Coupling of waveguides with very dissimilar mode field diameters (MFDs) is a critical problem of fiber-to-chip connectivity, when a single-mode optical fiber with MFD of ˜10 um has to be connected to a high-index waveguide with a sub-wavelength cross-section (e.g. a 0.2×0.5 um Si wire). Current solutions to coupling comprise, for example, butt coupling assisted by inverted taper, vertical coupling assisted by a diffraction grating; angle polished grating assisted coupling, a combination of butt coupling and evanescent coupling, evanescent coupling of the fiber core of a side polished fiber and a planar waveguide on a separate substrate (the side polished fiber and the planar waveguide are separate input/output ports). Problems of these approaches may include limited coupling efficiency (˜1.5 dB) and/or low mechanical strength. Thus, there is an long-standing and unresolved need for improved coupling with dissimilar MFDs.
Embodiments include a coupler design, in which a strip high index waveguide is fabricated on a flat surface of the cladding of a side polished fiber. By properly choosing parameters of the waveguide and fiber, one can achieve strong evanescent coupling between those very dissimilar waveguides, with the theoretical limit of the coupling efficiency approaching 100%. The high-index waveguide is connected to an optical chip by means of conventional tapers. A piece of the side polished fiber and the chip form a planar monolithic unit and have a high mechanical strength.
In this embodiment, a signal propagating in the core of a single mode or few-mode fiber with polished cladding is transformed to the high refractive index waveguide, fabricated on a flat surface of the fiber cladding, by means of evanescent coupling. In contrast to butt coupling, the condition of the effective coupling is not a similarity of the mode profiles in terms of high mode-field overlap, but the phase matching condition, i.e. the equality of the effective refractive indices of the modes.
Coupling from a fiber core with a relatively large mode field diameter (MDF) to a given (predefined) waveguide with a small MFD, such as a high refractive index waveguide of the optical chip, is fulfilled in a several steps. The first step is the evanescent co-directional coupling of the signal from the input waveguide to an auxiliary high-index waveguide deposited on a flat surface of the side polished fiber cladding; the transverse dimensions of this waveguide are chosen so that the phase matching condition is satisfied, and the length is chosen so that the maximum coupling efficiency is achieved. To achieve a high coupling efficiency, a certain relation between the parameters of the device (the geometrical parameters, the light wavelength and the refractive indices of all cores and cladding) are to be met. In the present ID, we determine the values of the parameters satisfying these relations. The other steps serve for connecting this auxiliary waveguide to a waveguide on the optical chip. To facilitate these steps, conventional tapers are used. In one of the proposed embodiments, the core mode of the fiber can be coupled to a non-fundamental mode of an auxiliary high-index waveguide. In this case the non-fundamental mode is converted to the fundamental mode via evanescent coupling or other mode-conversion technique like adiabatic tapering.
Advantages of the method proposed are as follows: high coupling efficiency (<1.5 dB coupling loss, theoretical efficiency limit is 100%); higher mechanical strength; possibility of new functions: selective coupling of a given mode of the input fiber to the output waveguide (de-multiplexing); electro-optical and/or mechanical control of coupling by applying electric field and/or mechanical stress.
Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as described herein, including the detailed description that follows, the claims, as well as the appended drawings.
It is to be understood that both the foregoing general description and the following detailed description present embodiments, and are intended to provide an overview or framework for understanding the nature and character of the disclosure. The accompanying drawings are included to provide a further understanding, and are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments, and together with the description serve to explain the principles and operation of the concepts disclosed.
Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, in which some, but not all embodiments are shown. Indeed, the concepts may be embodied in many different forms and should not be construed as limiting herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Whenever possible, like reference numbers will be used to refer to like components or parts.
In contrast to butt coupling and vertical coupling, in the method proposed in this disclosure, the waveguides are parallel (planar geometry). The input waveguide, W1, shown in
In the embodiment of
In this case the fiber can be glued or fused to a flat plate (substrate) with the refractive index close to that of the fiber cladding (for example SiO2) and after that all the system can be polished so that a flat surface comprising a part of the polished fiber cladding and a part of the plate is created. A high refractive index layer can be deposited on this flat surface so that a wafer for fabrication of an optical chip is obtained. Such a wafer has already a piece of input fiber and forms a monolithic unit with this fiber. An optical chip can be created on this wafer using standard lithography methods. This substrate will include a high index waveguide, which is parallel to the fiber core. In
For a Si waveguide with a nominal constant thickness of 200 nm, we find from numerical solutions of a 3D vector eigenvalue problem that matching of the effective index of the fundamental mode with the effective index of the fiber mode occurs for Si wire widths around 160 nm (
Next, we consider high-index strip waveguides in which the thickness, rather than the width, is reduced to achieve mode index matching. Modeling done so far suggests that in the embodiment of
The transverse dimensions (e.g., the thickness) of the auxiliary waveguide W2′ are chosen so that the effective refractive indices of the fundamental modes of waveguides W1 and of W1′ are equal (phase matching condition). Under that condition, according to the coupled wave theory, the efficiency of evanescent coupling is 100%. If the thickness of a rectangular waveguide is much less than its width, the optimal thickness of W2′ can be estimated analytically:
TTE and TTM, are the optimal thicknesses of W2′ for TE and TM polarizations respectively, Δε≡(nco)2−(ncd)2, δn≡neff−ncl, nco and ncl are the refractive indexes of the waveguide and surrounding medium respectively, neff is the effective index of the guided modes and and λ is the wavelength. For example, for δn=b5*10−3, ncl=1.45, nco=3.45, λ0=1.55,μm (typical values for fiber-to-chip connectivity), TTE≈6.1 nm, TTM≈34.3 nm . To our knowledge, such thicknesses can be achieved using in-house capabilities developed in the Green Laser Project.
The coupling length depends on the spacing between the waveguides. For the case of thin waveguide (the thickness is much less than the width), the coupling length Lc can be calculated from the Coupled Wave Theory as
An example of this dependence is shown in
Tolerance for the waveguide length: according to the Coupled Wave Theory, the coupling efficiency is related to the length of the waveguide W2′ (
For z=Lc the coupling efficiency is 100%. According to Eq. (2), the deviation, Δz (the tolerance for z), from this optimal value, which causes 1 dB drop in efficiency is 0.3 Lc. Thus, for Lc=600 μm, the tolerance to z is 180 μm, which is pretty high.
Tolerance to spacing between the waveguides: From
Tolerance to the cross-section of the waveguide: Deviation of the waveguide thickness from the optimum causes breaking the phase matching condition that results in the drop in the coupling efficiency. According to the Coupled Wave Theory,
where T stands for the waveguide dimensions (the thickness and/or width), Δβ is the deviation of the propagation constant difference from the resonant value. Calculated results for a flat waveguide (thickness<<width) is shown in
Evaluation of the coupling length for a fiber-strip waveguide system in 2D is shown in
Yet another approach to matching the propagation constants of the fiber and Si waveguide modes is to reduce the refractive index of the Si waveguide core in the region of evanescent coupling. This can be achieved by micro-structuring the Si wire waveguide to have an effective material refractive index value for which the fundamental mode is index-matched to the mode of the fiber.
In practice, the reduction of the Si waveguide core index can be achieved by using a Sub-Wavelength Grating (SWG) structure that is defined lithographically at the same time as other Si-photonic chip components. The SWG, by virtue of its grating period being much smaller than the wavelength, functions as a material with an effective index determined by the period and duty cycle of the grating, and by the refractive index values of the grating materials. Using Si and a fiber cladding index matching medium as the grating components, an index range of ˜1.6-3.5 can be engineered. The period and duty cycle of the SWG can be adiabatically adjusted to change the mode index from the value matched to the mode of the SMF in the evanescent coupling region, up to the standard Si waveguide mode effective index. This transition can also be realized in conjunction with the tapering of the SWG waveguide width, to realize an advantage of a larger coupling coefficient for a wider Si waveguide width in the evanescent coupling region.
The period of the SWG structure that is required to achieve a modified Si core index of 1.9 can be estimated to be around 485 nm from an effective medium theory for SWGs with Si segments of ˜60 nm in thickness,
The embodiment of
Many modifications and other embodiments of the embodiments set forth herein will come to mind to one skilled in the art to which the embodiments pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. For example, the antenna arrangements may include any type of antenna desired, including but not limited to dipole, monopole, and slot antennas. The distributed antenna systems that employ the antenna arrangements disclosed herein could include any type or number of communications mediums, including but not limited to electrical conductors, optical fiber, and air (i.e., wireless transmission). The distributed antenna systems may distribute and the antenna arrangements disclosed herein may be configured to transmit and receive any type of communications signals, including but not limited to RF communications signals and digital data communications signals, examples of which are described in U.S. Patent Application Ser. No. 12/892,424 entitled “Providing Digital Data Services in Optical Fiber-based Distributed Radio Frequency (RF) Communications Systems, And Related Components and Methods,” incorporated herein by reference in its entirety. Multiplexing, such as WDM and/or FDM, may be employed in any of the distributed antenna systems described herein, such as according to the examples provided in U.S. Patent Application Ser. No. 12/892,424.
Therefore, it is to be understood that the description and claims are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. It is intended that the embodiments cover the modifications and variations of the embodiments provided they come within the scope of the appended claims and their equivalents. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
This application is a continuation of International Application No. PCT/US2015/44432, filed on Aug. 10, 2015, which claims the benefit of priority under 35 U.S.C. §119 of U.S. Provisional Application Ser. No. 62/037,747, filed on Aug. 15, 2014, the contents of which are relied upon and incorporated herein by reference in their entirety.
Number | Date | Country | |
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62037747 | Aug 2014 | US |
Number | Date | Country | |
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Parent | PCT/US15/44432 | Aug 2015 | US |
Child | 15409962 | US |