1. Field of Invention
The invention relates to a method of transferring patterns. More particularly, the invention relates to a method of transferring patterns onto keys.
2. Description of Related Art
Currently, image transfer technologies are often applied for decorating and labeling products. To satisfy requirements for product decoration and product labeling, so far various image transfer technologies have been developed and employed. Among the image transfer technologies, thermal transfer technology is extensively applied for embellishing the products.
A keyboard on a notebook computer is taken for example. In a conventional transfer technology, a set of keys is assembled to a jig, and a film having a plurality of patterns is disposed on and fixed to the keys. The film is pressed and heated to transfer the patterns on the film to surfaces of the keys. The keys disassembled from the jig are assembled to a base of the keyboard according to their corresponding positions. However, the keys are likely to be misarranged on the base when the conventional transfer technology is adopted.
The invention is directed to a method for transferring patterns. By applying said method, a key module can have a favorable assembly yield.
In an embodiment of the invention is a method for transferring patterns on a key module. The key module includes a base and a plurality of keys assembled to the base, and a first space exists between each of the keys and the base. The method includes following steps. A support jig is assembled to the key module. The support jig has a plurality of first support portions filling the first spaces to fix positions of the keys relative to the base. A film is positioned on the keys. A plurality of patterns respectively corresponding to the keys are disposed on the film. The film is heated and pressed, such that the patterns are respectively transferred to the keys.
As described in the above embodiments of the invention, by assembling the support jig to the key module, the keys can be fixed to the base according to their corresponding positions. Further, when the film is pressed and heated, the patterns can be smoothly transferred to the keys. Thereby, the key module can directly proceed with assembly and then pattern transfer, so as to effectively simplify the assembly process of the key module and improve assembly yield of the key module.
It is to be understood that both the foregoing general descriptions and the detailed embodiments are exemplary and are, together with the accompanying drawings, intended to provide further explanation of technical features and advantages of the invention.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
In order to elaborate a process of transferring patterns to keys, please refer to
Based on the above embodiment of the invention, the support jig 200 assembled to the key module 100 has the first support portions 210 filling the first spaces 130 between the keys 120 and the base 110, such that the keys 120 can be supported by the first support portions 210 of the support jig 200, and that a constant distance can be maintained between the keys 120 and the base 110. When the film 300 is pressed for pattern transfer, positions of the keys 120 relative to the base 110 can be fixed by the support jig 200. Thereby, when the film 300 is pressed, flatness of the film 300 can be guaranteed. Besides, the patterns 310 can be smoothly transferred to the keys 120.
Detailed descriptions are further provided hereinafter. In
Additionally, a second space 140 exists between every two adjacent keycaps 122, and the support jig 200 has a plurality of second support portions 220 connected to the first support portions 210. When the support jig 200 is assembled to the key module 100, the second support portions 220 fill the second spaces 140 to fix relative positions of the adjacent keycaps 122. As such, relative displacement does not take place between the adjacent keycaps 122. It should be further mentioned that each of the second support portions 220 has a support surface 220a, and each of the support surfaces 220a and a surface of each of the keycaps 122 adjacent to the corresponding support surface 220a are substantially located on the same plane when the second support portions 220 fill the second spaces 140.
As such, the relative positions of the keycaps 122 and the positions of the keycaps 122 relative to the base 110 can be simultaneously fixed by the first support portions 210 and the second support portions 220 of the support jig 200. That is to say, after the first spaces 130 and the second spaces 140 are filled with the support jig 200, the keys 120 can be supported. Thereby, when the film 300 shown in
Moreover, in this embodiment, the support jig 200 has a stripe shape. After the keys 120 are assembled to the base 110, the stripe-shaped support jig 200 fills the first and the second spaces 130 and 140 from a side of the key module 100. Upon completion of transferring the patterns 310, the support jig 200 is removed from the side of the key module 100. Note that the external configuration of the support jig 200 and how the support jig 200 is assembled to the key module 100 are not limited in this embodiment. Namely, this embodiment is applicable as long as the relative positions of the keys 120 and the positions of the keys 120 relative to the base 110 are fixed.
On the other hand, as indicated in
In light of the foregoing, by, assembling the support jig to the key module, the positions of the keys relative to the base can be fixed, and simultaneously the surface of each of the keys and the support surfaces of the support jig are on the same plane. When the film is pressed and heated, the film can be placed on the keys while the flatness of the film is guaranteed. Thereby, the patterns can be smoothly and unerringly transferred to the keys. As such, the key module can be assembled to the base, and then the pattern transfer process is performed, so as to prevent incorrect arrangement of the keys which usually occurs when the conventional transfer technology is adopted. In other words, by means of the support jig, the assembly process of the key module can be effectively simplified, and assembly yield can be improved as well.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
This application claims the priority benefit of U.S.A. provisional application Ser. No. 61/168,225, filed on Apr. 10, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.
Number | Date | Country | |
---|---|---|---|
61168225 | Apr 2009 | US |