The present invention is generally directed to optical communications, and more specifically to methods of coupling optical fibers to optical chips.
Optical communications systems are becoming more reliant on the use of optical chips for performing various functions on optical signals, such as switching, attenuating, multiplexing, demultiplexing, etc. Optical chips typically contain one or more input waveguides that input the light signal from an external source, one or more output waveguides that output an optical signal, and various optical devices that are connected via the input and output waveguides and, in some case, by other connecting waveguides. An advantage of optical chip technology is that a number of different optical channels can be controlled by the same chip.
Optical chips can be fabricated on any type of substrate that is transparent to the wavelength of the light being controlled on the chip. Silica glass and silicon, for example silicon implemented as silicon-on-insulator (SOI), have been used.
As integrated photonics devices become more mature, attention is being directed to reducing optical losses in optical data systems, such as coupling losses experienced between an optical fiber network and an optical chip. Such losses can be due, at least in part, to mismatches between the mode of the optical fiber that delivers the optical signal to the optical chip and the waveguides of the optical chip itself. For example, in many optical data systems, optical signals are carried in single mode silica glass fibers (SMFs) that have a mode diameter of around 9 μm. The mode size of a single mode waveguide at the input/output of an SOI chip, on the other hand, is around 4 μm. As a result, significant optical losses can occur where there is no mode conversion when coupling between an SMF and an optical chip.
There is a need, therefore, to develop approaches for low-loss coupling between optical fibers and optical chips. In particular, there is a need to develop approaches for low-loss coupling in parallel situations where there are several fibers coupled to a chip.
One embodiment of the invention is directed to an optical fiber ribbon cable that has a plurality of thermally expandable core (TEC) optical fibers formed in a ribbon. Each TEC optical fiber has a first end, a second end couplable to another optical fiber and an optical core extending between the first end and the second end. The optical core of each TEC optical fiber has a first diameter at the first end and a second diameter at the second end, the second diameter being larger than the first diameter. The optical core of each TEC optical fiber includes a tapered core section at a region of the optical core between the first end and the second end.
Another embodiment of the invention is directed to a method of forming an optical fiber ribbon cable. The method includes thermally forming expanded optical cores in a plurality of respective sections of thermally expandable core (TEC) fibers, so that each section of TEC fiber comprises a first region having an unexpanded core, a second region having an expanded core, and a tapered region between the first region and the second region. The method also includes cleaving the respective sections of the TEC fibers and forming the sections of the TEC fibers having the expanded optical cores into a ribbon.
Another embodiment of the invention is directed to a method of forming a hybrid optical fiber ribbon cable. The method includes providing a first fiber ribbon cable comprising single mode optical fibers, the single mode optical fibers having ends, and providing a second fiber ribbon cable comprising thermally expandable core (TEC) optical fibers, the TEC optical fibers having ends. The method also includes fusing the ends of the single mode fibers to the ends of respective TEC fibers using laser radiation. A tapered core region is formed in the TEC fibers, proximate the ends of the TEC fibers, using laser radiation.
The above summary of the present invention is not intended to describe each illustrated embodiment or every implementation of the present invention. The figures and the detailed description which follow more particularly exemplify these embodiments.
The invention may be more completely understood in consideration of the following detailed description of various embodiments of the invention in connection with the accompanying drawings, in which:
While the invention is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
The present invention is directed to systems, devices, and methods that can provide benefits to optical communication networks.
One method for providing a low-loss coupling between one SMF 100 and an optical chip 102 includes the use of a short length of fiber 104 having a thermally expandable core (TEC), hereafter referred to as TEC fiber. The TEC fiber 104 is formed with a core 106 having a dimension that closely matches that of the chip waveguide 108, so that there is good coupling between the TEC fiber core 106 and the chip waveguide 108 when the TEC fiber 104 is butted against the input surface 110 of the chip. The SMF 100 and the TEC fiber 102 may be aligned to the chip 102 via any suitable means, for example using a v-groove alignment mechanism or via core camera alignment (not shown).
The SMF 100 is fusion spliced to the TEC fiber 104 at the fusion region 112 to form a hybrid fiber, i.e. a fiber that is part TEC fiber and part non-TEC fiber. Exposure of the TEC fiber core 106 to heat during the fusion splicing process results in an expansion of the TEC fiber core 106 to form a tapered core region 114 that is more closely matched to the dimension of the SMF core 116. The expansion of the TEC fiber core 106 when heated is a result of thermally-enhanced diffusion of species that provide a high refractive index, for example metal ions, such as transition metal ions. The plasma arc is applied to the fusion joint for a duration that is longer than normal for fusion splicing, in order to provide sufficient heating for the core to thermally expand. Whereas normal fusion splicing requires exposure to the plasma arc for a fraction of a second, the tapered TEC core region 112 results after exposure to the plasma arc for several seconds, typically in the range 10 s-20 s. The axial extent of the tapered core region 114 is close to the width of the plasma arc exposed to the TEC fiber 104 during the plasma fusion process. Examples of TEC fiber currently available include the high numerical aperture UHNA series of fibers available from Nufern Inc., East Granby, Conn.
The scaling of this approach to multi-fiber applications has, unfortunately, been found to be problematic. Modern multi-fiber applications tend to use ribbonized fibers for ease of handling, where fibers are formed into a single ribbon using a ribbonizing tool. For example, a ribbonized fiber may include four or eight, or some other number of optical fibers. Ribbon splicers, such as the FSM-series of ribbon splicers available from Fujikura, Tokyo, Japan, are commonly used for splicing ribbonized fibers together. It has been found, however, that plasma splicing an SFM ribbon to a ribbon of TEC fibers does not consistently produce low loss fiber splices. SMF ribbon to SMF ribbon splicing is well known, and can be achieved with low optical loss. For example, ribbon splicing a 4-fiber SMF ribbon to a second 4-fiber SMF ribbon using a plasma ribbon splicer (Furukawa FSM-30R), results in fiber splice losses of the order of 0.01-0.02 dB across the ribbon. Plasma fusion of a 4-fiber SMF ribbon to a 4-fiber TEC ribbon (UHNA4 fiber), on the other hand, results in higher losses and less consistent loss across the width of the fiber, ranging from 0.07 dB to 0.29 dB in different fibers, even after optimization of the plasma conditions. Splice losses across an 8-fiber SMF ribbon fused to an 8-fiber TEC fiber ribbon (UHNA4 fiber) also resulted in inconsistent splice losses across the ribbon, regardless of splicer settings: splice losses ranged from 0.13 dB to 0.85 dB across the spliced ribbon. The UHNA4 TEC fibers used in these experiments were obtained from Nufern, East Granby, Conn.
Thus, the present invention is directed to methods of making ribbonized hybrid fibers that avoid the problem of high splice loss and inconsistent splice losses across the ribbon. One approach is to first form lengths of TEC fiber having an expanded core. One way of doing this is to heat a length of TEC fiber, for example in a filament heater, as shown in
Lengths of the expanded core TEC fiber 220 may be cut, e.g. through cleaving to form ends 222 and 224, as shown in
At the second end 238 of the ribbon 230, where the fiber cores are expanded, the fiber ends 240 are exposed. Thus, the ribbon 230 includes a number of fibers 220 whose cores have relatively small diameter at the first end 232 and relatively large diameters at the second end 234. The exposed fiber ends 240 may subsequently be fusion spliced to a ribbon 250 of single-mode fibers 252, as is schematically illustrated in
Steps for the process of making a ribbonized fiber cable for that contains expanded-core TEC fibers include thermally forming expanded optical cores in a number of respective sections of TEC fibers, so that each section of TEC fiber comprises a first region having an unexpanded core 212, a second region having an expanded core 214, and a tapered core region 216 between the first and second regions. The respective sections of the TEC fibers can be cleaved to a desired length either before or after the fiber cores are thermally expanded. The sections of the TEC fibers having the expanded optical cores can then be formed into a ribbon using conventional ribbonizing techniques.
In addition to using a filament for heating the TEC fiber core, another method of selectively heating a section of TEC fiber to expand the TEC fiber core is to use a laser, for example a carbon dioxide (CO2) laser. It is important that, for laser heating, the wavelength of light produced by the laser is absorbed by the optical fiber. The CO2 laser typically produces radiation at 10.6 μm, which is absorbed in silica glass. An exemplary set up for laser heating a TEC fiber 304 is schematically illustrated in
As with the method of filament heating discussed above, the TEC fiber 304 may be cut into sections of desired length either before or after the formation of an expanded core.
Since the laser fusion/thermal core expansion technique works provides more uniform, low splice loss across a fiber ribbon than does plasma arc splicing, the use of a laser to fuse the fibers while simultaneously expanding the core of the TEC fiber can allow for efficient splicing of a TEC fiber ribbon cable to an SMF ribbon cable. For example, in the exemplary embodiment illustrated in
Results of two different approaches to using a CO2 laser to expand the core of a TEC fiber, and for splicing an expanded core TEC fiber to a single mode fiber, are presented.
The process included the steps of thermal core expansion followed by splicing. Thermal core expansion was based on illuminating the fiber multiple times with a CO2 laser (Lazermaster CO2, produced by AFL, Duncan, S.C.) with sufficient cool down time between illumination pulses that cladding deformation was avoided. The ends of a 1 m length of UHNA4 TEC fiber were illuminated with either 30 cycles of the CO2 laser on for 2 sec and off for 3 sec, or 6 cycles of the laser on for 6 sec and off for 9 sec.
The TEC fiber was spliced in between two single mode SMF-28 patch cords, each 5 m long, using a set up as shown in
A number of SMF-28 to TEC fiber to SMF-28 splices were made and their losses measured for repeatability. The losses measured for a first set of 20 splices are shown in
Typical losses in dB, as a function of wavelength, are shown in the following table.
The process used in Example 2 was to thermally expand the core of a 1 m length of UHNA4 TEC fiber over a long section. The TEC fiber was then cleaved in the center of the thermally expanded core area using a conventional fiber cleaver. A CO2 laser was used to splice the cleaved TEC fiber to an SMF-28 fiber using the same settings as are used for SMF-28 to SMF-28 splicing.
Typical losses in dB, as a function of wavelength, are shown in the following table.
The splice losses obtained using this technique were generally less than those achieved using the technique of Example 1, typically in the range 0.1-0.15 dB per splice. Furthermore, the variation in splice loss across multiple splices was less. These experiments show that a CO2 laser may be used form expanded core section in TEC fiber and to form low loss hybrid splices between an expanded core TEC fiber and a single mode fiber.
Various modifications, equivalent processes, as well as numerous structures to which the present invention may be applicable will be readily apparent to those of skill in the art to which the present invention is directed upon review of the present specification. The claims are intended to cover such modifications and devices. For example, in the examples discussed above, each fiber ribbon cable contains only four fibers, although a fiber ribbon cable according to the invention may contain a different number of fibers, for example 8 or 16 fibers.
As noted above, the present invention is applicable to optical systems for communication and data transmission. Accordingly, the present invention should not be considered limited to the particular examples described above, but rather should be understood to cover all aspects of the invention as fairly set out in the attached claims.
This application is being filed on Jan. 17, 2018 as a PCT International Patent Application and claims the benefit of U.S. Patent Application Ser. No. 62/447,251, filed on Jan. 17, 2017, the disclosure of which is incorporated herein by reference in its entirety.
Filing Document | Filing Date | Country | Kind |
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PCT/US2018/014096 | 1/17/2018 | WO | 00 |
Number | Date | Country | |
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62447251 | Jan 2017 | US |