Claims
- 1. A method for fabricating a device for separating at least one constituent of a sample from a remainder of the sample, comprising:
providing a silicon substrate; porifying at least two elongated regions on said silicon substrate to define at least two distinct, unconnected capillary columns, each comprising a matrix in said silicon substrate; and fabricating at least one detector on said substrate adjacent at least one of said at least two distinct, unconnected capillary columns.
- 2. The method of claim 1, further comprising applying a stationary phase to said matrix of at least one of said at least two distinct, unconnected capillary columns.
- 3. The method of claim 2, wherein said applying comprises binding a capture substrate to said matrix of at least one of said at least two distinct, unconnected capillary columns.
- 4. The method of claim 3, wherein said capture substrate comprises an antibody.
- 5. The method of claim 3, wherein said capture substrate comprises an antigen.
- 6. The method of claim 1, further comprising disposing a sealing element over at least one of said at least two distinct, unconnected capillary columns.
- 7. The method of claim 1, further comprising providing a processor in communication with said at least one detector.
- 8. The method of claim 7, further comprising fabricating said processor on said substrate.
- 9. The method of claim 1, further comprising providing a memory device in communication with the separation device.
- 10. The method of claim 9, further comprising fabricating said memory device on said substrate.
- 11. The method of claim 1, further comprising:
selecting at least one reaction location along at least one of said at least two distinct, unconnected capillary columns, said at least one reaction location continuous with said at least one capillary column and having a width that differs from a width of said at least one capillary column; and porifying said at least one reaction location.
- 12. The method of claim 1, further comprising disposing a migration facilitator in communication with at least one of said at least two distinct, unconnected capillary columns.
- 13. The method of claim 1, further comprising fabricating a first electrode proximate a first end of at least one of said at least two distinct, unconnected capillary columns and a second electrode proximate a second end of said at least one capillary column.
- 14. A method for fabricating an ultrasmall flow channel device, comprising:
forming at least one elongate trench in a substrate, said at least one elongate trench extending along at least a portion of a major plane of said substrate; and forming hemispherical grain silicon in said at least one elongate trench.
- 15. The method of claim 14, further comprising disposing a stationary phase on said hemispherical grain silicon.
- 16. The method of claim 15, wherein said disposing comprises forming silicon oxide on said hemispherical grain silicon.
- 17. The method of claim 15, wherein said disposing comprises securing at least one type of capture molecule to at least one region of said at least one elongate trench.
- 18. The method of claim 17, wherein said disposing comprises securing a plurality of different types of capture molecules to a corresponding plurality of discrete regions of said at least one elongate trench.
- 19. The method of claim 14, wherein said forming said hemispherical grain silicon in said at least one elongate trench comprises forming said hemispherical grain silicon so as to permit a sample to flow through said at least one elongate trench.
- 20. The method of claim 14, wherein said forming said at least one elongate trench comprises forming said at least one elongate trench in silicon of said substrate.
- 21. A method for fabricating an ultrasmall flow channel device, comprising:
forming at least one elongate trench in silicon of a substrate; and forming hemispherical grain silicon on at least surfaces of said at least one elongate trench.
- 22. The method of claim 21, wherein said forming said at least one elongate trench comprises etching said at least one elongate trench into said silicon.
- 23. The method of claim 21, wherein said forming said at least one elongate trench comprises forming said at least one elongate trench to extend along at least a portion of a major plane of said substrate.
- 24. The method of claim 21, further comprising disposing a stationary phase on said hemispherical grain silicon.
- 25. The method of claim 24, wherein said disposing comprises forming silicon oxide on said hemispherical grain silicon.
- 26. The method of claim 24, wherein said disposing comprises securing at least one type of capture molecule to at least one region of said at least one elongate trench.
- 27. The method of claim 26, wherein said disposing comprises securing a plurality of different types of capture molecules to a corresponding plurality of discrete regions of said at least one elongate trench.
- 28. The method of claim 21, wherein said forming said hemispherical grain silicon in said at least one elongate trench comprises forming said hemispherical grain silicon so as to permit a sample to flow through said at least one elongate trench.
- 29. The method of claim 21, wherein said forming said at least one elongate trench comprises forming said at least one elongate trench in silicon of said substrate.
- 30. A method for manufacturing a separation device, comprising:
forming matrices in a semiconductor substrate to define at least two distinct, unconnected separation substrates, each separation substrate:
having a plurality of pores that open to a surface of said substrate; and comprising a sufficient surface area to facilitate separation of a constituent from a sample.
- 31. The method of claim 30, further comprising applying a stationary phase to at least one of said matrices.
- 32. The method of claim 31, wherein said applying comprises binding a capture substrate to at least one of said matrices.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No. 09/442,713, filed Nov. 18, 1999, pending, which is a divisional of application Ser. No. 09/177,814, filed Oct. 23, 1998, now abandoned.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09177814 |
Oct 1998 |
US |
Child |
09442713 |
Nov 1999 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09442713 |
Nov 1999 |
US |
Child |
10387830 |
Mar 2003 |
US |