Claims
- 1. Method of transferring a relatively thick metal film of excellent conductivity and of high optical quality to a secondary substrate from a master substrate, said method including the steps of:
- (A) evaporation depositing an adhesion film followed by a conductive film onto a master substrate while exposing the assembly to air between evaporations,
- (B) electroplating a layer of the same conductive film onto the conductive film of step (A) of sufficient thickness to achieve the necessary conductivity in the electroplated layer,
- (C) bonding a secondary substrate to the electroplated layer with a replication cement, and
- (D) separating the secondary substrate and both bonded conductive layers from the adhesion coated master leaving the optical quality surface of the conductive electrode exposed.
- 2. Method according to claim 1 wherein the adhesion film is a chrome film and wherein the conductive film is copper.
- 3. Method according to claim 2 wherein each of the films of claim 2 is about 1000.ANG. in thickness.
- 4. Method according to claim 1 wherein in step (B), electroplating is carried in a solution containing 400 parts water, 100 parts CuSO.sub.4. 5H.sub.2 O, and 4-10 parts H.sub.2 SO.sub.4.
Government Interests
The Government has rights in this invention under Contract No. DAAL01-85-C-0197 with the Department of the Army.