Claims
- 1. A method of manufacturing an implantable electronic device, comprising the steps of:
- providing a sheet metal substrate;
- pickling said sheet metal substrate;
- bead blasting said sheet metal substrate;
- after said pickling and bead blasting steps, forming said bead blasted metal substrate to construct a three dimensional shield portion;
- repeating the steps of providing, pickling, bead blasting and forming to construct an additional three dimensional shield portion;
- locating an electronic circuit within said three-dimensional shield portion; and
- joining said three dimensional shield portion and said additional shield portion to one another to form a hermetic enclosure containing said electronic circuit.
- 2. The method according to claim 1 wherein said metal substrate is titanium.
- 3. The method according to claim 1 further comprising vacuum annealing said shield portion.
- 4. The method according to claim 3 further comprising sizing and trimming said vacuum annealed shield portion.
CROSS REFERENCE TO CO-PENDING APPLICATION
This application is a continuation-in-part of commonly assigned U.S. patent application Ser. No. 08/083,735, filed Jun. 25, 1993, entitled "Method of Surface Finishing A Medical Device Shield Using Metallic Media", abandoned.
US Referenced Citations (18)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
83735 |
Jun 1993 |
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