meth)acrylate, diethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, ethoxylated neopentyl glycol di(meth)acrylate, and hydroxy pivalic acid neopentyl glycol di(meth)acrylate;
the mono(meth)acrylate, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, glycidyl (meth)acrylate, acryloyl morpholine, N-vinylpyrrolidone, tetrahydrofurfuryl acrylate, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isobornyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, benzyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, ethylcarbitol (meth)acrylate, phosphoric acid (meth)acrylate, ethyleneoxide-modified phosphoric acid (meth)acrylate, phenoxy (meth)acrylate, ethyleneoxide-modified phenoxy (meth)acrylate, propyleneoxide-modified phenoxy (meth)acrylate, nonylphenol (meth)acrylate, ethyleneoxide-modified nonylphenol (meth)acrylate, propyleneoxide-modified nonylphenol (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, 2-(meth)acryloyloxyethyl-2-hydroxypropyl phthalate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-(meth)acryloyloxyethyl hydrogen phthalate, 2-(meth)acryloyloxypropyl hydrogen phthalate, 2-(meth)acryloyloxypropyl hexahydro hydrogen phthalate, 2-(meth)acryloyloxypropyl tetrahydro hydrogen phthalate, dimethylaminoethyl (meth)acrylate, trifluoroethyl (meth)acrylate, tetrafluoropropyl (meth)acrylate, hexafluoropropyl (meth)acrylate, octafluoropropyl (meth)acrylate, and adamantyl mono(meth)acrylate;
the tri(meth)acrylate, such as trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, tris-2-hydroxyethyl isocyanurate tri(meth)acrylate, and glycerol tri(meth)acrylate; and
the polyfunctional (meth)acrylate being tetrafunctional or more functional (meth)acrylate, such as pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ditrimethylolpropane penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and ditrimethylolpropane hexa(meth)acrylate; and the polyfunctional (meth)acrylate in which part of the above-described (meth)acrylate is replaced by an alkyl group or ε-caprolactone.
The dilution monomer may be used singly or in combination of two or more kinds thereof. In consideration of abrasion resistance of the coating film obtained, an amount of use of the dilution monomer is preferably 100 parts by mass or less, and preferably 10 to 70 parts by mass, based on 100 parts by mass of the oligomer.
A radical photopolymerization initiator adapted for a wavelength region of ultraviolet light emitted from the semiconductor light emitting element may be added thereto. As one example, when the wavelength region of light emitted from a light source of the semiconductor light emitting element is 350 to 405 nm, any of various materials can be used, if such a material is a photopolymerization initiator which has ultraviolet absorption in this wavelength region and may preferably cure the ultraviolet curable resin composition.
Moreover, a radical photopolymerization initiator similar to the initiator when the resin is cured with the conventional high pressure mercury lamp or the like, may be added thereto. In such a case, absorption of ultraviolet light becomes significantly small in the wavelength region of light emitted from the light source of the semiconductor light emitting element. At this time, the ultraviolet curable resin can be sufficiently cured, by heating the ultraviolet curable resin.
Specific examples thereof include, in the form of an α-amino ketone-type, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butane-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, and N,N-dimethylaminoacetophenone. Specific examples of commercially available products include Irgacure 907, Irgacure 369, Irgacure 379, and Irgacure 389 (trade names, manufactured by BASF SE). In addition, “Irgacure” is a registered trademark of BASF SE.
Specific examples of commercially available products include, in the form of an α-hydroxyalkylphenone-type, Irgacure 184, Irgacure 2959, and Irgacure 127 (trade names, manufactured by BASF SE).
Specific examples thereof include, in the form of an acylphosphine oxide-type, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide. Specific examples of commercially available products include Irgacure 819, Lucirin TPO, Lucirin TPO-L, Irgacure 2100, Darocur 4265, and Irgacure 2022 (trade names, manufactured by BASF SE).
Specific examples thereof include, in the form of an O-acyloxime-type, 1-[4-(phenylthio)phenyl]-1,2-octanedione-2-(O-benzoyloxime), and ethanone,1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyloxime). Specific examples of commercially available products include Irgacure OXE01, and Irgacure OXE02 (trade names, manufactured by BASF SE).
In the present invention, any of these photopolymerization Initiators may be used singly or in combination of two or more kinds thereof, and in such a case, a combination of an α-hydroxyalkylphenone-type and an acylphosphine oxide-type or an O-acyloxime-type is preferable.
In consideration of coating conditions of the ultraviolet curable resin, physical properties thereof after curing, or the like, an amount of blending the above-described photopolymerization initiator is preferably 0.01 to 30 parts by mass, more preferably 0.01 to 20 parts by mass, and further preferably 0.01 to 10 parts by mass, based on 100 parts by mass of the ultraviolet curable resin to be applied.
In order to provide the layer with adhesion onto a glass optical fiber, the silane coupling agent is mainly added to the primary layer. Specific examples of the silane coupling agents include mercaptopropyltrimethoxysilane, methacryloxytrimethoxysilane, methacryloxypropyltrimethoxysilane, and aminopropyltriethoxysilane. Moreover, these silane coupling agents may be used in combination therewith.
Moreover, the photosensitizer may be used in combination with the radical photopolymerization initiator to be used with the conventional high pressure mercury lamp. Photosensitivity can be imparted to the layer, by combining the photosensitizer with the photopolymerization initiator, in the wavelength region in which the photopolymerization initiator has no absorption. Specific examples of the photosensitizers which may react to the light source of the semiconductor light emitting element in 350 nm to 405 nm include, among thioxanthone-based compounds, thioxanthone, 2,4-diethylthioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, and 1-chloro-4-propoxythioxanthone. Moreover, specific examples thereof include, among amine-based compounds, 4,4′-dimethylaminobenzophenone, and 4,4′-diethylaminobenzophenone.
An amount of blending the photosensitizer is preferably in a proportion of 0.01 to 20 parts by mass, and more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the ultraviolet curable resin. A sufficient sensitization effect and photocurability can be obtained, by adjusting the proportion to 0.01 to 20 parts by mass.
In order to improve sensitivity, any of N-phenylglycines, phenoxyacetic acids, thiophenoxyacetic acids, mercaptothiazole or the like can be used as the chain transfer agent. Specific examples of the chain transfer agents include mercaptosuccinic acid, mercaptoacetic acid, mercaptopropionic acid, methionine, cysteine, thiosalicylic acid, and a derivative thereof. These chain transfer agents may be used singly or in combination of two or more kinds thereof.
An amount of addition of the chain transfer agent is preferably in the range of 0.01 to 10 mass %, from a viewpoint of reducing sensitivity fluctuations, more preferably 0.1 to 10 mass %, and particularly preferably 0.5 to 5 mass %, based on total solids including the ultraviolet curable resin.
The ultraviolet curable resin may contain, when necessary, a leveling agent, a defoaming agent, and any of various additives for the purpose of antisagging or the like. Moreover, as a coloring agent, a pigment, a dye, a coloring matter or the like is preferably used.
A method of producing the optical fiber according to the present invention has: (a) a resin application step of applying the ultraviolet curable resin, onto the outer circumference of the optical fiber; (b) a heating step of heating the ultraviolet curable resin; and (c) a light irradiation step of irradiating the ultraviolet curable resin with ultraviolet light emitted from the semiconductor light emitting element, in a state in which the ultraviolet curable resin is heated, to cure the ultraviolet curable resin into the coating resin.
In the heating step (b), the ultraviolet curable resin only needs to be heated in ultraviolet irradiation, and the heating step (b) is provided in the resin application step (a) of applying the ultraviolet curable resin or the light irradiation step (c). For example, the resin application step (a), the heating step (b), and the light irradiation step (c) may be provided in this order. Moreover, all or part of the resin application step (a), the heating step (b), and the light irradiation step (c) may be repeated. Moreover, the resin application step (a) and the heating step (b) may be simultaneously performed. Furthermore, the heating step (b) and the light irradiation step (c) may be simultaneously performed.
When the resin application step (a) and the heating step (b) are simultaneously performed, for example, a die, from which the resin is output, is heated by a heater or the like provided around the die.
When the heating step (b) and the light irradiation step (c) are simultaneously performed, for example, an inside of a cylindrical body, which is provided in the light irradiator, and through which the optical fiber after the optical fiber is coated with the ultraviolet curable resin, is heated by the heater or the like.
As the heater or the like, a well-known heater can be used, such as a tape heater, a ribbon heater, a rubber heater, an oven heater, a ceramic heater, an infrared irradiation unit, an ultraviolet irradiation unit, a heating wire heater, a carbon heater, and a halogen heater.
Next, the heating temperature in the heating step (b) is explained in more detail.
When the ultraviolet curable resin is cured by using the conventional high pressure mercury lamp or the like, the coating resin having a desired elastic modulus can be obtained by performing ultraviolet irradiation in a required quantity. However, it has been found that, when the semiconductor light emitting element is used in place of the high pressure mercury lamp or the like, the desired elastic modulus cannot be obtained even by performing ultraviolet irradiation in the required quantity. In this regard, improvement is seen by adding, to the ultraviolet curable resin, the radical photopolymerization initiator adapted for the wavelength region of ultraviolet light emitted from the semiconductor light emitting element. However, even if such a photopolymerization initiator is used, Young's modulus cannot be sufficiently improved to a level same with the level when using the high pressure mercury lamp or the like.
When the inventors of the present invention have continued to conduct studies on that cause in various manners, the inventors obtained the following findings, and completed the present invention. That is, upon curing the ultraviolet curable resin by using the high pressure mercury lamp or the like, the ultraviolet curable resin is heated by radiant heat or the like to 130° C. or higher, which is higher than a glass transition temperature (Tg). On the other hand, upon using the semiconductor light emitting element in place of the high pressure mercury lamp or the like, the ultraviolet curable resin is hardly heated only to a degree of 30° C. to 50° C., which is assumed to have an influence on the results in which no desired elastic modulus is obtained.
In the present invention, upon performing ultraviolet irradiation by the semiconductor light emitting element, action of accelerating curing of the ultraviolet curable resin is utilized by heating the ultraviolet curable resin. Thus, even if the semiconductor light emitting element is used as the light source for curing the resin, it has been enabled to obtain an objective optical fiber having the coating resin with a sufficiently high elastic modulus.
A heating temperature of the ultraviolet curable resin herein is preferably equal to or higher than a temperature Tx mentioned later, and more preferably equal to or higher than the glass transition temperature Tg. An upper limit of the heating temperature is not particularly limited, but realistically from the viewpoints of consumption energy saving and prevention of volatilization of a low-molecular-weight component in the ultraviolet curable resin, the upper limit is preferably equal to or lower than a temperature higher by 40° C. than the glass transition temperature (Tg).
Herein, a way of determining the temperature Tx is described with reference to
tan δ is obtained from the storage elastic modulus E′ and loss elastic modulus E″ obtained by the measurements. tan δ is obtained by the following formula.
tan δ=(loss elastic modulus E″)/(storage elastic modulus E′)
Next, a temperature at a maximal point of tan δ is read from the measurement results. This value corresponds to the glass transition temperature (Tg) of the ultraviolet curable resin, and is the glass transition temperature (Tg) in the present invention.
Moreover, in a storage modulus E′ curve (A) obtained from the measurement results, such a temperature is taken as Tx, the temperature corresponding to a point of intersection, in a region of temperature equal to or lower than the glass transition temperature (Tg), between a tangent line (L1) in which an absolute value of an inclination relative to the curve is minimized, and a tangent line (L2) in which the absolute value of the inclination relative to the curve is maximized.
In addition, a reason why the ultraviolet curable resin is preferably heated to a level equal to or higher than the temperature Tx, and more preferably to a level equal to or higher than the glass transition temperature Tg, is considered as described below.
In the ultraviolet curable resin, polymerization progresses by ultraviolet irradiation. The resin has a low glass transition temperature Tg′ in a liquid state, and accordingly as the polymerization progresses by ultraviolet irradiation, a network structure of molecular chains is formed in the resin, and an elastic modulus is increased. When curing is finally completed, the glass transition temperature reaches Tg higher than Tg′. After completion of the reaction, a rise of the glass transition temperature stops.
As known in comparison with
Thus, curability at the level same with the level when using the conventional high pressure mercury lamp or the like, cannot be obtained in curing by the light source of the semiconductor light emitting element only.
Herein, if the temperature reaches the level equal to or higher than the glass transition temperature, the network structure of molecular chains in the resin is loosened and progress of the crosslinking reaction is facilitated. Thus, the resin is heated to a level equal to or higher than TgLED being the temperature between Tg′ and Tg to be passed therethrough in polymerization, and preferably to a level equal to or higher than Tg. Thus, the network structure is loosened in the reaction and progress of the crosslinking reaction is facilitated. As a result, a resin cured product having a sufficiently high elastic modulus is obtained, in comparison with the case where the resin is cured by using the light source of the semiconductor light emitting element without such a heating.
In addition, the glass transition temperature TgLED of the coating resin cured by the light source of the semiconductor light emitting element is near Tx of the coating resin cured by the high pressure mercury lamp or the like, and thus Tx can be substituted for TgLED, and the resin is preferably heated to a level equal to or higher than Tx, and more preferably to a level equal to or higher than Tg.
In addition, in a resin having a higher elastic modulus, the network structure by a polymerization reaction is more rigid, Tg is higher, and an effect of heating is larger.
With the method of producing the optical fiber and the apparatus of producing the same according to the present invention, curing of the ultraviolet curable resin can be accelerated by supplementing a required heat by heating the ultraviolet curable resin. Further, even when the semiconductor light emitting element is used as the light source for curing the resin, it can be obtained for the optical fiber having the coating resin with the high elastic modulus.
Herein, an issue in which a desired elastic modulus cannot be obtained, is conspicuous in the case, for example, of the coating resin in which the desired elastic modulus is as high as 500 MPa. The coating resin, in which such a high elastic modulus is required, is, generally, in the secondary layer of the optical fiber, the colored layer provided on the outer circumference of the secondary layer, or the tape layer prepared by arranging a plurality of optical fibers in parallel and being coated in batch.
Young's modulus of the coating resin is adjusted by a chain length (molecular weight) of a polyether moiety or polyester moiety, or a kind or amount of addition of the dilution monomer, for example, in polyether-based urethane (meth)acrylate or polyester-based urethane (meth)acrylate. Specific examples of decreasing the Young's modulus include by: increasing the chain length of the polyether moiety or the polyester moiety; and adding a monomer having a linear soft segment. On the other hand, when the Young's modulus is increased, the Young's modulus can be increased by: decreasing the chain length of the polyester moiety or the polyether moiety; increasing a urethane group concentration; or selecting a monomer or a polyfunctional monomer, each having a rigid molecular structure, such as an aromatic ring.
The method of producing an optical fiber according to a first embodiment of the present invention is explained in detail, referring to the drawings.
The apparatus of producing the optical fiber according to this embodiment, shown in
The ultraviolet irradiation unit 26a is formed in which, for example, one or a plurality of semiconductor light emitting elements each having a peak wavelength from 300 nm to 405 nm is/are arranged. Moreover, the unit 26a may be formed into one light irradiator having a plurality of peak wavelengths by combining the plurality of semiconductor light emitting elements each having the peak wavelength from 300 nm to 405 nm. Moreover, a plurality of semiconductor light emitting elements each having the same peak wavelength may be arranged within an identical light irradiator, and a plurality of the light irradiators may be arranged. Irradiation energy is preferably 10 to 3,000 mJ/cm2, and more preferably 30 to 1,500 mJ/cm2. The semiconductor light emitting element is electrically connected to a controller (not shown), and output thereof is controlled. For example, a semiconductor laser, a light emitting diode or the like can be used as the semiconductor light emitting element.
As the temperature measuring instrument 31, for example, a thermoviewer can be used. A surface temperature of a substance is measured by the thermoviewer, but the coating of the optical fiber is sufficiently thin, as mentioned above, and thus the surface temperature is regarded as the temperature of the ultraviolet curable resin without any problems. Moreover, the optical fiber is running at a high speed, for example, 500 m/min or more in production, and thus a temperature immediately before being inserted into the ultraviolet irradiation unit is regarded to be the same with the heating temperature in light irradiation in the ultraviolet light irradiation unit without any problems.
The optical fiber preform 21 is composed, for example, of quartz-based glass, and is produced by a well-known method, such as a VAD method, an OVD method, and a CVD method. An end of the optical fiber preform 21 is heated by the heater 22 arranged around the optical fiber preform 21, melted and drawn, and the optical fiber bare wire 23 is drawn off. On the thus-drawn-off optical fiber bare wire 23, the primary layer and the secondary layer are coated in batch by the resin application device 24a positioned in a lower part. At this time, the ultraviolet curable resin is applied onto the outer circumference of the optical fiber bare wire 23, and simultaneously heated by heating the ultraviolet curable resin by the heater equipped in the resin coating device 24a. The ultraviolet curable resin immediately enters the ultraviolet irradiation unit 26a in a heated state, and the ultraviolet curable resin is cured by ultraviolet light emitted from the semiconductor light emitting element. Thus, the primary layer and the secondary layer, each being the coating resin, are formed.
A configuration of the resin coating device 24a and a coating method are specifically described herein.
The die unit 52 has an optical fiber introduction unit (not shown) for introducing an optical fiber bare wire 23; and the die holder 53 has an opening (not shown) being a circular hole coaxially connected with the optical fiber introduction unit, and a heater 53b as a heater. The resin suppliers 54 and 55 have: resin tanks 54a and 55a for storing a resin R1 being an ultraviolet curable resin for a primary layer and a resin R2 being an ultraviolet curable resin for a secondary layer; pumps 54b and 55b for delivering the resins R1 and R2 stored in the resin tanks 54a and 55a; and supply pipes 54c and 55c for supplying, to the die unit 52, the resins R1 and R2 delivered by the pumps 54b and 55b. The control unit 51 receives information on a temperature of the ultraviolet curable resin, the temperature being measured by the temperature measuring instrument 31, to control the heater 53b of the die holder 53 based thereon.
In the resin coating device 24a, the resin R1 for forming the primary layer on the optical fiber bare wire 23, and the resin R2 for forming the secondary layer thereon are applied as described below. First, the pumps 54b and 55b of the resin suppliers 54 and 55 deliver the resins R1 and R2 stored in the resin tanks 54a and 55a, and supply the resins R1 and R2 to the die unit 52 through the supply pipes 54c and 55c.
On the other hand, the optical fiber bare wire 23 is introduced from the optical fiber introduction unit of the die unit 52, and delivered from the opening of the die holder 53. As a result, the resins R1 and R2 are coated on the outer circumference of the optical fiber bare wire 23.
The control unit 51 herein receives the information on the temperature of the ultraviolet curable resin from the temperature measuring instrument 31, to control output of the heater 53b of the die holder 53, in such a manner that the resin R2 for the secondary layer, to be coated on the optical fiber bare wire 23, reaches a level equal to or higher than the temperature Tx as mentioned above, for example. Then, the control unit 51 controls the heater 53b to be a desired temperature in the temperature of the ultraviolet curable resin.
In this embodiment, the control unit 51 controls the heater 53b as described above. Thus, the resin R2 can be heated to the desired temperature. As a result, even when the semiconductor light emitting element is used as a light source for curing the resin, the ultraviolet curable resin is satisfactorily cured, and the optical fiber having the coating resin with the high elastic modulus can be obtained.
In addition, in this embodiment, the description is made on the method in which the information on the temperature of the ultraviolet curable resin is received from the temperature measuring instrument 31, to control the heater 53b of the die holder 53 based thereon. However, such a method may be applied: to a method in which the temperature of the ultraviolet curable resin is not measured in production, and past production data is stored, to control the temperature of the heater 53b based thereon; or to a method in which the heater 53b is kept at a predetermined temperature in which the temperature of the ultraviolet curable resin does not fall below the desired temperature in production. Moreover, the resin tanks 54a and 55a are more preferably heated, to preliminarily bring the temperature of the resins R1 and R2 to be supplied to the die unit 52 closer to the desired temperature.
Next, anther method of producing an optical fiber according to the first embodiment of the present invention is explained, referring to
A production apparatus according to this embodiment shown in
As shown in
In the followings, the method of producing an optical fiber of this embodiment is specifically explained.
Specifically, an end of an optical fiber preform 21 containing quartz glass as a main component is heated by a heater 22 arranged around the optical fiber preform 21, melted and drawn, and an optical fiber bare wire 23 is drawn off. On the thus-drawn-off optical fiber bare wire 23, the primary layer is coated by the resin application device 24b for the primary layer, and irradiated with ultraviolet light by the ultraviolet irradiation unit 26b for the primary layer. Then, the ultraviolet curable resin for the secondary layer is coated by the resin application device 24c for the secondary layer, and the resin of the secondary layer is cured by the ultraviolet irradiation unit 26c for the secondary layer. At this time, the ultraviolet curable resin is applied, by heating the resin application device 24c for the secondary layer, onto an outer circumference of an optical fiber 25 coated with the primary layer, and simultaneously heated. The optical fiber 25 coated with the secondary layer is immediately inserted into the ultraviolet irradiation unit 26c in a heated state, and the ultraviolet curable resin is cured by ultraviolet light emitted from the semiconductor light emitting element of the ultraviolet irradiation unit 26c. Thus, the secondary layer is coated.
A configuration of the resin application device 24c for the secondary layer and a coating method are specifically described herein.
In comparison with the resin supplier 24a in
In the resin application device 24c for the secondary layer, a resin R2 is applied onto the optical fiber 25 having coated with the primary layer as described below. First, as shown in
On the other hand, the optical fiber 25 having coated with the primary layer is introduced from an optical fiber introduction unit of the die unit 52, and delivered from an opening of the die holder 53. As a result, the resin R2 is coated on the outer circumference of the optical fiber 25 having coated with the primary layer.
The control unit 51 herein receives information on the temperature of the ultraviolet curable resin from the temperature measuring instrument 31, to control output of a heater 53b of the die holder 53, in such a manner that the resin R2 to be coated on the optical fiber 25 having coated with the primary layer reaches a level equal to or higher than the temperature Tx, as mentioned above, for example. Then, the control unit 51 controls the heater 53b so as to be desired temperature in the temperature of the ultraviolet curable resin.
In this embodiment, the control unit 51 controls the heater 53b as described above. Thus, the resin R2 can be coated on the optical fiber 25 having coated with the primary layer at the desired temperature. As a result, even when the semiconductor light emitting element is used as the light source for curing the resin, the ultraviolet curable resin is satisfactorily cured, and the optical fiber having the coating resin with the high elastic modulus can be obtained.
In addition, in this embodiment, the description is made on the method in which the information on the temperature of the ultraviolet curable resin is received from the temperature measuring instrument 31, to control the heater 53b of the die holder 53 based thereon. However, such a method may be applied: to a method in which the temperature of the ultraviolet curable resin is not measured in production, and past production data is stored, to control the temperature of the heater 53b based thereon; or to a method in which the heater 53b is kept at a predetermined temperature in which the temperature of the ultraviolet curable resin does not fall below the desired temperature in production. Moreover, the resin tank 55a is more preferably heated, to preliminarily bring the temperature of the resin R2 to be supplied to the die unit 52 closer to the desired temperature.
The first embodiment has an aspect in which the ultraviolet curable resin is applied and simultaneously heated, in the resin application device. Further, a tape heater, a ribbon heater or the like can be used as the heater 53b, to have an advantage of capability of readily heating the resin. Moreover, a temperature of the resin application device is adjusted in several cases, in order to suppress resin overflow or mixing of air bubbles from the resin application device, and in such a case, this embodiment can be realized only by changing temperature setting, without large modification of equipment.
Next, the method of producing an optical fiber according to a second embodiment of the present invention is explained in detail, referring to the drawings. In the first embodiment, the method is applied in which the ultraviolet curable resin is heated by heating the die of the resin application device, but this embodiment refers to a method in which an ultraviolet curable resin is heated in an ultraviolet irradiation unit.
As shown in
Moreover, the unit has heaters 69 in an upper end and a lower end of the cylindrical body 65.
Further, the apparatus of producing the optical fiber according to this embodiment has a control unit 70, and a temperature measuring instrument 31 for measuring a temperature inside the cylindrical body 65, in which the control unit 70 receives information on a temperature measured by the temperature measuring instrument 31, to control the heater 69 based thereon.
The control unit 70, herein, receives the information on the temperature measuring instrument 31, to control output of the heater 69, so as to be equal to or higher than the temperature Tx, as mentioned above, inside the cylindrical body 65, for example. Then, the control unit 70 controls the heater 69 so as to satisfy a desired temperature inside the cylindrical body 65. Thus, the ultraviolet curable resin is irradiated with ultraviolet light, and simultaneously heated.
In addition, as mentioned above, the coating of the optical fiber is sufficiently thin, and thus the temperature inside the cylindrical body 65 is regarded as the temperature of the ultraviolet curable resin without any problems.
In addition, in this embodiment, the description is made on the method in which the information on the temperature of the ultraviolet curable resin is received from the temperature measuring instrument 31, to control the heater 69 based thereon. However, such a method may be applied: to a method in which the temperature of the ultraviolet curable resin is not measured in production, and past production data is stored, to control the temperature of the heater 69 based thereon; or to a method in which the heater 69 is kept at a predetermined temperature in which the temperature of the ultraviolet curable resin does not fall below the desired temperature in production.
This embodiment can be applied to both of a Wet-on-Wet system and a Wet-on-Dry system. When this embodiment is applied to the Wet-on-Dry system, if this embodiment is applied to the ultraviolet irradiation unit for forming a coating having Young's modulus of 500 MPa or more in a light irradiation step for the secondary layer, for example, such an application is effective.
The production method according to this embodiment has an aspect in which a heating step for the ultraviolet curable resin and the light irradiation step are simultaneously provided, and the ultraviolet curable resin is heated, and simultaneously irradiated with ultraviolet light.
In this embodiment, each of the production method and the production apparatus has an advantage of capability of readily heating the resin by a tape heater, a ribbon heater or the like as the heater 69. Moreover, by providing the heater inside the ultraviolet irradiation unit, heating and irradiation can be simultaneously performed without lowering the temperature of the heated resin.
Next, the method of producing an optical fiber according to a third embodiment of the present invention is explained in detail, referring to the drawings.
As shown in
Further, the apparatus of producing the optical fiber according to this embodiment has a control unit (not shown), and a temperature measuring instrument 31, which is installed right above the ultraviolet irradiation unit 46a and which measures a temperature of the ultraviolet curable resin applied thereon, in which the control unit receives information on the temperature measured by the temperature measuring instrument 31, to control the heating unit 29 based thereon.
The control unit, herein, receives the information from the temperature measuring instrument 31, to control output from the heating unit 29, so as to be equal to or higher than the temperature Tx, as mentioned above, in the temperature of the ultraviolet curable resin, for example. Then, the control unit controls the heating unit 29, so as to satisfy a desired temperature in the temperature of the ultraviolet curable resin. Thus, the ultraviolet curable resin is heated.
In addition, in this embodiment, the description is made on the method in which the information on the temperature of the ultraviolet curable resin is received from the temperature measuring instrument 31, to control the heating unit 29 based thereon. However, such a method may be applied: to a method in which the temperature of the ultraviolet curable resin is not measured in production, and past production data is stored, to control the temperature of the heating unit 29 based thereon; or to a method in which the heating unit 29 is kept at a predetermined temperature in which the temperature of the ultraviolet curable resin does not fall below the desired temperature in production.
This embodiment can be applied to both of a Wet-on-Wet system and a Wet-on-Dry system. An apparatus of producing an optical fiber according to a Wet-on-Dry system, as shown in
Moreover, as shown in
As the heating unit 29, use may be made of: a known heater, such as an oven, a ceramic heater, an infrared irradiation unit, a heating wire heater, a carbon heater, and a halogen heater, and any kind thereof may be used, if the resin can be heated.
As in this embodiment, the ultraviolet curable resin can be heated immediately before the resin enters the light irradiation unit, by providing the heating unit 29 right above the ultraviolet irradiation unit 46a, and ultraviolet irradiation can be performed without lowering the temperature of the ultraviolet curable resin.
Next, the method of producing an optical fiber according to a fourth embodiment of the present invention is explained in detail, referring to the drawings.
As shown in
As the heater according to this embodiment, use may be made of: the ultraviolet irradiation unit 46d using the high pressure mercury lamp or the metal halide lamp as the light source. A temperature of the thus-heated ultraviolet curable resin is monitored by the temperature measuring instrument 31.
The ultraviolet irradiation unit 46d has a role as the heater, and simultaneously a role as an ultraviolet irradiator. By applying light from, as a first lamp, the ultraviolet irradiation unit having the high pressure mercury lamp or the like as the light source, the ultraviolet curable resin can be heated by radiant heat, and the ultraviolet curable resin can be cured by the ultraviolet irradiation unit 46e in a heated state. Thus, when the ultraviolet curable resin is cured by the conventional high pressure mercury lamp or the like, the ultraviolet curable resin is provided with the radiant heat equal to or higher than 130° C., being significantly higher than the glass transition temperature (Tg).
According to this embodiment, the high pressure mercury lamp or the like being conventional equipment can be used as the heater, and thus this embodiment is advantageous in apparatus cost and has an advantage of no necessity of large modification of equipment.
This embodiment can be applied to both of the Wet-on-Wet system and the Wet-on-Dry system. When this embodiment is applied to the Wet-on-Dry system, as shown in
It is known that a defect occurs in quartz glass, if an optical fiber to which germanium is added is irradiated with light having a short wavelength band of 250 nm or less as the light source of the ultraviolet irradiation unit for forming the coating in the light irradiation step for the secondary layer, for example, a loss of the optical fiber is increased by occurrence of this defect in several cases. Moreover, an amount of radical photopolymerization initiator which efficiently absorbs light having a long wavelength of 400 nm or more is small, and the wavelength is close to a visible light region, and thus storage stability to indoor light may be lowered, in several cases, with an ultraviolet curable resin using a photopolymerization initiator to cause reaction in this wavelength. Accordingly, a wavelength of light emitted from the semiconductor light emitting element is preferably 300 nm or more, more preferably 300 nm or more and 405 nm or less, and further preferably 365 nm or more and 405 nm or less.
Moreover, as in the fourth embodiment, when the ultraviolet irradiation unit is used, as the light source, the high pressure mercury lamp or the metal halide lamp as the heating unit, a short wavelength cut filter (long-pass filter) to cut a wavelength of 300 nm or less is further preferably installed within the ultraviolet irradiation unit.
The present invention will be described in more detail based on examples given below, but the invention is not meant to be limited by these.
An ultraviolet curable resin in which a glass transition temperature (Tg) was adjusted to 80° C. by adjusting a molecular weight or a substituent of the urethane acrylate. In addition, this Tg coincides with Tg of a film prepared by using a conveyor-type ultraviolet irradiation apparatus having an electrodeless UV lamp (D valve) described below. When a temperature Tx of this resin was determined by the above-described method, Tx was 45° C. Irgacure 184 was used as a photopolymerization initiator.
The ultraviolet curable resin was spin-coated on quartz glass to be 50 μm in thickness. The resin was cured, by putting the thus-prepared sample in a purge box under a nitrogen atmosphere, followed by irradiated with ultraviolet light (365 nm) with accumulated irradiation energy of 1,000 mJ/cm2 in a conveyor-type ultraviolet irradiation apparatus mounted with an electrodeless UV lamp (D valve) or a line-type LED unit having a peak wavelength at 365±10 nm.
TgLED of a film prepared by irradiated with light from LED (at 25° C.) without heating, was 45° C.
When the resin was subjected to UV irradiation while the resin was heated, the resin was cured, by placing the thus-prepared sample on a rubber heater heated to a predetermined temperature, putting the resultant assembly in a purge box under a nitrogen atmosphere, and adjusting illuminance and velocity to be a predetermined accumulated quantity of light and being irradiated with ultraviolet light (365 nm) in a conveyor-type ultraviolet irradiation apparatus. A heating temperature was adjusted to 40° C., 60° C. or 80° C.
The resultant film was peeled from a glass substrate, cut into a 6 mm-wide strip shape into strips of film. A tensile test was conducted on this test piece under 23° C., and under conditions of a tensile speed of 1.0 mm/min and a gauge length of 25 mm by using a tensile tester (trade name “RTC, TENSILON Universal Tensile Testing Machine,” manufactured by A&D Co., Ltd.), and Young's modulus was calculated from tensile strength at 2.5% strain.
As shown in
On the other hand, when the coating resin was subjected to UV irradiation while the coating resin was heated, an elastic modulus of the film obtained by curing the resin with UV while the resin was heated to a temperature of 60° C. or 80° C. being higher than Tx of the resin showed an elastic modulus equivalent to the elastic modulus of the film cured by the electrodeless UV lamp. Thus, it was confirmed that the curing sufficiently progressed.
When the resin was heated to a temperature of 40° C. being lower than Tx of the resin, the elastic modulus was somewhat improved in comparison with the elastic modulus of a film cured at room temperature, but curability as high as the curability with the electrodeless UV lamp cannot be obtained.
Thus, also from this experiment, the heating temperature of the resin is preferably equal to or higher than the temperature Tx, and more preferably equal to or higher than the glass transition temperature Tg.
An optical fiber was produced according to a production method in the second embodiment shown in
Specifically, the optical fiber was produced, by using the apparatus equipped with heaters in an upper end and a lower end of a cylindrical body within an ultraviolet irradiation unit for curing the secondary layer, and changing heater temperatures, to measure Young's modulus of the secondary layer. In addition, as an ultraviolet curable resin for the secondary layer, use was made of two kinds of ultraviolet curable resins A or B in which Tg was different. The thus-obtained optical fiber is an optical fiber, in which the ultraviolet curable resins consisting of two layers of the primary layer (thickness 30 μm) and the secondary layer (thickness 30 μm), respectively, were coated on an outer circumference of the glass optical fiber bare wire, and cured.
An ultraviolet curable resin was prepared to be a coating resin, in which Young's modulus would be 2.0 MPa and a glass transition temperature (Tg) would be −30° C., by using an ultraviolet curable resin obtained by using polyether-based urethane acrylate as an oligomer, and adding a photopolymerization initiator, a photosensitizer or the like thereto.
Ultraviolet curable resin A: an ultraviolet curable resin was used, in which a glass transition temperature (Tg) would be adjusted to 82° C. by adjusting a molecular weight and a substituent of the urethane acrylate. When temperatures Tx and TgLED of this resin were determined by the above-described method, Tx and TgLED were 42° C. and 46° C., respectively. Irgacure 184 and Lucirin TPO were used as a photopolymerization initiator.
Ultraviolet curable resin B: an ultraviolet curable resin was used, in which a glass transition temperature (Tg) would be adjusted to 98° C. by adjusting a molecular weight and a substituent of the urethane acrylate. When temperatures Tx and TgLED of this resin were determined by the above-described method, Tx and TgLED were 54° C. and 51° C., respectively. Irgacure 184 and Irgacure OXE02 were used as a photopolymerization initiator.
Ultraviolet curable resin C: an ultraviolet curable resin was used, in which a glass transition temperature (Tg) would be adjusted to 80° C. by adjusting a molecular weight and a substituent of the urethane acrylate. When temperatures Tx and TgLED of this resin were determined by the above-described method, Tx and TgLED were 45° C. and 45° C., respectively. Irgacure 184 was used as a photopolymerization initiator.
An ultraviolet irradiation unit was used, in which accumulated irradiation energy was 600 mJ/cm2 and a region of width 30 mm×length 200 mm was served as a light irradiation region, by arranging, in one light irradiation unit body 61, 20 pieces of semiconductor light emitting elements 66 each having a peak wavelength at 365±10 nm (trade name “6SMG,” manufactured by Nichia Corporation, optical output 2 W), along a running direction of the optical fiber.
A coating layer 14 of an optical fiber 10, as shown in
The glass transition temperature (Tg) of the coating resin was measured by the above-described measuring method.
The ultraviolet curable resin A was used, and a temperature of an ultraviolet light transmission cylindrical body in an ultraviolet irradiation unit was adjusted to 85° C. by a ribbon heater. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 70° C., which was equal to or higher than 42° C. of a temperature Tx. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 1,100 MPa.
The ultraviolet curable resin B was used, and a temperature of an ultraviolet light transmission cylindrical body in an ultraviolet irradiation unit was adjusted to 90° C. by a ribbon heater. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 76° C., which was equal to or higher than 54° C. of a temperature Tx. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 1,150 MPa as large as Example 1.
The ultraviolet curable resin B was used, and a temperature of an ultraviolet light transmission cylindrical body in an ultraviolet irradiation unit was adjusted to 120° C. by a ribbon heater. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 108° C., which was equal to or higher than 98° C. of a glass transition temperature Tg. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 1,210 MPa higher than Example 2.
The ultraviolet curable resin C was used, an infrared heating unit was installed between a resin application device and an ultraviolet irradiation unit, and the ultraviolet curable resin was heated by infrared light. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 85° C., which was equal to or higher than 80° C. of a glass transition temperature Tg. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 1,000 MPa.
The ultraviolet curable resin A was used, and linear velocity was adjusted to be 1,000 mJ/cm2 in irradiation energy, by using an electrodeless lamp (D valve) as a curing light source. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 134° C., which was equal to or higher than 42° C. of a temperature Tx. Young's modulus of the secondary layer of the thus-obtained optical fiber was 1,200 MPa.
An optical fiber was prepared in the same manner as in Example 1, without providing the ribbon heater being the heater, and except by adjusting the linear velocity to be 1,000 mJ/cm2 in irradiation energy of the light emitting diode. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 32° C., which was less than 42° C. of a temperature Tx. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 730 MPa, which was lower as compared with Example 1 using a heater.
An optical fiber was prepared by using the ultraviolet curable resin B, under the same conditions as in Example 2, except that the light emitting diode being the light source of the light irradiation unit in Example 2 was changed to a Mercury-Xenon lamp (Hg—Xe). A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 140° C., which was equal to or higher than 54° C. of a temperature Tx. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 1,310 MPa.
The ultraviolet curable resin B was used, the ultraviolet irradiation unit in Example 2 was replaced with a light emitting diode, and linear velocity was adjusted to be 1,000 mJ/cm2 in irradiation energy. The heater was not used in Comparative example 4. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 30° C., which was less than 54° C. of a temperature Tx. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 680 MPa, which was lower than Young's modulus as compared with Example 2 using a heater.
An optical fiber was prepared in the same manner as in Example 4, without providing the infrared heating unit, and except by adjusting the linear velocity to be 600 mJ/cm2 in irradiation energy of the light emitting diode. A surface temperature of a fiber coating resin came out from the ultraviolet irradiation unit was 30° C., which was less than 45° C. of a temperature Tx. As a result, Young's modulus of the secondary layer of the thus-obtained optical fiber was 410 MPa, which was lower than Young's modulus as compared with Example 4 using a heater.
The thus-obtained results are shown in Table 1 below.
As shown in Table 1, in Comparative Example 1 in which the electrodeless lamp was used as the conventional ultraviolet light source, Young's modulus of the secondary layer was 1,200 MPa, and in Comparative Examples 3 in which the Mercury-Xenon lamp was used, Young's modulus thereof was 1,310 MPa, and a high elastic modulus was obtained as in the secondary layer.
Then, in Comparative Example 2 or Comparative Example 4 in which the light emitting diode (LED) was used as the ultraviolet light source and no heater was used, Young's moduli of the secondary layers were 730 MPa and 680 MPa, and lowered to about 61% and about 52%, respectively, in comparison with a case where the electrodeless lamp was used (Comparative Example 1) and a case where the Mercury-Xenon lamp was used (Comparative Example 3).
In contrast, in Example 1 in which the ultraviolet curable resin A was used, the light emitting diode was used as the ultraviolet light source, further the heater was provided, and the heating temperature was adjusted to be equal to or higher than Tx, Young's modulus of the secondary layer was achieved 1,100 MPa, and the Young's modulus substantially equivalent to the level when the metal halide lamp was used (Comparative Example 1) was obtained. Moreover, in Example 2 in which the ultraviolet curable resin B was used and the heating temperature was adjusted to be equal to or higher than Tx, Young's modulus of the secondary layer was achieved 1,150 MPa, resulted in the Young's modulus of about 90% of the level when the Mercury-Xenon lamp was used (Comparative Example 3). Moreover, in Example 3 in which the heating temperature was adjusted to be equal to or higher than the glass transition temperature (Tg), Young's modulus of the secondary layer was achieved 1,210 MPa, resulted in the Young's modulus substantially equivalent to the level when the Mercury-Xenon lamp was further used (Comparative Example 3).
In addition, when the light emitting diode was used as the light source for curing the resin, power consumption was able to be significantly reduced, and further a longer life of the light source was able to be achieved, in comparison with the case where the electrodeless lamp or the Mercury-Xenon lamp was used (Comparative Example 1 or 3).
Having described our invention as related to the present embodiments, it is our intention that the invention not be limited by any of the details of the description, unless otherwise specified, but rather be construed broadly within its spirit and scope as set out in the accompanying claims.
10 Optical fiber
11 Optical fiber bare wire
12 Primary layer
13 Secondary layer
14 Coating layer
21 Optical fiber preform
22 Heater
23 Optical fiber bare wire
24
a,
26
b,
44
a,
44
b,
44
c Resin application device
25 Optical fiber
26
a,
26
b,
26
c,
46
a,
46
b,
46
c,
46
d,
46
e,
46
f,
46
g,
46
h,
46
i Ultraviolet irradiation unit
27 Guide roller
28 Winding device
29 Heating unit
31 Temperature measuring instrument
51 Control unit
52 Die unit
53 Die holder
53
b Heater
54, 55 Resin supplier
54
b,
55
b Pump
54
c,
55
c Supply pipe
61 Ultraviolet irradiation unit body
62 Intake device
63 Exhaust device
64 Insertion opening
65 Ultraviolet light transmission cylindrical body
66 Semiconductor light emitting element
67 Light collection optical system
68 Mirror
69 Heater
70 Control unit
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014-133321 | Jun 2014 | JP | national |
This application is a Continuation of PCT International Application No. PCT/JP2015/068411 filed on Jun. 25, 2015, which claims priority under 35 U.S.C. §119 (a) to Japanese Patent Application No. 2014-133321 filed in Japan on Jun. 27, 2014. Each of the above applications is hereby expressly incorporated by reference, in its entirety, into the present application.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2015/068411 | Jun 2015 | US |
| Child | 15390131 | US |
