Claims
- 1. A method of producing a heat-transfer material comprising the steps of:
- (a) preparing a body made of metal serving as a cathode and forming a hydrophobic film on a surface of said body;
- (b) subsequently keeping said surface of said body and an anode in contact with a plating solution, said anode being soluble to said plating solution on electroplating; and
- (c) subsequently applying a direct electrical potential between said anode and said cathode to cause a plating current to flow through said plating solution to produce slime from said anode and to lay deposits of plating metal on said surface of said body and moving said slime to said surface of said body to lay deposits of said slime on said surface of said body, so that said deposits of plating metal and said deposits of said slime jointly form on said surface of said body a porous layer which has minuscule projections of electrodeposits densely formed on one surface of said layer directed away from said body.
- 2. A method of producing a heat-transfer material according to claim 1, in which said body is a tube having said surface internally thereof.
- 3. A method of producing a heat-transfer material according to claim 1, in which said body is a tube having said surface externally thereof.
- 4. A method of producing a heat-transfer material according to claim 1, in which said body is made of copper, said plating aqueous solution being copper sulfate aqueous solution.
- 5. A method of producing a heat-transfer material according to claim 1, in which said body and said plating solution are moved relative to each other at a velocity of 0.5 to 5 m/sec to cause said slime to flow to said surface of said body.
- 6. A method of producing a heat transfer material according to claim 1, in which a anodic current density is not less than 20 A/dm.sup.2.
Priority Claims (3)
Number |
Date |
Country |
Kind |
60-266812 |
Nov 1985 |
JPX |
|
61-47763 |
Mar 1986 |
JPX |
|
61-48794 |
Mar 1986 |
JPX |
|
Parent Case Info
This is a division of Ser. No. 934,652 filed Nov. 25, 1986, now U.S. Pat. No. 4,780,373.
US Referenced Citations (13)
Foreign Referenced Citations (5)
Number |
Date |
Country |
2510580 |
Sep 1975 |
DEX |
14259 |
Feb 1977 |
JPX |
259 |
Jan 1979 |
JPX |
26496 |
Feb 1983 |
JPX |
1375600 |
Nov 1974 |
GBX |
Non-Patent Literature Citations (2)
Entry |
Chemical Abstracts, vol. 94, 1987, p. 440, Abstract No. 50575c, "Electroplating Printed Circuit Boards". |
Metal Finishing Abstracts, vol. 22, No. 12, Mar./Apr. 1980, p. 101, letter D, "Reflective Silver Coated Strip". |
Divisions (1)
|
Number |
Date |
Country |
Parent |
934652 |
Nov 1986 |
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