Claims
- 1. A process for fabricating a porous preform for use in composite formation process comprising:
- providing a hardenable, liquid, organometallic, ceramic precursor binder;
- providing a mass of at least one filler material;
- mixing together said hardenable, liquid, organometallic, ceramic precursor binder and said mass of at least one filler material to form at least one porous preform; and
- filling at least a portion of said porous preform with at least one metal by at least one process selected from the group consisting of spontaneous infiltration, pressure infiltration and vacuum assisted infiltration.
- 2. The process of claim 1, wherein said hardenable, liquid, organometallic, ceramic precursor comprises titanium, zirconium, aluminum, or silicon.
- 3. The process of claim 2, wherein said hardenable, liquid, organometallic, ceramic precursor comprises silicon.
- 4. The process of claim 1, wherein said hardenable, liquid, organometallic, ceramic precursor comprises oxygen or nitrogen.
- 5. The process of claim 4, wherein said hardenable, liquid, organometallic, ceramic precursor comprises nitrogen.
- 6. The process of claim 1, wherein said hardenable, liquid, organometallic, ceramic precursor comprises an alkenyl, alkynyl, epoxy, acrylate or methacrylate group.
- 7. The process of claim 6, wherein said hardenable, liquid, organometallic, ceramic precursor comprises an alkenyl group.
- 8. The process of claim 7, wherein said alkenyl group comprises a vinyl group.
- 9. The process of claim 3, wherein said hardenable, liquid, organometallic, ceramic precursor comprises a polyureasilazane.
- 10. The process of claim 3, wherein said hardenable, liquid, organometallic, ceramic precursor comprises a polysilazane.
- 11. The process of claim 3, wherein said hardenable, liquid, organometallic, ceramic precursor comprises a polysiloxane.
- 12. The process of claim 1, wherein said binder is present to the extent of 0.1% to about 20% based on the total weight of the filler material/binder mixture.
- 13. The process of claim 12 wherein said binder is present to the extent of 0.1 wt % to 5 wt % based on the total weight of the filler material/binder mixture.
- 14. The process of claim 13 wherein said binder is present to the extent of 0.1 wt % to 2 wt % based on the total weight of the filler material/binder mixture.
- 15. The process of claim 1, wherein the binder is hardened through the application of heat, UV irradiation, or laser energy.
- 16. The process of claim 15, wherein the binder is hardened through the application of heat.
- 17. The process of claim 16, where the binder further comprises a free radical generator.
- 18. The process of claim 17, wherein said free radical generator is a peroxide or an azo compound.
- 19. The process of claim 18, wherein said peroxide is dicumyl peroxide.
- 20. The process of claim 1, wherein said at least one metal comprises aluminum.
- 21. The process of claim 1, wherein at least a portion of said porous preform is filled by a spontaneous infiltration process.
- 22. The process of claim 21, wherein at least one of an infiltration enhancer and an infiltration enhancer precursor are provided to said at least one preform.
- 23. The process of claim 21, wherein an infiltrating atmosphere is provided for at least a portion of the spontaneous infiltration process.
- 24. The process of claim 23, wherein said infiltrating atmosphere comprises a non-nitrogen atmosphere.
- 25. The process of claim 1, wherein said hardenable, liquid, organometallic, ceramic precursor binder comprises metal-nitrogen bonds.
- 26. The process of claim 25, wherein said hardenable, liquid, organometallic, ceramic precursor binder comprises at least one of silicon-nitrogen bonds, aluminum-nitrogen bonds and boron-nitrogen bonds.
- 27. The process of claim 1, wherein said porous preform has a porosity of between about 5% and 90% by volume.
- 28. The process of claim 26, wherein said porous preform has a porosity of between about 25% and 50% by volume.
- 29. The process of claim 21, wherein said at least one metal comprises aluminum.
- 30. The process of claim 22, wherein said at least one infiltration enhancer precursor comprises magnesium and said at least one metal comprises aluminum.
- 31. The process of claim 30, wherein an infiltrating atmosphere is provided for at least a portion of the spontaneous infiltration process.
- 32. The process of claim 31, wherein said hardenable, liquid, organometallic, ceramic precursor binder comprises metal-nitrogen bonds and said infiltrating atmosphere comprises a non-nitrogen atmosphere.
Parent Case Info
This application is a continuation-in-part of U.S. patent application Ser. No. 08/121,814, filed Sep. 15, 1993, now U.S. Pat. No. 5,433,261, which in turn is a continuation-in-part of U.S. patent application Ser. No. 08/055,654, filed on Apr. 30, 1993, now abandoned.
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Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
121814 |
Sep 1993 |
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Parent |
55654 |
Apr 1993 |
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