The present invention relates to the manufacture of semiconductor devices. In particular, the present invention relates to methods and apparatus for cleaning semiconductor substrates.
During semiconductor device fabrication, semiconductor substrates may be subjected to one or more cleaning steps. In some cases, such cleaning steps may use a substrate cleaning apparatus such as a scrubber. For example, a scrubber box having one or more brushes may be used, wherein the semiconductor substrate to be cleaned may be introduced into the scrubber box, and the scrubber brushes may be closed against the substrate. The scrubber brushes may then be rotated relative to the substrate, subjecting the substrate to one or more types of mechanical and/or chemical cleaning actions (e.g., depending on the surface geometry of the rotary scrubber brushes used, and/or the number, size and distribution of pores of the brushes, and/or the nature of the cleaning fluid used).
Defect reduction may be an important consideration in the development and/or implementation of a semiconductor device manufacturing process. For example, since the emergence of copper metallization as a leading interconnect in semiconductor device fabrication, the tendency of copper oxide (CuxO) or so-called ‘aphids’ to form on substrate surfaces during substrate polishing has been identified as an important cause/source of defects in semiconductor devices. As such, at least one goal of cleaning steps after substrate polishing, such as post chemical mechanical polishing (CMP) substrate scrubbing, may be to achieve effective removal of CuxO from substrate surfaces.
Accordingly, effective methods and/or apparatus for reliably removing defects, particularly copper oxides from substrate surfaces are desirable.
In a first aspect of the invention, a method of chemical delivery is provided. The method includes the steps of (1) receiving a first input flow of a dilutant; (2) receiving a second input flow of a chemistry; (3) combining the first and the second input flows into a combined flow; (4) employing a mixer to mix the combined flow such that a homogeneity of the combined flow is increased; (5) dividing the combined flow into at least a first output flow and second output flow; (6) directing the first output flow toward a first scrubber dispensing element; and (7) directing the second output flow toward a second scrubber dispensing element.
In second aspect of the invention, an apparatus is provided for chemical delivery to a scrubber. The apparatus includes a liquid delivery module having (1) a first input adapted to receive a first input flow of a dilutant; (2) a second input adapted to receive a second input flow of a chemistry; and (3) one or more flow couplers coupled to the first input and the second input, and adapted to combine the first input flow and the second input flow into a combined flow. A mixing element is coupled to the one or more flow couplers, and adapted to mix the combined flow such that a homogeneity of the combined flow is increased. The liquid delivery module also includes (1) a flow splitter coupled to the mixing element and adapted to generate at least a first output flow and a second output flow from the combined flow; (2) a first output coupled to the flow splitter and adapted to direct the first output flow toward a first scrubber dispensing element; and (3) a second output coupled to the flow splitter and adapted to direct the second output flow toward a second scrubber dispensing element. Numerous other aspects are provided.
Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.
Liquid cleaning chemistries that act as effective agents for removal of CuxO during post copper CMP cleaning are known. For example, the liquid cleaning chemistry ElectraClean (EC), a combination of ammonium hydroxide and citric acid developed by Applied Materials, Inc., is one such effective chemical agent. However, the present inventors have observed that some liquid cleaning chemistries, such as EC, may cause one or more types of semiconductor device defects if the dilution factor of the liquid cleaning chemistry applied to the surface of the substrate being cleaned falls outside a desirable and/or predefined range. For instance, at an EC dilution factor of higher than 200:1, aphide formation may be seen to increase. At an EC dilution factor of lower than 150:1, intermittent corrosion of deposited copper conductor lines may be observed to occur. As such, maintaining a dilution factor of EC within a process window of about 150-200:1 may be an important goal relating to defect reduction.
For convenience, the present invention will be described primarily with regard to the use of EC (and dilution thereof). It will be understood that the invention also may be employed with other cleaning fluids (e.g., Waco CX-100, Ashland CP70, ESC 794 or the like). Also for convenience, the present invention will be described with regard to the use of water as a liquid dilutant for EC. It will be understood that the invention also may be employed with other dilutants (e.g., Benzotriazole (BTA) alcohol (C6H5N3) or the like)
The use of the liquid delivery module 101 of
In some embodiments, for example, the liquid delivery module 117 of
The liquid delivery module 117 of
The common line 127 terminates at a second joint 129, which is adapted to divide the flow of dilute liquid chemistry into two separate output flows. A first output 131 coupled the second joint 129 provides a first flow of dilute liquid chemistry, which may be directed toward a first liquid dispensing element 133 within the scrubber 119. The first liquid dispensing element 133 of the scrubber 119 may be located adjacent a substrate (not shown) to be cleaned, and may be one of any suitable type of liquid dispensing element, such as a spray bar, a scrubber brush, a nozzle, etc. A second output 135 coupled to the second joint 129 provides a second flow of dilute liquid chemistry, which may be directed toward a second liquid dispensing element 137 within the scrubber 119. The second liquid dispensing element 137 of the scrubber 119 may be located adjacent the same side of the substrate to be cleaned, or adjacent an opposite side of the substrate to be cleaned, relative to the first liquid dispensing element 133. The second output 135 also may supply the second flow of dilute liquid chemistry to a different substrate.
The liquid delivery module 117 of
Other differences between the liquid delivery module 117 of
The liquid delivery module 117 may further include one or more check valves 141 between at least one of the inputs 121, 123 and the first joint 125. The check valves 141 may also contribute to good blending and/or mixing of the DI water and liquid chemistry. For example, the check valves 141 may induce rotation in at least one of the respective input flows, which may be beneficial for blending purposes upon confluence of the input flows. In at least one embodiment of the invention, the various components of the liquid delivery module 117 (e.g., the first input 121, the second input 123, the first joint 125, the common line 127, the second joint 129, the first output 131, the second output 135, the mixing element 139, the check valves 141, etc.) may comprise a single unit (e.g., may be disposed in or comprise part of a single manifold as shown in
As with the liquid chemistry from the source 124, the dilution factor of the additional liquid chemistry introduced from the source 146 may be high (e.g., the combined flow proceeding through the common line 127 and/or the mixing element 139 may be highly dilute with respect to the additional liquid chemistry). The liquid delivery module 143 may be adapted to reduce and/or eliminate wide variation in the output dilution factor of the additional liquid chemistry in a manner similar to that in which it reduces and/or eliminates wide variation in the output dilution factor of the chemistry from the chemistry source 124. For example, the liquid delivery module 143 may be adapted to reduce dilution factor variation in the additional liquid chemistry to about 3% or less between different output flows, and/or to about 3% or less between one or more of the output flows and a predetermined dilution factor as reflected by the input flow proportions.
The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. For example, more than two liquid chemical inputs may be employed, each for the introduction of different liquid chemistries, and a similar reduction and/or elimination of wide dilution factor variation relating to each liquid chemistry input may be accomplished in accordance with the present invention. Also, more than three dilute liquid chemistry outputs may be employed (e.g., for directing flows of dilute liquid chemistry to respective dispensing elements), and a similar reduction and/or elimination of wide dilution factor variation relating to each dilute liquid chemistry output may be accomplished in accordance with the present invention. Since the liquid delivery module of the present invention is adapted to be mounted adjacent the substrate scrubber it serves, and is adapted to provide local dilution of liquid chemistries with liquid dilutant, one or more of the source of liquid dilutant (e.g., DI water), and/or the sources of liquid chemistries may be located remotely with respect to the liquid delivery module. In addition, liquid dispensing elements that are coupled to dilute liquid chemistry outputs that branch from the same combined flow in accordance with the present invention, and that are adjacent the same substrate, need not be adjacent the same surface of the substrate. Such liquid dispensing elements may be adjacent different (e.g., opposite) sides of the same substrate. Also, liquid dispensing elements may be disposed in different substrate scrubbers.
Liquid chemistry dilution factors outside the range of 150:1 to 200:1 may be employed. Maintaining other dilution factors according to different preferred input proportions and/or for different liquid chemistries, such as a surfactants, is similarly achievable using the inventive methods and apparatus of the present application.
Joints disposed at the confluence of input flows, and/or disposed upstream of output flows in accordance with the present invention may be any suitable flow couplers. Also, where more than two inputs are combined in accordance with the present invention, or more than two outputs are provided in accordance with the present invention, one joint or flow coupler need not form all the needed connections. Multiple joints or flow couplers may be provided for such purposes.
Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.