Flat panel display manufacturing may use color filters that include different colored inks printed on a glass (or other material) substrate. The ink may be deposited using an inkjet printer adapted to precisely jet ink and/or other suitable material directly into specific pixel wells defined by a matrix. Due to variations in the amount of solvent and/or contaminants present on the surface of the substrates (e.g., in the pixel wells and/or on the matrix) during printing operations, the deposited ink may spread or otherwise manifest unevenly.
The present invention provides methods and apparatus for preparing a substrate surface for printing such that residual solvent and/or contaminants may be substantially removed from the substrate surface. In some embodiments, the present invention may incorporate apparatus for flowing purge gases (e.g., fresh air, nitrogen, etc.) on the substrate prior to ink jetting. The purge gases may blow or evaporate residual solvent and/or contaminants away from the surface, facilitating uniform ink distribution. In the same or other embodiments, the purge gases may be saturated with solvent such that jetted ink is exposed to substantially uniform levels of solvent on the substrate surface, facilitating uniform ink distribution.
Materials in contact with liquid have an attractive or repulsive response to the liquid. The material's composition, its corresponding surface chemistry, and the chemistry of the liquid determine the interaction with the liquid. This phenomena is termed hydrophilicity (e.g., ink-philicity for liquid ink) and hydrophobicity (e.g., ink-phobicity for liquid ink).
Hydrophilicity, also called hydrophilic, is a characteristic of materials exhibiting an affinity for liquid. Hydrophilic literally means “liquid-loving” and such materials readily adsorb liquids. The surface chemistry allows these materials to be wetted forming a liquid film or coating on their surface. Hydrophilic materials also possess a high surface tension value and have the ability to form bonds with liquid.
Hydrophobicity, also termed hydrophobic, materials possessing this characteristic have the opposite response to liquid interaction compared to hydrophilic materials. Hydrophobic materials (“liquid fearing”) have little or no tendency to adsorb liquids and liquid tends to “bead” on their surfaces (i.e., form discrete droplets). Hydrophobic materials possess low surface tension values and lack active groups in their surface chemistry for formation of bonds with liquid.
Wettability refers to a surface property characteristic for all materials which yields a unique value for different compounds. The surface tension value of a material can be utilized to determine wettability of a material by specific liquids. Through the measurement of the contact angle between a solid surface and a droplet of liquid on the surface, the surface tension for the solid material can be calculated.
Surface tension refers to a force, due to an unbalance in molecular forces, that occurs when two different materials (e.g., a liquid droplet on a solid surface) are brought into contact with each other forming an interface or boundary. The force is due to the tendency for all materials to reduce their surface area in response to the unbalance in molecular forces that occurs at their points of contact. The result of this force will vary for different systems of liquids and solids, which dictates the wettability and contact angle between the drop and surface.
The contact angle of a droplet on a solid surface is a measurement of the angle formed between the surface of the solid and the line tangent to the droplet radius from the point of contact with the solid. The contact angle is related to the surface tension by Young's equation through which the behavior of specific liquid-solid interactions can be calculated. A contact angle of zero degrees results in wetting, while an angle between 0 and 90 degrees results in spreading of the drop (due to molecular attraction). Angles greater than 90 degrees indicate the liquid tends to bead or shrink away from the solid surface (e.g., as will be described in detail below with reference to
Returning to the present invention, the matrix of pixel wells may be formed on the substrate using lithography or any suitable process. Due to variations in the ink-philicity/ink-phobicity of the substrate and/or the material used to form the matrix, the cross-sectional profile (e.g., the distribution) of the ink drops deposited into the pixel wells may not be optimal for forming color filters. In some cases, the uneven distribution of ink within a pixel well may result in a defect in the color filter. For example, if the ink “beads-up,” it may not fill the pixel wells completely. In another example, if the side walls are ink-philic and a pixel well is not completely filled, a concave (e.g., meniscus) profile may result. The inventors of the present invention have noticed that the ink-philicity/ink-phobicity of the matrix varies significantly among manufactures. Attempts to adjust the surface tension and thus, fill profile of the ink through chemical variations, if even possible, may not be satisfactory.
The present invention further provides methods and apparatus for adjusting the distribution of ink (or other material) within pixel wells, regardless of the ink-philicity/ink-phobicity of the substrate and/or the material used to form the matrix, so that the resulting cross-sectional profile if the deposited ink conforms to a desired shape. For example, a slightly crowned profile or a flat profile may be desired for a color filter application. According to embodiments of the present invention, a stream or curtain of pressurized gas may be used to push ink previously deposited in pixel wells to conform to a desired profile. The pressurized gas may include nitrogen and/or any suitable non-reactive gas. The pressurized gas may be applied immediately after the deposition of the ink or up until the ink cures. In some embodiments, one or more nozzles for directing the pressurized gas may be mounted to a support member that also supports inkjet print heads. As the print heads pass over a substrate depositing ink into pixel wells, the pressurized gas may be directed at the ink just deposited to adjust the profile of the ink.
In alternative or additional embodiments, rather than dynamically applying pressurized gas to the pixel wells as they are filled, the entire substrate may be placed in a chamber within which an overall increased air/gas pressure may be applied to all pixel wells. The increased air/gas pressure acts to adjust the distribution of ink within the pixel wells.
In some embodiments, the substrate, gas, and or ink may additionally be heated to further aid in adjusting the distribution of ink within the pixel wells. Heat may affect the fluidity and/or surface tension of the materials and thus, alter the ink's profile within the pixel wells.
The present invention provides for a number of advantages. For example, the present invention can be utilized to concurrently deposit inks and adjust the profiles of the deposited inks. By adjusting the profile of the deposited inks, the occurrence of defects resulting from uneven distribution of ink may be reduced or eliminated. Further, through timing and the use of different amounts of gas pressure, the amount of force applied to the deposited ink may be controlled to adjust the shape of the ink's profile within the pixel wells.
Turning to
In the exemplary embodiments of
In operation, the pressurized gas delivery systems 110-118 may apply gas pressure to the pixel wells in a scanning process that coincides with the printing process. Alternatively or additionally, the scanning process may be performed after printing has completed. In some embodiments, the scanning process may be performed perpendicular to the printing direction while in other embodiments, the scanning may be in the printing direction. Although not shown, the substrate (and the inkjet printing system 100) may be enclosed in a chamber adapted to contain pressurized gas/air. In some embodiments, the chamber may be adapted to heat the substrate. The scanning process may be performed under fixed or variable heat and pressure recipes within the chamber.
The inkjet printing system 100 of the present invention may include any number of pressurized gas delivery systems 110-118 (e.g., 1, 2, 3, 4, 5, 6, etc.) or it may include a single system with any number of nozzles. Exemplary pressurized gas delivery systems suitable for use with an inkjet print system 100 according to the present invention include the Continuous Gas System available from Praxair Corporation.
Pressurized gas delivery systems 110-118 may include one or more plenums having an opening or an array of nozzles adapted to dispense a curtain of pressurized gas onto a substrate. The opening or nozzles may be round, rectangular, or any suitable shape. For example, the curtain of pressurized gas may by formed by releasing the gas through a rectangular slit in a plenum. In some embodiments, the pressure of the gas may be controlled at the gas supply 119 and/or by adjusting the opening of the pressurized gas delivery systems 110-118. The pressure of the gas may be varied depending upon the desired profile of the ink in the pixel well. A profile suitable for use in manufacturing color filters for displays may be achieved using gas pressures in the range of approximately 5 to 150 psi. However, other pressures may be used. The opening(s) through which pressurized gas is released upon the substrate may be located from approximately 2.0 mm to approximately 10 mm above the substrate. Other distances between the opening and the substrate may be used.
In a first exemplary embodiment, the pressurized gas delivery system 110 may be coupled to the print bridge 108 in a position and manner similar to that used for a print head. That is, the pressurized gas delivery system 110 may be capable of similar rotation and movement as the print heads 102-106 and may be moved adjacent the print heads 102-106 or may be spaced apart from them. The pressurized gas delivery system 110 may include a single nozzle or, in some embodiments, nozzles (e.g., 2, 3, 4, . . . 100, 101, etc.) in a cluster or array. In some embodiments, the gas delivery system 110 may be adapted to sense the amount of pressure being applied to the ink in the pixel wells and provide a feedback signal to the pressurized gas delivery system controller 120. Pressure, optical, and/or temperature sensors may be included in the pressurized gas delivery system 110 to collect and provide feedback and/or feed-forward data. The pressurized gas delivery system 110 may be positioned on either side of the print heads 102-106 or may be positioned interstitially.
In one or more embodiments, the pressurized gas delivery system 110 may be positioned to the left of the print heads 102-106 (e.g., as shown in
In a second exemplary embodiment, the pressurized gas delivery system 112 of
In a third exemplary embodiment, the pressurized gas delivery systems 114-118 may be attached to and adjacent the print heads 102-106. That is, pressurized gas delivery system 114 may be separately mounted on print bridge 108 immediately adjacent print head 102 or may be mounted to the same assembly as print head 102 such that any movement by print head 102 will coincide with (e.g., cause) movement of pressurized gas delivery system 114. Similarly, pressurized gas delivery system 116 may be mounted with or adjacent print head 104 and pressurized gas delivery system 118 may be mounted with or adjacent print head 106. In some embodiments, pressurized gas delivery systems 114-118 may each include a plenum with an opening or openings adapted to create a curtain of pressurized gas. Each print head 102-106 may have an associated pressurized gas delivery system 114-116.
In embodiments where each print head 102-106 has a corresponding pressurized gas delivery system 114-118, each pressurized gas delivery system 114-116 may be oriented to apply pressure to a different set of pixel wells. For example, during a printing operation where the printing proceeds from left to right, pressurized gas delivery system 118 may adjust ink profiles of a printed column of pixel wells. The pressurized gas delivery system 116 may adjust ink profiles of two filled columns of pixel wells. Pressurized gas delivery system 114 may adjust ink profiles of three filled columns.
Alternatively, pressurized gas delivery systems 114-118 may include more than one nozzle such that the nozzles are clustered at one or more print heads 102-106 and one or more print heads do not have an associated pressurized gas delivery system 114-118. For example, in some embodiments, print head 102 may have a pressurized gas delivery system 114 mounted along with the print head. The pressurized gas delivery system 114 may include two or more nozzles, each capable of adjusting ink profiles differently. Print heads 104, 106 may not include a pressurized gas delivery system 116, 118. When two nozzles are incorporated in a pressurized gas delivery system 114, one nozzle may supply gas at a first pressure to adjust a first type of ink (or cause a first type of profile) in a first pixel well and one nozzle may supply gas at a second, different pressure to adjust the profile of a second type of ink (or cause a second type of profile) in a second pixel well. Alternatively or additionally, differently pressurized gases dispensed from different nozzles may be used to adjust the profiles of inks at different stages of curing and/or within a single pixel well.
When three nozzles are incorporated into a pressurized gas delivery system 114, each nozzle may be capable of adjusting a different portion of an ink profile within a pixel well through the use of differently pressurized gases. For example, pressured gas aimed at either end of a pixel well may be applied at a first pressure while pressurized gas at a second pressure may be applied to a center portion of the pixel well. If the first pressure is higher than the second pressure, a profile having a relatively high center point and lower end points may be achieved. Alternatively, a single nozzle applying pressurized gas at a variable pressure as it moves along the pixel well may be used to achieve a similar profile.
Pressurized gas delivery systems 110-118 may be coupled to the pressurized gas delivery system controller 120 logically (e.g., electrically, wirelessly, optically, etc.) and/or mechanically. The pressurized gas delivery system controller 120 may include software capable of selectively applying pressurized gas to pixel wells as described above. The pressurized gas delivery controller 120 may be capable of processing and/or storing feedback/feed-forward data received from each pressurized gas delivery system 110-118. The feedback/feed-forward data may indicate the amount of pressure actually being applied to the pixel wells and/or the temperature of the area near the pixel wells. The feedback data may be used to adjust the amount of pressure being applied to the pixel wells.
In alternative embodiments, each pressurized gas delivery system 110-118 may have an associated pressurized gas delivery system controller (e.g., each pressurized gas delivery system 110-118 may be capable of individually responding to feedback/feed-forward data). The feedback/feed-forward data from the pressurized gas delivery systems 110-118 may include location coordinates (e.g., on an XY plane) of the sensed region. The location data may also be retrieved or received from the printing system (e.g., system controller 122).
The pressurized gas delivery system controller 120 may be any suitable computer or computer system, including, but not limited to, a mainframe computer, a minicomputer, a network computer, a personal computer, and/or any suitable processing device, component, or system. The pressurized gas delivery system controller 120 alternatively may comprise a dedicated logic circuit or any suitable combination of hardware and/or software. The pressurized gas delivery system controller 120 may be adapted to control any of the pressurized gas delivery systems 110-118, including controlling the movement of each pressurized gas delivery system 110-118 rotationally and in both positive and negative lateral displacement directions along the X-axis; the positive X-axis direction being indicated by the frame of reference arrow labeled X in
As noted above, the system 100, in an exemplary embodiment, may include the system controller 122. As with the pressurized gas delivery system controller 120, the system controller 122 may be any suitable computer or computer system, including, but not limited to, a mainframe computer, a minicomputer, a network computer, a personal computer, and/or any suitable processing device, component, or system. The system controller 122 alternatively may comprise a dedicated logic circuit or any suitable combination of hardware and/or software. The system controller 122 may be adapted to control any of the print heads 102-106 through the print head support 108, including controlling the movement of each print head 102-106 rotationally and in both positive and negative lateral displacement directions along the X-axis; the positive X-axis direction being indicated by the frame of reference arrow labeled X in
The system controller 122 may interface with the pressurized gas delivery system controller 120 and/or may communicate directly with the pressurized gas delivery systems 110-118. Either the pressurized gas delivery system controller 120 or the system controller 122 may determine adjustments to be made to the pressure and/or temperature of the gas, the orientation or position of the nozzles, and/or the timing of the application of pressurized gas.
Pressurized gas delivery systems 114-118 may also be mounted fore and/or aft of any of print heads 102-106 relative to the print direction (which may be both positive and negative directions along the Y-axis, the positive Y-axis direction being indicated by the frame of reference arrow labeled Y in
The present invention provides various methods of adjusting (e.g., flattening) uneven profiles after printing. The ink thickness variations can be reduced so that thickness and color uniformity is greatly improved at both the pixel level and the display object level (e.g., the panel level). There are a number of variations of the methods of the present invention that may be employed to achieve a desired ink profile. In a first exemplary variation, printed substrates may be placed into a pressurized chamber with a pressure ranging from approximately 5 to approximately 150 psi for approximately ten seconds to approximately five minutes. In a second exemplary variation, printed substrates may be placed into a pressurized chamber with a pressure ranging from approximately 5 to approximately 30 psi using either heated compressed nitrogen (N2) or heated compressed air for approximately ten seconds to approximately five minutes. In either case, the heated gas may be in the range from approximately 40 degrees Celsius to approximately 80 degrees Celsius. However, in either of these first two variations, other temperature, pressure, and time ranges may be used.
In a third exemplary variation of the present methods, substrates may be scanned with a pressurized gas delivery system (e.g., a compressed N2 or compressed air nozzle) at a rate of approximately five feet per minute (e.g., one to ten ft/min), either following the print direction or approximately perpendicular to the print direction, within a heated chamber. The chamber may be heated within the range from approximately 40 degrees Celsius to approximately 80 degrees Celsius. The scanning may be performed concurrently with the printing (e.g., immediately after the ink is deposited) or after printing has been completed entirely or partially. The pressurized gas may be in the range of approximately five to approximately forty psi. However, other chamber temperatures, scan rates, directions, pressures, time frames, and gases may be used.
In a fourth exemplary variation of the present methods, substrates may be scanned with a heated, pressurized gas delivery system (e.g., a heated compressed N2 or heated compressed air nozzle) at a rate of approximately five feet per minute (e.g., one to ten ft/min) following the print direction or approximately perpendicular to the print direction. The scanning may be performed concurrently with the printing (e.g., immediately after the ink is deposited) or after printing has been completed entirely or partially. The pressurized gas may be in the range of approximately five to approximately forty psi. The temperature of the gas may be in the range from approximately 40 degrees Celsius to approximately 80 degrees Celsius. However, other gas temperature ranges, scan rates, directions, pressures, time frames, and gases may be used.
In alternative or additional embodiments, the substrates may be heated. The stage upon which the substrate is supported may include heating elements controlled by either the pressurized gas delivery system controller 120 or the system controller 122. Alternatively, a spot heater coupled to the print bridge may be employed. The substrates may be heated to a temperature of approximately 40 degrees Celsius to approximately 80 degrees Celsius. Other temperatures may be used.
Turning to
In some embodiments, the fill profile of pixel wells may be concave before the present invention is applied to adjust the profile. In such embodiments, the pressurized gas may be directed at and angle toward the side walls of the pixel wells and/or to the outer edges of the pixel wells to aid in adjusting the profile. Alternatively, a direct downward application of pressurized gas directed at the outer edges of the pixel wells or to the entirety of the pixel wells may be used to modify the profile. Alternatively, additional ink may be added to such partially filled ink wells.
Turning to
Apparatus and methods for preparing a substrate for printing are now described with respect to
Turning to
Inkjet printing system 1000 may also include gas delivery 1006a-b and/or gas recovery 1008a-b, which may be coupled to print head 1002, adjacent nozzles 104a-g as shown. Gas delivery 1006a-b and gas recovery 1008a-b may comprise multiple apertures and may be situated adjacent each other as shown in
Gas delivery 1006a-b may be coupled to a gas supply 1010 and a gas delivery system controller (not shown), such as the gas delivery system controller 120 of
The inkjet printing system 1000 may be adapted to print to a substrate S.
In operation, the gas supply 1010 may supply a purge gas (e.g., compressed air, fresh air, nitrogen, etc.) to the gas delivery 1006a-b. The purge gas may be passed through a series of regulator, control, and adjustment valves (not shown) (e.g., needle valves, mass flow controller, etc.) between the gas supply 1010 and the gas delivery 1006a-b. The gas delivery 1006a-b may direct (e.g., through a valve, vent, aperture, etc.) the purge gas toward the substrate S such that the purge gas may blow or evaporate any residual solvent and/or contaminants away from the surface of the substrate S. This purging may help create a similar substrate surface condition for every print pass. That is, because the purge gas will remove contaminants and/or substantially equalize any amount of solvent present on the substrate surface, ink jetted onto the substrate S will mix with no or equal amounts of solvent over the entire surface. This will facilitate uniform line width jetting by each nozzle 1004a-g.
In some embodiments, the gas recovery 1008a-b may be provided to capture or reclaim the purge gas and any particulates which may be blown from the surface of the substrate and/or any evaporates. The vacuum 1012 may assist in exhausting the purge and/or other gases from the printing environment through the gas recovery 1008 by drawing off the purge gases through the gas recovery 1008, thus leaving a clean surface for subsequent printing.
In an exemplary embodiment, as the substrate S is moved below the stationary print head 1002 in the positive Y direction during a print pass, as indicated by the Y-axis of
When the print direction changes (e.g., the substrate is moved in the negative Y direction), the alternative gas delivery 1006b and alternative gas recovery 1008a are turned on and the other gas delivery 1006a and gas recovery 1008b are turned off. The switching of the gas recovery and delivery may be effected through a system of automated electrically valves V1, V2 that open and close based on the direction of the substrate's motion. Thus, when the substrate S is moved in the negative Y direction, the gas delivery 1006b may now direct purge gas toward the substrate S. Gas delivery 1006b is turned off by valve V1, nozzles 1004a-g may dispense ink onto the substrate S, and purge gas, particulates, contaminants, evaporates, and other substances may be collected by the gas recovery 1008a. Gas recovery 1008b is turned off by valve V2. The recovered matter is siphoned to the vacuum 1012. The gas recovery and delivery will switch again when the direction of the substrate changes again with the next print pass. In this way, purge gas may be delivered to the substrate S immediately prior to ink landing on the purged area of the substrate S and the gas is drawn away from the substrate S immediately after the ink lands regardless of the current print direction.
In the same or other embodiments, the gas supply 1010 may supply a purge gas to the gas delivery 1006a. The gas delivery 1006a may direct the purge gas toward the substrate S. Gas recovery 1008a may intake the purge gas, etc. in advance of ink being deposited on the substrate S via nozzles 1004a-g. During a subsequent print pass in the opposite direction, gas supply 1010 may supply a purge gas to the gas delivery 1006b. The gas delivery 1006b may direct the purge gas toward the substrate S. Gas recovery 1008b may intake the purge gas, etc. in advance of ink being deposited on the substrate S via nozzles 1004a-g. In this embodiment, the purge gas may be delivered to and drawn away from an area on the substrate S prior to printing on the area via nozzles 1004a-g irrespective of the current print direction. In some embodiments, the relative locations of gas delivery 1006b and gas recovery 1008b may be switched relative to the nozzles 1004a-g. Any suitable combination of uses and numbers of the gas deliveries 1006a-b and gas recoveries 1008a-b that is practicable may be used. For example, gas delivery 1006a may direct purge gas toward the substrate while gas recovery 1008b may draw the spent purge gas away.
Turning to
Solvents for use in inkjet printing may be housed in the solvent tank 1104. Exemplary solvents include PGEMA (CAS 165-85-5), n-amyl propionate (CAS 624-54-4), or any solvent compatible with inks used in ink jetting. In some embodiments, the vapor pressure of these solvents should be between about 0.01 to 1000 mm Hg at about 25° C. Preferably, the vapor pressure of these solvents should be between about 0.5 to 300 1000 mm Hg at about 25° C. Other ranges of vapor pressures and/or temperatures may be used. Higher vapor pressure solvents will generally allow the solvent to evaporate more quickly from the surface of the substrate. Lower vapor pressure solvents may require heating to evaporate the solvent.
In operation, solvent held in one or more solvent tanks 1104 may pass solvent to the bubbler 1106. Similarly, the gas source 1108 may pass a purge gas (e.g., compressed air, fresh air, nitrogen, etc.) to the bubbler 1106. The bubbler 1106 may mix products from the purge gas source 1108 and the solvent tank 1104.to pass purge gas saturated with solvent vapor to an inkjet printing apparatus, such as the gas delivery 1006 of
Gas delivery 1208 may be coupled to a gas supply 1212 and a gas delivery system controller (not shown), such as the gas delivery system controller 120 of
Gas recovery 1210 may be coupled to a vacuum 1214, which may be similar to the vacuum 1012 described above with respect to
As shown in
In
Operation of the embodiments of
In operation, the gas supply 1212 may supply a purge gas (e.g., compressed air, fresh air, nitrogen, etc.) to the gas delivery 1208. The purge gas may be passed through a series of regulator, control, and adjustment valves (not shown) (e.g., needle valves, mass flow controller, etc.) between the gas supply 1212 and the gas delivery 1208. The gas delivery 1208 may direct (e.g., through a valve, vent, etc.) the purge gas toward the substrate S such that the purge gas may blow or evaporate any residual solvent and/or contaminants away from the surface or the substrate S. This purging may create a similar substrate surface condition for every print pass. That is, because the purge gas will remove contaminants and/or substantially equalize the amount of solvent present on the substrate surface, ink jetted onto the substrate S will mix with no or equal amounts of solvent over the entire surface. This will facilitate uniform line width jetting by each nozzle 1204a-c.
In some embodiments, the gas recovery 1210 may be provided to reclaim the purge gas and any particulates which may be blown from the surface of the substrate and/or any evaporates. The vacuum 1214 may assist in exhausting the purge and/or other gases from the printing environment through the gas recovery 1210 leaving a clean surface for subsequent printing.
Gas delivery 1208 and gas recovery 1210 may be moved (e.g., oscillated, swept, etc.) over the surface of the substrate S. This may aid loosening contaminants from the surface of the substrate S and/or facilitating evaporation of any solvent and/or contaminants remaining on the surface. By moving the gas delivery 1208 and gas recovery 1210, areas of the substrate S surface may be approached from different angles which may help in the preparation process. In some cases, purge gas delivered from the gas delivery 1208 may be pulsed, jetted intermittently, jetted more forcefully, or otherwise varied so as to facilitate the removal of contaminants and/or solvent from the surface of the substrate S.
In the specific example of
While the present invention has been described primarily with reference to inkjet printing of color filters, it will be understood that the invention also may be employed with other materials and applications. For example, the present invention may also be applied to spacer formation, polarizer coating, and nanoparticle circuit forming.
Accordingly, while the present invention has been disclosed in connection with specific embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention.
The present application is related to the following commonly-assigned, co-pending U.S. Patent Applications, each of which is hereby incorporated herein by reference in its entirety for all purposes: U.S. Provisional Patent Application Ser. No. 60/721,624, filed Sep. 25, 2005 and entitled “METHODS AND APPARATUS FOR ADJUSTING PIXEL FILL PROFILES”; U.S. Provisional Patent Application Ser. No. 60/625,550, filed Nov. 4, 2004 and entitled “APPARATUS AND METHODS FOR FORMING COLOR FILTERS IN A FLAT PANEL DISPLAY BY USING INKJETTING”; U.S. patent application Ser. No. 11/019,967, filed Dec. 22, 2004 and entitled “APPARATUS AND METHODS OF AN INKJET HEAD SUPPORT HAVING AN INKJET HEAD CAPABLE OF INDEPENDENT LATERAL MOVEMENT” (Attorney Docket No. 9521-1); U.S. patent application Ser. No. 11/019,929, filed Dec. 22, 2004 and titled “METHODS AND APPARATUS FOR INKJET PRINTING.” (Attorney Docket No. 9521-2); U.S. patent application Ser. No. 11/019,930, filed Dec. 22, 2004 and entitled “METHODS AND APPARATUS FOR ALIGNING PRINT HEADS” (Attorney Docket No. 9521-3); and U.S. Provisional Patent Application Ser. No. 60/703,146, filed Jul. 28, 2005 and entitled “METHODS AND APPARATUS FOR SIMULTANEOUS INKJET PRINTING AND DEFECT INSPECTION” (Attorney Docket No. 9521-7/L). U.S. Provisional Patent Application Ser. No. 60/721,340, filed Sep. 27, 2005 and entitled “INKJET DELIVERY MODULE” (Attorney Docket No. 10145/L/DISPLAY).