The present technology relates generally to methods for manufacturing coated composite materials, such as for use in aerospace parts.
Aerospace vehicle parts, such as rocket engines and thermal protection systems, are exposed to high temperatures and oxidizing environments during operation. Composite materials such as ceramic matrix composites (CMCs) have been developed to withstand these extreme conditions. However, conventional processes for manufacturing CMCs are generally expensive, have long lead times (e.g., several months), and may not be suitable for certain geometries (e.g., thick parts). Moreover, conventional techniques for applying protective coatings to CMCs may require additional post-processing steps that further increase manufacturing time and cost. Such coatings may also exhibit poor adhesion to the underlying material and may be vulnerable to spalling during use. Accordingly, there remains a need for improved high temperature, high performance materials.
Many aspects of the present technology can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale. Instead, emphasis is placed on clearly illustrating the principles of the present technology.
Aspects of the present technology are directed generally to methods for manufacturing coated composite materials, such as for use in aerospace parts. In several of the embodiments described below, methods of manufacturing a coated composite material structure include applying a plurality of material layers to a preform structure. The material layers can include at least one first material layer including a first matrix precursor (e.g., a ceramic-forming resin or polymer), and at least one second material layer including a second matrix precursor (which may be the same as or different from the first matrix precursor) and a coating precursor (e.g., a silicon carbide (SiC) precursor). The method can also include infusing the preform structure with the matrix precursors and the coating precursor from the material layers (e.g., via a resin film infusion (RFI) process). Subsequently, the infused preform structure can be heated to form a composite material structure (e.g., a ceramic matrix composite (CMC) structure). The heating can concurrently form a coating (e.g., a SiC coating) on at least a portion of the composite material structure. The coatings fabricated according to the processes described herein are expected to exhibit improved adhesion to the underlying structure. Additionally, the techniques described herein can reduce the time and costs associated with manufacturing coated composite materials.
Certain details are set forth in the following description and in
The accompanying Figures depict embodiments of the present technology and are not intended to limit the scope of the present technology. The sizes of various depicted elements are not necessarily drawn to scale, and these various elements may be arbitrarily enlarged to improve legibility. Component details may be abstracted in the Figures to exclude details such as the position of components and certain precise connections between such components when such details are unnecessary for a complete understanding of how to make and use the present technology. Many of the details, dimensions, angles and other features shown in the Figures are merely illustrative of particular embodiments of the technology. Accordingly, other embodiments can have other details, dimensions, angles and features without departing from the present technology. In addition, those of ordinary skill in the art will appreciate that further embodiments of the present technology can be practiced without several of the details described below.
Block 110 of the method 100 includes applying a plurality of material layers to a preform structure. For example,
The material layers 204 can serve as a source of material for densifying the preform structure 202. The material layers 204 can be provided in various formats suitable for application to a surface 206 of the preform structure 202, such as plies, sheets, films, tapes, etc. The material layers 204 can be cut or otherwise adjusted to have dimensions the same or similar to those of the surface 206 of the preform structure 202. Although
In some embodiments, the material layers 204 include different types of materials, such as a plurality of first material layers 208a-c (collectively, “first material layers 208”) and at least one second material layer 210. The first material layers 208 can each include a matrix precursor that can be converted into a matrix material for a CMC or other composite material. For example, the matrix precursor can be a polymer or resin that can be converted into a ceramic matrix (e.g., a carbon or SiC matrix) through heat treatment, as discussed further below. The matrix material formed from the matrix precursor can be the same as the matrix material of the preform structure 202, or can be a different matrix material. Examples of matrix precursors suitable for use with the present technology include, but are not limited to: polycarbosilanes, polysilazanes, benzoxazine resins, bismaleimide resins, cyanate ester resins, epoxy resins, phenolic resins, polybutadiene resins, polyester resins, polyimide resins, silicon oxycarbide resins, or vinyl ester resins.
The second material layer 210 includes a coating precursor embedded in a matrix precursor. The coating precursor can be a material that is converted into a coating upon heat treatment. For example, the coating precursor can include a material such as silicon or silica (SiO2) that is reduced and subsequently forms 2SiC when heated. As another example, the coating precursor can include carbon. In some embodiments, the coating precursor includes multiple different materials, e.g., silicon and carbon, SiO2 and carbon, other combinations of silicide-forming constituents, etc. The coating precursor can be provided in any suitable format, such as a powder, particles, flakes, fibers, etc. In some embodiments, the coating precursor is a solid material that is mixed, embedded, or otherwise combined with the matrix precursor to form the second material layer 210.
In some embodiments, the coating precursor is included only in the second material layer 210, and the first material layers 208 do not include any coating precursor. In other embodiments, however, one or more of the first material layers 208 can also include a coating precursor different from the coating precursor of the second material layer 210. In such embodiments, the final composite material structure can include multiple different coating layers (e.g., two, three, four, or more different coating layers).
The matrix precursor of the second material layer 210 can be the same as the matrix precursor of the first material layers 208, or can be a different matrix precursor. In some embodiments, for example, the matrix precursor of the second material layer 210 is configured to form a carbon or SiC matrix when heated to a suitable temperature. The temperature range at which the matrix precursor is converted to the matrix material can be the same as or similar to the temperature range for converting the coating precursor into the coating. This allows the coating and the matrix to be concurrently formed in a single processing step, as described in greater detail below.
The first and second material layers 208, 210 can be arranged in any suitable configuration. For example, in the illustrated embodiment, the first material layers 208 are positioned between the preform structure 202 and the second material layer 210. As can be seen in
The material layers 204 can be applied to the preform structure 202 in accordance with any suitable technique known to those of skill in the art, including manual, semi-automated, or fully-automated layup processes. In some embodiments, for example, the first and second material layers 208, 210 are sequentially applied to the preform structure 202. For example, the first material layers 208 can be applied to the surface 206 of the preform structure 202, then the second material layer 210 is applied to the lowermost first material layer 208c. Alternatively, the first and second material layers 208, 210 can be assembled into a stack that is subsequently applied as a unit to the surface 206 of the preform structure 202.
Although
Optionally, the assembly 200 can include additional material layers that are not shown in
Referring again to
In some embodiments, after the preform structure has been infused with the matrix precursor and coating precursor, the infused preform structure is cured to re-solidify the matrix precursor and prepare the infused preform structure for subsequent processing. Curing can occur at any suitable temperature, such as a temperature within a range from 150° C. to 500° C. (e.g., 150° C., 200° C., 250° C., 300° C., 350° C., 400° C., 450° C. or 500° C.). The curing temperature can be higher than the infusion temperature. However, the curing temperature can be low enough to prevent the infused preform structure from carbonizing and/or graphitizing. In other embodiments, however, the curing process is optional and may be omitted.
Referring again to
In some embodiments, the inner portion 402 is made of a CMC (e.g., C/C, C/SiC, SiC/SiC), and the coating 404 is made of a carbide (e.g., SiC) or silicide. The coating 404 can have different characteristics than the inner portion 402, e.g., with respect to chemistry, density, and/or structure. Because the coating 404 is formed concurrently with the inner portion 402, the interface region 408 between the coating 404 and the inner portion 402 can provide a gradual transition from the material of the coating 404 to the material of inner portion 402, rather than being a distinct boundary with a sharp transition between the coating 404 and the inner portion 402. Accordingly, the coating 404 is expected to exhibit improved adhesion and resistance to spalling and/or delamination.
The method 100 of
The processes described herein with reference to
The above detailed description of embodiments of the present technology are not intended to be exhaustive or to limit the technology to the precise forms disclosed above. Although specific embodiments of, and examples for, the technology are described above for illustrative purposes, various equivalent modifications are possible within the scope of the technology, as those skilled in the relevant art will recognize. For example, although steps are presented in a given order, alternative embodiments may perform steps in a different order. The various embodiments described herein may also be combined to provide further embodiments.
From the foregoing, it will be appreciated that specific embodiments of the technology have been described herein for purposes of illustration, but well-known structures and functions have not been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments of the technology. Where the context permits, singular or plural terms may also include the plural or singular term, respectively.
As used herein, the phrase “and/or” as in “A and/or B” refers to A alone, B alone, and A and B. Additionally, the term “comprising” is used throughout to mean including at least the recited feature(s) such that any greater number of the same feature and/or additional types of other features are not precluded. It will also be appreciated that specific embodiments have been described herein for purposes of illustration, but that various modifications may be made without deviating from the technology. For example, although the embodiments herein are described primarily with respect to CMCs, the present technology may also be applied to polymer matrix composites or other types of advanced composite materials. Further, while advantages associated with some embodiments of the technology have been described in the context of those embodiments, other embodiments may also exhibit such advantages, and not all embodiments need necessarily exhibit such advantages to fall within the scope of the technology. Accordingly, the disclosure and associated technology can encompass other embodiments not expressly shown or described herein.
Number | Name | Date | Kind |
---|---|---|---|
3243929 | Strandlund et al. | Apr 1966 | A |
3910374 | Holehouse | Oct 1975 | A |
3948346 | Schindler | Apr 1976 | A |
4084739 | Koltz et al. | Apr 1978 | A |
4235303 | Dhoore et al. | Nov 1980 | A |
4257998 | Diepenbrock, Jr. et al. | Mar 1981 | A |
4265955 | Harp et al. | May 1981 | A |
4594120 | Bourland, Jr. et al. | Jun 1986 | A |
4687691 | Kay | Aug 1987 | A |
4910065 | McKinney | Mar 1990 | A |
4971746 | Ferrer | Nov 1990 | A |
5080306 | Porter et al. | Jan 1992 | A |
5362527 | Harpell et al. | Nov 1994 | A |
5445861 | Newton et al. | Aug 1995 | A |
5455000 | Seyferth | Oct 1995 | A |
5460864 | Heitkamp | Oct 1995 | A |
5460865 | Tsotsis | Oct 1995 | A |
5575402 | Botsolas | Nov 1996 | A |
5604010 | Hartz et al. | Feb 1997 | A |
5662761 | Middelman et al. | Sep 1997 | A |
5685940 | Hopkins et al. | Nov 1997 | A |
5784919 | Mattson | Jul 1998 | A |
5785919 | Wilson | Jul 1998 | A |
5830548 | Andersen et al. | Nov 1998 | A |
5895699 | Corbett et al. | Apr 1999 | A |
6114652 | Clarke et al. | Sep 2000 | A |
6180206 | Kain, Jr. | Jan 2001 | B1 |
6182787 | Kraft et al. | Feb 2001 | B1 |
6235655 | Jozaki | May 2001 | B1 |
6509081 | Diamond | Jan 2003 | B1 |
6871725 | Johnson | Mar 2005 | B2 |
7197852 | Grillos | Apr 2007 | B2 |
7434659 | Ayle | Oct 2008 | B2 |
7785098 | Appleby et al. | Aug 2010 | B1 |
7998389 | Burchett et al. | Aug 2011 | B2 |
8282040 | Westman et al. | Oct 2012 | B1 |
8375839 | Landi | Feb 2013 | B2 |
8408358 | Hermiller et al. | Apr 2013 | B1 |
8475894 | Noble et al. | Jul 2013 | B2 |
8491743 | Pham et al. | Jul 2013 | B2 |
8511429 | Yu et al. | Aug 2013 | B1 |
8696843 | Dean | Apr 2014 | B1 |
8720817 | Kismarton et al. | May 2014 | B1 |
9079674 | Grillos et al. | Jul 2015 | B1 |
9469418 | Grillos | Oct 2016 | B1 |
11148204 | Colin | Oct 2021 | B2 |
20010015157 | Neal | Aug 2001 | A1 |
20020070077 | Porte et al. | Jun 2002 | A1 |
20040067364 | Ishikawa et al. | Apr 2004 | A1 |
20040156478 | Appleby et al. | Aug 2004 | A1 |
20050097892 | Carper | May 2005 | A1 |
20060067364 | Jung | Mar 2006 | A1 |
20060108058 | Chapman et al. | May 2006 | A1 |
20060188696 | Grose et al. | Aug 2006 | A1 |
20070238379 | Bhatnagar et al. | Oct 2007 | A1 |
20080179448 | Layland et al. | Jul 2008 | A1 |
20080256960 | Greason et al. | Oct 2008 | A1 |
20090263627 | Hand et al. | Oct 2009 | A1 |
20100078985 | Mahoney et al. | Apr 2010 | A1 |
20100170746 | Restuccia et al. | Jul 2010 | A1 |
20100243803 | Westre et al. | Sep 2010 | A1 |
20100243903 | Fahr et al. | Sep 2010 | A1 |
20100276545 | Chavagnac et al. | Nov 2010 | A1 |
20110012290 | Burchett et al. | Jan 2011 | A1 |
20110133025 | Vauchel et al. | Jun 2011 | A1 |
20110189440 | Appleby et al. | Aug 2011 | A1 |
20120037449 | Ayle | Feb 2012 | A1 |
20120174748 | Landi | Jul 2012 | A1 |
20140077037 | Hand | Mar 2014 | A1 |
20140165361 | Stulc et al. | Jun 2014 | A1 |
20170342549 | Kashyap | Nov 2017 | A1 |
20190299290 | Kuhns | Oct 2019 | A1 |
Number | Date | Country |
---|---|---|
10058339 | Jun 2002 | DE |
1340316 | Sep 2003 | EP |
WO-2009032585 | Mar 2009 | WO |
Entry |
---|
U.S. Appl. No. 17/555,035, filed Dec. 17, 2021, Song et al. |
Jacques Valverde—Thierry Pichon, “From IXV To Space Rider: CMC Thermal Protection System Evolutions,” Ariane Group, HT-CMC/10th, Bordeaux, Sep. 22-26, 2019, 14 pages. |
Number | Date | Country | |
---|---|---|---|
20230075051 A1 | Mar 2023 | US |