Method of sensing superheat

Information

  • Patent Grant
  • 9772235
  • Patent Number
    9,772,235
  • Date Filed
    Tuesday, December 30, 2014
    9 years ago
  • Date Issued
    Tuesday, September 26, 2017
    6 years ago
Abstract
A method of sensing superheat includes the steps of: (a) connecting a fluid inlet member of a superheat sensor to one of a plurality of fluid systems; (b) allowing fluid to flow from the fluid system to which the superheat sensor is connected to the superheat sensor; (c) sensing a temperature of the fluid in the fluid system with one of an internal temperature sensor mounted within a housing of the superheat sensor and an external temperature sensor mounted outside of the housing of the superheat sensor; and (d) calculating a superheat of the fluid in the fluid system.
Description
BACKGROUND OF THE INVENTION

Various embodiments of a fluid sensor are described herein. In particular, the embodiments described herein relate to an improved superheat sensor.


There are many fluid system applications that require knowledge of a fluid's superheat in order to optimize the state of the fluid system. These systems include, but are not limited to, HVAC systems. Fluids that may be used within these systems include, but are not limited to, refrigerants.


As used herein, the term superheat is defined as the condition where the fluid, regardless of the system type, has excess energy relative to the fluid's boiling point. This excess energy may be measured as the number of degrees of temperature above the fluid's boiling point, or superheat.


Methods of measuring superheat are known. For example, U.S. Pat. No. 5,070,706 discloses a superheat sensor having a single coupling to a fluid channel carrying fluid through which superheat is being measured.


U.S. Pat. No. 5,820,262 discloses a refrigerant sensor for calculating a superheat value for refrigerant material. The sensor has an internal pressure sensor and an internal temperature sensor.


U.S. Patent Publication No. 2011/0192224 discloses a superheat sensor having a flexible wall that defines an interface between an inner cavity having a charge fluid therein and the flow channel in thermal contact with the fluid flowing therein. The flexible wall is adapted to conduct heat between the flow channel and the inner cavity.


U.S. Patent Publication No. 2011/0222576 discloses a method for calibrating a superheat sensor.


Typical superheat sensors do not provide automatic fluid-type detection, high sensitivity, and resolution under a wide range of pressures, store superheat and related parametric history, generate alarms, and provide a variety of industry standard reporting options.


Accordingly, there remains a need in the art for an improved sensor and method of identifying and measuring superheat in fluids, especially refrigerants in HVAC systems.


SUMMARY OF THE INVENTION

The present application describes various embodiments of a superheat sensor. One embodiment of the superheat sensor includes a housing, a pressure sensor mounted within the housing, a fluid passageway connecting the pressure sensor to a source of superheat fluid, and a processor.


In a second embodiment, a method of sensing superheat includes connecting a fluid inlet member of a superheat sensor to one of a plurality of fluid systems and allowing fluid to flow from the fluid system to which the superheat sensor is connected to the superheat sensor. A temperature of the fluid in the fluid system is sensed with one of an internal temperature sensor mounted within a housing of the superheat sensor and an external temperature sensor mounted outside of the housing of the superheat sensor. A superheat of the fluid in the fluid system is then calculated.


In a third embodiment, a method of sensing superheat includes calibrating a superheat sensor and connecting a fluid inlet member of the superheat sensor to one of a plurality of fluid systems. Fluid is allowed to flow from the fluid system to which the superheat sensor is connected to the superheat sensor. A temperature of the fluid in the fluid system is sensed, and a fluid type of the fluid in the fluid system is detected. A superheat of the fluid in the fluid system is then calculated and error conditions are determined. Superheat and related parametric and alarm data are stored. The superheat sensor is disconnected and subsequently connected to another of the plurality of fluid systems without re-calibrating the superheat sensor.


Other advantages of the superheat sensor will become apparent to those skilled in the art from the following detailed description, when read in view of the accompanying drawings.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a perspective view of a first embodiment of the universal superheat sensor according to the invention.



FIG. 2 is a cross sectional view of the universal superheat sensor illustrated in FIG. 1.



FIG. 3 side elevational view of a second embodiment of the universal superheat sensor.



FIG. 4 is a cross sectional view of a third embodiment of the universal superheat sensor.



FIG. 5 is an exploded perspective view of a fourth embodiment of the universal superheat sensor.





DETAILED DESCRIPTION

The present invention will now be described with occasional reference to the specific embodiments of the invention. This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.


Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for describing particular embodiments only and is not intended to be limiting of the invention. As used in the description of the invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.


Unless otherwise indicated, all numbers expressing quantities of ingredients, properties such as molecular weight, reaction conditions, and so forth as used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless otherwise indicated, the numerical properties set forth in the specification and claims are approximations that may vary depending on the desired properties sought to be obtained in embodiments of the present invention. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical values, however, inherently contain certain errors necessarily resulting from errors found in their respective measurements.


As used in the description of the invention and the appended claims, the phrase “universal superheat sensor” is defined as a superheat sensor which contains all the necessary sensors, electronics, and intelligence to automatically detect multiple fluid types, such as refrigerants, without re-calibration, and report the superheat of the multiple common fluid types used in residential, industrial, and scientific applications.


The superheat sensor according to the invention is a single, self-contained, stand-alone device which contains all the necessary sensors, electronics, and intelligence to automatically detect the fluid type, such as refrigerant, and report the superheat of multiple common fluid types used in residential, industrial, and scientific applications. The superheat sensor according to the invention communicates this information in a cost effective way using industry standard reports. It stores this information in a local memory device for subsequent retrieval of historical data. Additional data storage may be provided, such as through removable memory cards, and via an off-board computer, such as a laptop computer. The superheat sensor according to the invention may also be configured to provide the user various alarms for conditions such as low pressure (fluid leakage), low and/or high superheat (indicators of system flooding and out-of-range system efficiency), excessive pressure (system overcharge or imminent hardware failure), temperature out of range, and like conditions.


Referring now to FIGS. 1 and 2, a first embodiment of the universal superheat sensor 10 includes a housing 12, a fluid inlet member 14, an integrated pressure and temperature sensor 16, a printed circuit board (PCB) 18, a superheat processor 20, a data-reporting or communication module 22, and an Input/Output (IO) module 24. It will be understood that in lieu of the PCB 18, alternative substrates may be used for mounting electronic components. For example, electronic components, including but not limited to those disclosed below, may be mounted on a substrate formed from a polymer, ceramic, metal, or other desired material.


The housing 12 is the enclosure for all or a portion of the components of the universal superheat sensor 10. The illustrated housing 12 is provides a hermetic or airtight sealed space within which the measurement of the fluid may occur. The illustrated housing 12 includes a body 26 having an opening 28 in which the fluid inlet member 14 is mounted, and a cover 30 having an opening 32 in which the IO module 24 is mounted. If desired, a seal (not shown) may be disposed between the body 26 and the cover 30.


The body 26 and the cover 30 of the housing 12 may have any other desired size and shape, and may be formed from any desired material, such as plastic, metal, or ceramic. Alternatively, the fluid inlet member 14 may be formed from any other desired material.


In the embodiment illustrated in FIG. 2, the fluid inlet member 14 is a brass core or fitting having a centrally formed fluid passageway 34. The fluid inlet member 14 connects the integrated pressure and temperature sensor 16 to the source of superheat fluid (not shown). The fluid inlet member 14 may be any type of fitting, such as a standard ¼ inch port. Any other desired type of fluid inlet member may also be used. Additionally, external adapters (not shown) may be attached to the fluid inlet member 14 to connect it to a variety of fluid fittings (not shown) of fluid systems, such as HVAC systems.


As shown in FIG. 2, the illustrated integrated pressure and temperature sensor 16 is mounted to the PCB 18 within the housing 12, and includes a wide-range pressure sensor portion 36 that converts fluid pressure to an electrical signal. The generated electrical signal may be subsequently used by the superheat processor 20. As used in the description of the invention and the appended claims, the phrase “wide-range pressure sensor” is defined as a pressure sensor that it will support common ranges of system pressures that occur in known refrigerant systems while maintaining accuracy. The pressure sensor portion 36 may be any type of pressure sensor; including silicon, piezo-ceramic, capacitive, and integrated hall-effect transducers, and any other device that produces an electrical analogue of pressure. In the illustrated embodiment, the pressure sensor portion 36 of the integrated pressure and temperature sensor 16 is a silicon transducer. As shown in FIG. 2, the integrated pressure and temperature sensor 16 is exposed directly to the pressurized superheat fluid via the fluid inlet member 14 for fast and accurate measurement.


The illustrated integrated pressure and temperature sensor 16 includes a temperature sensor portion 38 that converts temperature to an electrical signal. The generated electrical signal may be subsequently used by the superheat processor 20. The illustrated temperature sensor portion 38 is provided to measure the internal liquid refrigerant temperature and is structured and configured to support a wide range of fluid system temperatures, such as temperatures within the range of from about −50 degrees C. to about +125 degrees C., while maintaining an acceptable accuracy for a specific application. In some applications, an acceptable accuracy may be +/−0.5 degrees C. In other applications, an acceptable accuracy may be a range smaller or larger than +/−0.5 degrees C. Alternatively, the temperature sensor portion 38 may support fluid system temperatures within the range of from about −25 degrees C. to about +150 degrees C. The temperature sensor portion 38 may be any type of temperature sensor, including a thermistor, a thermocouple, a resistive element etched onto a substrate, a diode, or any other device that produces an electrical analogue of temperature. Advantageously, the illustrated integrated pressure and temperature sensor 16 is relatively small and physically close to the fluid to maximize both response time and measurement accuracy. It will be understood that the temperature sensor and the pressure sensor may be separate sensors as described below.


The illustrated superheat processor 20 is mounted to the PCB 18 and is a high-resolution, high accuracy device that processes the input signals from the pressure and temperature sensor portions 36 and 38, respectively, of the integrated pressure and temperature sensor 16, detects the fluid type, calculates the superheat of the fluid, and provides an output that identifies the level of the calculated superheat. The superheat processor 20 may also be configured to provide other data, such as fluid temperature, fluid pressure, fluid type, historical data maintained in an onboard memory (such as alarm and on-off history), and other desired information. The superheat processor 20 may be configured as a high-resolution processor that is able to detect and process, with a single pressure sensor and a single temperature sensor, or with the illustrated integrated pressure and temperature sensor 16, the wide-range of system pressures and temperatures that may be encountered in the fluids of the fluid systems with which the universal superheat sensor 10 will be used, for example refrigerants of HVAC systems. Advantageously, the superheat processor 20 maintains a high level of accuracy through one-time calibration over the operating range of pressure and temperature input. Non-limiting examples of suitable superheat processors include microcontrollers, Field Programmable Arrays (FPGA), and Application Specific Integrated Circuits (ASIC) with embedded and/or off-board memory and peripherals.


The illustrated communication module 22 is mounted to the PCB 18 and is a configurable hardware module that provides industry-standard Modbus data over a hard-wired backbone, such as an RS485 hard-wired backbone, schematically illustrated at 40 in FIG. 2. If desired, the communication module 22 may provide Modbus data and other communication protocols over communications means, such as RS232, I2C, SPI, and 4-20 mA, Current Loop, USB 2.0, Bluetooth, an RF module, and wireless information to a cell-phone application. An internal antenna (not shown) may be provided to support the RF module. The illustrated communication module 22 is flexible enough to support other current and future communication protocols as they become available.


The illustrated IO module 24 is a physical hardware interface that accepts input power and reports data through the available hard-wired interfaces. Common target devices that may be connected to the universal superheat sensor 10 via the IO module 24 are schematically illustrated at 42 in FIG. 2, and include, but are not limited to: additional temperature sensors (such as the temperature sensor 44 illustrated in FIG. 3) industry standard controller modules, laptop and notebook computers, cell phones, and memory cards such as non-volatile memory cards.


As shown in FIG. 3, an external temperature sensor 44 may be connected to the IO module 24 via the backbone 40. Also, the external temperature sensor 44 may be positioned near various components of a refrigeration system, such as an evaporator outlet and a compressor to measure the evaporator core temperature, the discharge temperature, and the like. It will be understood that any desired number of external temperature sensors 44 may be connected to the IO module 24 to simultaneously measure the temperature internally and at multiple components or devices.


Advantageously, the superheat processor 20 may process the pressure and temperature inputs from the integrated pressure and temperature sensor 16 and the external temperature sensors 44, if provided. The superheat processor 20 is calibrated to detect and identify a plurality of fluid types. The superheat processor 20 further calculates the superheat of any of the plurality of fluid types with a high degree of resolution and accuracy. The superheat processor 20 may also determine error conditions and store superheat and related parametric and alarm data. The superheat processor 20 may then report the superheat of the fluid system to which the superheat sensor 10 is attached. The superheat processor 20 may also report additional data such as temperature, pressure, fluid type, on-time, alarms, operational history, and the like. Advantageously, the superheat processor 20 needs to be calibrated only one time, and may thereafter calculate superheat and perform any of the tasks described above for any of a plurality of fluid types.


Additionally, the embodiments of the universal superheat sensor 10, 60, 70, and 80 described herein allow real-time data to be presented to a user, such as a contractor.


Referring again to FIG. 3, a second embodiment of the universal superheat sensor is shown at 60. The illustrated universal superheat sensor 60 includes the housing 12, the fluid inlet member 14, the PCB 18, the superheat processor (not shown in FIG. 3), the communication module (not shown in FIG. 3), the IO module 24, an internal pressure sensor 62, and an external temperature sensor 44, as described above. As described above, any desired number of external temperature sensors 44 may be connected to the IO module 24 to simultaneously measure the temperature at multiple components or devices.


Referring now to FIG. 4, a third embodiment of the universal superheat sensor is shown at 70. The illustrated universal superheat sensor 70 includes the housing 12, the fluid inlet member 14, the PCB 18, the superheat processor (not shown in FIG. 4), the communication module (not shown in FIG. 4), the IO module 24, an internal pressure sensor 62, and an internal temperature sensor 72. As shown in FIG. 4, the internal temperature sensor 72 is mounted within the housing 12, but is not in contact with the superheat fluid. Rather, the internal temperature sensor 72 is adjacent to, but outside of the fluid passageway 34. It will be understood that the any desired number of external temperature sensors 44 may also be connected to the IO module 24 to simultaneously measure the temperature internally and at multiple components or devices. In addition to one or more external temperature sensors 44, if desired, the universal superheat sensor 80 may also include one or more of the target devices 42 that may be connected to the IO module 24 of the universal superheat sensor 80 via the backbone 40, as described above.


Referring now to FIG. 5, a fourth embodiment of the universal superheat sensor is shown at 80. The illustrated universal superheat sensor 80 includes a housing 82, a fluid inlet member 84, the PCB 88, the superheat processor 90, the communication module 92, and the IO module 94. The universal superheat sensor 80 may include the integrated pressure and temperature sensor 16. Alternatively, the universal superheat sensor 80 may include an internal temperature sensor and an internal pressure sensor, neither of which are shown in FIG. 5, but both of which are described above. The illustrated housing 82 includes a body 100 having an opening (not shown) in which the fluid inlet member 84 is mounted, and a cover 102. A seal 104 may be disposed between the body 100 and the cover 102. If desired, the universal superheat sensor 70 may also include one or more external temperature sensors 44, as described above, and may further include one or more target devices 42 that may be connected to the IO module 24 of the universal superheat sensor 70 via the backbone 40, as described above.


The principle and mode of operation of the universal superheat sensor have been described in its preferred embodiments. However, it should be noted that the universal superheat sensor described herein may be practiced otherwise than as specifically illustrated and described without departing from its scope.

Claims
  • 1. A method of sensing superheat comprising the steps of: (a) connecting a fluid inlet member of a superheat sensor to one of a plurality of fluid systems;(b) allowing fluid to flow from the fluid system to which the superheat sensor is connected to the superheat sensor;(c) sensing a temperature of the fluid in the fluid system with an internal temperature sensor mounted completely within a housing of the superheat sensor such that the internal temperature sensor is not in contact with the superheat fluid within the super-heat sensor, and such that the internal temperature sensor is outside of a flow path of fluid from the one of the plurality of fluid systems to which the superheat sensor is connected;(d) detecting a fluid type of the fluid in the fluid system;(e) calculating a superheat of the fluid in the fluid system; and(f) providing a user of the method of sensing superheat an alarm when one of a plurality of sensed conditions is present in the fluid system.
  • 2. The method of sensing superheat according to claim 1 further comprising a step of sensing a pressure of the fluid in the fluid system with a pressure sensor mounted within a housing of the superheat sensor.
  • 3. The method of sensing superheat according to claim 2 further comprising a step of calibrating the superheat sensor to detect and identify a plurality of fluid types.
  • 4. The method of sensing superheat according to claim 3 further comprising a step of calculating the superheat of any of the plurality of fluid types.
  • 5. The method of sensing superheat according to claim 2 wherein the step of sensing a temperature of the fluid in the fluid system and the step of sensing the pressure of the fluid in the fluid system is performed by an integrated pressure and temperature sensor mounted completely within the housing of the superheat sensor such that the integrated pressure and temperature sensor is not in contact with the superheat fluid within the super-heat sensor, and such that the integrated pressure and temperature sensor is outside of a flow path of fluid from the one of the plurality of fluid systems to which the superheat sensor is connected.
  • 6. A method of sensing superheat comprising the steps of: (a) calibrating a superheat sensor;(b) connecting a fluid inlet member of the superheat sensor to one of a plurality of fluid systems;(c) allowing fluid to flow from the fluid system to which the superheat sensor is connected to the superheat sensor;(d) sensing a temperature of the fluid in the fluid system with an internal temperature sensor mounted completely within a housing of the superheat sensor such that the internal temperature sensor is not in contact with the superheat fluid within the super-heat sensor;(e) detecting a fluid type of the fluid in the fluid system;(f) calculating a superheat of the fluid in the fluid system;(g) providing a user of the method of sensing superheat an alarm when one of a plurality of sensed conditions is present in the fluid system;(h) storing superheat alarm data in a memory device;(i) disconnecting the superheat sensor and subsequently connecting the superheat sensor to another of the plurality of fluid systems without re-calibrating the superheat sensor.
  • 7. The method of sensing superheat according to claim 6 further comprising a step of reporting any of temperature data, pressure data, fluid type, on-time data, alarm data, and operational history data.
  • 8. The method of sensing superheat according to claim 6 wherein the plurality of sensed conditions for which an alarm is provided is one of low pressure, low superheat, high superheat, excessive pressure, and temperature out of range.
  • 9. The method of sensing superheat according to claim 6 further including storing in the memory device one of an alarm time, alarm duration, and an alarm cause of the alarm provided to the user.
  • 10. The method of sensing superheat according to claim 6 further comprising a step of sensing temperature of a component of the fluid system to which the superheat sensor is attached with an external temperature sensor located outside a housing of the superheat sensor and electrically connected to a superheat processor of the superheat sensor, the external temperature sensor electronically connected to the component and configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional patent application of U.S. patent application Ser. No. 13/563,017 filed Jul. 31, 2012, which claims the benefit of U.S. Provisional Application No. 61/611,747 filed Mar. 16, 2012. The disclosure of both applications are incorporated herein by reference.

US Referenced Citations (220)
Number Name Date Kind
668202 Nethery Feb 1901 A
886045 Ehrlich et al. Apr 1908 A
1886205 Lyford Nov 1932 A
1926031 Boynton Sep 1933 A
2412205 Cook Dec 1946 A
2504055 Thomas Apr 1950 A
2651325 Lusignan Sep 1953 A
2840107 Campbell Jun 1958 A
2875779 Campbell Mar 1959 A
3031747 Green May 1962 A
3540218 Finn Nov 1970 A
3597977 Zierak Aug 1971 A
3729807 Fujiwara May 1973 A
3747628 Holster et al. Jul 1973 A
3808469 Raymond Apr 1974 A
3860949 Stoeckert et al. Jan 1975 A
4005454 Froloff et al. Jan 1977 A
4019388 Hall, II et al. Apr 1977 A
4023725 Ivett et al. May 1977 A
4100236 Gordon et al. Jul 1978 A
4152540 Duncan et al. May 1979 A
4181249 Peterson et al. Jan 1980 A
4298023 McGinnis Nov 1981 A
4341816 Lauterbach et al. Jul 1982 A
4354527 McMillan Oct 1982 A
4434813 Mon Mar 1984 A
4476893 Schwelm Oct 1984 A
4543875 Imhof Oct 1985 A
4545212 Noda Oct 1985 A
4581624 O'Connor Apr 1986 A
4593719 Leonard et al. Jun 1986 A
4628576 Giachino et al. Dec 1986 A
4647013 Giachino et al. Mar 1987 A
4660387 Usami Apr 1987 A
4661835 Gademann et al. Apr 1987 A
4687419 Suzuki et al. Aug 1987 A
4768348 Noguchi Sep 1988 A
4772935 Lawler et al. Sep 1988 A
4821997 Zdeblick Apr 1989 A
4824073 Zdeblick Apr 1989 A
4826131 Mikkor May 1989 A
4828184 Gardner et al. May 1989 A
4835976 Torrence Jun 1989 A
4869282 Sittler et al. Sep 1989 A
4932788 Yeh Jun 1990 A
4938742 Smits Jul 1990 A
4943032 Zdeblick Jul 1990 A
4946350 Suzuki et al. Aug 1990 A
4959581 Dantlgraber Sep 1990 A
4966646 Zdeblick Oct 1990 A
5000009 Clanin Mar 1991 A
5029805 Albarda et al. Jul 1991 A
5037778 Stark et al. Aug 1991 A
5050838 Beatty et al. Sep 1991 A
5054522 Kowanz et al. Oct 1991 A
5058856 Gordon et al. Oct 1991 A
5061914 Busch et al. Oct 1991 A
5064165 Jerman Nov 1991 A
5065978 Albarda et al. Nov 1991 A
5066533 America et al. Nov 1991 A
5069419 Jerman Dec 1991 A
5070706 Waters et al. Dec 1991 A
5074629 Zdeblick Dec 1991 A
5082242 Bonne et al. Jan 1992 A
5096643 Kowanz et al. Mar 1992 A
5116457 Jerman May 1992 A
5131729 Wetzel Jul 1992 A
5133379 Jacobsen et al. Jul 1992 A
5142781 Mettner et al. Sep 1992 A
5161774 Engelsdorf et al. Nov 1992 A
5169472 Goebel Dec 1992 A
5176358 Bonne et al. Jan 1993 A
5177579 Jerman Jan 1993 A
5178190 Mettner Jan 1993 A
5179499 MacDonald et al. Jan 1993 A
5180623 Ohnstein Jan 1993 A
5197517 Perera Mar 1993 A
5209118 Jerman May 1993 A
5215244 Buchholz et al. Jun 1993 A
5216273 Doering et al. Jun 1993 A
5217283 Watanabe Jun 1993 A
5222521 Kihlberg Jun 1993 A
5238223 Mettner et al. Aug 1993 A
5244537 Ohnstein Sep 1993 A
5267589 Watanabe Dec 1993 A
5271431 Mettner et al. Dec 1993 A
5271597 Jerman Dec 1993 A
5285648 Bessler Feb 1994 A
5295360 Olds et al. Mar 1994 A
5309943 Stevenson et al. May 1994 A
5323999 Bonne et al. Jun 1994 A
5325880 Johnson et al. Jul 1994 A
5333831 Barth et al. Aug 1994 A
5336062 Richter Aug 1994 A
5355712 Petersen et al. Oct 1994 A
5368704 Madou et al. Nov 1994 A
5375919 Furuhashi Dec 1994 A
5400824 Gschwendtner et al. Mar 1995 A
5415024 Proffitt et al. May 1995 A
5417235 Wise et al. May 1995 A
5445185 Watanabe et al. Aug 1995 A
5458405 Watanabe Oct 1995 A
5543349 Kurtz et al. Aug 1996 A
5553790 Findler et al. Sep 1996 A
5566703 Watanabe et al. Oct 1996 A
5577533 Cook, Jr. Nov 1996 A
5589422 Bhat Dec 1996 A
5611214 Wegeng et al. Mar 1997 A
5663899 Zvonar et al. Sep 1997 A
5666815 Aloise Sep 1997 A
5785295 Tsai Jul 1998 A
5810325 Carr Sep 1998 A
5820262 Lechner Oct 1998 A
5838351 Weber Nov 1998 A
5848605 Bailey et al. Dec 1998 A
5856705 Ting Jan 1999 A
5873385 Bloom et al. Feb 1999 A
5908098 Gorman et al. Jun 1999 A
5909078 Wood et al. Jun 1999 A
5926955 Kober Jul 1999 A
5941084 Sumida et al. Aug 1999 A
5941608 Campau et al. Aug 1999 A
5954079 Barth et al. Sep 1999 A
5955817 Dhuler et al. Sep 1999 A
5970998 Talbot et al. Oct 1999 A
5994816 Dhuler et al. Nov 1999 A
6019437 Barron et al. Feb 2000 A
6023121 Dhuler et al. Feb 2000 A
6038928 Maluf et al. Mar 2000 A
6041650 Swindler et al. Mar 2000 A
6096149 Hetrick et al. Aug 2000 A
6105737 Weigert et al. Aug 2000 A
6114794 Dhuler et al. Sep 2000 A
6116863 Ahn et al. Sep 2000 A
6123316 Biegelsen et al. Sep 2000 A
6124663 Haake et al. Sep 2000 A
6171972 Mehregany et al. Jan 2001 B1
6182742 Takahashi et al. Feb 2001 B1
6224445 Neukermans et al. May 2001 B1
6255757 Dhuler et al. Jul 2001 B1
6279606 Hunnicutt et al. Aug 2001 B1
6283441 Tian Sep 2001 B1
6318101 Pham et al. Nov 2001 B1
6321549 Reason et al. Nov 2001 B1
6386507 Dhuler et al. May 2002 B2
6390782 Booth et al. May 2002 B1
6408876 Nishimura et al. Jun 2002 B1
6430951 Iritani et al. Aug 2002 B1
6494804 Hunnicutt et al. Dec 2002 B1
6505811 Barron et al. Jan 2003 B1
6520197 Deshmukh et al. Feb 2003 B2
6523560 Williams et al. Feb 2003 B1
6533366 Barron et al. Mar 2003 B1
6540203 Hunnicutt Apr 2003 B1
6581640 Barron Jun 2003 B1
6637722 Hunnicutt Oct 2003 B2
6662581 Hirota et al. Dec 2003 B2
6694998 Hunnicutt Feb 2004 B1
6724718 Shinohara et al. Apr 2004 B1
6755761 Hunnicutt et al. Jun 2004 B2
6761420 Maluf et al. Jul 2004 B2
6845962 Barron et al. Jan 2005 B1
6872902 Cohn et al. Mar 2005 B2
6902988 Barge et al. Jun 2005 B2
6958255 Khuri-Yakub et al. Oct 2005 B2
6966329 Liberfarb Nov 2005 B2
7011378 Maluf et al. Mar 2006 B2
7063100 Liberfarb Jun 2006 B2
7210502 Fuller et al. May 2007 B2
7234313 Bell et al. Jun 2007 B2
7372074 Milne et al. May 2008 B2
7449413 Achuthan et al. Nov 2008 B1
7528689 Lee et al. May 2009 B2
7987679 Tanaka Aug 2011 B2
8113448 Keating Feb 2012 B2
8113482 Hunnicutt Feb 2012 B2
8156962 Luckevich Apr 2012 B2
8827546 Vonsild et al. Sep 2014 B2
20020014106 Srinivasan et al. Feb 2002 A1
20020029814 Unger et al. Mar 2002 A1
20020096421 Cohn et al. Jul 2002 A1
20020121100 Yabuki et al. Sep 2002 A1
20020174891 Maluf et al. Nov 2002 A1
20030061889 Tadigadapa et al. Apr 2003 A1
20030098612 Maluf et al. May 2003 A1
20030159811 Nurmi Aug 2003 A1
20030206832 Thiebaud et al. Nov 2003 A1
20040079101 Beitelmal et al. Apr 2004 A1
20040115905 Barge et al. Jun 2004 A1
20050121090 Hunnicutt Jun 2005 A1
20050200001 Joshi et al. Sep 2005 A1
20050205136 Freeman Sep 2005 A1
20060017125 Lee et al. Jan 2006 A1
20060067649 Tung et al. Mar 2006 A1
20060145885 Goulis et al. Jul 2006 A1
20060213263 Kawanishi et al. Sep 2006 A1
20060218953 Hirota Oct 2006 A1
20070062207 Aiyama et al. Mar 2007 A1
20070204635 Tanaka Sep 2007 A1
20070251586 Fuller et al. Nov 2007 A1
20070289941 Davies Dec 2007 A1
20080028779 Song Feb 2008 A1
20080042084 Fuller Feb 2008 A1
20080072977 George et al. Mar 2008 A1
20080229770 Liu Sep 2008 A1
20080271788 Matsuzaki et al. Nov 2008 A1
20090064693 Matsiev et al. Mar 2009 A1
20090123300 Uibel May 2009 A1
20090186466 Brewer Jul 2009 A1
20100019177 Luckevich Jan 2010 A1
20100038576 Hunnicutt Feb 2010 A1
20100204840 Sun et al. Aug 2010 A1
20100225708 Peng et al. Sep 2010 A1
20110056240 Malik et al. Mar 2011 A1
20110209485 Lifson et al. Sep 2011 A1
20110222576 Vonsild Sep 2011 A1
20120000540 Harslund Jan 2012 A1
20120000550 Hunnicutt et al. Jan 2012 A1
20120210713 Ernst et al. Aug 2012 A1
20130174591 Das et al. Jul 2013 A1
Foreign Referenced Citations (45)
Number Date Country
1673703 Sep 2005 CN
2859486 Jan 2007 CN
102292684 Dec 2011 CN
2215526 Oct 1973 DE
2930779 Feb 1980 DE
3401404 Jul 1985 DE
4101575 Jul 1992 DE
4417251 Nov 1995 DE
4422942 Jan 1996 DE
250948 Jan 1988 EP
261972 Mar 1988 EP
1024285 Aug 2000 EP
2238267 May 1991 GB
SHO 39-990 Feb 1964 JP
04-000003 Jan 1992 JP
H04297761 Oct 1992 JP
06-117414 Apr 1994 JP
2000111213 Apr 2000 JP
2001184125 Jul 2001 JP
2003-049933 Feb 2003 JP
SHO 63-148062 Jul 2003 JP
2006-080194 Mar 2006 JP
9916096 Apr 1999 WO
9924783 May 1999 WO
0014415 Mar 2000 WO
0014415 Jul 2000 WO
2005084211 Sep 2005 WO
2005084211 Jan 2006 WO
2006076386 Jul 2006 WO
2008076388 Jun 2008 WO
2008076388 Aug 2008 WO
2008121365 Oct 2008 WO
2008121369 Oct 2008 WO
2010019329 Feb 2010 WO
2010019329 Feb 2010 WO
2010019665 Feb 2010 WO
2010019665 Feb 2010 WO
2010065804 Jun 2010 WO
2010065804 Jun 2010 WO
2011022267 Feb 2011 WO
2011022267 Feb 2011 WO
2011094300 Aug 2011 WO
2011094300 Aug 2011 WO
2011094302 Aug 2011 WO
2011094302 Aug 2011 WO
Non-Patent Literature Citations (46)
Entry
Chinese First Office Action, Application No. CN 201310081837.9, dated Aug. 18, 2016.
Chinese First Office Action, Application No. 201310081837.9, dated Aug. 18, 2016.
Ayon et al., “Etching Characteristics and Profile Control in a Time Multiplexed ICP Etcher,” Proc. of Solid State Sensor and Actuator Workshop Technical Digest, Hilton Head SC, (Jun. 1998) 41-44.
Bachmann, Stephan, “Electronic Expansion Valves: Fitters Notes (Part 8)”, Danfoss Fitters Notes, Jul. 2008.
Bartha et al., “Low Temperature Etching of Si in High Density Plasma Using SF6/02,” Microelectronic Engineering, and Actuator Workshop Technical Digest, Hilton Head SC, (Jun. 1998) 41-44.
Booth, Steve and Kaina, Rachid, Fluid Handling—Big Gains from Tiny Valve, Appliance Design (Apr. 2008), pp. 46-48.
Changenet et al., “Study on predictive functional control of an expansion valve for controlling the evaporator superheat”, Proc.IMechE vol. 222 Part I, May 28, 2008, pp. 571-582.
Controls Overview for Microstaq Silicon Expansion Valve (SEV), Rev. 1, Dec. 2008 [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pdf/SEV—controls.pdf>.
Copeland, Michael V., Electronic valves promise big energy savings, Fortune, Sep. 9, 2008 [online], [retrieved Sep. 9, 2008]. Retrieved from the internet <URL: http://techland.blogs.fortune.cnn.com/2008/09/09/electronic-valves-promise-big-energy-savings>.
Fung et al., “Deep Etching of Silicon Using Plasma” Proc. of the Workshop on Micromachining and Micropackaging of Transducers, (Nov. 7-8, 1984) pp. 159-164.
Gui, C. et al, “Selective Wafer Bonding by Surface Roughness Control”, Journal of the Electrochemical Society, 148 (4) G225-G228 (2001).
Gui, C. et al., “Fusion bonding of rough surfaces with polishing technique for silicon micromachining”, Microsystem Technologies (1997) 122-128.
Günther, Götz, “Entwicklung eines pneumatischen 3/2-Wege-Mikroventils”, O + P Olhydraulik Und Pneumatik, Vereinigte Fachverlage, Mainz, DE, vol. 42, No. 6, Jun. 1, 1998, pp. 396-398, XP000831050, ISSN: 0341-2660.
Higginbotham, Stacey, Microstaq's Tiny Valves Mean Big Energy Savings [online], [retrieved Dec. 8, 2008]. Retrieved from the Internet <URL: http//earth2tech.com/2008/09/09/microstaqs-tiny-valves-mean-big-energy savings (posted Sep. 9, 2008)>.
J. Mark Noworolski, et al.,“Process for in-plane and out-of-plane single-crystal-silicon thermal microactuators”, Sensors and Actuators A 55 (1996); pp. 65-69.
Jonsmann et al., “Compliant Electra-thermal Microactuators”, IEEE Technical Digest , Twelfth IEEE International Conference on Micro Electro Mechanical Systems Jan. 17-21, 1999, Orlando, Florida, pp. 588-593, IEEE Catalog No. 99CH36291C.
K.R. Williams et al., “A Silicon Microvalve for the Proportional Control of Fluids”, Transducers '99, Proc. 10th International Conference on Solid State Sensors and Actuators, held Jun. 7-10, 1999, Sendai, Japan, pp. 18-21.
Keefe, Bob, Texas firm says value-replacing chip can drastically cut energy use, Atlanta Metro News, Sep. 10, 2008 [online], [retrieved Sep. 10, 2008]. Retrieved from the Internet <URL: http://www.ajc.com/search/content/shared/money/stories/2008/09/microstaq10—cox-F9782.html>.
Klaassen et al., “Silicon Fusion Bonding and Deep Reactive Ion Etching; A New Technology for Microstructures,” Proc., Transducers 95 Stockholm Sweden, (1995) 556-559.
Linder et al., “Deep Dry Etching Techniques as a New IC Compatible Tool for Silicon Micromachining,” Proc, Transducers, vol. 91, (Jun. 1991) pp. 524-527.
Luckevich, Mark, MEMS microvlaves: the new valve world, Valve World (May 2007), pp. 79-83.
Madou, Marc, “Fundamentals of Microfabrication”, Boca Raton: CRC Press, 1997, 405-406.
MEMS, Microfluidics and Microsystems Executive Review [online], Posted Apr. 16, 2009. [retrieved May 17, 2010]. Retrieved from the Internet <URL: http:www.memsinvestorjournal.com/2009/04/mems-applications-for-flow-control-.html>.
Microstaq Announces High Volume Production of MEMS-Based Silicon Expansion Valve [onlne], [retrieved Jan. 27, 2010]. Retrieved from the Internet <URL: http://www.earthtimes.org/articles/printpressstory.php?news+1138955 (posted Jan. 27, 2010)>.
Microstaq Product Description, Proportional Piloted Silicon Control Valve (CPS-4) [online], Published 2008, [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/products/cps4.html>.
Microstaq Product Description, Proportional Direct Acting Silicon Control Valve (PDA-3) [online], Published 2008, [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/products/pda3.html>.
Microstaq Product Descriptions, SEV, CPS-4, and PDA-3 [online], Published 2009, [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/products/index.html>.
Microstaq Technology Page [online], Published 2008, [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/technology/index.html>.
Petersen et al. “Surfaced Micromachined Structures Fabricated with Silicon Fusion Bonding” Proc., Transducers 91, (Jun. 1992) pp. 397-399.
Press Release, Freescale and Microstaq Join Forces on Smart Superheat Control System for HVAC and Refrigeration Efficiency (posted Jan. 22, 2008) [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pressReleases/prDetail—04.html>.
Press Release, Microstaq Unveils Revolutionary Silicon Expansion Valve at Demo 2008 [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pressReleases/prDetail—05.html (posted Sep. 8, 2008)>.
Press Release, Microstaq Mastering Electronic Controls for Fluid-Control Industry (posted May 5, 2005) [online[, [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pressReleases/prDetail—02.html>.
Press Release, Nanotechnology Partnerships, Connections Spur Innovation for Fluid Control Industries (posted Jun. 9, 2005) [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pressReleases/prDetail—03.html>.
Product Review, greentechZONE Products for the week of May 18, 2009 [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.en-genius.net/site/zones/greentechZONE/product—reviews/grnp—051809>.
SEV Installation Instructions [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pdf/SEV—Instruction—sheet.pdf>.
Silicon Expansion Valve Information Sheet [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pdf/SEV—Infosheet—2—0.pdf>.
Silicon Expansion Valve (SEV)—for Heating, Cooling, and Refrigeration Applications [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pdf/SEV—Quicksheet.pdf>.
Silicon Expansion Valve Data Sheet [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.microstaq.com/pdf/SEV—Datasheet—1—8.pdf>.
SMIC Announces Successful Qualification of a MEMS Chip for Microstaq (posted Oct. 26, 2009) [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.prnewswire.com/news-releases/smic-announces-successful-qualification-of-a-mems-chip-for-microstaq-65968252.html (posted Oct. 26, 2009)>.
SMIC quals Microstaq MEMS chip for fluid control (posted Oct. 26, 2009) [online], [retrieved May 17, 2010]. Retrieved from the Internet <URL: http://www.electroiq.com/ElectroiQ/en-us/index/display/Nanotech—Article—Tools—Template.articles.small-times.nanotechmems.mems.microfluidics.2009.10.smic-quals—microstaq.html>.
Tiny Silicon Chip Developed by Microstaq Will Revolutionize Car Technology (posted May 19, 2005) [online], [retrieved May 19, 2005]. Retrieved from the Internet <URL: http://www.nsti.org/press/PRshow.html?id=160>.
Turpin, Joanna R., Soft Economy, Energy Prices Spur Interest in Technologies [online], Published Dec. 8, 2008. [retrieved May 18, 2010]. Retrieved from the Internet <URL: http://www.achrnews.com/copyright/BNP—GUID—9-5-2006—A—10000000000000483182>.
Uibel, Jeff, The Miniaturization of Flow Control (Article prepared for the 9th International Symposium on Fluid Control Measurement and Visualization (FLUCOME 2007)), Journal of Visualization (vol. 11, No. 1, 2008), IOS Press.
Yunkin et al., “Highly Anisotropic Selective Reactive Ion Etching of Deep Trenches in Silicon,” Microelectronic Engineering, Elsevier Science B.V., vol. 23, (1994) pp. 373-376.
Zhixiong Liu et al., “Micromechanism fabrication using silicon fusion bonding”, Robotics and Computer Integrated Manufacturing 17 (2001) 131-137.
Non Final Office Action , U.S. Appl. No. 14/854,449, dated Mar. 10, 2016.
Related Publications (1)
Number Date Country
20150110148 A1 Apr 2015 US
Provisional Applications (1)
Number Date Country
61611747 Mar 2012 US
Divisions (1)
Number Date Country
Parent 13563017 Jul 2012 US
Child 14585785 US