Claims
- 1. A method of manufacturing a plate for a microelectronic device, said plate comprising a non-metallic material having a predefined pattern of precisely-positioned passages or cavities in which charged particles are guided, characterized in that the passages or cavities are made by means of the following steps:
- a. securing to the plate, by means of an adhesive layer, a mask having apertures arranged in the predefined pattern and having areas substantially corresponding to cross-sectional areas of the passages or cavities, said adhesive layer having a predetermined thickness;
- b. producing at least one jet of abrasive-powder particles having a predetermined average size;
- c. directing the at least one jet at a surface of the plate through the apertures in the mask;
- d. performing a relative movement between the at least one jet and the plate to effect formation of the cavities; and
- e. removing the mask from the plate;
- said adhesive layer thickness being smaller than said abrasive-powder particle size.
- 2. A method as in claim 1 where the mask comprises a metallic material.
- 3. A method as in claim 1 where the plate comprises a brittle material.
- 4. A method as in claim 3 where the plate comprises an electrically-insulating material.
- 5. A method as in claim 1 where the adhesive layer thickness is smaller than one-half of the abrasive-powder particle size.
- 6. A method as in claim 5 where the adhesive layer thickness is smaller than one-third of the abrasive-powder particle size.
- 7. A method as in claim 1 where the adhesive layer consists essentially of a glucose-based material.
- 8. A method as in claim 1 where the adhesive layer consists essentially of an acetate-based material.
- 9. A method as in claim 1 where the microelectronic device comprises a display device.
- 10. A method of manufacturing a disc for a diode from a plate, said method comprising:
- a. securing a mask to the plate by means of an adhesive layer having a predetermined thickness;
- b. producing at least one jet of abrasive-powder particles having a predetermined average size;
- c. directing the at least one jet at a surface of the plate through the mask;
- d. performing a relative movement between the at least one jet and the plate to effect formation of the discs; and
- e. removing the mask from the plate;
- said adhesive layer thickness being smaller than said abrasive-powder particle size.
- 11. A method as in claim 10 where the mask comprises a metallic material.
- 12. A method as in claim 10 where the plate comprises a brittle material.
- 13. A method as in claim 12 where the plate comprises an electrically-insulating material.
- 14. A method as in claim 10 where the adhesive layer thickness is smaller than one-half of the abrasive-powder particle size.
- 15. A method as in claim 14 where the adhesive layer thickness is smaller than one-third of the abrasive-powder particle size.
- 16. A method as in claim 10 where the adhesive layer consists essentially of a glucose-based material.
- 17. A method as in claim 10 where the adhesive layer consists essentially of an acetate-based material.
Priority Claims (1)
Number |
Date |
Country |
Kind |
09301422 |
Dec 1993 |
BEX |
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Parent Case Info
This is a continuation of application Ser. No. 08/359,377, filed Dec. 20, 1994 now U.S. Pat. No. 5,593,528.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4232059 |
Proffitt |
Nov 1980 |
|
5593528 |
Dings et al. |
Jan 1997 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
562670 |
Sep 1993 |
EPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
359377 |
Dec 1994 |
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