Method of producing liquid droplet ejection head

Abstract

A liquid droplet ejection head includes: a nozzle plate that has a plurality of nozzles ejecting a liquid droplet; a flow path member that includes: pressure generating chambers that communicate with the nozzles; and liquid supply paths through which liquid is supplied to the pressure generating chambers; and a damper portion that is disposed in at least one part of a region, the region being on the nozzle plate, corresponding to the liquid supply paths, the damper portion reducing a fluctuation of an ejection amount of the liquid droplets to enable stable ejection.

Description

BACKGROUND

1. Technical Field

The present invention relates to a liquid droplet ejection head, an apparatus for ejecting liquid droplet, and a method of producing a liquid droplet ejection head, and more particularly to a liquid droplet ejection head in which variation of the ejection amount of liquid droplets can be absorbed to enable stable ejection and printing of high quality, and which is simple and economical, an apparatus for ejecting liquid droplet, and a method of producing such a liquid droplet ejection head.

2. Related Art

An inkjet head comprising nozzles for ejecting an ink, pressure generating chambers communicating with the nozzles, and an ink supply path for supplying the ink to plural pressure generating chambers is used. In such an inkjet head, when the ejection amount of liquid droplets is largely varied as a whole, there arises a problem in that the ejection state immediately after the variation of the ejection amount of liquid droplets is disturbed by the inertia force (inertance) of the ink in the ink supply path. In order to prevent the problem from arising, a configuration is known in which a damper function is provided in a branch portion of an ink supply path.

SUMMARY

According to an aspect of the present invention, a liquid droplet ejection head comprising: a nozzle plate that has a plurality of nozzles ejecting a liquid droplet; a flow path member that comprises: pressure generating chambers that communicate with the nozzles; and liquid supply paths through which liquid is supplied to the pressure generating chambers; and a damper portion that is disposed in at least one part of a region, the region being on the nozzle plate, corresponding to the liquid supply paths, the damper portion reducing a fluctuation of an ejection amount of the liquid droplets to enable stable ejection.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiment of the present invention will be described in detail based on the following figures, wherein:

FIG. 1 is a plan view of a liquid droplet ejection head of a first embodiment of the invention;

FIG. 2A is a section view taken along the line A-A in FIG. 1, and FIG. 2B is a detail view of a portion B of FIG. 2A;

FIG. 3 is an exploded perspective view of the liquid droplet ejection head shown in FIG. 1;

FIGS. 4A and 4B show a damper portion in a first embodiment, FIG. 4A is a plan view, FIG. 4B is a section view taken along the line C-C in FIG. 4A, and FIG. 4C is a section view taken along the line D-D in FIG. 4A;

FIGS. 5A to 5G show steps of producing the liquid droplet ejection head, FIG. 5A is a section view showing joining of plates, FIG. 5B is a section view showing etching of a plate for a flow path member, FIG. 5C is a section view showing formation of a water-repellent film, and FIG. 5D is a section view showing processing of a nozzle;

FIGS. 6A to 6D show a damper portion in a second embodiment, FIG. 6A is a plan view, FIG. 6B is a section view taken along the line E-E in FIG. 6A, FIG. 6C is a section view taken along the line F-F in FIG. 6A, and FIG. 6D is a section view taken along the line G-G in FIG. 6A;

FIGS. 7A to 7C show a damper portion in a third embodiment, FIG. 7A is a plan view, FIG. 7B is a section view taken along the line H-H in FIG. 7A, and FIG. 7C is a section view taken along the line I-I in FIG. 7A;

FIGS. 8A to 8C show a damper portion in a fourth embodiment, FIG. 8A is a plan view, FIG. 8B is a section view taken along the line J-J in FIG. 8A, and FIG. 8C is a section view taken along the line K-K in FIG. 8A;

FIGS. 9A to 9D show a damper portion in a fifth embodiment, FIG. 9A is a plan view, FIG. 9B is a section view taken along the line M-M in FIG. 9A, FIG. 9C is a section view taken along the line N-N in FIG. 9A, and FIG. 9D is a section view taken along the line O-O in FIG. 9A;

FIG. 10A is a plan view showing an example of a laser mask,

FIG. 10B is a section view taken along the line M-M in FIG. 9A showing a method of forming a damper portion 11 and a nozzle 2a by using the laser mask shown FIG. 10A, and FIG. 10C is a section view taken along the line N-N in FIG. 9A showing a method of forming the damper portion 11 and the nozzle 2a by using the laser mask shown FIG. 10A;

FIGS. 11A to 11D show a damper portion in a sixth embodiment, FIG. 11A is a plan view, FIG. 11B is a section view taken along the line P-P in FIG. 11A, FIG. 11C is a section view taken along the line Q-Q in FIG. 11A, and FIG. 11D is a section view taken along the line R-R in FIG. 11A;

FIG. 12A is a plan view showing an irradiation area of laser in laser processing, and FIG. 12B is a plan view showing a laser mask used in the laser processing;

FIGS. 13A to 13C show a damper portion in the sixth embodiment, FIG. 13A is a plan view, FIG. 13B is a section view taken along the line S-S in FIG. 13A, and FIG. 13C is a section view taken along the line T-T in FIG. 13A;

FIG. 14 shows a damper portion in a seventh embodiment, FIG. 14A is a plan view, FIG. 14B is a section view taken along the line U-U in FIG. 14A, FIG. 14C is a section view taken along the line V-V in FIG. 14A, and FIG. 14D is a section view taken along the line W-W in FIG. 14A;

FIG. 15A is a plan view showing an irradiation area of laser in laser processing, and FIG. 15B is a plan view showing a laser mask used in the laser processing;

FIGS. 16A to 16D show a damper portion in an eighth embodiment, FIG. 16A is a plan view, FIG. 16B is a section view taken along the line X-X in FIG. 16A, FIG. 16C is a section view taken along the line Y-Y in FIG. 16A, and FIG. 16D is a section view taken along the line Z-Z in FIG. 16A;

FIG. 17A is a plan view showing an irradiation area of laser in laser processing, and FIG. 17B is a plan view showing a laser mask used in the laser processing;

FIGS. 18A to 18D show a production method of another embodiment, FIG. 18A is a section view showing application of a photosensitive resin, FIG. 18B is a section view showing exposure in which a mask of a photosensitive resin is used, FIG. 18C is a section view showing formation of a step by development, and FIG. 18D is a section view showing formation of a nozzle; and

FIG. 19 is a diagram schematically showing a color printer to which a liquid droplet ejection apparatus of a tenth embodiment of the invention is applied.

DETAILED DESCRIPTION

First Embodiment

(Configuration of Liquid Droplet Ejection Head)

FIGS. 1 and 2 show a liquid droplet ejection head of a first embodiment of the invention. FIG. 1 is a plan view, FIG. 2A is a section view taken along the line A-A in FIG. 1, and FIG. 2B is a detail view of a portion B of FIG. 2A.

As shown in FIG. 1, the liquid droplet ejection head 1 has:

a vibration plate 7 which has an approximately parallelogram shape; plural piezoelectric elements 8 which are arranged on the vibration plate 7; and plural nozzles 2a which are formed at positions corresponding to the piezoelectric elements 8. When one of the piezoelectric elements 8 is driven, a liquid stored in the head is ejected as a liquid droplet from the corresponding one of the nozzles 2a. The reference numeral 7a denotes a supply hole which is disposed in the vibration plate 7, and through which the liquid is supplied from a liquid tank (not shown) to the interior of the head 1.

As shown in FIG. 2A, the liquid droplet ejection head 1 has a nozzle plate 2 in which the nozzles 2a are formed. On a face (rear face) of the nozzle plate 2 which is opposite to the ejection side, a pool plate 3 having a communication hole 3a and a liquid pool 3b, a supply hole plate 4A having a communication hole 4a and a supply hole 4b, a supply path plate 5 having a communication hole 5a and a supply path 5b, a supply hole plate 4B having the communication hole 4a and the supply hole 4b, a pressure generating chamber plate 6 having a pressure generating chamber 6a, and the vibration plate 7 are sequentially stacked as a flow path member 13. As described above, the plural piezoelectric elements 8 are arranged on the vibration plate 7. A flexible printed circuit board 12 (hereinafter, abbreviated as “FPC 12′”) for applying a voltage to the piezoelectric elements 8 is disposed so as to cover the plural piezoelectric elements 8. When one of the piezoelectric elements 8 is driven through the FPC 12′, a liquid stored in the head is ejected as a liquid droplet from the corresponding one of the nozzles 2a.

The liquid pool 3b constitutes a liquid supply path 12 which is continuous in a direction perpendicular to the plane of the paper. A nozzle supply path 14 which supplies the liquid to each of the nozzles 2a, and in which the liquid supply path 12 communicates with the pressure generating chamber 6a through the supply hole 4b and the supply path 5b, and the pressure generating chamber 6a communicates with the nozzle 2a through the communication holes 5a, 4a, 3 is configured.

A damper portion 11 which absorbs a change of the ejection amount of liquid droplets to enable stable ejection is formed in the region of the nozzle plate 2 corresponding to the liquid supply path 12. A protection member 9 is disposed on the surface of the nozzle plate 2 on the liquid droplet ejection side, and in the periphery of the nozzle 2a and in a corresponding region of the damper portion 11.

In the liquid droplet ejection head 1, as shown in FIG. 2B, the protection member 9 is joined to the periphery of the nozzle 2a and in a predetermined region of the damper portion 11 on the surface of the nozzle plate 2 on the liquid droplet ejection side. The configuration of the damper portion 11, and the disposition of the protection member 9 will be described later in detail. A water-repellent film 10 configured by a ground layer 10a and a water-repellent layer 10b is formed on the surface of the nozzle plate 2 in the periphery of the nozzle 2a, and the side face and surface of the protection member 9. Since the water-repellent film 10 is formed in the periphery of the nozzle 2a, the liquid droplet to be ejected from the nozzle 2a is stably ejected. Since the protection member 9 is disposed in the periphery of the nozzle 2a, the water-repellent film 10 in the periphery of the nozzle 2a can be protected from a mechanical damage due to paper jamming or the like.

Although FIGS. 1 and 2 show one liquid droplet ejection head 1, plural liquid droplet ejection heads 1 may be combined to constitute a liquid droplet ejection head unit, or plural liquid droplet ejection head units may be arranged to be used as a liquid droplet ejection head array.

Next, the components of the liquid droplet ejection head 1 will be described in detail.

(Nozzle Plate)

As the material of the nozzle plate 2, a synthetic resin is preferably used from the viewpoints that the plate is flexible in order to partly configure the damper portion 11 (see FIG. 4) in one part, and that the nozzle 2a is easily formed. Examples of the material are a polyimide resin, a polyethylene terephtalate resin, a liquid crystal polymer, an aromatic polyamide resin, a polyethylene naphtalate resin, and a polysulfone resin. Among the resins, a self-bonding polyimide resin is preferably used. The nozzle plate 2 preferably has a thickness of 10 to 100 μm. When the thickness is less than 10 μm, it is sometimes difficult to ensure a sufficient nozzle length and realize an excellent print quality (directionality). When the thickness exceeds 100 μm, it is sometimes difficult to ensure the flexibility and obtain a sufficient damper effect.

(Plates for Flow Path Member)

As the materials of the plates for the flow path member 13, such as the pool plate 3, a metal such as SUS is preferably used from the viewpoints that an etching process which will be described later can be smoothly performed, and that it has a high ink resistance.

(Protection Member)

As the material of the protection member 9, in same manner as the pool plate 3 and the like serving as the plates for the flow path member 13, a metal such as SUS is preferably used from the viewpoints that the etching process can be smoothly performed, and that it has a high ink resistance. When a plate of the same material as the pool plate 3 and the like is used, the etching process can be efficiently performed by a single operation. The protection member preferably has a thickness of 10 to 20 μm. When the thickness is less than 10 μm, the effect of protecting (reinforcing) the nozzle 2a and the damper portion 11 (see FIG. 4) is sometimes insufficient. When the thickness exceeds 20 μm, the performance of wiping an ink or foreign materials in the vicinity of the nozzle is sometimes insufficient.

(Piezoelectric Element)

As the material of the piezoelectric element 8, for example, lead zirconate titanate (PZT) and the like are used. The piezoelectric element has an individual electrode 8a on the upper face, and a common electrode 8b on the lower face. The individual electrode 8a and the common electrode 8b are formed by a sputtering process or the like. The common electrode 8b on the lower face is electrically connected to the vibration plate 7 by a conductive adhesive agent, and grounded through the vibration plate 7. In the piezoelectric element 8, an area required at least for ejecting a liquid droplet is individualized and joined to a position of the vibration plate 7 corresponding to the pressure generating chamber 6a.

(Water-Repellent Film)

As the ground layer 10a constituting the water-repellent film 10, for example, a silicon oxide film such as SiO, SiO₂, or SiO_x, or a silicon oxide film such as Si₂N₃ or SiN_X having a thickness 10 to 100 nm is preferably used because such a film has a high ink resistance, and exhibits a high adhesiveness with a resin such as polyimide used as the nozzle plate 2, and a fluorine water-repellent material used in the water-repellent layer 10b. As the water-repellent layer 10b, for example, a fluorine water-repellent film made of a fluorine compound, a silicone water-repellent film, a plasma-polymerized protection film, polytetrafluoroethylene (PTFE) nickel eutectoid plating, and the like are useful. Among them, a fluorine water-repellent film made of a fluorine compound is preferable because it has excellent water repellency and adhesiveness. Preferably, the water-repellent layer 10b has a thickness of 10 to 50 nm.

(Liquid Flow)

The liquid flow will be described with reference to FIG. 3. The liquid supplied to the supply hole 7a of the vibration plate 7 is ejected as a liquid droplet from the nozzle 2a of the nozzle plate 2 through a supply hole 6b of the pressure generating chamber plate 6, a pool (¼) 4c of the second supply hole plate 4B, a pool ( 2/4) 5c of the supply path plate 5, a pool (¾) 4c of the first supply hole plate 4A, a liquid pool ( 4/4) 3b of the pool plate 3, the liquid supply path 12, the supply hole 4b of the first supply hole plate 4A, the supply path 5b of the supply path plate 5, the supply hole 4b of the second supply hole plate 4B, the pressure generating chamber 6a of the pressure generating chamber plate 6, the communication hole 4a of the second supply hole plate 4B, the communication hole 5a of the supply path plate 5, the communication hole 4a of the first supply hole plate 4A, and the communication hole 3a of the pool plate 3. In this way, the liquid pool 3b and the liquid supply path 12 are commonly used for supplying the liquid to the nozzles 2a.

FIG. 4 shows the damper portion in the first embodiment. FIG. 4A is a plan view, FIG. 4B is a section view taken along the line C-C in FIG. 4A, and FIG. 4C is a section view taken along the line D-D in FIG. 4A.

In the first embodiment, as shown in FIG. 4, the damper portion 11 which absorbs a change of the ejection amount of liquid droplets to enable stable ejection is formed in the region of the nozzle plate 2 corresponding to the liquid supply path 12 formed in the flow path member 13.

The embodiment further comprises the protection member 9 which is disposed on the surface of the nozzle plate 2 on the liquid droplet ejection side, and in the periphery of the nozzle 2a and at least one part of the damper portion 11. A damper reinforcement portion 11a is formed by the part of the damper portion 11 in which the protection member 9 is disposed, and a damper function portion 11b is formed by a part of the damper portion in which the protection member 9 is not disposed.

In the embodiment, the damper portion 11 is integrally formed by a polyimide resin which is a flexible material, so as to have the same thickness as the nozzle plate 2. The protection member 9 and the flow path member 13 are configured by an SUS plate.

In the embodiment, the nozzles 2a are arranged as plural nozzle rows in parallel to the disposition direction of the liquid supply path 12.

The protection member 9 extends so as to bridge over plural nozzle rows in a direction intersecting with the liquid supply path 12, and is disposed in the direction of wiping the surfaces of the nozzles 2a.

Meanwhile, the above-mentioned word “the direction of wiping” means a direction of a wiping unit's (for example, blade etc) transference relative to the surface of the nozzles 2a in sweeping the surface of the nozzles 2a by wiping.

(Method of Producing Liquid Droplet Ejection Head)

FIGS. 5A to 5D show steps of producing the liquid droplet ejection head 1.

(1) Joining of Plates (First Step)

First, as shown in FIG. 5A, a protection member plate 9b made of, for example, SUS and having a thickness of 10 μm, and a flow path member plate 13b are joined together by thermal compression (for example, 300° C. and 300 kgf) to both faces of a plate 2b for the nozzles made of, for example, a self-bonding polyimide film and having a thickness of 25 μm. In the case where a self-bonding polyimide film is not used as the plate 2b for the nozzles, the joining may be conducted by using an adhesive agent or the like.

(2) Etching of Flow Path Member Plate (Second Step)

Next, as shown in FIG. 5B ((b1) is a section view taken along the line C-C, and (b2) is a section view taken along the line D-D, the same shall apply hereinafter), a part of the flow path member plate 13b is etched into a predetermined pattern, and the flow path member 13 having the liquid supply path 12 and the nozzle supply path 14 is formed so that, in a part of a region corresponding to the liquid supply path 12, the plate 2b for the nozzles has the damper portion 11 which absorbs a change of the ejection amount of liquid droplets to enable stable ejection (second step). As the etching method, for example, a usual method in which a resist that allows patterning so as to have a desired pattern by the photolithography method is used as a mask may be employed.

(3) Etching of Protection Member Plate (Third Step)

At the same time with the above-described second step, as shown in FIG. 5B, apart of the protection member plate 9b is etched into a pattern in which the opening width (the width of the damper function portion 11b which will be described later) is 250 μm, and the protection member 9 is formed in the periphery of a portion which is on the surface of the nozzle plate 2 on the liquid droplet ejection side, and in which the nozzle 2a is to be formed, and at least one part of the damper portion 11 so that the damper portion 11 is partitioned into the damper reinforcement portion 11a (for example, the width of 200 μm) and the damper function portion 11b (the width of 202 μm, as described above) (see FIG. 4). Also as the etching method in this case, for example, a usual method in which a resist that allows patterning so as to have a desired pattern by the photolithography method is used as a mask may be employed. Alternatively, the second and third steps may be separately performed. When the steps are performed simultaneously as in the embodiment, however, the steps can be performed more efficiently. The wiping direction is indicated by the arrows.

(4) Formation of Water-Repellent Film (Third Dash Step)

As required, as shown in FIG. 5C, preferably, a film of silicon dioxide (SiO₂) of 10 to 100 nm is formed by, for example, the sputtering method as the ground layer 10a on the surface of the plate 2b for the nozzles and the surface and side face of the protection member plate 9b, and thereafter a film of the water-repellent layer 10b made of a fluorine water-repellant agent is formed at 10 to 50 nm by the vapor deposition method to form the water-repellent film 10.

(5) Processing of Nozzles (Fourth Step)

Next, as shown in FIG. 5D, laser processing is applied to the plate 2b for the nozzles from the side of the flow path member 13 to form the nozzle 2a, thereby forming the nozzle plate 2. As the laser used in this laser processing, a gas laser or a solid-state laser may be used. An example of a useful gas laser is an excimer laser, and an example of a useful solid-state laser is a YAG laser. In the lasers, an excimer laser is preferably used.

(6) Joining of Vibration Plate and Piezoelectric Elements (Fifth Step)

Next, as shown in FIG. 2, the vibration plate 7 and the plural piezoelectric elements 8 are joined onto the flow path member 13. As a joining method, an adhesive agent of, for example, a thermoplastic resin such as polyimide or polystyrene, or a thermosetting resin such as a phenol resin or an epoxy resin can be used.

(7) Disposition of Flexible Printed Circuit Board (Sixth Step)

Next, as shown in FIG. 2, the FPC 12′ for applying a voltage to the piezoelectric elements 8 is disposed so as to cover the plural piezoelectric elements 8, so that, when one of the piezoelectric elements 8 is driven through the FPC 12′, the liquid stored in the head is ejected as a liquid droplet from the corresponding one of the nozzles 2a.

(Effects of First Embodiment)

The above-described first embodiment can attain the following affects.

(a) Since the protection member 9 is disposed also on a part of the damper portion 11 in addition to the periphery of the nozzle 2a, the damper portion 11 can sufficiently exert the damper effect. Furthermore, the strength of the damper portion can be ensured, and the damper portion can be protected.(b) Since the damper portion 11 is configured by the flexible material so as to have the same thickness as the nozzle plate 2, the number of components can be reduced, and an economical head can be supplied.(C) The protection member 9 extends so as to bridge over plural nozzle rows in the direction intersecting with the liquid supply path 12, and is disposed in the direction of wiping the surfaces of the nozzles 2a. Therefore, the property of discharging liquids or foreign materials from the face of the nozzle 2a can be enhanced, and a sure wiping operation can be realized.

Second Embodiment

FIG. 6 shows a damper portion in a second embodiment, FIG. 6A is a plan view, FIG. 6B is a section view taken along the line E-E in FIG. 6A, FIG. 6C is a section view taken along the line F-F in FIG. 6A, and FIG. 6D is a section view taken along the line G-G in FIG. 6A.

As shown in FIG. 6, the second embodiment is identical with the first embodiment except that, in the first embodiment, the disposition (opening) shape of the protection member 9 is formed as a shape which obliquely extends, and exerts the same effects.

Third Embodiment

FIG. 7 shows a damper portion in a third embodiment, FIG. 7A is a plan view, FIG. 7B is a section view taken along the line H-H in FIG. 7A, and FIG. 7C is a section view taken along the line I-I in FIG. 7A.

As shown in FIG. 7, the third embodiment is identical with the first embodiment except that the disposition (opening) width of the protection member 9 in the first embodiment is configured so as to be changed, and exerts the same effects. Namely, the third embodiment is identical with the first embodiment except that the opening width of the protection member 9 in the damper function portion 11b is set to, for example, 350 μm, and that of the protection member 9 in the periphery of the nozzle 2a is set to, for example, 200 μm.

(Effects of Third Embodiment)

Since the opening width of the protection member 9 in the damper function portion 11b is increased (the disposition width of the protection member 9 is reduced), the reinforcement effect of the damper portion 11 can be limited to the minimum degree, and the damper effect can be enhanced to the maximum extent.

Fourth Embodiment

FIG. 8 shows a damper portion in a fourth embodiment, FIG. 8A is a plan view, FIG. 8B is a section view taken along the line J-J in FIG. 8A, and FIG. 8C is a section view taken along the line K-K in FIG. 8A.

As shown in FIG. 8, the fourth embodiment is identical with the first embodiment except that the disposition shape of the protection member 9 in the first embodiment is configured so that the shape of the damper function portion 11b has an independent island shape. Namely, the fourth embodiment is identical with the first embodiment except that the shape of the damper function portion 11b (the opening shape of the protection member 9) is formed so that the opening width of the protection member 9 has a rectangular island shape of, for example, 350 μm, and the opening shape of the protection member 9 in the periphery of the nozzle 2a is formed so that the opening width has a thin strip-like shape of 200 μm.

(Effects of Fourth Embodiment)

Since the disposition shape of the protection member 9 is configured so that the shape of the damper function portion 11b has an independent island shape, the degree of the damper effect can be adequately adjusted.

Fifth Embodiment

FIG. 9 shows a damper portion in a fifth embodiment, FIG. 9A is a plan view as seen from the rear face, FIG. 9B is a section view taken along the line M-M in FIG. 9A, FIG. 9C is a section view taken along the line N-N in FIG. 9A, and FIG. 9D is a section view taken along the line O-O in FIG. 9A.

As shown in FIG. 9, the damper portion 11 in the embodiment is configured by a thin portion which is obtained by reducing the thickness of the nozzle plate 2 by, for example, laser irradiation using a laser mask 15. Preferably, the thin portion is opened to an atmosphere, and at least one thin portion is independently disposed correspondingly to each of the nozzles 2a.

FIG. 10A is a plan view showing an example of the laser mask, FIG. 10B is a section view taken along the line M-M in FIG. 9A showing a method of forming the damper portion 11 and the nozzle 2a by using the laser mask shown FIG. 10A, and FIG. 10C is a section view taken along the line N-N in FIG. 9A showing a method of forming the damper portion 11 and the nozzle 2a by using the laser mask shown FIG. 10A.

In the laser mask 15 in the embodiment, thin portion openings 15a and nozzle openings 15b are formed. In the embodiment, the laser mask 15 is placed on the incidence side, the nozzle arrangement pitch is w2, and a stage is moved by a width of w1. In the case where an m number of laser patterns are used for forming one nozzle 2a, when the opening diameter of the communication hole 4a of the pool plate 3 is w3, the maximum diameter of the pattern for the nozzle 2a is Nmax, and the dimension of a thinning region (the damper function portion 11b) in the direction of the nozzle row is w4, it is preferable to satisfy the following relationships. Namely, desired processing is efficiently carried out at a desired position by a combination of openings of the laser mask 15 and the pool plate 3.w2−w3/2>(n−1)·w1+Nmax/2w1−Nmax/2>w3/2w1>w4·(n−1)

When the width of the common liquid supply path is L0, the pitch of nozzle rows is Lnp, the length of the opening of the laser mask 15 in a direction perpendicular to the nozzle rows is L3 (≈w3), and the dimension of the opening of the laser mask 15 in a direction perpendicular to the nozzle rows of the thinning region (the damper function portion 11b) is L, it is preferable to satisfy the following relationships.Lnp−L3>L, preferably L<L0.(Effects of Fifth Embodiment)(A) Since the laser processing for the thin portion, and that for the nozzle 2a are simultaneously carried out, the damper portion 11 which surely exerts the damper effect can be produced further simply and efficiently.(B) In the laser processing for the thin portion, and that for the nozzle, the laser mask 15 in which the thin portion openings 15a that are equal to or less than n (n is a natural number) are arranged, and the nozzle openings 15b that are two to n (n is a natural number) are arranged is used while the mask is shifted. Therefore, the laser processing for the thin portion, and that for the nozzle 2a, i.e., the processes of different processing depths can be carried out by using one mask. As a result, the damper portion which surely exerts the damper effect, and the nozzles having an excellent ejection performance can be produced further simply and efficiently.

Sixth Embodiment

FIG. 11 shows a damper portion in a sixth embodiment, FIG. 11A is a plan view as seen from the rear face, FIG. 11B is a section view taken along the line P-P in FIG. 11A, FIG. 11C is a section view taken along the line Q-Q in FIG. 11A, and FIG. 11D is a section view taken along the line R-R in FIG. 11A. FIG. 12A is a plan view showing an irradiation area of laser in laser processing, and FIG. 12B is a plan view showing a laser mask used in the laser processing. FIG. 13 shows a damper portion in the sixth embodiment, FIG. 13A is a plan view, FIG. 13B is a section view taken along the line S-S in FIG. 13A, and FIG. 13C is a section view taken along the line T-T in FIG. 13A.

The sixth embodiment is identical with the fifth embodiment except that the characteristics that the intensity distribution of the laser (excimer laser) in the laser processing is rectangular in the longitudinal direction and gaussian in the short direction are used, the laser mask 15 shown in FIG. 12B is used, the irradiation area is set as a reference to the center in the short direction, the peak beam in the longitudinal direction (at the center in the short direction) is used in the laser processing of the nozzle 2a, and a weak beam in the short direction is used in the laser processing of the thin portion (the damper portion 11).

In FIG. 13A, the damper function portion 11b is indicated by broken lines, and a projection 11c which is not laser-processed and remains at the middle of the damper portion 11 is similarly indicated by broken lines.

(Effects of Sixth Embodiment)

(A) In the laser processing, the energy density distribution of the laser (excimer laser) which is rectangular in the longitudinal direction and gaussian in the short direction is used. Therefore, the laser processing for the thin portion, and that for the nozzle 2a, i.e., the processes of different processing depths can be simultaneously carried out by using one mask, and hence the energy utilization efficiency can be enhanced.(B) Since the nozzle processing is carried out in the center region in the short direction, it is possible to realize a uniform ejection directionality.(C) Since multiple nozzles are simultaneously processed, the process efficiency can be improved.(D) The damper portion 11 is processed in a state where the energy density is small. Even when a special control is not conducted, therefore, the nozzle plate 2 is not penetrated.

Seventh Embodiment

FIG. 14 shows a damper portion in a seventh embodiment, FIG. 14A is a plan view as seen from the rear face, FIG. 14B is a section view taken along the line U-U in FIG. 14A, FIG. 14C is a section view taken along the line V-V in FIG. 14A, and FIG. 14D is a section view taken along the line W-W in FIG. 14A. FIG. 15A is a plan view showing an irradiation area of laser in laser processing, and FIG. 15B is a plan view showing a laser mask used in the laser processing.

The seventh embodiment is identical with the sixth embodiment except that specific values are provided to the components, and a damper portion corresponding to a nozzle is partitioned into plural portions, and exerts the same effects.

Eighth Embodiment

FIG. 16 shows a damper portion in an eighth embodiment, FIG. 16A is a plan view as seen from the rear face, FIG. 16B is a section view taken along the line X-X in FIG. 16A, FIG. 16C is a section view taken along the line Y-Y in FIG. 16A, and FIG. 16D is a section view taken along the line Z-Z in FIG. 16A. FIG. 17A is a plan view showing an irradiation area of laser in laser processing, and FIG. 17B is a plan view showing a laser mask used in the laser processing.

The eighth embodiment is identical with the sixth embodiment except that the laser mask shown in FIG. 17B is used while shifting two times, the nozzle 2a is formed by three irradations, the thin portion (the damper portion 11) is formed by one irradiation, and the thickness of the thin portion is equal to or less than ⅔ of that of the nozzle plate 2, and exerts the same effects.

In the embodiment, in the case where the width w4 of the damper portion 11 is set to be equal to or smaller than the pitch of the nozzle patterns (w1>w4), the thin portion has a shape such as shown in FIG. 16B, and, in the case of w1<w4, the laser processing is applied plural times on the damper portion 11 (this not shown), and hence a step is formed in the thin portion.

Ninth Embodiment

FIG. 18 shows a production method of another embodiment, FIG. 18A is a section view showing application of a photosensitive resin, FIG. 18B is a section view showing exposure in which a mask of the photosensitive resin is used, FIG. 18C is a section view showing formation of a step by development, and FIG. 18D is a section view showing formation of a nozzle.

In the ninth embodiment, as shown in FIG. 18A, a photosensitive resin 17 is first applied by the spin coat method onto a base film 16 made of a polyimide film. Next, as shown in FIG. 18B, the photosensitive resin 17 is exposed by using a mask 18, thereby curing an exposed portion of the photosensitive curable resin 17. Next, as shown in FIG. 18C, a development process is performed by a developer to remove away an uncured portion 19, thereby forming a step. Next, as shown in FIG. 18D, the nozzle 2a is processed by laser, and then joined to the other flow path member 13, thereby completing a liquid droplet ejection head.

(Effect of Ninth Embodiment)

A liquid droplet ejection head comprising a damper portion can be produced simply and economically.

Tenth Embodiment

Configuration of Color Printer

FIG. 19 is a diagram schematically showing a color printer to which a liquid droplet ejection apparatus of a tenth embodiment of the invention is applied. The color printer 100 has an approximately box-like case 101. A sheet-supply tray 20 which houses sheets P is disposed in a lower portion of the interior of the case 101, and a discharge tray 21 on which a recorded sheet P is to be discharged is disposed in an upper portion of the case 101. The printer has main transportation paths 31a to 31e which extend from the sheet-supply tray 20 to the discharge tray 21 via a recording position 102, and a transportation mechanism 30 which transports the sheet P along an inversion transport path 32 extending from the side of the discharge tray 21 to that of the recording position 102.

At the recording position 102, plural liquid droplet ejection heads 1 shown in FIG. 1 are juxtaposed to constitute a record head unit, and four record head units are arranged in the transportation direction of the sheet P as record head units 41Y, 41M, 41C, 41K respectively ejecting ink droplets of yellow (Y), magenta (M), cyan (C), and black (K), thereby constituting a record head array.

The color printer 100 comprises: a charging roll 43 which serves as attracting means for attracting the sheet P; a platen 44 which is opposed to the record head units via an endless belt 35; a maintenance unit 45 which is placed in the vicinity of the record head units 41Y, 41M, 41C, 41K; and a control unit which is not shown, which controls various portions of the color printer 100, and which applies a driving voltage on the basis of an image signal to the piezoelectric elements 8 of the liquid droplet ejection heads 1 constituting the record head units 41Y, 41M, 41C, 41K to eject ink droplets from the nozzles 2a, thereby recording a color image onto the sheet P.

The record head units 41Y, 41M, 41C, 41K have an effective printing region which is equal to or larger than the width of the sheet P. As the method of ejecting liquid droplets, the piezoelectric method is used. However, the method is not particularly restricted. For example, another usual method such as the thermal method may be adequately used.

Ink tanks 42Y, 42M, 42C, 42K which respectively store inks of colors corresponding to the record head units 41Y, 41M, 41C, 41K are placed above the record head units 41Y, 41M, 41C, 41K. The inks are supplied from the ink tanks 42Y, 42M, 42C, 42K to the liquid droplet ejection heads 1 through pipes which are not shown.

The inks stored in the ink tanks 42Y, 42M, 42C, 42K are not particularly restricted. For example, usual inks such as water-, oil-, and solvent-based inks may be adequately used.

The transportation mechanism 30 comprises: a pickup roll 33 which takes out one by one the sheet P from the sheet-supply tray 20 to supply the sheet to the main transportation path 31a; plural transportation rolls 34 which are placed in various portion of the main transportation paths 31a, 31b, 31d, 31e and inversion transport path 32, and which transport the sheet P; the endless belt 35 which is disposed at the recording position 102, and which transports the sheet P toward the discharge tray 21; driving and driven rolls 36, 37 around which the endless belt 35 is looped; and a driving motor which is not shown, and which drives the transportation rolls 34 and the driving roll 36.

(Operation of Color Printer)

Next, the operation of the color printer 100 will be described. Under the control of the control unit, the transportation mechanism 30 drives the pickup roll 33 and the transportation rolls 34, takes out the sheet P from the sheet-supply tray 20, and transports the sheet P along the main transportation paths 31a, 31b. When the sheet P reaches the vicinity of the endless belt 35, charges are applied to the sheet P by the charging roll 43, and the sheet P is attracted by an electrostatic force to the endless belt 35.

The endless belt 35 is rotated by the driving of the driving roll 36. When the sheet P is transported to the recording position 102, a color image is recorded by the record head units 41Y, 41M, 41C, 41K.

The liquid pools 3b of the liquid droplet ejection head 1 shown in FIG. 19 are filled with the inks supplied from the ink tanks 42Y, 42M, 42C, 42K, the inks are supplied from the liquid pools 3b to the pressure generating chambers 6a through the supply holes 4b and the supply paths 5b, and the inks are stored in the pressure generating chambers 6a. When the control unit selectively applies the driving voltage to the plural piezoelectric elements 8 on the basis of the image signal, the vibration plate 7 flexes in accordance with the deformation of the piezoelectric element 8. This causes the capacity of the pressure generating chamber 6a to be changed, and the ink stored in the pressure generating chamber 6a is ejected as an ink droplet from the nozzle 2a onto the sheet P through the communication holes 5a, 4a, 3, thereby recording an image onto the sheet P. Images of Y, M, C, and K are sequentially superimposed on the sheet P, and a color image is recorded. In this case, the damper portion 11 is formed in the nozzle plate 2, and hence variation of the ejection amount of liquid droplets is absorbed, so that stable ejection and printing of high quality can be realized simply and economically.

The sheet P on which the color image has been recorded is discharged by the transportation mechanism 30 to the discharge tray 21 via the main transportation path 31d.

In the case where the double-sided recording mode is set, the sheet P which has been once discharged to the discharge tray 21 is returned to the main transportation path 31e, and transported through the inversion transport path 32 and again through the main transportation path 31b to the recording position 102. A color image is recorded on the face of the sheet P that is opposite to the face on which recording has been previously performed, by the record head units 41Y, 41M, 41C, 41K.

The invention is not restricted to the above-described embodiments and examples, and may be variously modified without departing from the spirit of the invention.

In the embodiment, for example, the protection member 9 is used. Alternatively, the protection member 9 may not be used. As the protection member 9, SUS is used. Alternatively, a resin may be used. The laser processing for the thin portion, and that for the nozzle are simultaneously carried out. Alternatively, the processings may be separately carried out.

The liquid droplet ejection head, apparatus for ejecting liquid droplets, and method of producing a liquid droplet ejection head of the invention are effectively used in various industrial fields in which high-resolution patterns of image information are requested to be formed by ejecting liquid droplets, such as the electric and electronic industry field in which, for example, a color filter for a display device is formed by ejecting inks onto the surface of a polymer film or glass by using the inkjet method, bumps for mounting components are formed by ejecting solder paste onto a circuit board, and wirings are formed on a circuit board, and the medical field in which bio chips for checking reaction with a sample are produced by ejecting a reaction reagent to a glass substrate or the like.

Claims

1. A method of producing liquid droplet ejection head comprising: joining a flow path member plate and a protection member plate to opposite faces of a plate for nozzles, the protection member plate being disposed on a surface of the plate for nozzles that is on a liquid droplet ejection side of the plate for nozzles;a first forming step including forming a flow path member including at least the flow path member plate, the flow path member having liquid supply paths and a damper portion in at least one part of a region, the region being on the plate for nozzles, corresponding to the liquid supply paths by etching a predetermined pattern into at least the flow path member plate, the damper portion reducing a fluctuation of an ejection amount of the liquid droplets to enable stable ejection;after the first forming step, a second forming step including forming a nozzle plate by performing laser processing on the plate for nozzles from a side of the flow path member to form the nozzles;wherein the protection member plate is separate from the damper portion and is in a periphery of the nozzles and at least one part of the damper portion, andthe damper portion is formed to include a damper reinforcement portion comprising a first part of the damper portion in which the protection member is disposed, and a damper function portion comprising a second part of the damper portion in which the protection member is not disposed, the second part of the damper portion being distinct from the first part of the damper portion.

2. The method for producing liquid droplet ejection head as claimed in claim 1, whereinthe plate for nozzles in joining comprises a flexible plate, andthe damper portion in the first joining has a same thickness as the nozzle plate in a stacking direction of the plates.

3. The method for producing liquid droplet ejection head as claimed in claim 1, wherein the damper portion in the first forming step comprises a thin portion formed by reducing a thickness of the nozzle plate.

4. The method for producing liquid droplet ejection head as claimed in claim 3, wherein the thin portion in the first forming step is independently disposed so as to correspond to at least one of the nozzles.

5. The method for producing liquid droplet ejection head as claimed in claim 3, whereinthe thin portion in the first forming step is formed by performing laser processing, andthe laser processing on the thin portion in the first forming step is simultaneously performed with the laser processing on the nozzles in the second forming step.

6. The method for producing liquid droplet ejection head as claimed in claim 5, whereinthe laser processing on the thin portion in the first forming step, and the laser processing on the nozzles in the second forming step are performed by using a mask,whereinthe mask comprises: thin portion openings of n or less; andnozzle openings of from 2 to n, provided that n is a natural number.

7. A method for producing liquid droplet ejection head comprising: joining a flow path member plate and a protection member plate to opposite faces of a plate for nozzles, the protection member plate being disposed on a surface of the plate for nozzles that is on a liquid droplet ejection side of the plate for nozzles;a first forming step including forming a flow path member including at least the flow path member plate, the flow path member having liquid supply paths and a damper portion in at least one part of a region corresponding to the liquid supply paths by etching a predetermined pattern into at least the flow path member plate, the damper portion reducing a fluctuation of an ejection amount of the liquid droplets to enable stable ejection;after the first forming step, a second forming step including forming a protection member in at least one part of a periphery of a portion, where nozzles are to be formed, of a surface of the plate for nozzles on a liquid droplet ejection side, and partitioning the damper portion into a damper reinforcement portion and a damper function portion by etching a predetermined pattern into at least one part of the protection member plate; andafter the second forming step, a third forming step including forming a nozzle plate by performing laser processing on the plate for nozzles from a side of the flow path member to form the nozzles;wherein the protection member plate is separate from the damper portion and is in a periphery of the nozzles and at least one part of the damper portion, andthe damper reinforcement portion comprises a first part of the damper portion in which the protection member is disposed, and the damper function portion comprises a second part of the damper portion in which the protection member is not disposed, the second part of the damper portion being distinct from the first part of the damper portion.

8. The method for producing liquid droplet ejection head as claimed in claim 7, whereinthe plate for nozzles in the joining comprises a flexible plate, andthe damper portion has a same thickness as the nozzle plate in a stacking direction of the plates.

9. The method for producing liquid droplet ejection head as claimed in claim 7, wherein the etching of the flow path member plate in the first forming step is simultaneously performed with the etching of the protection member plate in the second forming step.

10. The method for producing liquid droplet ejection head as claimed in claim 7, wherein the damper portion in the first forming step comprises a thin portion formed by reducing a thickness of the nozzle plate.

11. The method for producing liquid droplet ejection head as claimed in claim 7, wherein the thin portion in the first forming step is independently disposed so as to correspond to at least one of the nozzles.

12. The method for producing liquid droplet ejection head as claimed in claim 7, whereinthe thin portion in the first forming step is formed by performing laser processing, andthe laser processing on the thin portion in the first forming step is simultaneously performed with the laser processing on the nozzles in the third forming step.

13. The method for producing liquid droplet ejection head as claimed in claim 12, whereinthe laser processing on the thin portion in the first forming step, and the laser processing on the nozzles in the third forming step are performed by using a mask,whereinthe mask comprises: thin portion openings of n or less; andnozzle openings of from 2 to n, provided that n is a natural number.