Patent Application
20220384996
This disclosure relates to the field of connectors, and more specifically to connectors suitable for use in high data rate applications.
This section introduces aspects that may help facilitate a better understanding of the inventions. Accordingly, the statements of this section are to be read in this light and are not to be understood as admissions about what is prior art or what is not prior art.
To date, it has been challenging to produce a connector assembly that contains multiple, high speed connectors in a compact way while at the same time providing electromagnetic interference (EMI) shielding.
Accordingly, it is desirable to provide solutions to this challenge.
The inventors describe various exemplary input/output (I/O) connector assemblies. The inventive assemblies include electromagnetic interference (EMI) protection, among other things.
In one embodiment, an inventive multi-level, multi-port connector assembly may comprise: an electromagnetic shielding cage configured to protect a top port connector and to be positioned over a bottom port connector to provide shielding for at least the top and bottom port connectors from a range of electromagnetic interference (EMI), wherein at least a portion of the top port connector is positioned over the bottom port connector when the electromagnetic shielding cage is positioned over the bottom port connector. In such an embodiment, each of the top and bottom port connectors may comprise power and communication signal conductors, where the signal conductors are operable to conduct at least high-speed communication signals
In inventive connector assemblies that comprise both top and bottom port connector, the bottom port connector may comprise a surface mounted technology (SMT) connector while the top port connector may comprise a press-fit connector. Alternatively, each of the top and bottom port connectors may be configured to be connected using ball grid arrays, solder charging, press-fit, SMT or optical fiber.
In an embodiment, the cage may comprise a cover, a cage base, a top back cover, a bottom back cover, and a front end-shield, among other components, where the cover and front end-shield may comprise one or more associated apertures operable to allow air to flow through into or out of the interior of the cage. Still further, each of the one or more apertures may be configured to have a width and a depth to reduce the effects of EMI on components within an interior of the assembly, for example. Further, inventive cages may comprise an internal heat sink, first fastening clip, a top heat sink and second fastening clip, where one embodiment of the internal heat sink may have a length that is substantially the same as a full length of the cover.
In an embodiment, inventive front end-shields may comprise a plurality of conductive, deformable elements formed around part, or substantially all, of a perimeter of the end shield, the elements comprising part of a ground conductor, and inventive first fastening clips may comprise one or more deformable elements operable to apply a force on the internal heat sink to make contact with components within the cage.
The top port connector or bottom port connector may comprise part of a bypass connector, for example.
In addition to the connection techniques described above, inventive assemblies may be configured such that a top port connector comprises high-speed communication signal terminals configured to be connected to a circuit board using cables and low-speed communication signal terminals or power terminals configured to be connected to a circuit board using cables, and a bottom port connector comprises high-speed communication signal terminals configured to be connected directly to the board and low-speed communication signal terminals or power terminals configured to be connected directly to the board.
Alternatively, an inventive connector assembly may be configured such that a top port connector comprises high-speed communication signal terminals configured to be connected to a circuit board using cables and low-speed communication signal terminals or power terminals configured to be connected directly to the board, and a bottom port connector comprises high-speed communication signal terminals configured to be connected to the board using cables and low-speed communication signal terminals or power terminals configured to be connected directly to the board.
Another alternative, connector assembly may be configured such that a top port connector comprises high-speed communication signal terminals configured to be connected to a circuit board using cables and low-speed communication signal terminals or power terminals configured to be connected directly to the board, and a bottom port connector comprises high-speed communication signal terminals configured to be connected directly to the board and low-speed communication signal terminals or power terminals configured to be connected directly to the board.
Still another alternative, connector assembly may be configured such that a bottom port connector comprises low-speed communication signal terminals or power terminals configured to be connected to a circuit board using cables.
In addition to inventive connector assemblies, the inventors provide inventive methods for shielding a multi-level, multi-port connector assembly from EMI. One such method may comprise: mounting a bottom port connector to a circuit board; protecting a top port connector and the mounted bottom port connector with an electromagnetic shielding cage to shield at least the top and bottom port connectors from a range of electromagnetic interference (EMI). Such a method may further comprise conducting at least high-speed communication signals and power from the top and bottom connectors.
In additional embodiments, mounting the bottom port connector may comprise connecting the bottom port connector using surface mounted technology (SMT), connecting the top port connector to the circuit board may comprise using a press-fit connection.
Other connection techniques may also be used. For example, a top port connector and bottom port connector may be connected to a circuit board using SMT, a press-fit connection, ball grid arrays, solder charging, or optical fiber, for example.
As previously noted, in exemplary methods the cage may comprise a cover, cage base, a top back cover, a bottom back cover, and an EMI front end-shield.
The inventive methods may yet further comprise additional features, such as (1) allowing air to flow through into, or out of, the interior of the cage using one or more apertures in the cage, where each of the one or more apertures may be configured to have a width and a depth to reduce the effects of EMI on components within an interior of a cage, (2) forming a ground conductor from a plurality of conductive, deformable elements formed around part, or substantially all, of a perimeter of a front end shield.
Similarly, as noted previously, in each of the inventive methods, a top port connector or bottom port connector may comprise at least part of bypass connector.
The inventive top and bottom port connectors may comprise a combination of high-speed, low-speed and power terminals and may be connected to a circuit board in a number of ways.
For example, in one inventive method a top port connector comprises high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may comprise connecting both sets of terminals to a circuit board using cables.
In another inventive method a bottom port connector comprises high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may comprise connecting both set of terminals directly to a circuit board.
A further inventive method comprises a top port connector, where the top port connector comprises high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may comprise, connecting the high-speed communication signal terminals to a circuit board using cables and connecting the low speed communication signal terminals or power terminals directly to the circuit board.
Still another inventive method comprises a bottom port connector, where the bottom port connector comprises high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may further comprise connecting the high-speed communication signal terminals to a circuit board using cables and connecting the low speed communication signal terminals or power terminals directly to the circuit board.
Two additional inventive methods comprise (i) a top port connector that comprises high-speed communication signal terminals configured to be connected to the circuit board using cables and low-speed communication signal terminals or power terminals configured to be connected directly to a board, and a bottom port connector that comprises high-speed communication signal terminals configured to be connected directly to the board and low-speed communication signal terminals or power terminals configured to be connected directly to the board, and (ii) a bottom port connector that comprises low-speed communication signal terminals or power terminals. Such a latter method may comprise connecting the terminals to a circuit board using cables.
The present invention is illustrated by way of example and is not limited by the accompanying figures in which like reference numerals indicate similar elements and in which:
Specific embodiments of the present invention are disclosed below with reference to various figures and sketches. Both the description and the illustrations have been drafted with the intent to enhance understanding. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements, and well-known elements that are beneficial or even necessary to a commercially successful implementation may not be depicted so that a less obstructed and a more clear presentation of embodiments may be achieved.
Simplicity and clarity in both illustration and description are sought to effectively enable a person of skill in the art to make, use, and best practice the present invention in view of what is already known in the art. One of skill in the art will appreciate that various modifications and changes may be made to the specific embodiments described below without departing from the spirit and scope of the present invention. Thus, the specification and drawings are to be regarded as illustrative and exemplary rather than restrictive or all-encompassing, and all such modifications to the specific embodiments described below are intended to be included within the scope of the present invention.
The detailed description that follows describes exemplary embodiments and is not intended to be limited to the expressly disclosed combination(s). Therefore, unless otherwise noted, features disclosed herein may be combined together to form additional combinations that were not otherwise shown for purposes of brevity.
The disclosure provided herein describes features in terms of preferred and exemplary embodiments thereof. Numerous other embodiments, modifications and variations within the scope and spirit of the appended claims will occur to persons of ordinary skill in the art from a review of this disclosure.
As used herein and in the appended claims, the term “comprises,” “comprising,” or any other variation thereof is intended to refer to a non-exclusive inclusion, such that a process, method, article of manufacture, or apparatus that comprises a list of elements does not include only those elements in the list, but may include other elements not expressly listed or inherent to such process, method, article of manufacture, or apparatus.
The terms “a” or “an”, as used herein, are defined as one or more than one. The term “plurality”, as used herein, is defined as two or more than two. The term “another”, as used herein, is defined as at least a second or more.
Unless otherwise indicated herein, the use of relational terms, if any, such as “first” and “second”, “top” and “bottom”, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship, order or importance between such entities or actions.
The terms “including” and/or “having”, as used herein, are defined as comprising (i.e., open language). The term “coupled”, as used herein, is defined as connected, although not necessarily directly, and not necessarily mechanically. The use of “or” or “and/or” herein is defined to be inclusive (A, B or C means any one or any two or all three letters) and not exclusive (unless explicitly indicated to be exclusive); thus, the use of “and/or” in some instances is not to be interpreted to imply that the use of “or” somewhere else means that use of “or” is exclusive. Terminology derived from the word “indicating” (e.g., “indicates” and “indication”) is intended to encompass all the various techniques available for communicating or referencing the object/information being indicated. Some, but not all, examples of techniques available for communicating or referencing the object/information being indicated include the conveyance of the object/information being indicated, the conveyance of an identifier of the object/information being indicated, the conveyance of information used to generate the object/information being indicated, the conveyance of some part or portion of the object/information being indicated, the conveyance of some derivation of the object/information being indicated, and the conveyance of some symbol representing the object/information being indicated.
As used herein the phrases “high-speed” and “high data rate” are meant to be synonymous unless the context or knowledge of one skilled in the art indicates otherwise. Similarly, the phrases “low-speed” and “low data rate” are meant to be synonymous unless the context or knowledge of one skilled in the art indicates otherwise.
As used herein the phrase “operable to” means “functions to” unless the context or knowledge of one skilled in the art indicates otherwise.
Referring now to
In more detail, in the embodiment depicted in
The connectors 3a, 3b may comprise an input/output (I/O) connector, such as those used for optical small form-factor pluggable applications or double density optical small form-factor pluggable applications, for example. As configured, the assembly may be referred to as a multi-port, multi-level, EMI shielded connector.
In more detail, embodiments, each of the connectors 3a, 3b may be configured to conduct electrical or optical signals. In the latter case, each connector may comprise optical-to-electrical (O/E) or electrical-to-optical (E/O) conversion circuitry. In additional embodiments, each connector 3a, 3b may include active electrical devices, such as amplifiers and retiming circuitry.
In many instances, the O/E, E/O conversion circuitry, active devices and retiming circuitry may generate a substantial amount of heat during operation Thus, as described further herein, each connector may comprise one or more heat sinks.
Continuing, each connector 3a, 3b may comprise one or more separate power and communication signal conductors that form a part of separate power and communication signal paths (i.e., typically, the ports are not electrically connected to one another). In embodiments, at least exemplary high-speed communication signals up to, and exceeding, 112 gigabits per second (Gbps) may be transported by the signal conductors of the connectors 3a, 3b of the assembly 1a. In alternative embodiments, communication signals up to 160 Gbps may be transported by conductors of the connectors 3a, 3b of the assembly 1a.
In one embodiment the bottom port connector 3a may be a surface mounted technology (SMT) connector, for example, that may first be mounted to the board 4 using a soldering process, for example Thereafter, the top port connector 3b (again, not shown) and cage 2 may be press-fitted to the board 4 such that the top port connector 3b and cage 2 are positioned over the bottom port connector 3a as shown in
Referring now to
The front end-shield 24a may comprise one or more associated openings, apertures or vents 24b (collectively “apertures”) that are operable to allow air to flow through into, and/or out of, the interior of the cage 2 in order to reduce the temperature of components enclosed by the cage 2, such as the top port connector 3b and any component connected to the connector 3b. Further, the front end-shield 24a may further comprise a plurality of conductive, deformable “fingers” or elements 240a to n (collectively “elements”, where “n” indicates the last element) that may be formed around part, or substantially all, of the perimeter of the shield 24a. In an embodiment, another device (e.g., paddle card, see component 5 in
Continuing, the cage 2 may further comprise a cage midsection 25a that may include an internal heat sink 25b and first fastening clip 25c, and a top heat sink 26a and second fastening clip 26b, the latter two components configured to be positioned on cover 20a. While
In more detail, the first fastening clip 25c may comprise one or more deformable elements 25e that are operable to apply a force on the internal heat sink 25b which is within cage midsection 25a. As a result of the force the heat sink 25b makes contact with components within the cage 2, such as a plug module inserted into the bottom port connector. Turning to the second fastening clip 26b, in an embodiment the clip 26b may be operable to apply a force to the top heat sink 26a so that the heat sink 26a makes contact with components enclosed by, and within, the cage 2, such as a plug module inserted into the top port connector, O/E and/or E/O conversion circuitry, active devices and/or retiming circuitry, for example.
In embodiments of the invention, the inventive assembly 1a may comprise additional components other than the front end-shield 24a that are operable to reduce the temperature of interior components of the assembly 1a. For example, each of the cover 20a (see
Depending on the embodiment, one or more of each of the above described apertures may be shaped as a hexagon, such as the apertures 6 depicted in
Further, each aperture, such as apertures 20b for example, may be configured to have a width to reduce the effects of EMI on components within an interior of the assembly la depending on the frequency or frequencies sought to be attenuated and may be configured to have an extruded depth to reduce the effects of EMI on interior components depending on the amount of attenuation (e.g., in dB) desired. For example, the smaller the width of the aperture the higher the upper cutoff frequency that can be attenuated while a deeper in extruded depth aperture can attenuate more of a given signal at a given frequency (i.e., reduce the decibel level of a signal). In an embodiment, an aperture used as a part of an inventive assembly may have a width and extruded depth (i.e., may be sized) that corresponds to an amount of attenuation desired.
Further, in embodiments a given sized aperture within a group of apertures may be repeated aperiodically to avoid aperture to aperture enhancement or “gain” at a given frequency or band of frequencies.
Exemplary apertures are depicted in
As also shown in
Referring now to
Referring now to
It should be understood that these speeds and power levels are merely exemplary. For example, in an alternative embodiment a connector may comprise low speed power conductors with associated and assigned ground contacts to electrically isolate each conductor (i.e., conductor contact) in order to increase the speed (i.e., data rate) above 10 Gbps, for example. Further, in alternative embodiments, a connector 3a, 3b may include multiple, parallel power terminal contacts to achieve power levels above 1.6 amps, for example.
In
Referring now to
In the embodiments depicted in
For example, referring now to
Referring now to
It should be understood that the cables used to connect terminals of a top or bottom port to another device such as the board 4, need not be twinax cables. Other types of cables, such as may be used. Yet further, optical cables may be used instead of coaxial or copper cables. In the case that optical cables are used, an inventive assembly may incorporate optical-to-electrical conversion circuity (and vice-versa) as described previously herein.
The claim language included below is incorporated herein by reference in expanded form, that is, hierarchically from broadest to narrowest, with each possible combination indicated by the multiple dependent claim references described as a unique standalone embodiment.
While benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments of the present invention. However, the benefits, advantages, solutions to problems, and any element(s) that may cause or result in such benefits, advantages, or solutions, or cause such benefits, advantages, or solutions to become more pronounced are not to be construed as a critical, required, or essential feature or element of any or all the claims.
This application claims priority to U.S. Provisional Application 62/910,462, filed Oct. 4, 2019, which is incorporated herein by reference in its entirety.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2020/054197 | 10/5/2020 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 62910462 | Oct 2019 | US |
