Patent Application
20080204102
The present invention relates generally to integrated circuits, and more particularly, to regulating the propagation delay in adjacent parallel metal lines in a metal interconnect layer of an integrated circuit.
In an integrated circuit, two parallel signals running next to each other in adjacent interconnect lines tend to either reinforce each other, if both are driven to the same polarity at the same time, or impede each other if driven to opposite polarities at the same time. The problem with signals reinforcing each other on adjacent capacitively coupled lines is that the signals can be “too fast”. Conversely, the problem with signals impeding each other on adjacent capacitively coupled lines is that the signals can be “too slow”. A signal is “too fast” or “too slow”, in comparison to a signal on a line that is capacitively coupled to another signal on a line that is not moving at the same time.
Consider two adjacent parallel lines of length L as shown in
C1=C2 [1]
C
1
+C
2
=C
TOTAL [2]
Now, consider line A to be at zero volts potential and line B to be at zero volts potential. Assume that Line A is the signal of interest. If Line B is held at zero volt potential and Line A is switched from zero volts to another potential, Line B is a capacitive load to Line A. Now, if instead of holding Line B at zero volts potential and having it transition at the same time as Line A, in the same polarity direction of Line A, Line B acts to capacitively couple Line A to the new potential. This effectively cancels the capacitance terms between Line A and Line B. If, on the other hand, Line B transitions in the opposite direction of Line A, Line B will try to couple Line A in opposition to the polarity that Line A is trying to achieve. This will slow Line A down.
Prior art techniques include shielding a signal line with adjacent parallel lines of the same material and ensuring that the shield is either tied to a static supply or tied to a signal that is not moving during the transition time of the signal of interest. While this technique is effective for dealing with capacitive coupling between adjacent signal lines, it increases the cost of the integrated circuit. Because additional lines are used for shielding, more space is required in the layout/area of the chip. Referring now to
What is desired, therefore, is a way to regulate the various delays caused by the coupling capacitance of adjacent interconnect lines in an integrated circuit, without the added circuit area and expense of additional shield lines.
The present invention makes the capacitive coupling between adjacent parallel lines more uniform and allows for better timing control of said lines through the use of inverters placed on one or both of the adjacent interconnect lines. By staggering the placement of inverters along adjacent lines, constructive and destructive coupling terms between the lines are balanced out.
The circuit and method of the present invention ensures that both cases of capacitive coupling are used in a single interconnect line or portion of a line, which results in a regulated propagation delay. This is done by inverting one of the lines halfway down its length L. In the static condition where Line B is not moving, both sides of the inverter are static and the capacitances associated with each side of the inverter looks like a static capacitive load to Line A. If Line B transitions, however, one side of the inverter, or the capacitance associated with one side of the inverter will be a reinforcing term while the other side of the inverter will be an impeding term. This is true regardless of direction of transitions on Line B.
An important constraint of the present invention is that the propagation delay through the inverter should be less than the propagation delay through one half of the line length, i.e. L/2, for best performance.
If desired, additional input and output inverter circuits can be coupled to the adjacent interconnect lines to provide the proper polarity inputs and outputs as required. Additionally, each segment of the coupled lines can include an inverter, and the pattern of the inverters can be staggered. Further, the inverter can be replace by other inverting logic gates such as an inverting bi-directional tri-state driver, or other logic gate.
One advantage of the present invention is that it requires less integrated circuit layout area than prior art shielded techniques because fewer lines are required.
The aforementioned and other features and objects of the present invention and the manner of attaining them will become more apparent and the invention itself will be best understood by reference to the following description of a preferred embodiment taken in conjunction with the accompanying drawings, wherein:
Referring now to
An important constraint of the present invention is that the propagation delay through the inverter 30 should be less than the propagation delay through one half of the line length, i.e. L/2, for best performance. Related to this constraint is an additional design rule in that when the delay through L/2 equals the delay through the inverter in a running length of interconnect, and additional inverter should be placed to gain the full benefit according to the present invention. A staggered pattern including multiple inverters in a single interconnect is shown and described in further detail below with respect to
Referring now to
Numerous variations of the basic circuit shown in
Another embodiment of the present invention is shown in
While there have been described above the principles of the present invention in conjunction with specific implementations and device processing technology, it is to be clearly understood that the foregoing description is made only by way of example and not as a limitation to the scope of the invention. Particularly, it is recognized that the teachings of the foregoing disclosure will suggest other modifications to those persons skilled in the relevant art. Such modifications may involve other features which are already known per se and which may be used instead of or in addition to features already described herein. Although claims have been formulated in this application to particular combinations of features, it should be understood that the scope of the disclosure herein also includes any novel feature or any novel combination of features disclosed either explicitly or implicitly or any generalization or modification thereof which would be apparent to persons skilled in the relevant art, whether or not such relates to the same invention as presently claimed in any claim and whether or not it mitigates any or all of the same technical problems as confronted by the present invention. The applicants hereby reserve the right to formulate new claims to such features and/or combinations of such features during the prosecution of the present application or of any further application derived therefrom.
