Patent Application
20140174821
1. Field of the Invention
The instant disclosure relates to a method of retaining a solder material to a solder terminal; in particular, the structure of the solder material and terminal assembled in an adaptor.
2. Description of Related Art
As technology advances, electronic components are becoming increasingly miniaturized. Consequently, soldering precision of miniaturized electronic components is becoming a greater challenge for surface mount technology (SMT).
To retain solder materials onto a solder terminal, one of the conventional approaches includes dipping the solder terminal into a sphere-shaped solder material. However, with the conventional approach, soldering material is highly susceptible to fall off from the solder terminal which leads to poor quality of welding. Another approach disposes the solder material onto the side surface of the solder terminal. However, since the position of the solder materials is susceptible to shift from the solder terminal, welding accuracy is hindered unless a welder resets and fine-tunes the positioning of the solder materials. Based on today's miniaturization trend, soldering accuracy is critical to production especially when electronic components are in close proximity.
To address the above issues, the inventor strives via associated experience and research to present the instant disclosure, which can effectively improve the limitation described above.
The main purpose of the instant disclosure is to provide a method for retaining a solder material on a solder terminal and adaptor thereof to overcome the aforementioned issues.
In order to achieve the aforementioned objectives, the method of retaining a solder material to a solder terminal includes the following steps: Firstly, a solder terminal is provided which includes a first surface, a second surface opposite to the first surface, and a side connecting the first and second surfaces. Additionally, the solder terminal is formed with a retaining hole. Secondly, a solder material is provided which includes a winding portion and a connecting portion extending from the winding portion. Thirdly, the winding portion is selectively arranged around the solder terminal along the first, second surfaces, and side while the connecting portion through the retaining hole. Finally, the connecting portion is bent towards the winding portion to resemble a hook shaped hanger.
To achieve the method mentioned above, the instant disclosure provides a solder material retained to a solder terminal that includes a first surface, a second surface and a side. Furthermore, the solder terminal is formed with a retaining hole allowing the engagement of solder material. The solder material includes a winding portion and a connection portion extending from the winding portion. The winding portion arranges around the solder terminal along the first surface, the second surface, and the side. Specifically, the winding portion includes a bent portion arranging proximately to the side and the connection portion bends and engages through the retaining hole in a hook-like fashion to retain to the solder terminal.
The instant disclosure further includes an adaptor having an insulator and an assembled soldering terminal interface which extends from the insulator. The assembled soldering terminal interface includes a plurality of solder terminals and a plurality of solder materials.
In summary, the instant disclosure not only efficiently stabilizes the connection between the solder terminal and the solder material, but also significantly reduces the chances of solder material from falling off of the solder terminal. Therefore, with the adaptor mentioned in the instant disclosure, more reliable connection can be more readily attained compared to the conventional solder contact.
In order to further understand the method and structure of retaining a solder material to a solder terminal, the following embodiments are provided along with illustrations to facilitate the disclosure. However, the detailed description and drawings are merely illustrative of the disclosure, rather than limiting the scope being defined by the appended claims and equivalents thereof.
The aforementioned illustrations and detailed descriptions are exemplary for the purpose of further explaining the scope of the present disclosure. Other objectives and advantages related to the present disclosure will be illustrated in the subsequent descriptions and appended drawings.
In
S101: Providing a solder terminal 10 including a first surface 11, a second surface 12 opposite to the first surface 11, and a side 13 connecting the first and second surfaces 11, 12. Furthermore, the solder terminal 10 is formed with a retaining hole 14.
S103: Providing a solder material 20 including a winding portion 21 and a connecting portion 211 extending from the winding portion 21.
S105: Arranging selectively the winding portion 21 around the solder terminal 10 along the first, second surfaces 11, 12, and side 13 while the connecting portion 211 through the retaining hole 14.
S107: Bending the connecting portion 211 towards the winding portion 21 to resemble a hook shaped hanger.
In the step S105, referring to
As illustrated in
The connection portion 211 engages with the solder terminal 10 through the retaining hole 14 and abuts the winding portion 21 in a hook-like fashion thus stabilizing the retaining of the solder material 20 on the solder terminal 10.
Please refer to
The solder material 20 in the first embodiment has a uniform cross-section throughout the length of the structure and includes a winding portion 21 and a connection portion 211 extending there-from. Furthermore, as shown in
Furthermore, the winding portion 21 includes a bent portion 212 which is arranged around the side 13. Specifically, the winding portion 21 is folded toward the first surface 11, further bent onto the side 13, and finally turned onto the second surface 12.
As illustrated in
In addition, the bent portion 212 may also be formed with a bent portion groove 2120. As shown in
Furthermore, in the second embodiment, the bent portion 212 may be arranged proximate to the side 13 with a predetermined distance in between to prevent the winding portion 21 from fracture due to the stress cause by sharp bending.
As illustrated in
Each of the plurality of the solder terminals 10 has a first surface 11, a second surface 12, and a side 13. Each of the solder terminals 10 is also formed with a retaining hole 14 which communicates the first surface 11 and the second surface 12.
Each of the plurality of the solder materials 20 has a winding portion 21 which passes through the retaining hole 14 and hangs on the solder terminal 10. In details, the winding portion 21 wraps around the solder terminal 10 along the first surface 11, the second surface 12, and the side 13. The winding portion 21 includes a bent portion 212 covering proximately to the side 13. Thus, the assembled soldering terminal interface W is formed on the insulator Q. In addition, the bent portion 212 is preferably arranged around the side 13 with a predetermined distance in between and the distance there-between is not limited thereto.
It is worth mentioned that the adaptor C and the assembled soldering terminal interface W can utilize either form of the aforementioned solder materials.
In summary, the method the structure of retaining the soldering material 20 on the solder terminal 10 with adaptors thereof allows solder materials to be effectively deposited onto the solder terminal. Thus, the instant disclosure reduces space required, eliminates the need for additional positioning adjustments during welding, effectively simplifies welding process and ensures welding efficiency.
The descriptions illustrated supra set forth simply the preferred embodiments of the present disclosure; however, the characteristics of the present disclosure are by no means restricted thereto. All changes, alternations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the present disclosure delineated by the following claims.
