Method of sealing a glass envelope

Abstract

A method of sealing a glass package comprising providing a first glass substrate, the first substrate having first and second alignment marks. A second glass substrate having third and fourth alignment marks is aligned to the first substrate by translating the first substrate relative to the second substrate, and aligning the second and fourth alignment marks by rotating the first substrate relative to the second substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an apparatus for assembling and sealing glass substrates to form a glass envelope according to an embodiment of the present invention;

FIG. 2 is an top-down illustration of the movement (translation and rotation) of a first substrate relative to a second substrate using alignment marks to align the first and second substrates.

FIG. 3 is a top view of first and second substrates, showing exemplary positioning of OLED devices and frit walls, and exemplary positioning of alignment marks.

FIG. 4 is a cross sectional view of a first substrate having OLED devices disposed thereon, and it's positioning relative to a second substrate having frit walls disposed thereon, prior to final assembly and sealing.

FIG. 5 is a perspective view of an apparatus for assembly and sealing of glass substrates to form a glass envelope

FIG. 6 is a partial perspective view of the apparatus of FIG. 5 showing the rail and sealing systems.

FIG. 7 is a diagrammatic view of an assembly and sealing system in accordance with an embodiment of the present invention

Claims

1. A method of sealing a glass envelope comprising the steps of: providing a first glass substrate, the first substrate having first and second alignment marks;aligning a second glass substrate to the first substrate, the second substrate having third and fourth alignment marks, and comprising at least one frit wall disposed thereon;sealing the first and second substrates by heating and melting the at least one frit wall with a laser; andwherein the step of aligning comprises aligning the first and third alignment marks by translating the first substrate relative to the second substrate, and aligning the second and fourth alignment marks by rotating the first substrate relative to the second substrate.

2. The method according to claim 1 further comprising prior to the step of sealing, aligning a mask on the first and second substrates.

3. The method according to claim 2 further comprising disposing a transparent pressure plate over the mask.

4. The method according to claim 1 further comprising disposing a transparent pressure plate over the second substrate.

5. The method according to claim 4 wherein the pressure plate comprises a mask.

6. The method according to claim 1 further comprising placing the first substrate on a rotatable alignment table such that the first alignment mark is coincident with an axis of rotation of the alignment table.

7. The method according to claim 1 wherein the first substrate comprises at least one organic light emitting diode (OLED) device.

8. The method according to claim 1 wherein the alignment of the first and third alignment marks is within ±20 μm.

9. The method according to claim 1 wherein the alignment of the second and fourth alignment marks is within ±20 μm.

10. The method according to claim 6 further comprising constraining the first substrate to the alignment table by a vacuum.

11. The method according to claim 1 further comprising heating the at least one frit wall prior to the aligning step to sinter the frit wall.

12. A method of sealing a display device comprising: positioning a first substrate comprising first and second alignment marks on an alignment table having an axis of rotation such that the axis of rotation passes through the first alignment mark;positioning a second substrate comprising third and fourth alignment marks over the first substrate, the second substrate including a frit deposited thereon;aligning the first alignment mark with the third alignment mark;rotating the first substrate about the axis of rotation to align the second alignment mark with the fourth alignment mark; andheating the frit with a laser beam to melt the frit and form a hermetic seal between the first and second substrates.

13. The method according to claim 12 further comprising constraining the first substrate on the alignment table by a vacuum.

14. The method according to claim 12 further comprising aligning a mask to the second substrate.

15. The method according to claim 12 further comprising disposing a pressure plate over the second substrate, the pressure plate being substantially transparent to a wavelength of the laser light.

16. The method according to claim 12 wherein the first substrate comprises at least one organic light emitting diode (OLED) device.

17. An apparatus for sealing a glass envelope comprising: a rotatably mounted alignment table configured to be translated along at least two orthogonal directions, a first x direction and a second y direction;a substrate transporter for transporting first and second substrates to the alignment table; anda laser sealing system for sealing the second substrate to the first substrate.

18. The apparatus according to claim 17 wherein the alignment table is further movable in a z direction orthogonal to the x and y directions.

19. The apparatus according to claim 17 wherein the substrate transporter comprises extendable arms.

20. The apparatus according to claim 18 wherein the alignment table comprises a vacuum chuck for securing the first substrate to the alignment table.