METHODS AND SYSTEM FOR A RECONFIGURABLE VEHICLE MODULAR EXPANSION PLATFORM

BACKGROUND OF THE DISCLOSURE

The subject matter disclosed herein relates to remote systems, and in particular to unmanned, autonomous, or remotely operated systems and methods for adding additional devices to remote systems to enhance or increase the remote system functionality.

A remote system comprises a remote system/vehicle and either remote system control (base or ground station system) for autonomous operation, or semi-autonomous control through a remote agent, for managing the remote system operations and activities. The remote system while capable of moving (e.g. flying, crawling, roving, etc.) autonomously, or semi-autonomously under the control of an operator or intelligent agent, commonly requires additional devices attached, such as cameras and other detector, sensor devices, or instrumentation to provide for a complete set of functions required to achieve some goal or objective. Current methods in which additional devices are added or attached to remote systems are achieved or accomplished in a non-inoperable manner among the plethora of remote system product offerings. For example, there is typically great variation from remote system manufacturer-to-manufacture in terms of how additional devices or expansion devices are both integrated to the remote system and attached mechanically. As one example, remote system camera add-ons alone have numerous different camera gimbal solutions highlighting just one of the possible remote system expansion solutions.

In many cases remote system expansion solutions are often specialized (to one remote system manufacturer), oversized or attached in a manner which is not ideal for the remote system operations (e.g. impact aerodynamics, blocks, clips, or obscures sensors and cameras required for operation, and/or impacts the remote system ability to navigate through or within confined spaces or environment) or otherwise limiting the remote system, such as reducing flight time, due to contributed weight or mechanical geometry of the additional devices, or even negatively impacting data quality utilized by one or more vehicle software components. In many cases adding additional payloads or expansion solutions to a remote system are not suitable or feasible for external incorporation and presents challenges including; conflicting or blocking of remote system camera, ranging, or sensor operations; or additionally where such external payloads or expansion solutions exposure to an environment can impact the payload or expansion solution reliability or operation. Further remote system expansion only considers fixed types of devices and as such is not easily reconfigurable for different types of expansion devices in size, feature, or function. A secondary challenge is the lack of software and network methods to achieve a unified framework for reliable and flexible communications between and among expansion devices in a remote system manufacture agnostic and/or geographic independent manner. While contemporaneous remote systems comprising a camera, ranging, or imaging system can communicate to a base or ground station system station and even remote computing systems, such systems are not fully reliable in scenarios where communications due to environmental factors (GPS denied or constrained locations or regions with connectivity limitations) compromise the communications link quality. Additionally, the same methods for payload expansion are not designed to communicate and function in a manner incorporating multiple heterogenous expansion devices concurrently that can include any combination of application specific processor or computing devices, communication systems or network devices, actuators, servos, motors, cameras, imaging systems, ranging, and sensors including temperature, pressure, humidity, chemical, and gases, solids, liquids, detectors, monitoring and measurement instruments, and other expansion devices capable of use within a remote system.

Accordingly, while existing remote systems are suitable for their intended purposes the need for improvement remains, particularly in providing a modular platform that allows multiple expansion devices to be selectively coupled to a remote system in a modular manner, while implemented independent of any given remote system manufacturer.

BRIEF DESCRIPTION OF THE DISCLOSURE

According to one aspect of the disclosure, a modular expansion platform for a first vehicle is provided. The first vehicle having a housing, a frame, or a body. The modular expansion platform includes a platform body coupled to the housing, frame or body of the first vehicle, the platform body having a shape. Wherein the perimeter of the shape of the platform body substantially conforms to a vehicle shape where the platform body couples to the frame or body.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include a processor module operably coupled to the platform, the processor module being coupled for communication to the at least one expansion module, the processor module having a plurality of interfaces, at least one of the plurality of interfaces being configured to transfer communications and data between the modular expansion platform and a second processor.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the second processor being positioned on a second unmanned, semi-autonomous, or autonomous vehicle.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the second processor being a controller or processor on the first vehicle.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the second processor being a second processing module coupled to the platform.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the at least one expansion module comprising one of: camera interfaces and devices; triggering and capture signals; imaging; scanners; RFID readers; thermal, narrow band and broad-spectrum interfaces and devices; device controllers; environmental sensors; liquid; gas and other fluid sensors, detectors, measurement, and monitoring devices; radiation and other energy detectors and measurement devices; atomic, chemical, molecular, compound sensors, detectors, measurement and analysis devices; biologic, viral, bacterial sensor, detection, measurement and analysis devices or systems; medical or metabolic sensors (such as heart rate, oxygen saturation levels (SpO2), blood pressure, temperature), detection, measurement and analysis devices or systems; thermal, infrared, UV sensors and devices; motion sensors; altitude sensors; ranging sensors; LIDAR devices; mechanical command and control interfaces; actuators; servo and motor devices; portable nuclear magnetic resonance (NMR) , XRAY, magnetic resonance imaging (MRI) devices and systems; and a plurality of network and communications transmitters/receivers.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the shape being one of a polygon and is selected from a group comprising: a quad shape, a hexagonal shape, a octagonal shape, a coaxial shape, a dodecahedron shape, a rectangular shape, a circular shape, and an elliptical shape.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the frame or body having a first layer and a second layer.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the platform body being coupled between the first layer and the second layer.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the at least one expansion module being positioned on the platform body based at least in part on at least one of the geometry of the body or frame, the weight distribution of the at least one expansion module, center of gravity of the vehicle, and the center of gravity of the modular expansion platform.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the second interface of the plurality of interfaces is a secondary expansion interface.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include a second platform body operably coupled to the frame or body; a second processor module having an interface electrically coupled to the second expansion interface; and at least one second expansion module coupled to the second platform body and electrically coupled to the second processor module.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the platform body having at least one of: an aperture aligned with the at least one expansion module; the at least one expansion module is accessible to an operator from a bottom of the platform body; and the at least one expansion module is accessible to the user from a side of the platform body.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include at least one mounting element extending from the platform body, the at least one expansion module being coupled to an end of the at least one mounting element.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include a device configured to generate an electromagnetic field, wherein at least a portion of the at least one expansion module is coupled to the platform body by the device.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the first vehicle having a plurality of sensors; and the platform body, when coupled to the housing, is configured to not interfere with an operation of the plurality of sensors.

According to another aspect of the disclosure, a method is provided. The method including providing a modular expansion platform coupled to a vehicle, the modular expansion platform having a processor module electrically coupled to at least one expansion module. A first connection is established between the processor module and the remote system. A second data connection is established between the processor module and the at least one expansion module. Data is transmitted from any one of the vehicle, the at least one expansion module, or the processor module to any other of the vehicle, the at least one expansion module, or the processor module via one or more of the first connection or the second data connection. At least one of the vehicle, the at least one expansion module, or the processor module causes an action to be performed based at least in part on the data.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the method may include establishing a third data connection between the processor module and an external device; and transmitting data from any one of the vehicle, the at least one expansion module, the external device, or the processor module to any other of the vehicle, the at least one expansion module, the external device, or the processor module via one or more of the first connection, the second data connection, or the third data connection.

These and other advantages and features will become more apparent from the following description taken in conjunction with the drawings.

BRIEF DESCRIPTION OF DRAWINGS

The subject matter, which is regarded as the disclosure, is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other features, and advantages of the disclosure are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:

FIG. 1A is a schematic illustration of a remote system, such as an autonomous vehicle (AV), in accordance with an embodiment;

FIG. 1B is a schematic illustration of a configuration of the modular expansion platform as inserted between two adjacent layers of an AV in accordance with an embodiment;

FIG. 1C is a schematic illustration of a configuration of the modular expansion platform placed below the AV bottom in accordance with an embodiment;

FIG. 1D is a schematic illustration of a configuration of the modular expansion platform positioned above a top layer of the AV in accordance with an embodiment;

FIG. 1E is a side view of an AV, such as a aerial vehicle or a drone, that includes a modular expansion platform incorporated as a layer adjacent the bottom of the AV in accordance with an embodiment;

FIG. 2A is a schematic illustration of a high-level modular expansion platform system architecture in accordance with an embodiment;

FIG. 2B is a schematic illustration of a communications system for an expansion module and processor module in accordance in accordance with an embodiment;

FIG. 2C is a schematic plan view illustrating a communication interconnection of multiple modular expansion platforms on a single AV in accordance with an embodiment;

FIG. 2D is a schematic view illustrating a communication interconnection of multiple AV's, a portable controller, and a cloud-based controller in accordance with an embodiment;

FIG. 3A through 3F are plan views illustrating different representative modular expansion platform geometry configurations associated to common AV airframe design patterns in accordance with one or more embodiments;

FIG. 4A and FIG. 4B are plan view illustrations of an AV and modular expansion platform arbitrary polygon or curved geometry in accordance with one or more embodiments;

FIG. 5A-FIG. 5F are plan views illustrating various representative expansion module mappings to expansion platform geometry patterns in accordance with one or more embodiments;

FIG. 6A-FIG. 6H and FIG. 7A-FIG. 7C are plan views illustrating various representative expansion module mappings to expansion platform geometry patterns in accordance with one or more embodiments;

FIG. 8A is a perspective view of additively manufactured modular expansion platform with direct deposition of conductive power, electronic devices, and signal circuits across four interconnection components in accordance with an embodiment;

FIG. 8B is a schematic view of a representative modular expansion platform implementation, the expansion and processor module placements, and the additively manufactured modular expansion platform with direct deposition of conductive power, electronic devices, and signal circuits across four interconnection components in accordance with an embodiment;

FIG. 9A is a schematic illustration of a use of panels for input-output connectors implemented on the side region of the modular expansion platform bottom-layer inserted within AV adjacent internal-layers in accordance with an embodiment;

FIG. 9B is a schematic illustration of a use of panels for input-output connectors implemented on the side region of the modular expansion platform bottom-layer attached to the AV bottom-layer in accordance with an embodiment;

FIG. 9C is a schematic illustration of a use of panels for input-output connectors implemented on the side region of the modular expansion platform bottom-layer attached to the AV a use of panels for input-output connectors implemented on the side region of the modular expansion platform bottom-layer attached to the AV top-layer in accordance with an embodiment;

FIG. 10A is a schematic illustration of expansion modules that are insertable and removable from a modular expansion platform in accordance with an embodiment;

FIG. 10B is a schematic illustration of the expansion modules that are insertable and removable from a modular expansion platform coupled to a top layer in accordance with an embodiment;

FIG. 11 is a schematic illustration of expansion modules that are insertable and removable dynamically under programmatic electromagnetic field control from a modular expansion platform in accordance with an embodiment;

FIG. 12A is a schematic illustration of layers of an AV with an expansion module having through hole/channels for wiring and/or cooling in accordance with an embodiment;

FIG. 12B is schematic illustration of layers of an AV with an expansion module having cooling-channels/heat-pipes in accordance with an embodiment;

FIG. 12C is schematic illustration of layers of an AV with an expansion module having through hole/channels for wiring and cooling-channels/heat-pipes in accordance with an embodiment;

FIG. 12D is schematic illustration layers of an AV with an expansion module having a channel for internal routing of connectors for 3D printed circuits or internal printed circuit boards in accordance with an embodiment;

FIG. 12E is schematic illustration layers of an AV with an expansion module having cooling-channels for 3D printed circuits or internal printed circuit boards in accordance with an embodiment;

FIG. 13A-FIG. 13E are perspective views of an expansion module for an AV in accordance with an embodiment;

FIG. 14A-FIG. 14C are various views illustrating representative mounting options for attaching external modules, payloads and devices to the bottom or side of the expansion platform bottom-layer sub-assembly in accordance with one or more embodiments; and

FIG. 15 is a schematic illustration of an integration of an external expansion module, device or system component to the modular expansion platform secondary power and communications interface in accordance with an embodiment.

The detailed description explains embodiments of the disclosure, together with advantages and features, by way of example with reference to the drawings.

DETAILED DESCRIPTION OF THE DISCLOSURE

With the increasing number of remotely operated systems, products, and applications, there is also a corresponding increasing desire to support additional expansion payloads and devices beyond cameras or imaging/ranging solutions that are typically provided for. These remote systems can take several forms, such as but not limited to autonomous guided vehicles (AGV), unmanned aerial vehicles (UAV), autonomous underwater vehicles (AUV), planes, multi-copters, vertical takeoff and landing (VTOL) vehicles, unmanned water vehicles, unmanned ground vehicles and rovers and the like. As used herein, the term “remote system” or “autonomous vehicle” (AV) may be used interchangeably to refer to any of the forgoing or other remotely operated (either autonomous, semi-autonomous, or operator controlled) device or system that is capable of moving through an environment. While embodiments herein may refer to specific remote systems, such as the aforementioned AGV, UAV, or AUV, this is for example purposes and the claims should not be so limited.

Referring now to FIG. 1A, an embodiment of an AV 10 is shown that is configured to move through the environment under the motive means provided by a movement system 12. The movement system 12 may include any known means for moving a system, such as but not limited to propellors, wheels, tracks, skis, jets, articulated legs, or a combination of the foregoing for example. The AV 10 may in some embodiments include position sensors 14, such as accelerometers 16, altimeter/depth/ranging sensors 18, gyroscopes, sonar, global positioning systems (GPS), or a combination of the foregoing for example. It should be appreciated that the AV 10 may further be configured to determine position based on triangulation principles using a communications system, such as by triangulating on communication (e.g. cellular) towers for example. The sensors 14, 16, 18 and movement systems 12 are connected to a controller 20. The controller 20 includes one or more processors that are responsive to executable computer instructions for performing operational methods for operating the AV 10.

In an embodiment, the AV 10 may include a number of additional sensors 15 that are distributed about the housing or chassis of the AV 10. These sensors 15, such as lidar sensors for example, may be used operationally by the AV 10 to perform control methods, such as flight control for example. The AV 10 may include these sensors to provide a 360 degree field of view/measurement about the AV 10. As is discussed herein, embodiments provide for a modular expansion platform that allows for adding expansion modules (e.g. sensors, devices, processors) without interfering or inhibiting with the sensors 15. Thus, one or more embodiments described herein provide advantages over prior art system where auxiliary devices and sensors are coupled to the outside of the AV chassis or housing.

Typically, the AV 10 will include a number of subcomponents that form layers 22, 24, such as on the top or bottom of the AV 10 for example. These layers 22, 24 may form part of the housing of the AV 10 for example, or may also define subsystems such as cooling passages, cameras, or LIDAR sensors for example. Manufacturers of prior art remote systems lack interoperability leading to numerous products that are specific to one manufacturer or do not interoperate seamlessly with one another. For example, a LIDAR sensor for one AV may not be interchangeable with another AV that has a camera desired by the user. As a result, the user may have to operate two AV's. Further, in some instanced the adding of additional payloads or expansion solutions to a remote system may result in conflicting or blocking of AV camera or sensor operations, or can impact the payload or expansion solution reliability or operation. For example, such externally mounted sensors or devices may block the AV's operating sensors (e.g. proximity sensors, LIDAR, etc.) and thus interfere and/or inhibit the operation of the AV. In some embodiments, the AV may have multiple sensors that provide a 360 degree field of view/measurement that may be at least partially blocked or inhibited by simply mounting auxiliary sensors or devices to the outside of the AV as is done in prior art systems. Further, as a result of view/measurements being at least partially blocked or inhibited, measured or processed data may be compromised in quality or degraded such that hardware or software, including executing algorithms may degrade in accuracy, quality, and/or performance. It should be appreciated that this leads to market segmentation, increased costs, and limitations to increased remote system functionality.

One characteristic common to all remote systems is the limited set of body/structure/airframes that remote system manufacturers implement. Embodiments of the present disclosure provide technical solutions to normalize the methods for remote system payload and device expansions. Further embodiments of the present disclosure include methods and systems that provide technical solutions for a unified expansion platform system design pattern, agnostic to a specific remote system manufacture, comprising mechanical, hardware and software methods and apparatus for remove system expansion and capabilities.

According to one aspect of the disclosure, a reconfigurable AV modular expansion platform is provided. The reconfigurable AV modular expansion platform (also referred herein as any of remote system modular expansion platform, modular expansion platform or expansion platform) comprises a top-layer assembly and bottom-layer assembly which has a geometry design pattern substantially follows the physical outline of the well-defined or limited set of manufactured remote system housing/structure/airframe designs whose common attribute is a base geometrical shape for a class of housing/structure/airframe configuration and geometry. In some embodiments, the geometry design pattern generally fits within the contour of the remote system housing/structure/airframe such that the performance of the remote system, relative to its intended use or mission, is not substantially impacted by the shape or addition of the modular expansion platform.

Further, aspects of the disclosure provide for a reconfigurable AV modular expansion platform that provides advantages in allowing sensors and/or devices to be added to the AV without interfering or inhibiting the operation of the AV or sensors that are incorporated into or are integral with the AV.

Referring now to FIGS. 1B-1D, embodiments are shown where the modular expansion platform is positioned either adjacent the bottom of the AV 10, the top of the AV 10. Referring now to FIG. 1B, an embodiment of an insertable assembly 100 is provided that sandwiches, or places in between, the modular expansion platform 102 between adjacent sections or layers 104, 106 of an AV (using the AV pre-existing mounting hardware locations).

It should be appreciated that while embodiments herein describe the layers 104, 106 as being the “top or inner” and “bottom or inner” layers, this is for example purposes and the claims should not be so limited. In other embodiments, the remote system may have a plurality of layers and expansion platform is positioned between two adjacent layers.

Another embodiment, with reference to FIG. 1C, provides an assembly 110 mounted at the bottom layer 106 of a remote system. It should be appreciated that the mounting may be accomplished using either the pre-existing mounting positions of AV bottom layer 106 or alternative attachment methods as described herein of the AV modular expansion platform top-layer 102 in accordance with the classes of remote system bottom section geometries. In either of the embodiments shown in FIG. 1B and FIG. 1C, the implementation is such that a given AV modular expansion platform 102 seamlessly integrates to the AV, resulting in an aggregated assembly that is packaged in a unified and indistinguishable format from the AV.

The AV modular expansion platform 102 is composed of lightweight, plastics, carbon-fiber (alternatively comprising a composite material with additional reinforcement materials) based materials (or similar materials including alloys or composites) to reduce or minimize weight contribution to the AV. The location method for the increase in expansion capabilities, reduces or minimizes aerodynamic drag contribution from the AV modular expansion platform 102 and centers the AV modular expansion platform 102 to a desired center-of-gravity.

In another embodiment, shown in FIG. 1D, the modular expansion platform 102 may be positioned adjacent or over a AV top layer 104.

The AV modular expansion platform 102 implements a defined class of common AV housing/structure/airframe designs and shapes which implements a base-layer that falls into the category of polygons and curves when projecting a two-dimensional cross-section from the remote system bottom-layer section.

Referring now to FIG. 1E, an embodiment of an AV 100 having movement systems in the form of propellors 112. The AV 100 includes a bottom layer 106 having landing struts 114. It should be appreciated that the bottom layer 106 may have additional assemblies/components, such as but not limited to cooling channels, antennas, or electrical connections for example. The expansion platform module 102 is coupled between the bottom layer 106 and a AV housing 116. The bottom layer 106 and the expansion platform module 102 may be coupled to the housing 116 via mechanical fasteners (not shown) that extend through bottom layer 106 and expansion platform module 102.

Referring now to FIG. 2A, an embodiment is shown of a modular expansion platform 400. In this embodiment, the modular expansion platform 400 includes expansion modules 404A-404N and processing capabilities. As used herein, an expansion module is a device, assembly, sensor, or circuit that performs a function desired by the operator. The function may include recording or measuring parameters in the environment that the AV is operating or providing wireless communications with the AV, another expansion module, another AV, a remotely located controller, a remotely located computer system, or a combination of the foregoing for example. In another embodiment an expansion module may contain a chemical or biological detection device or sensor for detection, monitoring or measuring levels of some chemical or biological material such as DNA, viral, bacterial, or other chemical or biologic molecules.

In one or more nonlimiting environments the expansion module may include, but is not limited to: camera interfaces and devices; triggering and capture signals; imaging; scanners; RFID readers; thermal, narrow band and broad-spectrum interfaces and devices; device controllers; environmental sensors; liquid; gas and other fluid sensors, detectors, measurement, and monitoring devices; radiation and other energy detectors and measurement devices; field energy (RF, magnetic) detectors and measurement devices atomic, chemical, molecular, compound sensors, detectors, measurement and analysis devices; biologic, viral, bacterial sensor, detection, measurement and analysis devices or systems; medical and/or metabolic sensors (such as heart rate, oxygen saturation levels (SpO2), blood pressure, temperature, pH for example), detection, measurement and analysis devices or systems; thermal, infrared, UV sensors and devices; motion sensors; altitude sensors; ranging sensors; LIDAR devices; mechanical command and control interfaces; actuators; servo and motor devices; portable nuclear magnetic resonance (NMR) , XRAY, magnetic resonance imaging (MRI) devices and systems; and a plurality of network and communications transmitters/receivers including wireless (i.e. radio frequency, cellular) and satellite, sensors, devices, and systems. In an embodiment, the expansion module 404A-404N is removably coupled to a power/control/data bus 414, such as via a port for example. The function performed by the expansion modules 404A-404N may be dedicated (e.g. a chemical sensor), or may be programmable/changeable by the operator.

As used herein, the processor module 402 may be an analog or digital circuit that receives inputs 406 and outputs power, control signals to the expansion modules 404A-404N via the bus 414. In one or more nonlimiting embodiments, the processor module 402 may be: a microprocessor, a microcomputer, a minicomputer, an optical computer, a board computer, a complex instruction set computer, an ASIC (application specific integrated circuit), a reduced instruction set computer (RISC), a field programmable gate array (FPGA), a quantum computer, a supercomputer, a solid-state computer, part of a distributed computer network, or a hybrid of any of the foregoing In an embodiment, the processor module 402 includes one or more processors that are responsive to executable computer instructions to perform operational methods, such as to transmit power and control commands to the expansion modules and receive and/or transmit data to/from the expansion modules via the bus 414. Further as an additional embodiment, each of the processor module and module interfaces may be fabricated in accordance to a single PCB method as an alternative manufacturing methodology for the expansion platform and/or sub-assemblies described.

In still further embodiments, The processor module 402 may further comprise a computer system-on-chip (or microcomputer, microprocessor, or other CPU implementation within a System-on-Chip or System-on-Module, or SoC/SoM integrated circuit), that includes one or more processing units, persistent storage for code and data, high-speed memory, I/O devices, at least one connector interface 608A, 608B (FIG. 2C), and support for networking and communications such as Ethernet, as well as wireless communications circuit 416 (e.g. radio frequency, cellular, Wi-Fi and/or Bluetooth and/or Satellite) including their respective antennae. In an embodiment, the data may be stored locally, such as in memory arranged on the processor module, an expansion module or using a removable memory (e.g. SD flash memory card or USB-based memory).

In one or more nonlimiting embodiments, the processor module 402 is capable of converting the analog voltage or current level provided by the expansion modules 404A-404N into a digital signal indicative of a parameter measured or recorded by the expansion module. Alternatively, expansion modules 404A-404N may be configured to provide a digital signal to processor module 402, or an analog-to-digital (A/D) converter (not shown) maybe coupled between expansion module and processor module to convert the analog signal provided by the expansion module into a digital signal for processing by processor module. In some embodiments, the processor module 402 uses the digital signals act as input to various processes for controlling the modular expansion platform 400 or the AV.

It should be appreciated that the arrangement of the processor module 402 and the expansion modules 404A-404N allows the modular expansion platform 400 to be configured by the operator for a variety of applications, and may be reconfigured as desired by removing and adding expansion modules. Since the expansion modules 404A-404N are coupled by standard interfaces, the modular expansion platform 400 provides a means for providing modules without requiring integration with the AV. Thus, in an embodiment the modular expansion platform 400 resolves the interoperability, market segmentation, cost and function issues of the prior art AV systems.

In an embodiment, the AV modular expansion platform 400 implements a hardware system comprising a single processor module 402 (PM or processor module) electrically coupled with one or more expansion modules 404A-404N (EM or expansion module) slots. In an embodiment, the processor module 402 is integrated in a pre-defined method to the modular expansion platform 400 base-layer or top-layer and is configured to provide power, communications, and data signals to each of the expansion modules 404A-404N via bus 414. In addition, the processor module 402 may include a AV facing interface (e.g. standard interfaces including Universal Serial Bus Type C (USB-C) as one example) for power 408, communications 410, and data. In one embodiment, a secondary AV facing interface 412 is also provided to support AV interconnection interfaces following other standards as they evolve in addition to a USB-C or other remote system interconnection interfaces such as Ethernet.

In an embodiment, each of the expansion modules 404A-404N interface with the processor module 402, and other expansion platform modules 404A-404N through a set of power/communications/data and control signals provided by the modular expansion platform, such as via bus 414 for example. Examples for control, data and communication signals include at least one of: UART, SPI, I2C, PWM (pulse-width-modulator), CAN, Ethernet network, Secure Digital Input Output (SDIO), and other high-speed serial and parallel data and/or control signals for real-time expansion module capabilities enabling interfacing to and integration with a virtually unlimited number of expansion module hardware implementations.

In another embodiment shown in FIG. 2B, the processor module 402 and the expansion module 404N each communicate concurrently or independently via communications mediums 420, 422. These communications are performed by communications circuits 416, 424 associated with the processor module 402 and expansion module 404N respectively. In an embodiment, the processor module 402 and expansion module 404N may communicate concurrently or independently via three separate communications mediums 420, 422, 426 with the third communications medium 426 being performed via the AV system communications circuit. In an embodiment, the communications circuits 416, 424 may transmit and receive communication signals via one or more of radio frequency, WiFi (IEEE 802.11), Bluetooth™ (IEEE 902.15.1), cellular, or satellite-based communications. In still further embodiments, the communications circuits 416, 424 may be configured to communicate via wired (tethered such as Ethernet or USB as examples), wireless, or optical communications.

In another embodiment shown in FIG. 2C, multiple AV modular expansion platforms 600A, 600B provided within a single AV. For example, the modular expansion platforms 600A, 600B may form separate adjacent layers of the AV, or one or more layers of the AV may be disposed between the modular expansion platforms 600A, 600B. In other embodiments, the modular expansion platform 600A is coupled at or adjacent the bottom of the AV and the modular expansion platform 600B is coupled at or adjacent the top of the AV.

In this embodiment, a daisy chain configuration (e.g. serially connected) is illustrated whereby the processor modules 602A, 602B support multiple data, communications, and power methods as well as a secondary expansion platform interface 608A, 608B (on each expansion platform respectively) comprising a data, communications, and power interfaces (such as USB-C) enabling multiple AV modular expansion platforms 600A, 600B.

In an embodiment, the AV modular expansion platform 600A, 600B has a common modular expansion platform geometry that allows multiple AV modular expansion platforms 600A, 600B can be stacked (e.g. positioned on adjacent layers), and daisy chained (e.g. serially connected) to allow transmission of power/data/communications signals 605. It should be appreciated that this allows for an increase in the number of expansion modules 604. By interconnecting data, communications, and power signals 605 across the multiple platforms, the total number of expansion modules 604, 704 available to be used with the AV is increased. In another embodiment, the secondary expansion interface 608Aof the processor module 602A, 60 can be used by one of: a stand-alone expansion module, a third party device or system in cases where independent or standalone devices are desired.

Referring now to FIG. 2D, an embodiment is shown that further illustrates the communications capabilities of the modular expansion platform to include communications with modular expansion platforms 610A, 610B, 610C on other AV's, with portable controller 612, and/or with cloud based computing networks 614. It should be appreciated that while the illustrated embodiment shows a single controller and a single cloud controller, this is for example purposes and the claims should not be so limited. In other embodiments, multiple portable control units, multiple cloud controllers or a combination of the foregoing may be used in the communications network. In this embodiment, each of the module expansion platforms includes a communication circuit, such as wireless communications circuit 416 for example, that allows for the transmission and reception of signals with a variety of other systems. It should be appreciated that in other embodiments, the communications circuit may be an expansion module.

These communications can include between two separate modular expansion platforms, such as modular expansion platform 610A to 610B, modular expansion platform 610A to 610C, and modular expansion platform 610B to 610C for example The communications can further include communications from systems such as portable controllers, such as between modular expansion platform 610A to portable controller 612. The portable controller 612 may be a handheld device used by the operator, such as to control the movement of the AV for example. Further still, the communications can be between a platform and a computer network, such as between modular expansion platform 610B to cloud based computing network 614 for example. It should be appreciated that the examples provided herein are non-limiting and an individual modular expansion platform may communicate with more or fewer systems.

The communication between the modular expansion platform and an external systems may be performed wireless, such as via radio frequency, cellular, BluetoothTM, WiFi, or satellite communications for example.

Referring now to FIGS. 3A-3F, shape examples include polygonal, circular, elliptical, quad, hexagonal, octagonal, coaxial, dodecahedron, and combinations thereof. As such, the modular expansion platform 200 can implement or realize any number of polygonal and/or curved surfaces, including in addition to the above base shapes, arbitrary rectangles 201, 202, circular patterns 203, elliptical 204, and a variety of polygonal shapes 206, 208 including arbitrary polygonal 300 (FIG. 4A) and curved shapes 302 (FIG. 4B) to accommodate new remote system design patterns as they evolve in the future. Each of these can have a plurality of geometry dimensions in terms of length, width, radius, diameter, angles, arc, and depth along all their respective axes (X,Y,Z and D as shown) resulting in numerous permutations of shapes and sizes.

It should be appreciated that the shape of the modular expansion platform may change based on the AV that the modular expansion platform is being coupled to, and/or the types of expansion modules being used. Referring now to FIG. 3A-3F-2F, shape examples include polygonal, rectangular (FIG. 3A), circular (FIG. 3C), elliptical (FIG. 3D), quadrilateral, hexagonal, octagonal, coaxial, dodecahedron, and combinations thereof. As such, the AV modular expansion platform 200 can implement or realize any number of polygonal and/or curved surfaces, including in addition to the above base shapes, arbitrary rectangles 201, 202 (FIG. 3A, FIG. 3B), circular patterns 203 (FIG. 3C), elliptical 204 (FIG. 3D), and a variety of polygonal shapes 206, 208 (FIG. 3E, FIG. 3F) including arbitrary polygonal 300 (FIG. 4A) and curved shapes 302 (FIG. 4B) to accommodate new AV design patterns as they evolve in the future. Each of these can have a plurality of geometry dimensions in terms of length, width, radius, diameter, angles, arc, and depth along all their respective axes (X,Y,Z and D as shown) resulting in numerous permutations of shapes and sizes.

It should be appreciated that the embodiments of FIGS. 3A-3F, FIG. 4A and FIG. 4B illustrate the modular expansion platform 200 as being planar, this is for exemplary purposes and the claims should not be so limited. In other embodiments, the modular expansion platform 200 may be contoured or shaped to conform with or cooperate with the shape of the layers 104, 106 of the AV. In other words, the shape of the modular expansion platform may vary in height, width and depth.

The modular expansion platform 200 further includes a mounting arrangement 210 for coupling the modular expansion platform 200 to the AV. In an embodiment, the mounting arrangement 210 may be a bolt hole pattern that receives a fastener that couples the modular expansion platform 200 to the AV layers 104, 106. It should be appreciated that multiple mounting arrangements 210, such as multiple bolt hole patterns for example, may be provided to allow the modular expansion platform 200 to accommodate multiple remote system manufacturers or models. It should be further appreciated that this may including having mounting arrangements 210 with different numbers, positions, or sizes of bolt holes. The bolt holes may include a threaded hole, a pass-through hole, or a combination thereof. In an embodiment, the mounting arrangement 210 may be an attachment by means of a remote system payload mounting interface provided by or integrated into the AV, wherein a configurable bolt pattern or other attachment method can be utilized to secure the modular expansion platform 200 to the remote system payload mounting interface. In other embodiments, other attachment means may be used such as be not limited to mechanical, electromechanical, and magnetic attachment systems.

Referring now to FIGS. 5A-5F, FIG. 6A-6H and FIG. 7A-7C for a given AV modular expansion platform 500 geometry, there is at least one processor module 502 and in some embodiments at least one expansion module 504 physically mapped to the modular expansion platform 500 geometry. In an embodiment, the number and location of expansion modules 504 is configured to fit a maximum number or nearly maximum number of expansion modules 504 for the given geometry (e.g. outline of the airframe) and associated mechanical constraints, such as thru-holes and geometry specific avoidance regions as imposed by the remote system for example. It should be appreciated that embodiments herein provide numerous representative examples for reconfigurable use of expansion modules that may be used with other embodiments.

In one embodiment, each expansion module location includes a reconfigurable expansion plate that is configurable (with expansion module specific different I/O connection or port interfaces) and adjacent from either side of the remote system modular expansion platform bottom-layer side structure. The expansion plate enables zero, one or more interfaces (connectors or ports as an example) to access the outside of the remote system modular expansion platform. Similarly, access to the internal expansion modules (such as sensors, wires, devices, or simply the environment as is the case for gas/environmental sensors) can access the expansion module utilizing the expansion plate method. It should be appreciated that while number of sides in the example embodiments may refer to having four sides (e.g. front, rear, left side, right side), this is for example purposes and the claims should not be so limited. In other embodiments, the expansion platform shape may be such that additional sides or surfaces may be provided. Therefore, the expansion platform may have “n” panels based at least in part on the expansion platform shape and the constraints of the air-frame geometry.

It should be appreciated that while some embodiments, such as FIG. 5A, illustrate the expansion modules 504 as being the same size, this is for example purposes and the claims should not be so limited. In other embodiments, the expansion modules on a particular modular expansion module may be of difference sizes. Further, the configurations of the modular expansion platforms 500 shown in FIGS. 5A-FIG. 7C are provided for example purposes and the claims should not be so limited. In other embodiments, other combinations of position and size of the expansion modules 504 and processor module 502 may be provided without deviating from the teachings herein.

Referring now to FIG. 8A and FIG. 8B, an embodiment of the AV modular expansion platform 550 is provided that includes circuitry 506 that transmits power, data, control, and communication signals from the processor module 502 to the expansion modules 504. In an embodiment, the circuitry 506 includes a processor module connector 503 and expansion module connectors 505. The connectors 503, 505 allow the processor module 502 and expansion modules 504 to be removably coupled to the circuitry 506, such as to upgrade the modular expansion platform 550 to have different functionality for example.

In an embodiment, the circuitry 506 is directly integrated into the modular expansion platform base-or-top layer 508. In an embodiment, the circuitry 506 is fabricated using additive manufacturing to form the circuitry 506 on the defined base-or-top layer 508 by directly depositing conductive materials onto the base-or-top layer structure 508 forming the electrical, electro-mechanical, and electronic implementation among the processor module 502 and expansion modules 504. By this method, the modular expansion platform base-or-top-layer 508 and circuitry 506 are fabricated within a single additive manufacturing process. This integrated process provides advantages and a technical solution in reducing or minimizing the AV weight (thus extending AV battery life and operation time) and reducing or eliminating the use of costly irregular shaped printed circuit boards that can be associated to the airframe geometry. The application of multi-material additive manufacturing to AV modular expansion platform 550 implementation illustrates how the expansion platform base-or-top layer 508 can simultaneously provide mechanical structure for multiple expansion modules 504 and electrical, electro-mechanical, and electronic structure and interconnections for expansion modules 504 within a single fabricated assembly.

This embodiment may further provide an advantage or technical solution for increasing the packing density of expansion modules 504 and reduction of weight contribution (elimination of additional traditional circuit boards), due to the integrated nature of utilizing the expansion platform base-or-top layer 508 for both mechanical and electrical functions. It should be appreciated that in other embodiments, other types of electronic devices may be integrated into the modular expansion platform, such as but not limited to field programable gate arrays (FPGA), System on a chip (SoC), System on Module (SoM), and application-specific integrated circuits (ASIC), digital and/or analog integrated circuits, radio frequency (RF) devices, antennas, sensors, as well as surface mounted passive electrical components (capacitors, resistors, inductors) for example.

The AV modular expansion platform can utilize any of the modules described and others defined and implemented by the user given the available module slot and data, communications, and power signals. In one embodiment, expansion modules are reconfigurable and can be selectively added or removed as desired by the operator in accordance with either stationary or dynamic applications. In one embodiment, the stationary reconfiguration scenario, the AV expansion platform is inserted within the AV, in other words incorporated into or coupled integrally with the housing, body, or frame of the AV. In this embodiment, the expansion modules may be added or removed by the operator physically adding or removing an expansion module utilizing the connector interface.

It should be appreciated that while the embodiments of FIG. 8A and FIG. 8B illustrate the circuitry 506 as being integrated into the structure of the AV modular expansion platform 550, this is for exemplary purposes and the claims should not be so limited. In other embodiments, the circuitry 506 and structural layer 508 may be formed separately. For example, the circuitry 506 may be formed using traditional methods, such as in the form of a printed circuit board for example, and mounted to the layer 508.

Referring to FIG. 9A, the modular expansion platform 800 is provided that is coupled to the AV 830. In this embodiment, the AV 830 has a housing or assembly that consists of a top or first layer 832 and a bottom or second layer 834. As discussed above, the AV 830 may have a plurality of layers and the layers 810, 812 are positioned between two adjacent layers. The layers 832, 834 may be coupled to the frame of the AV 830. In this embodiment, the modular expansion platform 800 is comprised of multiple layers that include a top or first layer 810 and a bottom or second layer 812. The layers 810, 812 may be integrally or separately formed with the expansion modules 804 and processor module 802 being disposed on or in the second layer 812. The modular expansion platform 800 is disposed between the top layer 832 and the bottom layer 834. In an embodiment, the expansion modules 804, or the connectors for the expansion modules are disposed about the periphery of the modular expansion platform 800, including but not limited to one or more of the front, top, bottom, the rear, or the sides. In an embodiment where the expansion module is a polygon shape, the expansion modules 804 or the connectors for the expansion modules may be arranged on any segment of the polygon. In other embodiments, one of the top layer 832 or the bottom layer 834 may include apertures that are aligned with the expansion modules or the connectors for the expansion modules to allow the operator the access to the expansion modules and/or the internal connectors of the modular expansion platform.

Referring now to FIG. 9B, another embodiment of the modular expansion platform 900 is shown located at or on the bottom-layer 934 of AV 930. In this embodiment, the expansion modules 904 are accessible via the bottom layer 912 with the top layer 910 being coupled to the AV bottom layer 934. and more easily added or removed by the operator physically adding or removing an expansion module utilizing a spring loaded, magnetic interconnection system as further described herein. It should be appreciated that the expansion modules 904, or connectors attached thereto, may be disposed about the periphery of the layer 912, such as but not limited to the front, rear, sides or the top/bottom of the layer 912. In an embodiment where the layer 912 is a polygon, the expansion module 904, or a connector attached thereto, can be disposed on any segment of the polygon.

Similarly, as shown in the embodiment of FIG. 9C, in another embodiment, the modular expansion platform 900 may be coupled at or on the top layer 910 in a similar manner as described herein. In this embodiment, the expansion modules 904 are accessible via the bottom layer 912 with the bottom layer 910 being coupled to the remote system top layer 936. and more easily added or removed by the operator physically adding or removing an expansion module utilizing a spring loaded, magnetic interconnection system as further described herein. It should be appreciated that the expansion modules 904, or connectors attached thereto, may be disposed about the periphery of the layer 912, such as but not limited to the front, rear, sides or the top/bottom of the layer 912. In an embodiment where the layer 912 is a polygon, the expansion module 904, or a connector attached thereto, can be disposed on any segment of the polygon.

Referring to FIG. 10A, another embodiment is provided, whereby the modular expansion platform 1000 is located at or on the bottom-layer 1034 of AV 1030, expansion modules 1004 can be added or removed selectively/dynamically and under programmatic control by the operator remotely. In an embodiment the expansion module 1004 may be ejected from the modular expansion platform during operation of the AV. In an embodiment, the adding or removing an expansion module 1004 occurs through programmatic application of magnetic fields (electromagnet) as part of the expansion module interconnection system as further described herein. Further, the primary and secondary power and communications interfaces 1006, 1008 of processor module 1002 may also be accessed via the bottom layer 1012.

As shown in FIG. 10B, the modular expansion platform 1000 may be coupled to a top layer 1036 of the AV. In this embodiment, the expansion modules 1004 can be added or removed selectively/dynamically and under programmatic control by the operator remotely. In an embodiment, the adding or removing an expansion module 1004 occurs through programmatic application of magnetic fields (electromagnet) as part of the expansion module interconnection system as further described herein. Further, the primary and secondary power and communications interfaces 1006, 108 of processor module 1002 may also be accessed via the top layer 1036.

In still another embodiment shown in FIG. 11, the modular expansion platform 1100 is mounted on the bottom of the AV 1132. The modular expansion platform 1100 may include a top layer 1110 and a bottom layer 1112. In this embodiment, the modular expansion platform 1100 includes one or more dynamic connections 1140. The dynamic connections 1140 further includes a first or programmable electromagnetic elements 1142 (e.g. four elements), one or more second magnets 1144 (e.g. four), and an interface 1146. The interface is electrically coupled to the processor module on the modular expansion platform and is configured to transfer data and electrical power. The modular expansion platform 1100 further includes a dynamically couplable processor module 1102 and at least one dynamically couplable expansion module 1104. The processor module 1102 and expansion module 1104 are configured the same as described herein with respect to the other embodiments.

Each of the dynamically couplable processor module 1102 and the dynamically couplable expansion module 1104 have one or more magnets 1148 (e.g. four) coupled to a side of the of the module 1102, 1104 opposite the side that is exposed to the environment/outer-surface. The magnets 1148 are configured to selectively engage the programmable electromagnetic elements 1142 when the modules 1102, 1104 are placed on or in the bottom layer 1112. The modules each further include an interface 1150 that is configured to operably engage the interface 1146 when the modules 1102, 1104 are coupled to the dynamic connections 1140. It should be appreciated that when the processor modules 1102, 1104 are coupled to the dynamic connections 1140, the interfaces 1150, 1146 are electrically coupled to transfer data and electrical power between the processor module 1102 and the expansion module 1104.

In some embodiments, the expansion module 1104 or the processor module 1102 may be ejected from the modular expansion platform 1100 by activation of the programmable electromagnetic element 1142. In still other embodiments, the expansion module 1104 or the processor module 1102 may be pulled onto the modular expansion platform 1100 by activation of the programmable electromagnetic element 1142.

It should be appreciated that the embodiment of FIG. 11 illustrates the interface 1146 configured to allow for selectively attaching (e.g. retracting) or removing (e.g. ejecting) of modules 1104 into the modular expansion platform 1100. In an embodiment, the retracting or ejecting of the modules 1104 may be under programmatic control, such as via the processor module 1102 for example. In an embodiment, the programmable electromagnetic elements 1142 are programmatically controlled (e.g. by processor module 1102) and the permanent magnets 1148 provide stability with a plug style interface 1146,1150. It should be appreciated that while the illustrated embodiment shows two dynamic connection locations, this is for example purposes and the claims should not be so limited. In other embodiments, more or fewer connection locations may be provided. In still further embodiments the modular expansion platform may be configured with a combination of dynamic and static module locations.

It should be appreciated that while some embodiments have illustrated the modular expansion platform as being solid, in other embodiments the layers of the modular expansion platform may include openings, holes, channels, and/or conduits that allow for cooling and/or routing of wiring or circuitry. These openings, holes, channels, and/or conduits may be formed during fabrication of the layer, such as by using additive manufacturing for example. It should be appreciated that the openings, holes, channels, and/or conduits may further be formed by secondary manufacturing operations, such as through subtractive manufacturing methods for example.

Referring now to FIG. 12A and embodiment is shown for a modular expansion platform 1200 coupled to an AV 1230 having a channel for routing wiring. In this embodiment, the modular expansion platform 1200 includes a first layer 1210 and a second layer 1212. The first layer 1210 includes a processor module 1202 and at least one first expansion module 1204A, while the second layer 1212 includes a second expansion module 1204B and a third expansion module 1204C. Each layer 1210, 1212 includes a hole/channel 1230A, 1230 that are positioned to be coaxial with each other.

Disposed within the channel formed by holes 1230A, 1230B are wires or conductors 1232, 1234 that allow for electrical and communication connection between the first expansion module 1204A and the second expansion module 1204B, and between the processor module 1202 and the third expansion module 1204C. It should be appreciated that the connections are examples and other combinations of connections may be provided. In other embodiments, a single conductor/wire is provided that forms a common buss that allows for transmission of signals between two or more of the components on the modular expansion platform. Further, in some embodiments, the conductor/wire may be fabricated and disposed within the holes 1230A, 1230B using additive manufacturing in a similar manner discussed above with respect to FIG. 8A and FIG. 8B.

The forming of internal channels may further be used to improve the heat transfer characteristics of the modular expansion platform. Referring now to FIG. 12B, an embodiment is shown of a modular expansion platform 1250 coupled to an AV 1230 having internal channels 1252, 1254 that form heat pipes. As used herein, a heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces. At the hot interface 1260, 1262 of a heat pipe, such as at the interface with the first expansion module 1204A or the processor module 1202, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor then travels along the heat pipe to the cold interface, such as at the outside surface 1256, 1258 of the modular expansion platform 1250, and condenses back into a liquid, releasing the latent heat. The liquid then returns to the hot interface through either capillary action, centrifugal force, or gravity and the cycle repeats.

In other embodiment, the channels 1252, 1254 are configured to flow air therethrough to transfer thermal energy away from the heat source through convection, rather than a liquid as is used in a heat pipe. It should be appreciated that in some embodiments, expansion modules 1204B, 1204C which are located on an outside surface of the modular expansion platform 1250 may transfer thermal energy directly to the environment. In some embodiments, the expansion modules 1204B, 1204C may include elements, such as fins for example, to increase the efficiency of thermal energy transfer.

It should be appreciated that the embodiments of FIG. 12A and FIG. 12B may be combined to provide a modular expansion platform 1265 as shown in FIG. 12C. In this embodiment, the modular expansion platform 1265 includes openings or holes 1230A, 1230B that provide a channel for routing wire/conductors as discussed with reference to FIG. 12A. The modular expansion platform 1265 further includes channels 1252, 1254 that are either a heat pipe, or are configured to flow air therethrough to transfer thermal energy from heat sources, such as processor module 1202 or first expansion module 1204A for example.

Referring now to FIG. 12D, another embodiment is shown of a modular expansion platform 1270 that includes provisions for internal routing of wires/conductors, such as those coupled to internal connectors of three-dimensional printed circuits 1272 or internal printed circuit boards 1274 for example. In an embodiment, the hole/opening 1230A, 1230B and the conductor 1253 may be formed using an additive manufacturing process, such as during the fabrication of the layers 1210, 1212 and circuits 1272, 1274 for example. In other embodiments, the layer1210 and circuit 1272 may be fabricated separately from the layer 1212 and circuit 1274 and the conductor 1253 is coupled to the circuits 1272, 1274 during assembly.

It should be appreciated that in some embodiments as is shown in FIG. 12E, the cooling-channels/heat-pipes 1252, 1254 discussed with respect to FIGS. 12A-12C may be combined with or incorporated into the modular expansion platform 1280 to provide thermal energy transfer for internally positioned circuits. It should further be appreciated that the modular expansion platform 1280 may further include channels/openings/holes to allow routing of wires or conductors as described herein with respect to FIGS. 12A-12D. It should still further be appreciated that the channels/openings/holes may be used for both routing wires or conductors and providing thermal energy transfer.

It should be appreciated that while the embodiments of FIGS. 12A-12E illustrate the hole/openings 1230A, 1230B and the cooling channels/heat-pipes 1252, 1254 as being vertically oriented (when viewed from the view of FIGS. 12A-12E), this is for example purposes and the claims should not be so limited. In other embodiments, the openings and cooling channels may be vertical, horizontal, on an angle, follow a three-dimensional path, or be a combination thereof.

Referring now to FIGS. 13A-13E, an embodiment is shown of a modular expansion platform 1300 that includes a plurality of layers 1302, 1304, 1306. Coupled to the middle layer 1304 are a plurality of projections 1308A, 1308B, 1308C, 1308D. As will be discussed in more detail herein, the projections 1308A, 1308C include channels 1310 that provide cooling air to pass therethrough and other openings for the routing of wires (such as for an antenna for example) or for fasteners. The projections 1308A, 1308B, 1308C, 1308D cooperate with the first layer 1302, and third layer 1306 and substantially conform to the shape of the AV to which it is going to be attached. The projections 1308A, 1308B, 1308C, 1308D and the portions of the first layer 1302 and third layer 1306 may include aligned transverse holes/openings 1312 that provide channels for flowing air into the AV to remove thermal energy from the AV and/or modular expansion platform 1300. The projections 1308A, 1308B, 1308C, 1308D and the portions of the first layer 1302 and third layer 1306 may further include aligned transverse holes 1314 that may be used to allow fasteners to pass therethrough for coupling the modular expansion platform 1300 to the AV. In an embodiment, still further holes 1316 may be used to route wires/conductors from the AV to layers or components positioned on a side opposite the modular expansion platform 1300.

The middle layer 1304 may further include an opening for a port 1318, such as a Universal Serial Bus for example, that allows an interconnection between the modular expansion platform 1300 and other components, such as but not limited to the AV and/or other modular expansion platforms for example.

The first layer 1302 (FIG. 13C is generally sized shaped to substantially conform with adjacent layers or assemblies of the AV. In the illustrated embodiment, the first layer 1302 is a generally planar member 1303 having a plurality of connectors 1320, 1321 disposed thereon. The connectors 1320, 3121 provide a mechanical and electrical interconnection for the processor and expansion modules as is described herein. In the illustrated embodiment, the expansion modules are removably coupled to the connectors 1320. In an embodiment, the processor module is coupled via three 50-pin connectors 1321. The first layer 1302 further includes trace wires or conductors 1322 that electrically connect the each of the connectors 1320, 1321. The conductors 1322 allow for transmission of electrical power and data signals between the expansion modules and the processing module(s). In an embodiment, the conductors 1322 are fabricated by additive manufacturing when the member 1303 is fabricated. In an embodiment, member 1303, the conductors 1322 and the connectors 1320 are fabricated using additive manufacturing, such as by a multi-dimensional printer such as that described in commonly owned U.S. patent application Ser. No. 17,574,326, or U.S. patent application Ser. No. 17/574,330, or U.S. patent application Ser. No. 17/574,331, entitled “Methods and Apparatus for Additive Manufacturing Based on Multi-Dimensional Build Platforms”, the contents of all of which are incorporated by reference herein.

The middle layer 1304 is defined by the projections 1308A, 1308B, 1308C, 1308D and a plurality of walls 1324 that define an area 1326 in which the expansion modules are positioned. The area 1326 is enclosed by the third layer 1306 which is a generally planar member 1328.

It should be appreciated that while of FIG. 13A-13E describe the layers 1302 and 1306 as being planar, this is for example purposes and the claims should not be so limited. In other embodiments, the layers may have curved, stepped, or three-dimensional shapes.

Referring now to FIG. 13D and FIG. 13E, an embodiment of the projections 1308A is shown. It should be appreciated that the projection 1308C may be a mirror image thereof. In an embodiment, the projection 1308C includes a body 1330 that is generally shaped to conform with the adjacent layers 1302, 1306. In an embodiment, one side 1332 is configured to couple with the walls 1324 and cooperate with the walls 1324 to define the area 1326. The body 1330 may include a number of openings or holes 1314, 1316 to allow for the routing of wires and to receive fasteners. The body 1330 further includes a transverse opening 1331.

In an embodiment, it is desirable to provide for cooling air to pass into the area 1326 and/or the adjacent layers or assemblies of the AV. In an embodiment, the body 1330 includes a plurality of slots 1334 having an entrance on an outer surface 1336 of the projection 1308A. The outer surface 1336 is exposed to the environment, such that as the AV moves through the environment, ambient air will pass through the slots 1334. In an embodiment, a first portion of the slots are in fluid communication with the opening 1331. In an embodiment, a second portion of the slots are in direct fluid communication with the area 1326. The body 1330 may further include a second plurality of slots 1338 formed in the side 1332. A portion of the slots 1338 are in fluid communication with the opening 1331. The slots 1338 are in fluid communication with the area 1326.

It should be appreciated that as the AV moves through the environment, ambient air is forced through the slots 1334. A first portion of the air flows into the opening 1331. A second portion of the air flows directly through the second portion of slots into the area 1326. The first portion of air may be used to cool the AV by flowing the air out of the opening 1331 into the AV structure. The first portion of air may further be used to flow through the second plurality of slots 1338 and into the area 1326. It should be appreciated that the air flowing into the area 1326 removes thermal energy from the components (e.g. expansion modules and processor modules) before exiting to the environment.

It should be appreciated that in other embodiments, other vents or heat transfer mechanisms may be used. For example, the sides, top or bottom of the modular expansion module may form a heat sink to transfer heat via conduction to the environment based on the temperature differential between the internal components and the environment. In another embodiment additional secondary vents may be incorporated into the module expansion module on the “front” side of the modular expansion module to force air into the internal area and then flow out the vent slots 1334. In still further embodiments, the air can flow from the top or bottom of the AV (e.g. through a vent channel) into the interior of the modular expansion platform, and forced out the vent slots 1334 via a fan located within the AV.

In some embodiments, the body 1330 may include additional openings, such as opening 1340 inside 1332 that form an entrance to a channel for routing wires/conductors. In the embodiment of FIG. 13A-13E, the opening 1340 connects to a channel 1342 such as to allow an antenna wire to exit the area 1326. In an embodiment, the channel 1342 has a curved three-dimensional shape that extends through the body 1330. In an embodiment, the channel 1342 may have any other suitable shape, such as a straight or linear shape for example In an embodiment, the antenna (not shown) is mounted to the external surface of the bodyl330.

Referring now to FIG. 13F, an embodiment is shown of a modular expansion platform 1300 have an example configuration. It should be appreciated that the embodiment illustrated in FIG. 13F is an example only and the modular expansion platform 1300 may be arranged in different configurations and with different modules. In this embodiment, the modular expansion platform 1300 includes a processor module 1350 that is electrically coupled to a plurality of sensor modules 1352A-1352H. In an embodiment, the processor module 1350 is electrically coupled to the sensor modules 1352A-1352F via connectors 1320, 1321 and conductors 1322.

In this embodiment, the sensor modules 1352A - 1352F are each configured to measure one or more parameters from a sample, such as a fluid sample for example. In an embodiment, each of the sensor modules 1352A - 1352F measure different parameters. In an embodiment, the sensors modules 1352A - 1352F are arranged in pairs where each pair measures the same parameter(s) to provide redundancy in measurement.

In an embodiment, the sensor modules 1352A-1352F are fluidly coupled to a gas intake filter 1354 to receive a sample of gas for measurement. In an embodiment, the sensor modules 1352A-1352F are fluidly coupled to the gas intake filter 1354 via a vacuum pump 1356 and a manifold 1358. The vacuum pump 1356 may be electrically coupled to the processor module 1350 and be selectively operated in response to programmable control methods. In an embodiment, exhaust ports 1360 are formed in the housing of the modular expansion platform 1300 to exhaust the gas samples from the sensor modules 1352A-1352F.

In an embodiment, in operation the AV having the modular expansion platform 1300 of FIG. 13F is moved to a location where measurements are desired. When at the location, the processor module 1350 activates the vacuum pump 1356 to draw a gas sample through the gas intake filter 1354 and manifold 1358 to the sensor modules 1352A-1352H where the parameter(s) are measured. Each of the sensor modules 1352A-1352H then transmit one or more signals (via conductors 1322) to the processor module 1350. The signals may include one or more values indicating the measured parameter(s) and/or other desired information, such as but not limited to the time the measurement was performed, any error or calibration checking performed by the sensor module, the sensor module identifier, or a combination of the foregoing.

It should be appreciated that while the embodiment of FIG. 13F describes the measured fluid as a gas, this is for example purposes only and the claims should not be so limited. In other embodiments, the fluid may be a liquid or solid medium for example. In other embodiments, the measurement may be an energy, field, or radiation level for example. Further, the modular expansion platform may have multiple different expansion modules other than the sensor modules illustrated in FIG. 13F.

Referring now to FIGS. 14A-14C, an embodiment is shown of a remote system modular expansion platform bottom-layer in cooperation with a expansion module expansion plate provides additional mounting provisions for one or more external support structures. In another embodiment the mounting structure can also reside on the bottom-layer surface (of the remote system modular expansion platform bottom-layer) in those situations where it is desired to have an external mounting attachment in this location. For example, it may be desired to couple a motorized camera gimbal, actuator, servo, or motor mechanism to the lower portion of the remote system structure. The remote system modular expansion platform outline geometries (which align with the AV structure geometries) discussed herein may implement additional mounting methods. These mounting methods may include bottom-layer surface threaded inserts and the expansion plate connection methods may include I/O connectors/ports and/or threaded inserts for example. These provide for mechanical mounting of accessories or expansion modules each of the modular expansion platforms described herein. Both methods, collectively, enable the mounting of external standalone expansion modules, third-party devices and systems, and I/O ports, connectors and devices.

It should be appreciated that the mounting attachments may be passive or active. In other words, the mounting attachments may be a mechanical/structural element only (a passive mount, e.g. a threaded fastener), or may include connectors or other devices embedded therein for transmitting electrical signals or power from modules that are coupled thereto.

In an embodiment, the modular expansion platform 700 implements a flexible mechanism for adding supporting structures enabling the mounting of such standalone modules or devices. Referring now to FIG. 14A, FIG. 14B, and FIG. 14C, an embodiment of the modular expansion platform 700 is shown having a plurality of mounting elements 720A, 720B, 720C. These mounting elements may include one or more projections or standoffs 722A, 722B, 722C. The standoffs space the mounting portion 724A, 724B, 724C away from the body 726. This may be desired, for example, to allow differently shaped expansion modules to be coupled to the AV modular expansion platform 700 without interfering with each other. Each of the elements 720A, 720B, 720C includes coupling elements 726A, 726B, 726C, such as one or more threaded mounting holes. That allow the expansion modules to be coupled thereto. The mounting elements 720A, 720B, 720C may have a variety of shapes, such as but not limited to a U-shape, an L-shape, a circular shape, a square shape, an elliptical shape, a polygonal shape, a contoured shape, or a combination of the forgoing for example.

It should be appreciated that while the embodiment of FIG. 14A-FIG. 14C illustrate the modular expansion platform 700 as having three mounting elements 720A, 720B, 720C, this is for example purposes and the claims should not be so limited. In other embodiments, the modular expansion platform 700 may have greater or fewer mounting elements. Further in some embodiments, each of the standoffs may position expansion modules at a different distance from the body 726. It should further be appreciated that the mounting elements may further be mounted to the sides, front, top, bottom, and/or rear surfaces/edges of the body 726. In an embodiment where the body 726 is a polygon, the mounting elements may extend from any segment of the polygon.

In an embodiment, shown in FIG. 14B, the body 726 may include mounting elements 726D disposed along the outer edge or periphery of the body. It should be appreciated that while only a single mounting element 726D is shown, a plurality of mounting elements may be arranged along the periphery of the body 726.

It should be appreciated that while the mounting elements 726D are illustrated as being a component that is separated from the expansion platform housing, this is for example purposes and the claims should not be so limited. In other embodiments, the mounting elements may mounted directly mounted to and/or incorporated into the housing of the expansion platform. In some embodiments, the mounting element structure may be formed by an additive manufacturing process. It should be appreciated that this provides advantages in allowing for mounting element structures that beneficial for particular applications.

It should be appreciated that while embodiments herein discuss the expansion modules 704 and processor modules 708 as being directly coupled to, or disposed within the modular expansion module, this is for example purposes and the claims should not be so limited Referring now to FIG. 15, an embodiment is shown of a modular expansion platform 700 that allows for interconnection and operability with one or more external stand-alone or separate modules 710, devices 712, or systems 714 with one or more processor modules 702. For example, the device 712 may be a gimbal mounted camera that is directly coupled to another portion of the AV or on a separate modular expansion platform. The interconnection for transmission of power/data/communications signals 705 may be accomplished by an external port, such as port 1318 (FIG. 13A) for example or integral to one or more of the mounting elements described previously.

In one embodiment the expansion modules can contain additional processors and communication devices providing additional processing and communications capability in conjunction with or independent of, to either of the AV, one or more modular expansion platforms (inclusive or the processor module or other expansion modules), AV base controller, or a remote device, system, or computing host via the available set of communications interfaces. In this method, the modular expansion platform implements a distributed computing system where each module can process and communicate with other modules and with remote system components, including remote cloud computing systems. In one embodiment the expansion modules can contain one or more communications or networking devices enabling communications among remote systems, or one or more remote computing systems, or one or more ground station communication systems.

In addition to one or more of the features described herein, or as an alternative, further embodiments of the modular expansion platform may include the platform body and at least one connection between the processor module and the at least one expansion module is formed by additive manufacturing. For example, each assembly or sub-assembly (mechanical, electrical, or both) of the expansion platform may be formed by additive manufacturing, including but not limited to the expansion platform mechanical components, the interconnecting electrics or conductors, the expansion modules, or combinations thereof. In other embodiments, the expansion platform may include assemblies or sub-assemblies that include a traditionally fabricated printed circuit board (PCB). In an embodiment, the assemblies or sub-assemblies and PCB may be arranged on the top layer, the bottom layer, or side panels of the platform. In still another embodiment there may be a combination of one or more PCB and other components that include electronics fabricated using additive manufacturing processes.

Further, one or more of the embodiments herein may utilize expansion modules that include sensors. Such sensors may include, but are not limited to: camera interfaces and devices; triggering and capture signals; imaging; scanners; RFID readers; thermal, narrow band and broad-spectrum interfaces and devices; device controllers; environmental sensors; liquid; gas and other fluid sensors, detectors, measurement, and monitoring devices; radiation and other energy detectors and measurement devices; atomic, chemical, molecular, compound sensors, detectors, measurement and analysis devices; biologic, viral, bacterial sensor, detection, measurement and analysis devices or systems; medical and/or metabolic sensors (such as heart rate, oxygen saturation levels (SpO2), blood pressure, temperature, pH for example), detection, measurement and analysis devices or systems; thermal, infrared, UV sensors and devices; motion sensors; altitude sensors; ranging sensors; LIDAR devices; mechanical command and control interfaces; actuators; servo and motor devices; portable nuclear magnetic resonance (NMR) , XRAY, magnetic resonance imaging (MRI) devices and systems; and a plurality of network and communications transmitters/receivers.

Embodiments of the present disclosure provide technical solutions for expanding the number and type of devices, systems and sensors that may be coupled to and operate with an AV. It should be appreciated that while embodiments herein may refer to an unmanned aerial vehicle, this is for example purposes and the claims should not be so limited. In other embodiments, the teachings described herein may be used with other types of autonomous systems and/or other types of unmanned, semiautonomous, or autonomous vehicles, such as but not limited to land-based vehicles (e.g. wheeled or tracked vehicles) or water-based vehicles (e.g. boats or submersible vehicles) for example, without deviating from the teachings provided herein. Further, the AV may be autonomous, semi-autonomous, or remotely operator controlled.

The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application. For example, “about” can include a range of ±8% or 5%, or 2% of a given value.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof. It should also be noted that the terms “first”, “second”, “third”, “upper”, “lower”, and the like may be used herein to modify various elements. These modifiers do not imply a spatial, sequential, or hierarchical order to the modified elements unless specifically stated.

While the disclosure is provided in detail in connection with only a limited number of embodiments, it should be readily understood that the disclosure is not limited to such disclosed embodiments. Rather, the disclosure can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the disclosure. Additionally, while various embodiments of the disclosure have been described, it is to be understood that the exemplary embodiment(s) may include only some of the described exemplary aspects. Accordingly, the disclosure is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.

Number	Date	Country
63209154	Jun 2021	US
63240515	Sep 2021	US
63248833	Sep 2021	US

METHODS AND SYSTEM FOR A RECONFIGURABLE VEHICLE MODULAR EXPANSION PLATFORM

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Provisional Applications (3)