Perovskite solar cells (PSCs) have emerged as a next generation photovoltaic (PV) technology, with the potential to displace many incumbent PV technologies in the future. The most efficient PSCs reported thus far are based on Pb-based halide perovskites, generally with bandgaps in a range between about 1.5 eV and about 1.7 eV. This bandgap range is substantially higher than that most suitable for single-junction solar cells, about 1.34 eV, according to the Shockley-Queisser (S-Q) calculation (˜1.34 eV), as well as for the bottom cell in all-perovskite tandem devices to go beyond the S-Q limit. Thus, there remains a need for new, lower bandgap perovskite compositions, and methods of making them, which will help enable the manufacture of high efficiency, stable PSCs on the industrial scale.
An aspect of the present disclosure is a composition that includes a perovskite having a stoichiometry comprising A1-xFAxSn1-yBy(I1-zXz)3, where A is a first cation, B is a second cation, X is a halide, and 0.5≤x≤0.9, 0.5≤y≤0.9, and 0≤z≤1. In some embodiments of the present disclosure, A may include at least one of cesium, guanidinium, and/or methylammonium. In some embodiments of the present disclosure, X may include at least one of bromide and/or chloride. In some embodiments of the present disclosure, z may be equal to zero.
In some embodiments of the present disclosure, the composition may be further characterized by a bandgap between about 1.1 eV and about 1.5 eV. In some embodiments of the present disclosure, the bandgap may be between about 1.3 eV and about 1.4 eV. In some embodiments of the present disclosure, the composition may be further characterized by at least one physical property having a characteristic value. In some embodiments of the present disclosure, the physical property may include a grain size with the characteristic value between about 300 nm and about 1500 nm. In some embodiments of the present disclosure, the grain size may be between about 750 nm and about 850 nm. In some embodiments of the present disclosure, the physical property may include a biaxial residual stress level with the characteristic value between about 0 MPa and about 100 MPa. In some embodiments of the present disclosure, the biaxial residual stress level may be between about 0 MPa and about 40 MPa. In some embodiments of the present disclosure, the physical property may include a dark carrier density with the characteristic value between about 1×1013 cm−3 and about 1×1017 cm−3. In some embodiments of the present disclosure, the dark carrier density may be between about 5×1014 cm−3 and about 5×1016 cm−3. In some embodiments of the present disclosure, the composition may include Cs1-xFAxSn1-yPbyI3. In some embodiments of the present disclosure, 0.6≤x≤0.8 and 0.6≤y≤0.8.
An aspect of the present disclosure is a method of making a perovskite, where the method includes combining a stoichiometric amount of at least one perovskite precursor that includes formamidinium (FA), tin, iodide, A, B, and X resulting in a mixture, adding an additive to the mixture, and treating the mixture. Further, the treating results in the forming of the perovskite having a stoichiometry comprising A1-xFAxSn1-yBy(I1-zXz)3, where A is a first cation, B is a second cation, X is a halide, 0≤x≤1, 0≤y≤1, 0≤z≤1, and the additive includes FA and tin and at least one of fluoride and/or chloride.
In some embodiments of the present disclosure, the additive is added at a concentration between about 0.1 mol % and about 10 mol % relative to the stoichiometric amount. In some embodiments of the present disclosure, the concentration may be between about 0.1 mol % and about 5 mol %. In some embodiments of the present disclosure, the additive may include at least one of SnF2·xFACl or SnCl2·xFACl, where 1.5≤x≤4.5. In some embodiments of the present disclosure, 2.5≤x≤3.5.
Some embodiments are illustrated in referenced figures of the drawings. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than limiting.
The embodiments described herein should not necessarily be construed as limited to addressing any of the particular problems or deficiencies discussed herein. References in the specification to “one embodiment”, “an embodiment”, “an example embodiment”, “some embodiments”, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
As used herein the term “substantially” is used to indicate that exact values are not necessarily attainable. By way of example, one of ordinary skill in the art will understand that in some chemical reactions 100% conversion of a reactant is possible, yet unlikely. Most of a reactant may be converted to a product and conversion of the reactant may asymptotically approach 100% conversion. So, although from a practical perspective 100% of the reactant is converted, from a technical perspective, a small and sometimes difficult to define amount remains. For this example of a chemical reactant, that amount may be relatively easily defined by the detection limits of the instrument used to test for it. However, in many cases, this amount may not be easily defined, hence the use of the term “substantially”. In some embodiments of the present invention, the term “substantially” is defined as approaching a specific numeric value or target to within 20%, 15%, 10%, 5%, or within 1% of the value or target. In further embodiments of the present invention, the term “substantially” is defined as approaching a specific numeric value or target to within 1%, 0.9%, 0.8%, 0.7%, 0.6%, 0.5%, 0.4%, 0.3%, 0.2%, or 0.1% of the value or target.
As used herein, the term “about” is used to indicate that exact values are not necessarily attainable. Therefore, the term “about” is used to indicate this uncertainty limit. In some embodiments of the present invention, the term “about” is used to indicate an uncertainty limit of less than or equal to ±20%, ±15%, ±10%, ±5%, or ±1% of a specific numeric value or target. In some embodiments of the present invention, the term “about” is used to indicate an uncertainty limit of less than or equal to ±1%, ±0.9%, ±0.8%, ±0.7%, ±0.6%, ±0.5%, ±0.4%, ±0.3%, ±0.2%, or ±0.1% of a specific numeric value or target.
Among other things, the present disclosure relates to the use of one or more additives during the formation of a perovskite, resulting in improved final physical properties and/or performance metrics of the finally formed perovskite. In addition to the improved quality of the finally formed perovskite, for the example of a film of perovskite, the residual stresses in films appear to play an important role in influencing both the stability and efficiency of perovskite solar cells (PSCs) incorporating the perovskite films. For example, as described herein, a novel tin (Sn)-halide-complex (SHC) additive, SnCl2·xFACl (where x is optimized to about 3 at a 5 mol % addition relative to the amount of SnI2 provided in the formulation used to make the target perovskite composition), the residual stress was effectively reduced in an exemplary MA-free, Cs-FA-based Sn—Pb halide perovskite film of composition (FAPbI3)0.7(CsSnI3)0.3 (or Cs0.3FA0.7Sn0.3Pb0.7I3) having a bandgap ˜1.34 eV (FA is formamidinium). As shown herein, it was determined that the SnCl2·3FACl additive enables the formation of a high-quality perovskite-substrate interface during room-temperature solution processing. The use of this exemplary additive also reduced the defect density by two orders of magnitude compared to identical perovskite synthesis in the absence of the additive (referred to herein as a “pristine” perovskite) and it further improved the structural and optoelectronic properties of the thin perovskite films. Using this approach, the power-conversion efficiency (PCE) values of the resulting PSCs approached nearly 20%, which to date, is the highest for MA-free Sn—Pb-based PSCs having a bandgap in the range of about 1.34 eV. In addition, a promising operational stability was demonstrated with greater than 80% of the initial PCE maintained after 750 hours under continuous operation at about 45° C. with maximum-power-point tracking under 1-sun illumination.
Typical inorganic perovskites include calcium titanium oxide (calcium titanate) minerals such as, for example, CaTiO3 and SrTiO3. In some embodiments of the present invention, the A-cation 110 may include a nitrogen-containing organic compound such as an alkyl ammonium compound. The B-cation 120 may include a metal and the X-anion 130 may include a halogen. Additional examples for the A-cation 110 include organic cations and/or inorganic cations, for example Cs, Rb, K, Na, Li, and/or Fr. Organic A-cations 110 may be an alkyl ammonium cation, for example a C1-20 alkyl ammonium cation, a C1-6 alkyl ammonium cation, a C2-6 alkyl ammonium cation, a C1-5 alkyl ammonium cation, a C1-4 alkyl ammonium cation, a C1-3 alkyl ammonium cation, a C1-2 alkyl ammonium cation, and/or a C1 alkyl ammonium cation. Further examples of organic A-cations 110 include methylammonium (CH3NH3+), ethylammonium (CH3CH2NH3+), propylammonium (CH3CH2CH2NH3+), butylammonium (CH3CH2CH2CH2NH3+), formamidinium (NH2CH═NH2+), hydrazinium, acetylammonium, dimethylammonium, imidazolium, guanidinium, benzylammonium, phenethylammonium, butylammonium and/or any other suitable nitrogen-containing or organic compound. In other examples, an A-cation 110 may include an alkylamine. Thus, an A-cation 110 may include an organic component with one or more amine groups. For example, an A-cation 110 may be an alkyl diamine halide such as formamidinium (CH(NH2)2). Thus, the A-cation 110 may include an organic constituent in combination with a nitrogen constituent. In some cases, the organic constituent may be an alkyl group such as straight-chain or branched saturated hydrocarbon group having from 1 to 20 carbon atoms. In some embodiments, an alkyl group may have from 1 to 6 carbon atoms. Examples of alkyl groups include methyl (C1), ethyl (C2), n-propyl (C3), isopropyl (C3), n-butyl (C4), tert-butyl (C4), sec-butyl (C4), iso-butyl (C4), n-pentyl (C5), 3-pentanyl (C5), amyl (C5), neopentyl (C5), 3-methyl-2-butanyl (C5), tertiary amyl (C5), and n-hexyl (C6). Additional examples of alkyl groups include n-heptyl (C7), n-octyl (C8) and the like.
Examples of metal B-cations 120 include, for example, lead, tin, germanium, and or any other 2+ valence state metal that can charge-balance the perovskite 100. Further examples include transition metals in the 2+ state such as Mn, Mg, Zn, Cd, and/or lanthanides such as Eu. B-cations may also include elements in the 3+ valence state, as described below, including for example, Bi, La, and/or Y. Examples for X-anions 130 include halogens: e.g., fluorine, chlorine, bromine, iodine and/or astatine. In some cases, the perovskite halide may include more than one X-anion 130, for example pairs of halogens; chlorine and iodine, bromine and iodine, and/or any other suitable pairing of halogens. In other cases, the perovskite 100 may include two or more halogens of fluorine, chlorine, bromine, iodine, and/or astatine.
Thus, the A-cation 110, the B-cation 120, and X-anion 130 may be selected within the general formula of ABX3 to produce a wide variety of perovskites 100, including, for example, methylammonium lead triiodide (CH3NH3PbI3), and mixed halide perovskites such as CH3NH3PbI3-xClx and CH3NH3PbI3-xBrx. Thus, a perovskite 100 may have more than one halogen element, where the various halogen elements are present in non-integer quantities; e.g., x is not equal to 1, 2, or 3. In addition, perovskite halides, like other organic-inorganic perovskites, can form three-dimensional (3-D), two-dimensional (2-D), one-dimensional (1-D) or zero-dimensional (0-D) networks, possessing the same unit structure. As described herein, the A-cation 110 of a perovskite 100, may include one or more A-cations, for example, one or more of cesium, FA, MA, etc. Similarly, the B-cation 120 of a perovskite 100, may include one or more B-cations, for example, one or more of lead, tin, germanium, etc. Similarly, the X-anion 130 of a perovskite 100 may include one or more anions, for example, one or more halogens (e.g., at least one of I, Br, Cl, and/or F), thiocyanate, and/or sulfur. Any combination is possible provided that the charges balance.
For example, a perovskite having the basic crystal structure illustrated in
In addition, perovskite halides, like other organic-inorganic perovskites, can form a three-dimensional (3D) network, a two-dimensional (2D) network, a one-dimensional (1D) network and/or a zero-dimensional (0D) network, possessing the same unit structure. A perovskite's 3D network is illustrated in
Referring to Panel A of
Sn—Pb PSCs with SnCl2·3FACl additive. An exemplary MA-free perovskite composition of Cs0.3FA0.7Sn0.3Pb0.7I3 was chosen, partially for its favorable bandgap of about 1.34 eV (see
The typical current density-voltage (J-V) curves, and the corresponding external quantum efficiency (EQE) spectra, for PSCs made with and without the SnCl2·3FACl additive are shown in
Note that the PSCs prepared with the SnCl2·xFACl additive, with x ranging from 1.5 to 4.5, all showed enhanced device performance compared to the PSCs without the additive (see
Physical properties of pristine and SnCl2·3FACl-added Sn—Pb perovskites. To understand the origin of the significantly improved device performance associated with using the SnCl2·3FACl additive (5 mol %), a set of physical and optoelectronic properties of the films were characterized. The top-view scanning electron microscope (SEM) images in
The improved microstructure and crystallinity of perovskite films are often important factors that contribute to enhancing PSC performance. In this context, another set of Cs0.3FA0.7Sn0.3Pb0.7I3 perovskite films and devices were prepared using a different additive, SnF2·3FACl (5 mol %). In comparison with the pristine films without any additive, the use of SnF2·xFACl additive also enhanced the crystallinity (see
Strain relaxation due to SnCl2·3FACl additive. Recently can affect charge transport and chemical stability of perovskite films. There is often a biaxial tensile residual stress in solution-processed perovskite films, associated with the film formation process and the coefficient of thermal expansion (CTE) mismatch between the film and the substrate. In general, such strain is detrimental to PSC operation as it can increase charge recombination, decrease perovskite stability, and reduce mechanical reliability. In order to evaluate the possible effect of residual stress, Cs0.3FA0.7Sn0.3Pb0.7I3 perovskite films without additive (pristine) and with the SnCl2.3FACl additive (5 mol %) were characterized using the well-established XRD sin2ψ method, as illustrated in
where m is the slope of the linear fit to the data, dn is the d220 spacing at sin2 ψ=0 (y-intercept), E<220> is the Young's modulus in the <220> direction, and v is the Poisson's ratio. E<220> is estimated as 18.5 GPa, as shown in the Supplementary Materials. The typical v value of 0.33 is assumed. The calculated residual stresses for Cs0.3FA0.7Sn0.3Pb0.7I3 perovskite films with and without SnCl2·3FACl additive are presented in
To elucidate the possible mechanisms responsible for the low residual stresses due to the SnCl2·3FACl additive mechanical delamination tests were performed. Residual stresses in perovskite films typically develop when the perovskite phase crystallizes from the as-spun film during the thermal annealing process, where the perovskite film attaches to the substrate at high temperatures and is subsequently cooled down. The significantly higher CTE of perovskite compared to that of glass results in the tensile nature of the residual stresses in the film after cooling (see
Composition-specific performance and stabilities of Sn—Pb PSCs with SnCl2·3FACl additives.
Finally, the effect of tuning the cesium content on device performance was tested. By reducing the cesium content to 10%, the resulting perovskite Cs0.1FA0.9Sn0.3Pb0.7I3 had a bandgap of ˜1.32 eV (see
All the perovskite solution and films depositions were conducted in a N2 glovebox with O2 level<1 ppm, H2O<1 ppm. A “baseline” perovskite, Cs0.3FA0.7Sn0.3Pb0.7I3, was prepared by making a solution by mixing 76.1 mg FAI (Greatcell, Australia), 203.9 mg PbI2 (anhydrous, Sigma-Aldrich, USA), 49.3 mg CsI (anhydrous, Sigma-Aldrich, USA), and 70.7 mg SnI2 (anhydrous, bead, Sigma-Aldrich, USA) in 263 μl DMF (anhydrous, Sigma-Aldrich, USA) and 88 μl DMSO (anhydrous, Sigma-Aldrich). For preparing SnF2·3FACl or SnCl2·3FACl additives, SnF2 (Sigma-Aldrich, USA) or SnCl2 (Sigma-Aldrich, USA) were mixed with FACl powders in a molar ratio of 1:3 in a DMF solvent, followed by a drying process using rotary evaporator. The SnF2·3FACl or SnCl2·3FACl additives were added to the perovskite precursor with different molar ratios relative to the SnI2 molar amounts. For example, the precursor with 5 mol % SnCl2·3FACl additive was prepared by adding 4.1 mg SnCl2·3FACl into the abovementioned baseline perovskite precursor solution.
The prepatterned ITO substrates were sequentially cleaned three times by ultrasonication in acetone and isopropanol (a first treatment in a first mixture of acetone, followed by a second treatment in a second mixture of IPA, this sequence repeated three times). The ITO/glass substrates were then dried with N2 gun and UV-ozone treated for 15 minutes. The PEDOT:PSS (CLEVIOS™ P VP Al 4083, filtered through a 0.45 μm Nylon filter) were spin coated onto ITO substrates at 3000 rpm for 30 seconds and annealed on a hot plate at 150° C. for 30 minutes in air. After that, the substrates were transferred to a nitrogen glovebox O2 level<1 ppm, H2O<1 ppm) to prepare the Cs0.3FA0.7Sn0.3Pb0.7I3. The perovskite films were deposited by spin-coating the solution as described above at 5000 rpm for 60 s. N2 stream was blown over the spinning substrate for 30 s during the spinning procedure to assist the formation of perovskite film. Films were then annealed at 150° C. for 15 minutes. Finally, C60 (25 nm)/Bathocuproine (6 nm)/Ag (120 nm) were sequentially deposited by thermal evaporation to complete the PSC devices.
X-ray diffraction (XRD) was performed using an X-ray diffractometer (D-8 Discover, Bruker, Germany) with Cu Kα1 radiation (λ=1.5406 Å) at a step size of 0.02°. XRD patterns for the confirmation of the perovskite phase were collected using a Ge (002) monochrometer, at a step time of 2 s. Diffraction patterns were collected as a function of θ angle of the film, using two different orthogonal orientations (φ=0° and 90°) for confirming the isotropic nature of the residue stresses. The d-spacings (220) for the well-defined XRD peaks at the highest 2q angle (˜40.6°) were used to generate the sin2ψ plots. Time-integrated photoluminescence spectra were excited at 405 nm and measured with a CCD camera. X-ray photoelectron spectroscopy (XPS) was performed with a Kratos Axis Ultra X-ray photoelectron spectrometer with a monochromatic Al Kα source (1486.6 eV) at a base pressure of 10−9 Torr. Photoelectrons were collected in a hemispherical analyzer and detected with a photodiode array. A 20-eV pass energy was used for all element specific spectral acquisitions. Resulting XPS spectra were first baseline corrected using linear subtraction methods for acquired Sn3d, Cl2p, and F1s spectra, and with Shirley baseline corrections for Pb4f, Cs3d, N1s, and I3d spectra. The Sn3d spectra were fit using a 30% Gaussian, 70% Lorentzian peak shape, with spin orbit coupling constrained using energetic separations of 8.4 eV, peak ratios of 3:2 (Sn3d5/2:Sn3d3/2), and equivalent FWHMs with an average of 1.03 eV±0.11 eV between samples.
The morphologies and microstructures of the prepared perovskite films and the cross-sectional structures and thickness of the solar cells were investigated using a field-emission scanning electron microscopy (FESEM, Nova 630 NanoSEM, FEI). The optical absorbance spectra of perovskite films were measured using an ultraviolet-visible (UV-vis) spectrophotometer (Cary-6000i, Agilent).
For the delamination test, the as-deposited Cs0.3FA0.7Sn0.3Pb0.7I3 films were coated with thin layer (˜160 nm) of polymethylmethacrylate (PMMA) for protection by spin-coating 50 μL of a 10 wt % PMMA (Sigma-Aldrich, USA) solution in chlorobenzene at 4000 rpm for 30 s. Subsequently, A thin layer of epoxy (Hysol, USA) was then applied onto the PMMA layer to ‘glue’ another cleaned glass substrate on top. The ‘sandwich’ specimens were then cured in a N2-filled glovebox for 12 h, and the excess epoxy at the edges was cleaned off with a razor blade. Then, A planar crack was introduced and propagated by inserting a razor blade ‘wedge’ into the ‘sandwich’ specimen slowly until the full delamination is achieved. The two mating fracture surfaces were observed using scanning electron microscope (LEO 1530 VP, Zeiss, Germany).
The following approach is used to arrive at a reasonable estimate. The Youngs' modulus, E, of FAPbI3 is assumed to be ˜17.8 GPa34 and that of CsSnI3 to be ˜20.2 GPa.35 Since these E values are reasonably close, the rule-of-mixtures approximation is used to calculate an E˜18.5 GPa for the Cs0.3FA0.7Sn0.3Pb0.7I3 solid-solution perovskite. Since E of halide perovskites are not very anisotropic,26,28 the average E˜18.5 GPa is used in Eqn. 1 in lieu of E<220>.
Devices were tested using a Newport Oriel Sol3A solar simulator with a xenon lamp inside a nitrogen glove box. The intensity of the solar simulator was calibrated using Jsc produced in a certified KG2-filtered silicon photodiode. By measuring the external quantum efficiency curve of the solar cell (conducted on a Newport system in ambient air), the spectral mismatch factor was calculated and used to appropriately adjust the intensity of the solar simulator lamp to provide 1-sun illumination. Through this procedure, we verified that the Jsc measured corresponded correctly to that the solar cells generated under AM1.5G solar illumination. The light current density-voltage (J-V) characteristic were taken from both forward bias to reverse bias and reverse bias to forward bias, with the step size of 10 mV and step delay of 10 ms, unless otherwise stated. The device area was 0.1 cm2 and was masked with a metal aperture to define an active area of 0.058 cm2. The stable power output (SPO) of the devices was measured by monitoring the photocurrent current density output with the biased voltage set near the maximum power point. External quantum efficiency (EQE) measurements were taken using a Newport Oriel IQE200.
For device operational stability test, PSCs were placed in a sealed cell holder with a transparent quartz cover. A continuous flow of N2 gas was passed through the holder to minimize the water and oxygen content in the atmosphere. J-V curves were performed every hour. The temperature of the devices was maintained at ˜45° C. under continuous one-sun-intensity white-LED illumination. Between the J-V measurements, the PSCs were biased at the maximum-power-point voltage using a potentiostat under illumination.
The Conductive-AFM measurements were performed on a Bruker Icon AFM system in Ar-filled glovebox. A Pt—Ir coated tip (Nanosensor PPP-EFM) scans in contact mode, where the tip virtually grounded, and a 600-mV bias voltage was applied to the sample. The scans were in 2×2 μm2, with 1024 points in the fast-scan axis and 256 lines in the slow-scan axis. The mappings were done at least on 3 random locations to ensure reliable results. Note that the experiments were done within a few hours after film deposition.
FET device fabrication. The typical device was fabricated on the 200 nm thickness SiO2/highly doped Si wafer (1-10 Ωcm−1) purchased from MTI corporation by using the standard optical lithography technique, and then the 5 nm thickness Ti/20 nm thickness Au electrodes were deposited on the patterned sample by using the thermal evaporation deposition system, and the gate electrode was directly contacted with highly doped Si wafer, all the procedures were performed in the cleanroom. The designed channel lengths (Lch) of the typical device is 10 μm and the channel width (Wch) is 1000 μm. The perovskite films were then prepared by spin coating the precursor solution on to the prefabricated device by using a spin-rate of 3000 rpm for 30 s, followed by annealing at 150° C. for 30 min on the hotplate in the Nitrogen-filled glovebox.
FET and IV measurement. The standard FET measurement was performed inside the N2 filled glovebox by using two Keithley 2400 source meters with LabVIEW control program. One sourcemeter was used to supply the source-drain voltage (VDS) and monitor the channel current (IDS), the other sourcemeter was used to supply the gate voltage (VGS) and monitor the gate leakage current. And the standard IV measurement was performed by using one Keithley 2400 sourcemeter with LabVIEW control program.
Example 1. A composition comprising: a perovskite having a stoichiometry comprising A1-xFAxSn1-yBy(I1-zXz)3, wherein: A is a first cation, B is a second cation, X is a halide, and 0.5<x≤0.9, 0.5≤y≤0.9, and 0≤z≤1.
Example 2. The composition of Example 1, wherein A comprises at least one of cesium, guanidinium, or methylammonium.
Example 3. The composition of either Example 1 or Example 2, wherein X comprises at least one of bromide or chloride.
Example 4. The composition of any one of Examples 1-3, wherein z equals zero.
Example 5. The composition of any one of Examples 1-4, further comprising a bandgap between about 1.1 eV and about 1.5 eV.
Example 6. The composition of any one of Examples 1-5, wherein the bandgap is between about 1.3 eV and about 1.4 eV.
Example 7. The composition of any one of Examples 1-6, wherein the composition further comprises at least one physical property with a characteristic value.
Example 8. The composition of any one of Examples 1-7, wherein the physical property comprises a grain size with the characteristic value between about 300 nm and about 1500 nm.
Example 9. The composition of any one of Examples 1-8, wherein the grain size is between about 750 nm and about 850 nm.
Example 10. The composition of any one of Examples 1-9, wherein the physical property comprises a biaxial residual stress level with the characteristic value between about 0 MPa and about 100 MPa.
Example 11. The composition of any one of Examples 1-10, wherein the biaxial residual stress level is between about 0 MPa and about 40 MPa.
Example 12. The composition of any one of Examples 1-11, wherein the physical property comprises a dark carrier density with the characteristic value between about 1×1013 cm−3 and about 1×1017 cm−3.
Example 13. The composition of any one of Examples 1-12, wherein the dark carrier density is between about 5×1014 cm−3 and about 5×1016 cm−3.
Example 14. The composition of any one of Examples 1-13, comprising Cs1-xFAxSn1-yPbyI3.
Example 15. The composition of any one of Examples 1-14, wherein 0.6≤x≤0.8 and 0.6≤y≤0.8.
Example 16. A method of making a perovskite, the method comprising: combining a stoichiometric amount of at least one perovskite precursor comprising formamidinium (FA), tin, iodide, A, B, and X resulting in a mixture; adding an additive to the mixture; and treating the mixture, wherein: the treating results in the forming of the perovskite having a stoichiometry comprising A1-xFAxSn1-yBy(I1-zXz)3, A is a first cation, B is a second cation, X is a halide, 0≤x≤1, 0≤y≤1, 0≤z ≤1, and the additive comprises FA and tin and at least one of fluoride or chloride.
Example 17. The method of Example 16, wherein the additive is added at a concentration between about 0.1 mol % and about 10 mol % relative to the stoichiometric amount.
Example 18. The method of either Example 16 or Example 17, wherein the concentration is between about 0.1 mol % and about 5 mol %.
Example 19. The method of any one of Examples 16-18, wherein the mixture is substantially in a liquid phase.
Example 20. The method of any one of Examples 16-19, wherein the mixture is substantially in a solid phase
Example 21. The method of any one of Examples 16-20, wherein the mixture is substantially in a gas phase.
Example 22. The method of any one of Examples 16-21, wherein the mixture includes a solvent.
Example 23. The method of any one of Examples 16-22, wherein the solvent includes at least one of dimethylformamide, dimethyl sulfoxide, N-methyl-2-pyrrolidone, gamma-butyrolactone, acetonitrile, 2-methoxyethanol, or N,N-dimethylacetamide.
Example 24. The method of any one of Examples 16-23, wherein: the additive comprises at least one of SnF2-xFACl or SnCl2-xFACl, and 1.5≤x≤4.5.
Example 25. The method of any one of Examples 16-24, wherein 2.5≤x≤3.5.
Example 26. The method of any one of Examples 16-25, wherein: the at least one perovskite precursor comprises SnI2, and the additive is present at a molar ratio between about 0.1% and about 10% or between about 3% and about 6% (optimum about 5%) relative to the amount of SnI2.
Example 27. The method of any one of Examples 16-26, wherein at least one of the combining or adding are performed at a first temperature between about 20° C. and about 50° C.
Example 28. The method of any one of Examples 16-27, wherein the treating comprises exposing the mixture to at least one of heat or vacuum.
Example 29. The method of any one of Examples 16-28, wherein the treating is performed at a second temperature between about 100° C. and about 180° C.
Example 30. The method of any one of Examples 16-29, wherein the second temperature is between about 100° C. and about 150° C.
Example 31. The method of any one of Examples 16-30, wherein the second temperature is between about 130° C. and about 150° C.
Example 32. The method of any one of Examples 16-31, wherein treating is performed at an absolute pressure between about 0.1 atm and about 1.1 atm.
The foregoing discussion and examples have been presented for purposes of illustration and description. The foregoing is not intended to limit the aspects, embodiments, or configurations to the form or forms disclosed herein. In the foregoing Detailed Description for example, various features of the aspects, embodiments, or configurations are grouped together in one or more embodiments, configurations, or aspects for the purpose of streamlining the disclosure. The features of the aspects, embodiments, or configurations, may be combined in alternate aspects, embodiments, or configurations other than those discussed above. This method of disclosure is not to be interpreted as reflecting an intention that the aspects, embodiments, or configurations require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment, configuration, or aspect. While certain aspects of conventional technology have been discussed to facilitate disclosure of some embodiments of the present invention, the Applicants in no way disclaim these technical aspects, and it is contemplated that the claimed invention may encompass one or more of the conventional technical aspects discussed herein. Thus, the following claims are hereby incorporated into this Detailed Description, with each claim standing on its own as a separate aspect, embodiment, or configuration.
This application claims priority from U.S. Provisional Patent Application No. 63/142,953 filed on Jan. 28, 2021, the contents of which are incorporated herein by reference in their entirety.
This invention was made with government support under Contract No. DE-AC36-08GO28308 awarded by the Department of Energy. The government has certain rights in the invention.
Number | Date | Country |
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3496173 | Jun 2019 | EP |
WO-2018026326 | Feb 2018 | WO |
2020108626 | Jan 2020 | WO |
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Number | Date | Country | |
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20220235076 A1 | Jul 2022 | US |
Number | Date | Country | |
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63142953 | Jan 2021 | US |