Claims
- 1. A method for removing a Ti-derived film, comprising:heating an aqueous solution containing an alkali hydroxide having a pH of 10 or greater to a predetermined temperature; immersing an electrode and a member coated with the Ti-derived film in the solution at the predetermined temperature; and applying a positive potential to the member, and a negative potential to the electrode.
- 2. The method for removing a Ti-derived film as claimed in claim 1, wherein the temperature of the aqueous solution is kept not higher than the boiling temperature of the aqueous solution.
- 3. The method for removing a Ti-derived film as claimed in claim 1, wherein the aqueous solution is kept at a predetermined temperature by initially raising its temperature by heating, and then raising its temperature by the heat of reaction.
- 4. The method for removing a Ti-derived film as claimed in claim 1, wherein the solution is a solution of an alkali hydroxide melted in a solvent consisting of a molten salt and an organic solvent.
- 5. The method for removing a Ti-derived film as claimed in claim 1, wherein the Ti-derived film is a film of titanium-aluminum nitride (TiA1N).
- 6. The method for removing a Ti-derived film as claimed in claim 1, wherein the solution is an aqueous solution containing an alkali hydroxide and hydrogen peroxide.
- 7. An apparatus for removing a Ti-derived film, comprising:a tank for holding an aqueous solution containing an alkali hydroxide having a pH of 10 or greater; a heating means for heating the solution in the tank to a predetermined temperature or higher; an electrode adapted for immersion in the solution; and a power source for applying a positive potential to a member coated with the Ti-derived film, and applying a negative potential to the electrode.
- 8. The apparatus for removing a Ti-derived film as claimed in claim 7, wherein the tank is provided with a temperature control means for controlling the temperature of the aqueous solution to a temperature not lower than the predetermined temperature but not higher than the boiling temperature of the aqueous solution.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-031018 |
Feb 1998 |
JP |
|
Parent Case Info
This application is the national phase under 35 U.S.C. §371 of PCT International Application No. PCT/JP99/00588 which has an International filing date of Feb. 12, 1999, which designated the United States of America.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP99/00588 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO99/41435 |
8/19/1999 |
WO |
A |
US Referenced Citations (4)