Number | Date | Country | Kind |
---|---|---|---|
57-225169 | Dec 1982 | JPX | |
58-49250 | Mar 1983 | JPX | |
58-194901 | Oct 1983 | JPX | |
58-194902 | Oct 1983 | JPX | |
58-194903 | Oct 1983 | JPX | |
58-194904 | Oct 1983 | JPX |
This application is a continuation of U.S. patent application Ser. No. 564,652, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
2894317 | Marks | Jul 1959 | |
3336345 | Yamamoto | Jan 1975 | |
3895127 | Comizzoli | Jul 1975 | |
4177138 | Mastuzaki et al. | Dec 1979 | |
4445256 | Huguenin et al. | May 1984 | |
4482447 | Mizuguchi et al. | Nov 1984 | |
4512854 | Grah | Apr 1985 |
Number | Date | Country |
---|---|---|
8426 | Mar 1973 | JPX |
108557 | Aug 1978 | JPX |
50629 | Apr 1980 | JPX |
83238 | Jun 1980 | JPX |
Entry |
---|
Hewins, T. F., et al., "Plating Process", IBM Technical Disclosure Bulletin, vol. 2, No. 3, p. 32 (Oct. 1959). |
Yeates, R. L., Electropainting, Robert Draper Ltd., Teddington, Second Edition, pp. 172-173 (Oct. 1970). |
Number | Date | Country | |
---|---|---|---|
Parent | 564652 | Dec 1983 |