This patent application claims the benefit of and priority to Indian Provisional Patent Application Serial No. 202241017794 filed Mar. 28, 2022, which Application is hereby incorporated herein by reference in its entirety.
This description relates generally to operational amplifiers (op amps), and more particularly to methods and apparatus to reduce error in operational amplifiers.
Operational amplifiers are used frequently in analog circuitry to produce an output voltage that is amplified relative to an input voltage. In some examples, the ratio of the output voltage of an operational amplifier to the input voltage of the operational amplifier is referred to as the gain of the operational amplifier. In some configurations, such as a negative feedback loop, the gain of an operational amplifier may be configured by external components.
For methods and apparatus to reduce error in operational amplifiers, an example device includes: switch circuitry configured to: connect, in a first state based on a control signal, the first switch input to the first switch output and the second switch input to the second switch output; and connect, in a second state based on the control signal, the first switch input to the second switch output and the second switch input to the first switch output; the operational amplifier configured to: generate, in response to the control signal, a first voltage based on a gain and the connections in the first state; and generate, in response to the control signal, a second voltage based on the gain and the connections in the second state; and an Analog to Digital Converter (ADC) configured to convert the third voltage and fourth voltage into a digital value based on a multiplication of the input voltage and the gain.
The same reference numbers or other reference designators are used in the drawings to designate the same or similar (functionally and/or structurally) features.
The drawings are not necessarily to scale. Generally, the same reference numbers in the drawing(s) and this description refer to the same or like parts. Although the drawings show regions with clean lines and boundaries, some or all of these lines and/or boundaries may be idealized. In reality, the boundaries and/or lines may be unobservable, blended and/or irregular.
Operational amplifiers are used in a wide variety of applications, including signal processing, sensing, control systems, etc. In many applications, an operational amplifier is used as an initial computation in a system that performs additional computations using the output of the operational amplifier. In such applications, the performance of the operational amplifier can have a significant impact on the performance of the system as a whole. As such, electronics manufacturers may seek to continually improve the performance and accuracy of operational amplifiers.
One manner of characterizing the performance of an operational amplifier is offset voltage. An offset voltage refers to an error in which the voltage produced by the operational amplifier is different from an expected voltage. For example, an operational amplifier having a gain of 10 may output 10.2 milli-Volts (mV) in response to a 1 mV signal, wherein the 0.2 mV is due to offset voltage. Offset voltage may occur due to a difference between the voltages received at an input stage of transistors within the operational amplifier. Furthermore, the magnitude of offset voltage is affected by the temperature of the operational amplifier. Temperature drift, a metric that quantifies how much an offset voltage changes in response to a temperature change, may also be used to characterize the performance of an operational amplifier.
In some examples, electronics manufacturers may mitigate offset voltage using a chopping technique. When using a chopping technique, the output of an operational amplifier can be characterized as a square wave that alternates between a maximum of G x (input voltage + offset voltage) and a minimum of G x (input voltage - offset voltage), where G refers to the gain of the operational amplifier. Prior solutions utilizing the chopping technique may mitigate the offset voltage by implementing a frequency filter to average the maximum and minimum voltages and thereby remove the offset voltage swing. However, prior solutions that utilize chopping may require additional space in an integrated circuit to implement the both the operational amplifier and the frequency filter, leading to increased manufacturing costs.
Example methods, systems, and apparatus described herein describe an example operational amplifier implemented on an integrated circuit (such as a microprocessor) including an example Analog to Digital Converter (ADC). Advantageously, the offset swing that occurs from using a chopping technique is removed when the example ADC samples the output of the operational amplifier. As a result, examples herein describe techniques to remove offset voltage without the use of circuitry external to a microprocessor such as a frequency filter. Additionally, the example operational amplifier alternates between G × (input voltage + offset voltage) and G × (input voltage - offset voltage) at a rate determined by the example ADC. As a result, the example operational amplifier may exhibit lower offset voltage and lower temperature drift than previous solutions.
The example voltage source 102 generates the input voltage 104. The example voltage source 102 may be implemented as any type of device and may generate the input voltage 104 for any purpose. For example, the voltage source 102 may be sensor circuitry that generates the input voltage 104 to perform a measurement. In another example, the voltage source 102 may be transceiver circuitry that generates the input voltage 104 in response to receiving data over a transmission medium (e.g., a cell network, a cable, etc.). In some examples, the input voltage 104 may change over time.
The example offset controller circuitry 105 receives the input voltage 104 from the voltage source 102 and produces digital values (i.e., ‘0’ and ‘1’ bits) representative of the input voltage. The digital values may be referred to as the example ADC output signal 120. The components within the example offset controller circuitry 105 may be implemented together on an integrated circuit. In some examples, one or more of the example voltage source 102, example memory 122, and example processor circuitry 124 may be implemented on the same integrated circuit as the example offset controller circuitry 105. In other examples, one or more of the example voltage source 102, example memory 122, and example processor circuitry 124 may be implemented separately from the example offset controller circuitry 105.
Within the example offset controller circuitry 105, the example switch circuitry 106A includes a plurality of switches. The example switch circuitry 106A has two inputs and two outputs. The example switch circuitry 106A transitions between a first state and a second state based on the chop control signal 118. In the first state, a first input is connected to a first output and a second input is connected to a second output in each of the example switch circuitry 106A. In the second state, the first input is connected to the second output and the second input is connected to the first output in the example switch circuitry 106A. The example switch circuitry 106A is discussed further in connection with
Within the example offset controller circuitry 105, the example offset voltage 108 is a representation of the internal error in the operational amplifier 110. In the illustrative example of
Within the example offset controller circuitry 105, the example operational amplifier 110 receives a differential input in the form of two input voltages from the switch circuitry 106A. The example operational amplifier 110 generates an output voltage, the op amp output signal 112, that is amplified relative to the input voltage between the differential pair of inputs. The gain of the operational amplifier 110 may be any value. In examples used herein, the gain of the operational amplifier 110 may be generalized as the variable G. The example operational amplifier 110 is represented as an ideal op amp in
Within the example offset controller circuitry 105, the example voltage divider 114 is implemented by two or more resistors in series which are coupled to the op amp output signal 112 at a first node and coupled to ground at a second node. The example voltage divider 114 also includes one or more intermediate nodes in between the resistors connected in series. Each intermediate node exhibits an intermediate voltage that is less than the op amp output signal 112 but is greater than ground (e.g., 0 volts (V)). The voltage of any intermediate node in the voltage divider 114 can be described as
where OPAOUT112 is the voltage from the op amp output signal 112, R1 is the total resistance between the intermediate node and the first node, and R2 is the total resistance between the intermediate node and ground. In
This node is connected to the second input of the switch circuitry 106A. The values of the resistors used in the voltage divider 114 values may be pre-determined by a manufacturer and may be based on the gain G.
Within the example offset controller circuitry 105, the example ADC 116 converts the op amp output signal 112, an analog voltage, into digital bits. The example ADC 116 generates the ADC output signal 120, which includes a high supply voltage for a logical ‘1’ bit and a low supply voltage for a logical ‘0’ bit. The example ADC 116 also generates the chop control signal 118. The example chop control signal 118 is discussed further in connection with
The example memory 122 stores the digital bits encoded in the ADC output signal 120. The example memory 122 may be implemented as any type of memory. For example, the example memory 122 may be a volatile memory or a non-volatile memory. The volatile memory may be implemented by Synchronous Dynamic Random Access Memory (SDRAM), Dynamic Random Access Memory (DRAM), RAMBUS® Dynamic Random Access Memory (RDRAM®), and/or any other type of RAM device. The non-volatile memory may be implemented by flash memory and/or any other desired type of memory device.
The example processor circuitry 124 may obtain the digital bits from memory 122. and perform operations based on the digital bits. For example, the digital bits may represent sensor readings, and the processor circuitry 124 may perform operations by presenting the readings to a user on a display. In another example, the digital bits represent a message from an external device, and the processor circuitry 124 may perform operations by sending a reply message to the external device. The example processor circuitry 124 may be implemented by any type of processor device. Examples of processor devices include programmable microprocessors, Field Programmable Gate Arrays (FPGAs) that may instantiate instructions, Central Processor Units (CPUs), Graphics Processor Units (GPUs), Digital Signal Processors (DSPs), or microcontrollers and integrated circuits such as Application Specific Integrated Circuits (ASICs).
Advantageously, the components of the example offset controller circuitry 105 may be implemented together on a single integrated circuit such as a microprocessor. Because ADCs are common components used in a variety of applications, a manufacturer may design a microprocessor to include an ADC by default. As such, the use of the example ADC 116 to correct the offset voltage produced in the op amp output signal 112 does not require additional die space on the integrated circuit like the frequency filter of previous solutions.
The example switch circuitry 106A changes between the first state and second state based on the chop control signal 118. In doing so, the example computer system 100 implements a chopping technique in which the op amp output signal 112 alternates between
As used above and herein, VIN104 refers to the example input voltage 104 and VOFF108 refers to the example offset voltage 108. Advantageously, the use of the example ADC 116 to both correct the offset voltage and to determine when the op amp output signal 112 changes values via the chop control signal 118 results in smaller magnitudes of offset voltage and temperature drift than previous solutions.
The switch circuitry 106A includes two inputs. In the example switch circuitry 106A, a first input is connected to the input voltage 104 and the second input is connected to an intermediate node of the voltage divider 114. The switch circuitry 106A additionally includes two outputs. In the example configurations 202, 204, the switch circuitry 106A may be implemented by four single pole single throw (SPST) switches, which in turn may be implemented using transistors or other suitable switching circuit elements. In such examples, within the switch circuitry 106A, a first SPST switch connects the first input to a first output, a second SPST switch connects the first input to a second output, a third SPST switch connects the second input to the first output, and the fourth SPST switch connects the second input to the second output. In other examples, different numbers of different switches may be used to implement the switch circuitry 106A. For example, two single pole double throw (SPDT) switches may be implemented where a given SPDT switch connects one of the inputs to both of the first and second outputs.
The example configuration 202 shows the example switch circuitry 106A in the first state. In the first state, the switch circuitry 106A connects the input voltage 104 to the first output and the op amp output signal 112 to the second output. The first output of the switch circuitry 106A is then connected in series to the external representation of the offset voltage 108. Therefore, the voltage experienced by the positive input terminal of the example operational amplifier 110 in the example configuration 202 is (VIN104 + VOFF108). Furthermore, a property of ideal op amps is that the output voltage increases, thus increasing the feedback input, until the voltage difference between the input terminals is 0 V. As such, the voltage experienced by the negative input terminal of the example operational amplifier 110 in the example configuration 202 at steady state is also (VIN104 + VOFF108). These voltages are then amplified by G within the example operational amplifier 110. Therefore, the op amp output signal 112 is G × (VIN104+ VOFF108) when the switch circuitry 106A is in the first state.
The example configuration 204 shows the example switch circuitry 106A in the second state. In the second state, the switch circuitry 106A connects the input voltage 104 directly to the negative terminal of the operational amplifier 110 via the second output. Furthermore, because the example operational amplifier 110 is represented as an ideal op amp, both terminals of the example operational amplifier 110 should experience the input voltage 104. However, the positive input terminal of the operational amplifier 110 is still connected in series with the offset voltage 108. As such, the voltage experienced by the positive input terminal is the sum of the offset voltage 108 and the voltage at the first output of the switch circuitry 106A. Therefore, in order for the positive terminal of the operational amplifier 110 to experience the input voltage 104, the voltage at the first output of the switch circuitry 106A must be VIN104 - VOFF108. In the example configuration 204, the first output of the switch circuitry 106A is connected in series to the second input of the switch circuitry 106A, which in tum is connected in series to the output of the example voltage divider 114. The example voltage divider 114 is designed to output a voltage that has a smaller amplitude than the example op amp output signal 112. Specifically, the output of the example voltage divider 114 has an amplitude that is reduced by a factor of G relative to the example op amp output signal 112. Therefore, for the voltage at the first output of the switch circuitry 106A to be VIN104-VOFF108,the example op amp output signal 112 is G × (VOFF104 - (VOFF108)when the switch circuitry 106A is in the second state.
The example PMOS transistors 302, 304, 306 are configured to form an input stage of the operational amplifier. In the input stage, the current that flows through the drain gate of the PMOS transistors 302, 304 is proportional to the voltage provided by the input voltage 104 and voltage divider 114. While the two voltages provided by the switch circuitry 106A are ideally equal in magnitude, in practice, may be different. The difference in magnitude of voltages measured at 302 and 304 is the offset voltage 108.
The example PMOS transistors 308, 310, 312, 314, and example NMOS transistors 316, 318, 320, 322 collectively form a folded cascode amplifier. The gain of the operational amplifier 110, which is a measurement of the amplification of the voltage between NMOS transistors 318, 322, is based on the transconductance of the transistors within the folded cascode amplifier.
In practice, the example operational amplifier 110 may include three example switch circuitry 106A, 106B, 106C implementations as described in
The example switch circuitry 106B has two inputs and two outputs. The two inputs of the example switch circuitry 106B are coupled to the drain gates of the example PMOS transistors 308, 310. The two outputs of the example switch circuitry 106B are coupled to the source gates of the example PMOS transistors 312, 314. When the example switch circuitry 106B is in the first state, the drain gate of the example PMOS transistor 308 is coupled to the source gate of the example PMOS transistor 312, and the drain gate of the example PMOS transistor 310 is coupled to the source gate of the example PMOS transistor 314. When the example switch circuitry 106B is in the second state, the drain gate of the example PMOS transistor 308 is coupled to the source gate of the example PMOS transistor 314, and the drain gate of the example PMOS transistor 310 is coupled to the source gate of the example PMOS transistor 312.
The example switch circuitry 106C has two inputs and two outputs. The two inputs of the example switch circuitry 106C are coupled to the source gates of the example NMOS transistors 316, 318. The two outputs of the example switch circuitry 106C are coupled to the drain gates of the example NMOS transistors 320, 322. When the example switch circuitry 106C is in the first state, the source gate of the example NMOS transistor 316 is coupled to the drain gate of the example NMOS transistor 320, and the source gate of the example NMOS transistor 318 is coupled to the source gate of the example NMOS transistor 322. When the example switch circuitry 106C is in the second state, the source gate of the example NMOS transistor 316 is coupled to the drain gate of the example NMOS transistor 322, and the source gate of the example NMOS transistor 318 is coupled to the source gate of the example NMOS transistor 320.
The example chop controller circuitry 402 implements the chopping technique according to the teachings of this disclosure. For example, the example chop controller circuitry 402 receives the example ADC SOC signal 410 from the example sample and hold circuitry 404 and generates the example chop control signal 118 synchronously. The example chop controller circuitry 402 also sends the chop control signal 118 to the example switch circuitry 106A, 106B, 106C to indicate when the switches should be in the first state and when the switches should be in the second state, as described previously in
The example sample and hold circuitry 404 receives the op amp output signal 112 generated by the example operational amplifier 110. Using a clock circuit, the example sample and hold circuitry 404 records a voltage from the op amp output signal 112 and outputs the recorded voltage for an amount of time. In some examples, the recorded voltage may be referred to as a sample or a conversion. The example sample and hold circuitry 404 sends the ADC SOC signal 410 to indicate when a new conversion has begun. Similarly, the amount of time that the example sample and hold circuitry 404 outputs a given recorded voltage may be referred to as a hold time. The example sample and hold circuitry 404 provides the sample output signal 412, which is the recorded voltage, to the example averager circuitry 406. The example op amp output signal 112 is discussed further in connection to
The example averager circuitry 406 receives multiple voltages within the example sample output signal 412 over time. For example, the example averager circuitry 406 may receive a first recorded voltage for a first hold time, followed by a second recorded voltage for a second hold time, etc. Upon receiving instructions from the example chop controller circuitry 402, the example averager circuitry 406 computes an average of the previous two recorded voltages within the example sample output signal 412. The example averager circuitry 406 provides the computed average voltage to the converter circuitry 408.
The example converter circuitry 408 converts the computed average voltage into a digital value. The digital value may include any number of bits. The example converter circuitry 408 may produce the digital value using any Analog to Digital conversion technique. For example, the example converter circuitry 408 may implement a look up table that describes, for any computed average voltage within a range of values, what corresponding digital bits should be produced. In such examples, the look up table may be preprogrammed into the converter circuitry 408 or may be provided to the example converter circuitry 408 by the processor circuitry 124. The digital values produced by the example converter circuitry 408 are referred to as the example ADC output signal 120.
Advantageously, the example ADC 116 includes the example chop controller circuitry 402 to synchronize the chop control signal 118, the ADC SOC signal 410, and when the averager circuitry 406 computes an average. The example chop controller circuitry 402 enables the ADC 116 to remove offset by ensuring that one of the voltages used as an input to the averager circuitry 406 is equal to G × (VOFF104+ VOFF108) and that the other voltage used an input to the averager circuitry 406 is equal to G × (VOFF104- VOFF108) As a result, the digital bits produced by the converter circuitry 408 are based on a computed average voltage of G × (VIN104. Furthermore, the use of the example ADC circuitry 116 to remove offset reduces implementation area compared to previous solutions that require an external filter to achieve the same.
The example timing diagram 502 shows how the op amp output signal 112 changes over time. Ideally, the op amp output signal 112 can be represented as a square wave that oscillates around G × VIN104. When the example switch circuitry 106A, 106B 106C are in the first state, the example op amp output signal 112 is at a voltage, described in
An ideal square wave includes instantaneous transitions between voltages. In practice, the example operational amplifier 110 may require an amount of time to transition between V1 and V2, as shown in
The example timing diagram 502 shows the foregoing signal over 2.5 periods of the chopping frequency. During one period of the chopping frequency, the op amp output signal 112 transitions once between G × VIN104 + VOFF108) and G × (VIN104 - VOFF108). Furthermore, during one period of the chopping frequency, the example ADC 116 produces one digital value.
The example chop control signal 118 includes a high supply voltage and a low supply voltage. When the example chop control signal 118 exhibits a low supply voltage, the example switch circuitry 106A, 106B, 106C are in the first state as described previously. Similarly, when the example chop control signal exhibits a high supply voltage, the example switch circuitry 106A, 106B, 106C are in the second state as described previously.
The example ADC SOC signal 410 describes when the example sample and hold circuitry 404 samples the op amp output signal 112. The example the example sample and hold circuitry 404 begins a sample of the example op amp output signal 112 when the ADC SOC signal 410 transitions from a low supply voltage to a high supply voltage. Similarly, the example the example sample and hold circuitry 404 ends the sample when the ADC SOC signal 410 transitions from the high supply voltage to the low supply voltage. The example ADC SOC signal 410 is produced by the example chop controller circuitry 402.
The example sample output signal 412 represents the voltages that the ADC records during each sample. While the example input voltage 104 may change over time, the example chop control signal 118 synchronizes the example chop control signal 118 and the example ADC SOC signal 410 such that the voltage recorded during any ADC sample period can be represented by one of two values. Specifically, samples labelled V1 refer to the voltage G × (VIN104 + VOFF108) and samples labelled V2 refer to the voltage G × (VIN104 -VOFF108). During one period of the chopping frequency, the example sample output signal 412 includes one sample labelled V1 and one sample labelled V2. To filter the offset voltage, the example converter circuitry 408 produces digital bits based off an average of the voltages recorded during one period of the chopping frequency (i.e., the voltages from two consecutive samples). Specifically,
where VConvert is the analog voltage produced by the averager circuitry 406 and provided to the converter circuitry 408.
The example ADC output signal outputs 120 includes one new digital value for each period of a chopping frequency. In the example timing diagram of
Advantageously, the chop control signal 118 (which dictates the value of the op amp output signal 112) is based on the ADC SOC signal 410 sent from the sample and hold circuitry 404 to the example chop controller circuitry 402. Therefore, the example ADC 116 generates the chop control signal 118 and ADC SOC signal 410 synchronously in the sense that, after a transition in the chop control signal 118 occurs, the subsequent sample of the op amp output signal 112 does not begin until the op amp output signal 112 has had sufficient time to settle. Specifically, the op amp output signal 112 may be considered settled when the difference between the instantaneous voltage of the op amp output signal 112 and the desired target voltage (either V1 or V2) is less than or equal to an error threshold. In doing so, code 1 and code 2 of the example sample output signal 412 are based on the desired target voltage of the op amp output signal 112 rather than an overshoot voltage or undershoot voltage that the example operational amplifier 110 produces during the settle time.
The example histogram 602 shows the offset of the example operational amplifier 110 over multiple simulations of the example computer system 100 operating. In some examples, the offset of the example operational amplifier 110 may be computed as a difference between a measured voltage of the op amp output signal 112 and an expected output voltage of the operational amplifier 110. In other examples, the offset of the example operational amplifier 110 may be computed as a difference between a measured voltage of the ADC output signal 120 and an expected output voltage of the ADC 116.
The x axis of the example histogram 602 shows the offset in volts, and y axis of the example histogram 602 shows the number of simulations in which the offset was computed between two particular voltages (i.e., the number of simulations that belong to a particular bin of the histogram). The example histogram 602 shows that across all example simulations, the example operational amplifier 110 exhibited an offset with a magnitude less than or equal to 202 micro Volts (µV).
The example histogram 602 shows the temperature drift of the example operational amplifier 110 over multiple simulations of the example computer system 100 operating. To compute a single temperature drift value, the example computer system 100 is simulated multiple times to operate at multiple ambient temperatures, and the offset is computed for each unique temperature simulation. The temperature drift can then be described as
where Tdrift is the temperature drift, Offsetmax is the highest recorded offset voltage, Offsetmin is the lowest recorded offset voltage, Tmαx is the highest operating temperature, and Tmin is the lowest operating temperature.
The x axis of the example histogram 604 shows the temperature drift in micro Volts per degree Celsius (µV / °C), and y axis of the example histogram 604 shows the number of simulations in which the temperature drift was computed between two particular values (i.e., the number of simulations that belong to a particular bin of the histogram). The example histogram 604 shows that across all example simulations, the example operational amplifier 110 exhibited a temperature drift with a magnitude less than or equal to 1.18 µV / °C.
In this description, the term “and/or” (when used in a form such as A, B and/or C) refers to any combination or subset of A, B, C, such as: (a) A alone; (b) B alone; (c) C alone; (d) A with B; (e) A with C; (f) B with C; and (g) A with B and with C. Also, as used herein, the phrase “at least one of A or B” (or “at least one of A and B”) refers to implementations including any of: (a) at least one A; (b) at least one B; and (c) at least one A and at least one B.
Example methods, apparatus and articles of manufacture described herein improve the performance of an operational amplifier and reduce the amount of die space needed to remove error from the operational amplifier. The output of the example operational amplifier 110 is provided directly to the example ADC 116 to remove the offset. Both the example operational amplifier 110 and example ADC 116 are implemented on the same integrated circuit, removing the need to use additional die space on a separate circuit to remove the offset. Furthermore, the example ADC 116 controls both when the output of the operational amplifier changes and when the output of the operational amplifier is sampled to form a digital value. As a result, the offset and temperature drift of the example operational amplifier 110 may be lower in magnitude than previous solutions.
The term “couple” is used throughout the specification. The term may cover connections, communications, or signal paths that enable a functional relationship consistent with this description. For example, if device A provides a signal to control device B to perform an action, in a first example device A is coupled to device B, or in a second example device A is coupled to device B through intervening component C if intervening component C does not substantially alter the functional relationship between device A and device B such that device B is controlled by device A via the control signal provided by device A.
A device that is “configured to” perform a task or function may be configured (e.g., programmed and/or hardwired) at a time of manufacturing by a manufacturer to perform the function and/or may be configurable (or re-configurable) by a user after manufacturing to perform the function and/or other additional or alternative functions. The configuring may be through firmware and/or software programming of the device, through a construction and/or layout of hardware components and interconnections of the device, or a combination thereof.
As used herein, the terms “terminal”, “node”, “interconnection”, “pin” and “lead” are used interchangeably. Unless specifically stated to the contrary, these terms are generally used to mean an interconnection between or a terminus of a device element, a circuit element, an integrated circuit, a device or other electronics or semiconductor component.
A circuit or device that is described herein as including certain components may instead be adapted to be coupled to those components to form the described circuitry or device. For example, a structure described as including one or more semiconductor elements (such as transistors), one or more passive elements (such as resistors, capacitors, and/or inductors), and/or one or more sources (such as voltage and/or current sources) may instead include only the semiconductor elements within a single physical device (e.g., a semiconductor die and/or integrated circuit (IC) package) and may be adapted to be coupled to at least some of the passive elements and/or the sources to form the described structure either at a time of manufacture or after a time of manufacture, for example, by an end-user and/or a third-party.
While the use of particular transistors are described herein, other transistors (or equivalent devices) may be used instead. For example, a p-type metal-oxide-silicon FET (“MOSFET”) may be used in place of an n-type MOSFET with little or no changes to the circuit. Furthermore, other types of transistors may be used (such as bipolar junction transistors (BJTs)).
Circuits described herein are reconfigurable to include the replaced components to provide functionality at least partially similar to functionality available prior to the component replacement. Components shown as resistors, unless otherwise stated, are generally representative of any one or more elements coupled in series and/or parallel to provide an amount of impedance represented by the shown resistor. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in parallel between the same nodes. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in series between the same two nodes as the single resistor or capacitor.
Uses of the phrase “ground” in the foregoing description include a chassis ground, an Earth ground, a floating ground, a virtual ground, a digital ground, a common ground, and/or any other form of ground connection applicable to, or suitable for, the teachings of this description. Unless otherwise stated, “about,” “approximately,” or “substantially” preceding a value means +/- 10 percent of the stated value.
Modifications are possible in the described embodiments, and other embodiments are possible, within the scope of the claims.
Number | Date | Country | Kind |
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202241017794 | Mar 2022 | IN | national |