1. Field of the Invention
The present invention relates to a method of strengthening glass, and more particularly, to a method of strengthening glass by ion implantation.
2. Description of the Prior Art
Glass materials have been widely applied in many kinds of articles for daily use because of high transparency to light. Glass may be strengthened by many different approaches for being applied in merchandise with higher demand of strength. Generally, the approaches may be divided into physical strengthening processes and chemical strengthening processes. In display and touch panel industries, thin glass substrates are generally strengthened by chemical strengthening process. The glass substrates are dipped into high temperature nitrohydrochloric acid for generating metal ion exchange, and compressed stress may be form on the surface of the glass substrates for strengthening the glass substrates. However, the chemical strengthening process mentioned above is not suitable for strengthening only some specific regions on the glass substrate, and the transparency of the glass substrate may be influenced by the chemical strengthening process. Accordingly, a method of strengthening glass by ion implantation has been developed in related industries.
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It is one of the objectives of the present invention to provide a method of strengthening glass by ion implantation. Positive ions and negative ions are implanted into a glass substrate concurrently to strengthen the glass substrate. Ion repelling issue and electrostatic discharge issue generated by implanting ions with the same charge will be improved accordingly.
To achieve the purposes described above, an embodiment of the present invention provides a method of strengthening glass by ion implantation including following steps. First, an ion implantation device is provided. The ion implantation device generates a plurality of positive ions and a plurality of negative ions. The positive ions and the negative ions are implanted into a glass substrate by the ion implantation device for strengthening the glass substrate.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
In the following description, numerous specific details are given to provide a thorough understanding of an ion implantation method related to the invention. In addition, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific examples in which the embodiments may be practiced.
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More specifically, the ion implantation device 200 in this embodiment may preferably include a positive ion source 211 and a negative ion source 212, the positive ion source 211 is configured to generate the positive ions 211P, and the negative ion source 212 is configured to generate the negative ions 212N, but not limited thereto. In addition, the ion implantation device 200 may further include an implanting unit 220, and the implanting unit 220 may include an accelerator or a mass spectrometry configured to accelerate and inspect the positive ions 211P and the negative ions 212N, but the present invention is not limited to this. Other appropriate devices for implanting ions may also be disposed in the ion implantation device 200. In this embodiment, a charge-mass ratio of each of the positive ions 211P is substantially equal to a charge-mass ratio of each of the negative ions 212N preferably, and the implanting unit 220 may accelerate each positive ion 211P and each negative ion 212N under an electric field with identical electric potential difference for giving each positive ion 211P and each negative ion 212N nearly the same velocity. The implantation condition of the positive ions 211P and the negative ions 212N may then be effectively controlled and the repelling issue may be improved accordingly. It is worth noting that the present invention is not limited to the condition described above. In other embodiment of the present invention, the charge-mass ratio of each of the positive ions 211P may be close to but not completely equal to the charge-mass ratio of each of the negative ions 212N for strengthening glass by ion implantation.
In other words, each of the positive ions 211P and each of the negative ions 212N in this embodiment may come from one identical atom. For example, the positive ions 211P and the negative ions 212N may be positive hydrogen ions (H+) and negative hydrogen ions (H−) respectively, positive oxygen ions (O+) and negative oxygen ions (O−) respectively, or positive helium ions (He+) and negative helium ions (He−) respectively, but the present invention is not limited to this. In other embodiment of the present invention, each of the positive ions 211P and each of the negative ions 212N may also come from different atoms for ion implantation. Additionally, the glass substrate 240 in this embodiment may have a surface 240A facing the ion implantation device 200, and the positive ions 211P and the negative ions 212N may be implanted into the glass substrate 240 via the surface 240A. An implanting depth of the positive ions 211P and the negative ions 212N in the glass substrate 240 may be controlled by modifying acceleration energies added on the positive ions 211P and the negative ions 212N by the implanting unit 220. Generally, the implanting depth may be decided by possible damages to the glass substrate during other manufacturing processes so as to effectively strengthen the glass substrate, but not limited thereto. In addition, implanting angles and concentrations of the positive ions 211P and the negative ions 212N may also be modified according to other considerations.
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Generally, the edge 240B of the glass substrate 240 has weaker strength because the glass substrate 240 is formed by cutting, splitting, or grinding process. The electrostatic discharge issue may become more serious on the edge 240B when implanting ions with the same charge into the glass substrate 240 via the edge 240B. In this embodiment, the edge 240B of the glass substrate 240 may be strengthened by concurrently implanting the positive ions 211P and the negative ions 211N into the substrate 240 via the edge 240B without forming any conductive film, and the electrostatic discharge issue on the edge 240 may also be avoided accordingly. Additionally, in this embodiment, the glass substrates 240 maybe stacked and the edges 240B of the glass substrates 240 may be strengthened by ion implantation at the same time. The process efficiency of the method of strengthening glass by ion implantation may be accordingly enhanced, and the cost of the method of strengthening glass by ion implantation may be reduced accordingly.
To summarize the above descriptions, in the method of strengthening glass by ion implantation of the present invention, the positive ions and the negative ions are concurrently implanted into the glass substrate to strengthen the glass substrate. Because the charge and the polarity of the positive ion is different from the charge and the polarity of the negative ion, the ion repelling issue generated by implanting ions with the same charge and the same polarity will be improved accordingly, and the performance of the ion implantation process may be enhanced. In addition, the electrostatic discharge issue may also be improved by the method of the present invention without forming any conductive film, the cost of the method of strengthening glass by ion implantation may be reduced, and the related product competitiveness may be enhanced accordingly.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Number | Date | Country | Kind |
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201210509476.9 | Dec 2012 | CN | national |