10 soft magnetic particle, 10a surface, 20 insulating film, 30 composite magnetic particle, 40 organic matter.
Embodiments of the present invention will be described with reference to the drawings.
Referring to
Soft magnetic particle 10 can be made of, for example, iron (Fe), an iron (Fe)-silicon (Si) alloy, an iron (Fe)-nitrogen (N) alloy, an iron (Fe)-nickel (Ni) alloy, an iron (Fe)-carbon (C) alloy, an iron (Fe)-boron (B) alloy, an iron (Fe)-cobalt (Co) alloy, an iron (Fe)-phosphorus (P) alloy, an iron (Fe)-nickel (Ni)-cobalt (Co) alloy, an iron (Fe)-aluminum (Al)-silicon (Si) alloy and the like. Soft magnetic particle 10 may be of a simple substance of metal or an alloy.
Insulating film 20 is formed, for example, by treating soft magnetic particle 10 with phosphoric acid. Further, insulating film 20 preferably contains an oxide. As insulating film 20 containing the oxide, an oxide insulator can be used, such as, in addition to iron phosphate containing phosphorus and iron, manganese phosphate, zinc phosphate, calcium phosphate, aluminum phosphate, silicon oxide, titanium oxide, aluminum oxide, or zirconium oxide. Insulating film 20 may be formed in a single layer as shown in the drawing, or may be formed in multiple layers.
Insulating film 20 serves as an insulating layer between soft magnetic particles 10. By covering soft magnetic particle 10 with insulating film 20, electric resistivity ρ of the dust core can be increased. Thus, eddy current can be prevented from flowing between soft magnetic particles 10, to thereby reduce iron loss of the dust core resulting from the eddy current.
As organic matter 40, thermoplastic resin such as thermoplastic polyimide, thermoplastic polyamide, thermoplastic polyamidimide, polyphenylene sulfide, polyamidimide, polyethersulfone, polyether imide or polyetheretherketone; non-thermoplastic resin such as wholly aromatic polyester or wholly aromatic polyimide; and higher fatty acid such as high-molecular-weight polyethylene, zinc stearate, lithium stearate, calcium stearate, lithium palmitate, calcium palmitate, lithium oleate and calcium oleate can be employed. These can also be employed in combination with each other. A high-molecular-weight polyethylene refers to a polyethylene having a molecular weight of not less than 100,000.
A method of producing a soft magnetic material according to the embodiment will then be described using
Referring to
Referring to
The above-described etching process removes the surface of soft magnetic particle 10 along a predetermined depth from surface 10a, to thereby remove surface layer micrograin 57 formed in soft magnetic particle 10 from soft magnetic particle 10. In this case, the etching process is preferably performed such that the average particle size of the soft magnetic powder after the etching process takes a value of not less than 90% of the average particle size of the soft magnetic powder before the etching process. The average particle size described herein refers to a particle size obtained when the sum of masses of particles added in ascending order of particle size in a histogram of particle sizes measured by a laser scatter diffraction method and the like reaches 50% of the total mass, that is, 50% particle size D.
It is also preferable that, after the etching process, the particle size of soft magnetic particle 10 is substantially distributed only in the range of not less than 10 μm and not more than 400 μm. In this case, any particle with a size of less than 10 μm and any particle with a size of greater than 400 μm may be forcefully removed from the soft magnetic powder after the etching process, by using a sieve with appropriate mesh size. It is further preferable that the particle size of soft magnetic particle 10 is substantially distributed only in the range of not less than 75 μm and not more than 355 μm.
The soft magnetic powder subjected to the etching process is then washed, and the soft magnetic powder is subsequently dried by replacing moisture with acetone.
Referring to
Referring to
The obtained mixed powder is then introduced into a mold and pressure-formed under a pressure of 700 MPa to 1500 MPa, for example. This results in compression of the mixed powder to create a compact. The mixed powder is preferably pressure-formed in an inert gas atmosphere or a decompressed atmosphere. In this case, the mixed powder can be prevented from oxidation by oxygen in the atmosphere. This pressure-forming causes strain 61 to be newly created in soft magnetic particle 10.
In this case, most of surface layer micrograin boundary 53 and subgrain boundary 52 originally existing within soft magnetic particle 10 are eliminated by the etching process as described using
Referring to
In this case, since most of surface layer micrograin boundary 53 and subgrain boundary 52 originally existing within soft magnetic particle 10 are eliminated, the amount of the grain discontinuities within the compact is relatively small even after the pressure-forming. Furthermore, since there are few grain discontinuities within soft magnetic particle 10 in the pressure-forming, new strain 61 is created without complexly intertwining with these grain discontinuities. For these reasons, the grain discontinuities existing within the compact can be easily reduced despite that the heat treatment is carried out at a relatively low temperature of less than the thermal decomposition temperature of insulating film 20.
Since the heat treatment on the compact is performed at a temperature of less than the thermal decomposition temperature of insulating film 20, the heat treatment does not lead to deterioration of insulating film 20. This keeps insulating film 20 covering soft magnetic particle 10 even after the heat treatment, and allows insulating film 20 to reliably prevent an eddy current from flowing between soft magnetic particles 10. More preferably, the compact obtained by the pressure-forming is heat-treated at a temperature of not less than 30° C. and not more than 300° C. In this case, insulating film 20 can be further prevented from deterioration.
The resulting compact is thereafter subjected to an appropriate treatment such as extrusion or cutting to provide a finished dust core as shown in
The method of producing the soft magnetic material according to the embodiment of the present invention includes the steps of preparing the soft magnetic powder containing the plurality of soft magnetic particles 10, etching the soft magnetic powder to remove surfaces 10a of soft magnetic particles 10, and, after the etching step, performing the heat treatment of the soft magnetic powder in a finely divided state at a temperature of not less than 400° C. and not more than 900° C.
According to the method of producing the soft magnetic material configured as above, soft magnetic particle 10 before the pressure-forming is subjected to the etching process and also to the heat treatment at a predetermined range of the temperature, to allow production of the dust core with the grain discontinuities well eliminated. This allows hysteresis loss of the dust core to be reduced. Since the heat treatment to the soft magnetic powder is carried out before insulating film 20 is formed on soft magnetic particle 10, the heat treatment does not lead to deterioration of insulating film 20. Furthermore, since the heat treatment to the compact is carried out at a temperature of less than the thermal decomposition temperature of insulating film 20, deterioration of insulating film 20 by the heat treatment is also suppressed. This allows insulating film 20 to serve well as an insulating layer between soft magnetic particles 10 and eddy current loss of the dust core to be reduced. As a result, iron loss of the dust core can be significantly reduced through reduction in hysteresis loss and eddy current loss.
The method of producing the soft magnetic material according to the present invention was evaluated by the examples described below.
According to the producing method described in the embodiment, the soft magnetic powder was first subjected to the etching process. In this case, as soft magnetic particle 10, water-atomized iron powder with a purity of not less than 99.8% (product name “ABC100.30” manufactured by Hoganas AB) was used. The etching process was carried out by preparing hydrogen chloride aqueous solution with a concentration of 3% by mass (600 cm3), introducing 200 grams of the soft magnetic powder into the solution and stirring the solution. In this case, different stirring times in a range of 10 minutes to 300 minutes were employed to produce the plurality of soft magnetic powders which were subjected to the etching process under different conditions. The soft magnetic powder which was not subjected to the etching process was also prepared for comparison purposes.
The average particle size and coercivity of the soft magnetic powder produced as above were measured. When the coercivity was measured, a resin binder was first used to solidify the soft magnetic powder and produce a pellet (20 mm in diameter, 5 mm in thickness). A magnetic field was applied to the pellet in the sequence of 1 (T: tesla), −1 T, 1 T and −1 T, and a vibrating sample magnetometer (VSM) was used to specify the shape of a B (magnetic flux) H (magnetic field) loop at the time. From the shape of this BH loop was calculated the coercivity of the pellet whose value was assumed to be the coercivity of the soft magnetic powder.
The soft magnetic powder was then subjected to the heat treatment under conditions at a temperature of 850° C. in a hydrogen gas stream for one hour. The coercivity of the soft magnetic powder after the heat treatment was measured by the similar method as above.
The soft magnetic powder was then covered with a film to form a phosphate iron film as insulating film 20 on the surface of soft magnetic particle 10. Polyphenylene sulfide (PPS resin) was added to the soft magnetic powder covered with the film in a proportion of 1% by mass relative to the soft magnetic powder, and mixed together. The resulting mixed powder was press-formed at a surface pressure of 13 ton/cm2 to produce the compact in a ring shape (34 mm in outer diameter, 20 mm in inner diameter, 5 mm in thickness). By winding a coil around the obtained compact (300 turns for the primary and 20 turns for the secondary) and applying a magnetic field to the compact, the coercivity and the magnetic permeability of the compact were measured.
The compact was then subjected to the heat treatment under conditions at a temperature of 550° C. in a nitrogen gas stream for one hour. The coercivity and the magnetic permeability of the compact after the heat treatment was measured by the similar method as above. Values of the coercivity and the magnetic permeability of the soft magnetic powder and the compact obtained by the above-described measurement are shown in Table 1.
As can be seen from Table 1, the soft magnetic powder with the stirring time of not more than 60 minutes achieved the average particle size which was kept to a value of not less than 90% relative to the average particle size before the etching process. In this case, the coercivity after the heat treatment could be reduced as compared to the soft magnetic powder which was not subjected to the etching process. In particular, the coercivity could be effectively reduced with the stirring time in the range of 30 to 40 minutes. It is thought that the reason why the coercivity was increased with increasing stirring time in the range of not less than 60 minutes was that soft magnetic particle 10 with the particle size reduced too much caused the effects of the shape diamagnetic field and stress strain by surface energy to exceed the effect of eliminating the surface layer micrograin boundary by the etching process.
More specifically, if no processing was performed, the original coercivity of the soft magnetic powder was 2.86 (Oe: oersted). If the heat treatment was performed, a coercivity of 2.20 (Oe) was achieved, which was about 77% of the original coercivity. On the other hand, when stirring was performed for 30 minutes in the etching process, the coercivity after the heat treatment was 1.95 (Oe), which was a value of about 68% relative to 2.86 (Oe). Thus, it was possible to confirm that the coercivity of the soft magnetic powder could be reduced to a value of not more than 70% according to the present invention.
In accordance with the reduced coercivity of the soft magnetic powder as described above, each coercivity of the compact obtained by the pressure forming and the compact further subjected to the heat treatment could be reduced and each magnetic permeability thereof could be increased. Particularly in the case of the processing time in the range of 30 minutes to 40 minutes, the coercivity of the compact after the heat treatment could be reduced to a value of not more than 1.30 (Oe) (=1.0×102 A/m).
In the present example, the soft magnetic powder which was used in Example 1 and was not subjected to the etching process and the soft magnetic powder which was stirred for 30 minutes in the etching process were subjected to the heat treatment under conditions at different heat treatment temperatures in the hydrogen gas stream for one hour. Each coercivity of the soft magnetic powder treated at respective heat treatment temperatures was measured by a method similar to that of Example 1. Values of each coercivity obtained by the measurement are shown in Table 2 and plotted values are shown in
Referring to Table 2 and
It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
The present invention is applicable in manufacturing motor cores, electromagnetic valves, reactors or other electromagnetic components fabricated from pressure-formed soft magnetic powder, for example.
Number | Date | Country | Kind |
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2004-099709 | Mar 2004 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP05/05885 | 3/29/2005 | WO | 00 | 9/29/2006 |