Claims
- 1. A method of lapping a body to be lapped, comprising the steps of preparing a lapping member having a substrate and an abrasive layer formed on said substrate which abrasive layer includes at least two kinds of abrasive material different from each other in hardness, and lapping said body by use of said lapping member.
- 2. A method of lapping according to claim 1, wherein said lapping member is a lapping tape having a flexible substrate.
- 3. A method of lapping according to claim 1 or 2, wherein said abrasive materials include diamond and one kind selected from the group consisting of Al.sub.2 O.sub.3 and SiC.
- 4. A method of lapping according to claim 3, wherein the content of said diamond is not more than about 10 wt %, the content of said one kind selected from the group consisting of Al.sub.2 O.sub.3 and SiC being in a range of about 40% to about 89%.
- 5. A method of lapping according to claim 4, wherein said abrasive materials exist in a form of clusters in the abrasive layer, recesses being formed between the clusters.
- 6. A method of lapping according to claims 1 or 2, wherein the abrasive materials include diamond and a substance having a hardness lower than the diamond.
- 7. A method of lapping a body to be lapped, comprising the steps of preparing a lapping tape including a first abrasive material having a hardness not less than that of a hardest material constituting a surface portion of said body and a second abrasive material having a hardness lower than that of the hardest material constituting said surface portion of said body, and lapping said body by use of said tape.
- 8. A method of lapping a body to be lapped, comprising the steps of preparing a lapping tape including a first abrasive material having hardness not less than that of a hardest material constituting a surface portion of said body and a second abrasive material having a hardness lower than that of said first abrasive material.
- 9. A method of lapping according to claim 7 or 8, wherein said body to be lapped is a magnetic disk having a magnetic layer, said method further comprising the steps of rotating the magnetic disk, contacting the lapping tape with the surface of the rotating disk, and moving the lapping tape in contact with the rotating magnetic disk.
- 10. A method comprising the steps of:
- preparing a lapping tape having an abrasive material layer provided with abrasive material clusters and chip pockets having an area of about 15-about 30% of entire surface of said layer formed between adjacent two clusters, each of said clusters having abrasive material of Al.sub.2 O.sub.3 or SiC and abrasive material of diamond, and binder resin said abrasive material layer comprising about 40 to about 89% by weight Al.sub.2 O.sub.3 of SiC abrasive material, and less than about 10% be weight diamond abrasive material, and
- lapping the surface of said magnetic disk medium by using the thus prepared lapping tape.
Priority Claims (1)
Number |
Date |
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60-266926 |
Nov 1985 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 07/369,680, filed Jun. 21, 1989, which is a continuation of application Ser. No. 07/203,098, U.S. Pat. No. 4,842,618 filed Jun. 7, 1988 which is a continuation of application Ser. No. 06/935,336, filed Nov. 26, 1986, U.S. Pat. No. 4,762,534.
US Referenced Citations (8)
Divisions (1)
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Date |
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369680 |
Jun 1989 |
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Continuations (2)
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203098 |
Jun 1988 |
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Parent |
935336 |
Nov 1986 |
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