Claims
- 1. A method for making a Ru-oxide film on a substrate, comprising:
- solubilizing a metal compound in a Lewis base to form a homogeneous metal-oxide precursor solution, said metal compound selected from the group consisting of Ru diketonates and Ru carboxylates;
- depositing the metal-oxide precursor solution as a film on a substrate; and sintering the film on the substrate at a temperature between 450.degree. C. and 700.degree. C. to make a Ru-oxide film.
- 2. The method of claim 1 wherein the Lewis base is an amine solvent.
- 3. The method of claim 1 wherein the Lewis base is selected from the group consisting of pyridine, 1-methylimidizole, dimethylformamide, and diethylamine.
- 4. The method of claim 1 wherein the metal diketonate is a metal acetylacetate.
- 5. The method of claim 1 wherein the step of depositing the precursor solution as a film on a substrate is by spin-cast or dip-cast deposition.
- 6. The method of claim 5 wherein the substrate is selected from a group consisting of silicon, Au, Ti, and Pt.
- 7. The method of claim 5, wherein the step of depositing the precursor solution as a film on a substrate comprises spin-cast deposition of the film in successive layers, one on top of the other, each layer being heat treated under ambient atmosphere at about 300.degree. C. for about 5 minutes and allowed to cool before deposition of the next layer.
- 8. The method of claim 1 wherein the Lewis base is mixed with a carboxylate acid.
- 9. The method of claim 8 wherein the carboxylate acid is acetic acid.
- 10. The method of claim 1 wherein the Lewis base is mixed with a solvent used to improve wettability characteristics.
- 11. The method of claim 10 wherein the solvent is toluene.
- 12. The method of claim 1 wherein the Lewis base is mixed with at least one modifier to reduce the volatility of the precursor solution.
- 13. The method of claim 12 wherein the at least one modifier is selected from the group consisting of nitric acid and phosphoric acid.
- 14. The method of claim 1 wherein the solubilizing of the metal compound occurs at a temperature from approximately 30.degree. C. to 120.degree. C.
- 15. The method of claim 5, further comprising the step of heating the film at a temperature between approximately 100.degree. C. and 300.degree. C.
- 16. The method of claim 1 wherein the metal compound is Ru((OC(CH.sub.3)).sub.2 CH.sub.2).sub.3 and the Lewis base is pyridine, said pyridine mixed with toluene.
Government Interests
This invention was made with Government support under Contract No. DEAC04-94AL85000 awarded by the Department of Energy. The Government has certain rights in the invention.
US Referenced Citations (8)