Patent Grant
10714874
Embodiments of the disclosure relate generally to communication cables and, more particularly, to methods for manufacturing continuous shield structures including fusible elements for use in communication cables.
As the desire for enhanced communication bandwidth escalates, transmission media need to convey information at higher speeds while maintaining signal fidelity and avoiding crosstalk, including alien crosstalk. However, effects such as noise, interference, crosstalk, alien crosstalk, and/or alien equal-level far-end crosstalk (“ELFEXT”) can strengthen with increased data rates, thereby degrading signal quality or integrity. For example, when two cables are disposed adjacent to one another, data transmission in one cable can induce signal problems in the other cable via crosstalk interference.
One approach to addressing crosstalk between communication cables is to circumferentially encase one or more conductors in a shield. Certain shields are designed as discontinuous or segmented shields that include separate patches of metallic material formed on a dielectric material. However, current segmented shield designs are typically manufactured by applying a continuous metallic layer to a dielectric layer, and then either “kiss-cutting” or etching gaps or spaces through the metallic layer. In a kiss-cutting process, the metallic layer is cut with a blade or laser without also penetrating or cutting the dielectric layer, and small sections of the metallic layer are removed. This is a relatively expensive process that requires special tooling and processing expertise. In an etching process, an acid or other agent is utilized to selectively remove portions of the metallic layer in order to form gaps or spaces. These conventional manufacturing processes are typically time-consuming, resulting in slower processing line speeds and an overall higher cost. For example, certain conventional discontinuous shield manufacturing processes typically operate at line speeds of approximately fifteen meters per minute. As a result of the relatively slow processing speeds, the discontinuous shields cannot be integrated into cables in an in-line manner.
Other shields are formed as continuous shields, such as a flexible metallic tube or a foil that coaxially surrounds the cable's conductors. However, complications can arise when a shield is electrically continuous between the two ends of the cable. The continuous shield can inadvertently carry voltage and current along the cable, for example from one terminal device at one end of the cable towards another terminal device at the other end of the cable. Signals carried along the shield can damage equipment connected to a cable and, in some cases, may pose a shock hazard. Loop currents that develop on the shields can also interfere with signals transmitted by the cable.
Accordingly, there is an opportunity for improved continuous shields that include fusible elements that break down in the event that a sufficient current is present on the shield. There is additionally an opportunity for improved methods, techniques, and/or systems for forming or manufacturing continuous shield structures that include fusible elements. There is additionally an opportunity for improved shield manufacturing methods and/or systems that may be carried out in a relatively faster and cost-effective manner and/or in-line with a cable assembly process.
The detailed description is set forth with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items; however, various embodiments may utilize elements and/or components other than those illustrated in the figures. Additionally, the drawings are provided to illustrate example embodiments described herein and are not intended to limit the scope of the disclosure.
Various embodiments of the present disclosure are directed to methods, techniques, and/or systems for manufacturing or otherwise forming shield structures for use in conjunction with cables. In certain example embodiments, a base layer of dielectric material may be provided, and a layer of electrically conductive or shielding material may be formed on the base layer. For example, an electrically conductive layer may be adhered to a base layer, deposited on a base layer, or otherwise formed on a base layer. The base layer and the electrically conductive layer may extend in a longitudinal direction. In certain embodiments, the base layer may have a first width that is greater than a second width of the electrically conductive layer. In other embodiments, the base layer and the electrically conductive layer may have approximately equal widths.
Once an electrically conductive layer has been formed on a base layer, a plurality of longitudinally spaced gaps or holes may be formed through the electrically conductive layer and the base layer. One or more gaps or holes may be formed at each of a plurality of longitudinally spaced locations. Each gap may span partially across the width of the electrically conductive layer. Additionally, at each of the plurality of longitudinally spaced locations, the one or more respective gaps may result in the formation of one or more fusible elements of the electrically conductive material spanning between an adjacent set of longitudinally spaced segments of the electrically conductive material.
The fusible element(s) formed between two longitudinally spaced segments of electrically conductive material may provide electrical continuity between the longitudinally spaced segments of electrically conductive material, thereby resulting in the shield structure being electrically continuous along its longitudinal length. In the absence of the fusible elements (i.e., if the gaps were formed across an entire width of the electrically conductive material), the longitudinally spaced segments would be electrically discontinuous segments. Additionally, one or more of the fusible elements may be configured to fuse or break down in the event that a fusing current is applied to the shield structure. Once a fusible element has fused, the electrical continuity between the two longitudinally spaced segments connected by the fusible element may be severed. As a result, the two longitudinally spaced segments may be discontinuous, thereby preventing a current or voltage signal from propagating along the longitudinal length of the shield structure between the two segments.
Any number of gaps may be formed as desired at a given longitudinally spaced location. Further, gaps may be formed with a wide variety of suitable dimensions (e.g., lengths across a widthwise direction of the shield structure, gap widths spanning along a longitudinal length of the shield structure, etc.) and/or at a wide variety of suitable angles. For example, gaps may be formed to span across a widthwise direction of the shield structure (e.g., partially across a width of the electrically conductive material, etc.) at an angle that is perpendicular to a longitudinal direction. As another example, gaps may be formed diagonally across a widthwise direction or at angles that are not perpendicular to the longitudinal direction. Gaps may also be formed with a wide variety of suitable shapes, such as rectangular shapes, shapes that include at least one curve or arc, and/or shapes that result in the gaps widening and/or tapering along a widthwise direction and/or a longitudinal direction.
The fusible element(s) formed at each longitudinally spaced location may have dimensions and are shapes defined by the one or more corresponding gaps at the longitudinally spaced location. Given the multitude of different gap dimensions that may be formed, a fusible element may also be formed with a wide variety of suitable lengths, widths, shapes, and/or other dimensions. Additionally, a fusible element may be formed with dimensions that facilitate the fusible element fusing or break down based upon a wide variety of current and/or other signals being present on, transmitted through, or introduced to the fusible element. For example, the fusible element may have a minimum fusing current between approximately 0.001 and approximately 0.500 amperes. Additionally, a fusible element may be configured to fuse or break down within a wide variety of suitable time frames. For example, a fusible element may have a maximum time period to break down or fusing that is equal to 0.434 divided by the minimum fusing current (in amperes) to the power or exponent 1.213. In various embodiments, the fusing or break down of a fusible element may be based at least in part upon the material utilized to form the fusible element, a cross-sectional area of the fusible element, a current present on the fusible element, and/or a period of time for which the current is present.
A wide variety of suitable methods or techniques may be utilized in order to form gaps or spaces. In certain embodiments, one or more suitable punches, blades, cutting implements, or other suitable cutting means may be utilized to form gaps or spaces. In other embodiments, one or more lasers may be utilized to form gaps or spaces. As desired, gaps or spaces may be formed in a single shield structure or concurrently in a plurality of shield structures. Additionally, in certain embodiments, a shield structure may be incorporated into a cable or formed into a cable component. As a result of forming gaps or spaces through both an electrically conductive layer and a base layer, a continuous shield structure may be formed in a relatively faster, more efficient, and/or cost-effective manner than conventional shield structures. For example, a shield structure may be formed at line speeds of between approximately ten (10) meters per minute and approximately 100 meters per minute. These increased processing speeds permit overall cost to be reduced. Additionally, these increased speeds permit easier incorporation of shield structures into cables in an in-line process (i.e., without taking up a shield structure between manufacture of the structure and cable assembly).
Additionally, as a result of forming continuous shield structures that include one or more fusible elements, a continuous shield structure may be provided that does not need to be grounded on either end. In the event that a potentially dangerous current or charge is present on the shield structure, one or more fusible elements may break down or fuse, thereby severing the electrical continuity of the shield structure. Accordingly, the fusible elements may limit or prevent damage to equipment connected to a cable incorporating the shield structure. In certain embodiments, use of fusible elements may also reduce or limit shock hazards resulting from potentially dangerous currents present on the shield structure.
Embodiments of the disclosure now will be described more fully hereinafter with reference to the accompanying drawings, in which certain embodiments of the disclosure are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
Example Systems for Forming Shield Structures
Turning first to
The electrically conductive material 107 and at least a base layer of dielectric material 112 may be fed through the system 100 to an accumulation point 120 at which they are joined together. In other words, the electrically conductive material 107 may be applied to or formed on a base layer of dielectric material 112. In certain embodiments, one or more suitable devices or components 125A, 125B may apply pressure to the electrically conductive material 107 and the base dielectric material 112 in order to bond or otherwise affix the two layers of material to one another. For example, one or more pressure rollers, spring-mounted rollers, or other suitable components may press the two layers of material together.
In certain embodiments, the base layer of dielectric material 112 may have a first width, and the electrically conductive material 107 may have a second width that is less than the first width. When the electrically conductive material 107 is formed on the base layer 112, the base layer 112 may extend beyond the electrically conductive material 107 along one or both edges in a width dimension. In certain embodiments, the electrically conductive material 107 may be approximately centered on the base layer 112 in a width dimension, and the base layer 112 may extend beyond the electrically conductive material 107 along both edges. In other embodiments, the base layer of dielectric material 112 and the electrically conductive material 107 may have widths that are approximately equal. In other words, the electrically conductive material 107 may span across the base layer of dielectric material 112 in a widthwise direction.
The base layer of dielectric material 112 may be positioned on one side of the electrically conductive material 107. As illustrated, the base layer 112 is positioned below or on a bottom side of the electrically conductive material 107; however, in other embodiments, the base layer 112 may be positioned above or on a top side of the electrically conductive material 107. In certain embodiments, an additional layer of dielectric material 117 may be positioned or situated on an opposite side of the electrically conductive material 107. In other words, the electrically conductive material 107 may be sandwiched between two layers 112, 117 of dielectric material. As shown in
In certain embodiments, the electrically conductive material 107 may be adhered to the base layer of dielectric material 112 and, if provided, an additional “sandwiching” layer of dielectric material 117. A wide variety of suitable adhesives may be utilized to adhere layers together, such as for example, pressure sensitive adhesives, contact adhesives, hot melt adhesives, heat-sensitive adhesives, etc. In certain embodiments, one or more adhesive application components 130A, 130B may be configured to apply adhesive to the electrically conductive material 107 and/or to one or more layers of dielectric material 112 prior to the layers being brought into contact with one another. For example, one or more application components 130A, 130B may spray, wipe, or otherwise apply adhesive. In other embodiments, one or more layers of material (e.g., the electrically conductive material 107, etc.) may already include applied adhesive that is covered by one or more disposable layers, such as removable paper or film layers, and the one or more adhesive application components 130A, 1308 may be configured to remove the disposable layer(s). In yet other embodiments, the electrically conductive material 107 may be bonded to one or more layers of dielectric material 112 using other suitable techniques, such as mechanical fasteners, welding, heated fusion, etc.
As desired in certain embodiments, the electrically conductive material 107 may be sandwiched between two layers of dielectric material 112, 117, and the two layers of dielectric material 112, 117 may be adhered or otherwise bonded together along their edges (i.e., the widthwise edges that extend beyond the electrically conductive material 107). For example, the two layers of dielectric material 112, 117 may be bonded together using one or more suitable adhesives (e.g., pressure sensitive adhesives, etc.), ultrasonic welding, mechanical fasteners, and/or other suitable techniques.
Although the system 100 illustrates the provision of electrically conductive material 107 in the form of a tape layer, electrically conductive material may be provided on a base dielectric layer 112 utilizing a wide variety of other suitable equipment and/or processing techniques. In various example embodiments, electrically conductive material may be painted, printed, sprayed, extruded, or vapor deposited onto a base dielectric layer 112. For example, liquid metal may be painted, sprayed, extruded or otherwise deposited onto a base dielectric layer 112.
In certain embodiments, such as embodiments in which electrically conductive material 107 has a smaller width than a base dielectric layer 112, one or more strength members may additionally be incorporated into a shield structure. As shown in
With continued reference to
In certain embodiments, a single gap formation tool 145 may be utilized. As a shield structure 147 is fed downstream through the system 100, the gap formation tool 145 may form gaps at different points along the longitudinal length of the shield structure 147. In other embodiments, a plurality of gap formation tools 145 may be utilized. In this regard, a plurality of gaps and/or different types of gaps may be formed in a shield structure 147. For example, in certain embodiments and explained in greater detail below with reference to
A gap formation tool 145 may be configured to form one or more gaps having a wide variety of shapes, dimensions, and/or sizes. According to an aspect of the disclosure, one or more gaps may be formed with a suitable dimension (e.g., a length, etc.) that spans partially across a widthwise dimension of the electrically conductive layer 107 incorporated into a shield structure 147. As a result of forming one or more gaps at a given location along the longitudinal length of the shield structure 147, the electrically conductive layer 107 may be divided into one or more spaced segments, patches, or sections. Additionally, one or more fusible elements may span between each adjacent pair or set of segments or patches. The fusible elements may electrically connect the adjacent sets or pairs of longitudinally spaced segments of electrically conductive material. In certain embodiments, a single gap may be formed at a given longitudinally spaced location, and the gap may result in the removal of electrically conductive material such that one (e.g., a fusible element at or near one widthwise edge of the electrically conductive material) or a plurality (e.g., respective fusible elements at opposite widthwise edges of the electrically conductive material) of fusible elements are formed. In other embodiments, a plurality of gaps may be formed at a given longitudinally spaced location such that one or a plurality of fusible elements are formed between adjacent segments or patches.
A gap may also be formed with any suitable width or size along a longitudinal direction of a shield structure 147. The width or longitudinally extending size of a gap may define a spacing between two adjacent segments of electrically conductive material within the shield structure 147. In certain embodiments, the width of a gap may also define a longitudinal length of a fusible element. In other embodiments, a fusible element may be formed with a length that is longer than that of the gap width. For example, a fusible element may extend between two segments of electrically conductive material at an angle relative to a longitudinal direction. As another example, a fusible element may include one or more curves, arcs, or bends as it extends between two segments of electrically conductive material. Examples of suitable gap widths include, but are not limited to, widths of 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 3.5, 4.0, 4.5, 5.0, 6.0, 7.0, 8.0, 9.0, 10, 12, 15, or 20 millimeters, widths included in a range between any two of the aforementioned values, or widths included in a range bounded on either a minimum or maximum end by one of the aforementioned values. In certain embodiments, a fusible element may span across a gap that is large enough to prevent current from arcing across the gap once the fusible element has fused or broken down.
A gap or a plurality of gaps may be formed at a wide variety of suitable angles relative to the longitudinal direction of a shield structure 147. For example, a gap may be formed at a perpendicular angle relative to the longitudinal direction. In other words, the gap may be formed directly across a width dimension of a shield structure 147. As another example, a gap may be formed at any suitable angle such that is extends diagonally across the width dimension of a shield structure 147. For example, a gap may be formed at an angle between zero degrees and between ninety degrees relative to the longitudinal direction of the shield structure, such as an angle of approximately 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, or 85 degrees, or at any angle included in a range between two of the aforementioned values. In various embodiments, each of a plurality of gaps may be formed at approximately the same angle relative to the longitudinal direction or, alternatively, at least two gaps may be formed at different angles.
As desired in various embodiments, a wide variety of suitable spacings may exist between gaps (or longitudinally adjacent sets of gaps) along a longitudinal direction of a shield structure 147. In other words, spaced electrically conductive segments or patches of material formed between gaps and connected by fusible elements may have any suitable longitudinal lengths. In certain embodiments, the longitudinal length of each segment may be approximately equal. In other embodiments, at least two segments may have varying longitudinal lengths. In the event that segment lengths are varied, the length may vary in accordance with a predetermined pattern or, alternatively, at random. In various embodiments, the segments may have longitudinal lengths of about 0.03, 0.05, 0.1, 0.3, 0.5, 0.75, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, or 5.0 meters or in a range between any two of these values. As desired, the dimensions of the electrically conductive segments can be selected to provide electromagnetic shielding over a specific band of electromagnetic frequencies or above or below a designated frequency threshold. For example, in the event that the segments are approximately two meters in length or greater, a return loss spike for a twisted pair cable may be formed within the operating frequency of the cable. However, the amplitude of the return loss spike may satisfy electrical performance requirements for the cable (i.e., fall within acceptable limits), thereby permitting higher signal frequencies to be supported by the cable.
Additionally, each of the longitudinally spaced segments may have any suitable width. In certain embodiments, each segment may have equal or approximately equal widths. In other embodiments, at least two segments may have different widths. Further, in certain embodiments, one or more segments of the electrically conductive material 107 may have widths that span across or approximately across (e.g., with a narrow space of dielectric material present on one or both sides) the width of an underlying base layer 112. In other words, the longitudinally spaced segments may span across or substantially across the base layer 112 in a widthwise direction or dimension perpendicular to the longitudinal direction. In other embodiments, one or more segments may have widths that are less than that of the base dielectric layer 112. For example, the base layer 112 may extend beyond the electrically conductive material 107 at one or both widthwise edges. In yet other embodiments, one or more segments may have widths that are substantially smaller than that of the underlying base layer 112. For example, a shield structure may be formed with two or more parallel rows of longitudinally spaced segments of electrically conductive material 107, and the two or more rows may be spaced along a widthwise dimension of the base layer 112. Each of the one or more rows of longitudinally spaced segments may include respective fusible elements.
A gap or a plurality of gaps may also be formed with a wide variety of suitable shapes and/or other dimensions. For example, gaps may be formed with rectangular shapes, shapes that include at least one curve or arc, and/or shapes that result in the gaps widening and/or tapering along a widthwise and/or longitudinal direction. According to an aspect of the disclosure, the fusible element(s) formed at each longitudinally spaced location between adjacent segments of electrically conductive material 107 may have dimensions and are shapes defined by the one or more corresponding gaps at the longitudinally spaced location. Given the multitude of different gap dimensions that may be formed, a fusible element may also be formed with a wide variety of suitable lengths, widths, shapes, and/or other dimensions. A few example shapes and/or configurations of fusible elements are described in greater detail below with reference to
Additionally, a fusible element may be formed with a wide variety of suitable dimensions, such as any suitable lengths, widths, cross-sectional areas, and/or other dimensions. In certain embodiments, a length of a fusible element may correspond to or incorporate the sections of one or more tapered portions of spaced segments of electrically conductive material 107 that will fuse with a desired minimum fusing current. For example, gaps may be formed such that one or both segments included in an adjacent pair of spaced segments may taper as they approach one another. The tapering may result in progressively less electrically conductive material. The fusible element may begin at a point in which the electrically conductive material becomes small enough to fuse with a desired minimum fusing current. Accordingly, in certain embodiments, the fusible element may be formed as part of one or more spaced segments. For example, the fusible element may be formed at or proximate to a narrowest point of one or more tapering portions of spaced segments. In other embodiments, a fusible element may extend from the end of a narrowest point of a tapered portion of a spaced segment towards an adjacent spaced segment.
In other embodiments, one or more gaps may be formed in order to provide a separation distance between an adjacent pair of segments, and one or more fusible elements may extend across the separation distance. In certain embodiments, a length of a fusible element may be approximately equal to the longitudinal gap or spacing formed between two adjacent spaced segments. For example, a fusible element may extend across a gap in a longitudinal direction between two adjacent spaced segments. In yet other embodiments, a length of a fusible element may be greater than the longitudinal length of a gap or spacing formed between two adjacent spaced elements. For example, a fusible element may extend across a gap at an angle relative to the longitudinal direction, in a direction that includes one or more curves or arcuate portions, or in a fashion that includes one or more changes of directions. In certain embodiments, a longer length of a fusible element may increase the likelihood of the fusible element fusing in the event that a fusing current is applied. A longer length results in current applied to the shield structure 147 propagating over a longer distance, thereby enhancing likelihood of fusing or break down.
In certain embodiments, a minimum fusing current for a fusible element may be based at least in part on the cross-sectional area of the fusible element. The cross-sectional area of the fusible current may be based at least in part upon a width, thickness, and/or other dimensions of the fusible element. As desired, one or more dimensions of a fusible element may be selected and/or formed via gaps in order to result in the fusible element having a desired minimum fusing current. Further, the one or more dimensions of the fusible element may also be based at least in part upon the material utilized to form the fusible element. In certain embodiments, a fusible element may have a constant width, cross-sectional area, and/or other dimensions across its length. In other embodiments, a fusible element may have a width, thickness, and/or a cross-sectional area that is varied across its length. For example, a fusible element that is formed from parts of one or more tapering or narrowing portions of spaced segment may have a width that varies across its length (e.g., a width that narrows with a tapering section of a first segment and then widens with a tapering section of an adjacent second segment, etc.).
A fusible element may be formed or designed to have a wide variety of suitable minimum fusing currents. In certain embodiments, a fusible element may have a minimum fusing current between approximately 0.001 and approximately 0.500 amperes. In various embodiments, a fusible element may have a minimum fusing current of 0.001, 0.005, 0.010, 0.020, 0.030, 0.040, 0.050, 0.075, 0.10, 0.125, 0.15, 0.175, 0.20, 0.25, 0.30, 0.35, 0.40, 0.45, or 0.50 amperes, or a minimum fusing current included in a range between any two of the above values. Additionally, a fusible element may be configured to fuse or break down within a wide variety of suitable time frames. For example, a fusible element may have a maximum time period to break down or fusing defined by equation one (1) below:
TF=0.0434/(CF1.213) (1)
where TF is the maximum time period until fusing or break down and CF is the minimum fusing current.
In various embodiments, the fusing or break down of a fusible element may be based at least in part upon several different factors including, but not limited to, the material(s) utilized to form the fusible element, a cross-sectional area of the fusible element, a current present on the fusible element, and/or a period of time for which the current is present. As desired, one or more materials utilized to form the electrically conductive layer 107 and one or more fusible elements and/or one or more dimensions of the fusible element (e.g., a width, a thickness, a cross-sectional area, etc.) may be selected in order to attain a desired minimum fusing current and/or maximum time until fusing.
Once longitudinally spaced gaps and/or combinations of gaps are formed in the shield structure 147, one or more respective fusible elements may span between or provide electrical continuity between each set of longitudinally adjacent spaced sections of electrically conductive material. A fusible element may be configured to fuse or break down in the event that a threshold current is present on, transmitted through, or introduced to the fusible element. Once the one or more fusible elements spanning between a set of adjacent spaced segments have fused or broken down, the electrical continuity between the segments may be severed, thereby preventing an electrical current from propagating longitudinally along the shield structure. As a result, the fusible elements may function as a safety mechanism for equipment connected to the cable 100 and/or may reduce or limit the shock hazard of the shield structure. Accordingly, a continuous shield layer 147 may be provided that does not need to be grounded on either end. As desired, the minimum fusing current of a fusible element may be based at least in part on equipment tolerances and/or safety standards.
As set forth above, the gap formation tool(s) 145 may be configured to form a wide variety of suitable gap configurations. Additionally, in certain embodiments, the gap formation tool(s) 145 and other components of the system 100 may be configured to operate at line speeds of at least approximately ten (10) meters per minute. For example, the system 100 may operate at line speeds between approximately 10 meters per minute and approximately 100 meters per minute. In various embodiments, the system 100 may operate at a line speed of approximately, 10, 20, 25, 30, 40, 50, 60, 70, 75, 80, 90, or 100 meters per minute, or at a line speed included in a range between two of the above values, or at a line speed included in a range that is bounded on either a minimum or maximum end by one of the above values. In certain embodiments, one or more accumulators 150A, 150B may be incorporated into the system 100. For example, one or more accumulators 150A. 150B may optionally be positioned upstream and/or downstream of the gap formation tool(s) 145. The accumulator(s) 150A, 150B may be configured to temporarily collect the shield structure 147 as it is fed downstream through the gap formation tool(s) 145. In this regard, the shield structure 147 may be momentarily slowed or stopped in order to more accurately or precisely form each gap.
With continued reference to
A wide variety of other components and/or devices may be incorporated into the system 100 as desired in various embodiments. For example, any number of rollers and/or dancers, such as the illustrated rollers 160, may be utilized to pull or otherwise advance materials (e.g., electrically conductive material 107, dielectric layers 112, 117, strength members, the shield structure 147, etc.) through the system 100. Any number of motors or other drive components may be utilized to power various components of the system 100 and/or to control line speed. As desired, the motors may be collectively or independently controlled by any number of suitable computing and/or control devices. In certain embodiments, the system 100 may additionally include one or more printing components or devices that are configure to print alphanumeric characters (e.g., text, a company name, etc.) and/or logos onto a shield structure 147. As desired, one or more optical recognition components may be utilized to identify the gaps or spaces in the shield structure 147 in order to facilitate printing between the gaps.
However, in contrast to the system 100 of
As shown in
With continued reference to
With continued reference to
As desired, one or more components of the system 200 may be synchronized with one or more components of a cable assembly system. For example, a line speed of a system 200 that assembles or manufactures a shield structure may controlled such that it is approximately equal to the line speed of a system 200 that assembles cable. In this regard, a shield structure may be manufactured and fed into a cable assembly process in a continuous manner. The systems and methods described herein for manufacturing shield structures permit line speeds that are greater than those of conventional processes utilized to form certain shield structures (e.g., discontinuous shield structures, etc.). These increased line speeds may facilitate the synchronization of a shield structure manufacturing process and a cable assembly process.
Turning now to
With reference to
Similarly, the second subsystem 310 may include a source 345 of electrically conductive material 347 and a source 350 of a base dielectric material 355. The electrically conductive material 347 and the base dielectric material 352 may be fed to an accumulation point 355 at which they are joined together. As desired, one or more pressure devices 360A, 360B may press the electrically conductive material 347 and the base dielectric material 352 together. Additionally, one or more suitable devices 365 may apply adhesive or remove a disposable layer prior to the electrically conductive material 347 and the base dielectric material 352 being pressed together. Other components may be added at the accumulation point 355 as desired, such as one or more strength members. Longitudinally spaced gaps or holes may then be formed in the combined electrically conductive material 347 and base dielectric material 352 by one or more gap formation tools 370.
The outputs of the first subsystem 305 and the second subsystem 310 may be fed downstream to an accumulation point 375 at which they are joined together. In this regard, an overall shield structure may be formed that includes a plurality of dielectric layers and a plurality of layers of electrically conductive material. As desired, one or more pressure devices 380A, 380B may press the two substructures together. Additionally, one or more suitable devices 355 may apply adhesive or remove a disposable layer prior to the two substructures being pressed together. Alternatively, the two substructures may be bonded together utilizing other suitable components and/or techniques, such as mechanical fasteners or ultrasonic welding. Additionally, other components may be added at the accumulation point 375 as desired, such as one or more strength members. Following formation of the overall shield structure, the structure may be taken up for subsequent incorporation into a cable as illustrated in
In certain embodiments, the gaps or holes formed in a first substructure may be longitudinally offset from the gaps or holes formed in a second substructure when the overall shield structure is formed. In other words, electrically conductive material included in the second substructure may cover any gaps or spaces formed through the electrically conductive material of the second substructure. In the event that electrical signals leak through one of the substructures, the other substructure may perform a shielding function. The presence of multiple layers of electrically conductive material may further provide enhanced shielding relative to shields with a single layer of electrically conductive material. In certain embodiments, multiple layers of electrically conductive material may also contribute to improved cable burn performance. Although the system 300 of
The system 400 may include one or more sources 405 of electrically conductive material 407 and one or more sources of dielectric material, such as a source 410 of a base dielectric material 412 and an optional source 415 of a “sandwiching” layer of dielectric material 417. The electrically conductive material 407 and the layer(s) 412, 417 of dielectric material may be fed to an accumulation point 420 at which they are joined together. As desired, one or more pressure devices 4250A, 425B may press the electrically conductive material 407 and the layer(s) 412, 417 of dielectric material together.
In contrast to the systems 100, 200, 300 of
With reference to
As an alternative to cutting or slitting the electrically conductive material 407, in other embodiments, a plurality of sources of electrically conductive material may be provided. Each source may provide electrically conductive material that is fed to the accumulation point to be joined with the base dielectric layer. In yet other embodiments, other suitable techniques may be utilized to form a plurality of longitudinally extending parallel layers of electrically conductive material on a base dielectric layer. For example, a plurality of electrically conductive layers may be formed in parallel utilizing electrically conductive paint, extrusion, or vapor deposition.
As desired in various embodiments, any number of strips of electrically conductive material may be formed or otherwise provided. For example, between approximately two and approximately ten strips of electrically conductive material may be formed. In various embodiments, approximately 2, 3, 4, 5, 6, 7, 8, 9, 10, or any number of strips included in a range between two of the previous values may be provided. In the example system 400 illustrated in
With continued reference to
Following the formation of gaps or holes in the shield structure 442, the shield structure 442 may be fed to one or more suitable cutting or slitting devices 455 configured to cut the shield structure 442 into a plurality of separate structures. In certain embodiments, the shield structure 442 may be cut along its longitudinal length between the parallel strips of electrically conductive material. In other words, the base dielectric layer 412 of the shield structure 442 may be slit along one or more longitudinally extending lines that are situated between strips of electrically conductive material. In this regard, a plurality of individual shield structures may be manufactured concurrently and then separated from one another after the formation of gaps or holes (and, in certain embodiments, after the incorporation of other elements, such as a “sandwiching” layer added after the formation of gaps). As shown in
The systems 100, 200, 300, 400 described above with reference to
Example Continuous Shield Structures
According to an aspect of the disclosure, continuous shield structures may be formed that include longitudinally spaced gaps or spaces through both a layer of electrically conductive material and a base layer of dielectric material. A wide variety of different types of continuous shield structures may be manufactured or formed as desired. For example, different types of continuous shield structures may be formed by each of the systems 100, 200, 300, 400 described above with reference to
As desired, the base dielectric layer 505 may be formed from or formed substantially from one or more dielectric materials. A wide variety of suitable dielectric materials may be utilized including, but not limited to, paper, various plastics, one or more polymeric materials, one or more polyolefins (e.g., polyethylene, polypropylene, etc.), one or more fluoropolymers (e.g., fluorinated ethylene propylene (“FEP”), melt processable fluoropolymers, MFA, PFA, polytetrafluoroethylene, ethylene tetrafluoroethylene (“ETFE”), ethylene chlorotrifluoroethylene (“ECTFE”), etc.), one or more polyesters, polyimide, polyvinyl chloride (“PVC”), one or more flame retardant olefins (e.g., flame retardant polyethylene (“FRPE”), flame retardant polypropylene (“FRPP”), a low smoke zero halogen (“LSZH”) material, etc.), polyurethane, neoprene, cholorosulphonated polyethylene, flame retardant PVC, low temperature oil resistant PVC, flame retardant polyurethane, flexible PVC, or any other suitable material or combination of materials. As desired, one or more foamed materials may be utilized to form the first portion. Indeed, the first portion may be filled, unfilled, foamed, un-foamed, homogeneous, or inhomogeneous and may or may not include one or more additives (e.g., flame retardant and/or smoke suppressant materials).
The base dielectric layer 505 may also be formed with a wide variety of suitable dimensions. For example, the base dielectric layer 505 may have any suitable width “W1”. In certain embodiments, the width “W1” may be determined based at least in part upon a desired cable component (e.g., a shield, a separator, etc.) to be formed from a shield structure. In other embodiments, the width “W1” may be determined based at least in part upon a desired number of shield structures to be formed utilizing a single base dielectric layer 505. In certain example embodiments, the base dielectric layer 505 may have a width “W1” between approximately five (5) mm and approximately thirty (30) mm. For example, the base dielectric layer 505 may have a width of approximately 5, 10, 15, 20, 25, or 30 mm, a width included in a range between two of the above values, or a width included in a range that is bounded at either a minimum or maximum end by one of the above values. Additionally, the base dielectric layer 505 may be formed with any suitable thickness. For example, the base dielectric layer 505 may have a thickness between approximately 10 micrometers (μm) and approximately 75 μm.
Additionally, the electrically conductive material 510 may be formed with a wide variety of suitable constructions and/or dimensions. For example, the electrically conductive material 510 may have any suitable width “W2”. In certain embodiments, the width “W2” may be determined based at least in part upon a desired cable component (e.g., a shield, a separator, etc.) to be formed from a shield structure. In various example embodiments, the electrically conductive material 510 may have a width “W2” between approximately 3 mm and approximately 25 mm or between approximately 3 mm and approximately 30 mm. For example, the electrically conductive material 510 may have a width of approximately 3, 5, 10, 12, 15, 18, 20, 22, 25, or 30 mm, a width included in a range between two of the above values, or a width included in a range that is bounded at either a minimum or maximum end by one of the above values. Additionally, the electrically conductive material 510 may be formed with any suitable thickness. For example, the electrically conductive material 510 may have a thickness between approximately 12.7 microns (0.5 mils) and approximately 76.2 microns (3.0 mils), such as a thickness between approximately 25.4 microns (1.0 mils) and approximately 76.2 microns (3.0 mils). In some applications, cable signal performance may benefit from a thickness that is greater than about 50.8 microns (2 mils). A greater thickness may limit negative insertion loss characteristics.
The electrically conductive material 510 may also be formed from a wide variety of suitable materials and/or combinations of materials. Examples of suitable electrically conductive materials include, but are not limited to, metallic materials (e.g., silver, copper, nickel, steel, iron, annealed copper, gold, aluminum, etc.), metallic alloys, conductive composite materials, etc. Indeed, suitable electrically conductive materials may include any material having an electrical resistivity of less than approximately 1×10−7 ohm meters at approximately 20° C. In certain embodiments, an electrically conductive material may have an electrical resistivity of less than approximately 3×10−8 ohm meters at approximately 20° C. In certain embodiments, the electrically conductive material 510 may be formed as a foil layer, such as a metallic foil layer. In other embodiments, the electrically conductive material 510 may be formed as a metallic screen. In yet other embodiments, electrically conductive material 510 may be extruded, sprayed, or otherwise deposited on the base dielectric layer 505.
The gaps 515A, 515B may be formed with a wide variety of suitable shapes, sizes, and/or other dimensions. As shown in
Each gap 515A, 515B may also be formed with any suitable width “WG”, which defines the spacing between adjacent electrically conductive patches and/or a longitudinal length of a fusible element. A few example gap widths are described in greater detail above with reference to
Additionally, as described in greater detail above with reference to
As shown, the gaps 615A, 615B may be formed at an acute angle relative to the longitudinal direction. As desired, gaps 615A, 615B may be formed at any suitable angle, such as an angle of approximately 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, or 85 degrees, or at any angle included in a range between two of the aforementioned values. In certain embodiments, the acute angle may enhance electrically conductive patch-to-substrate adhesion. Additionally, the acute angle may facilitate the covering of opposing isolating spaces or gaps when a cable component, such as a shield layer, is formed from the structure 600. In certain embodiments, benefit may be achieved when the acute angle is about 45 degrees or less. In other embodiments, benefit may be achieved when the acute angle is about 35 degrees or less, about 30 degrees or less, about 25 degrees or less, about 20 degrees or less, or about 15 degrees or less. In other embodiments, benefit may be achieved when the acute angle is between about 12 and 40 degrees. Regardless of the angle at which a gap is formed, the gap may have a suitable length such that it spans across partially across a widthwise dimension of the shield element 600 to facilitate formation of one or more fusible elements.
In certain embodiments, continuous shield structures may be formed in which electrically conductive material is sandwiched between two layers of dielectric material.
During the formation of the shield structure 800 illustrated in
In certain embodiments, one or more strength members may be incorporated into a continuous shield structure.
Additionally, the base dielectric layer 1005 may have a width that is greater than that of the electrically conductive material 1010 such that the base dielectric layer 1005 extends beyond the electrically conductive material 1010 along one or both widthwise edge. One or more longitudinally extending strength members, such as strength members 1020A and 1020B, may be positioned within the overhanging regions of the base dielectric layer 1005. As illustrated, the base dielectric layer 1005 may extend beyond the electrically conductive material along both widthwise edges, and a respective strength member 1020A, 1020B may be positioned within each overhanging region. In other words, the strength members 1020A, 1020B may be positioned such that gaps or holes 1015A, 1015B are not formed through the strength members 1020A, 1020B or positioned over or under the strength members 1020A, 1020B. The strength members 1020A, 1020B may extend along the longitudinal direction of the structure 1000 parallel to the electrically conductive material 1010. Additionally, the strength members 1020A. 1020B may provide structural support to the shield structure 1000.
In other embodiments, a strength member may be positioned over a region of the electrically conductive material through which no gaps are formed, such as a region in which fusible elements are formed. As desired, the strength member may be adhered or otherwise affixed to the electrically conductive layer and/or held in place by a sandwiching layer of dielectric material (e.g., a layer of dielectric material formed over the electrically conductive material 110 opposite the base layer 1005).
As desired in various embodiments, shield structures may be formed with a plurality of layers of electrically conductive material. For example, gaps or holes formed through a first layer of electrically conductive material may be covered by electrically conductive material included in a second layer.
Once the two individual shield structures 1105, 1110 have been formed, the structures 1105, 1110 may be joined, bonded, or otherwise combined together in order to form an overall shield structure 1100, as illustrated by cross-section in
As described in greater detail above with reference to the system 400 of
The electrically conductive strips 1210A, 1210B, 1210C may extend along a longitudinal direction in parallel to one another. As shown, each of the strips 1210A, 1210B, 1210C may have widths that are approximately equal; however, in other embodiments, at least two strips may be formed with different widths. Additionally, in certain embodiments, adjacent strips may be spaced from one another along a widthwise dimension that is parallel to the longitudinal direction. In other words, a portion of the base layer 1205 may be present between each pair of adjacent strips along the widthwise dimension. With continued reference to
Once the shield structure 1200 illustrated in
In other embodiments, a single layer or strip of electrically conductive material may be formed on the base layer. A plurality of sets of longitudinally spaced gaps or holes may be formed through the electrically conductive material and the base layer. The structure may then be cut or slit along one or more longitudinal lines in order to form a plurality of continuous shield structures. Each of the continuous shield structures may have electrically conductive material that spans across a widthwise dimension of its underlying base layer. In other embodiments, the shield structures cut near opposite widthwise edges of the overall structure may have dielectric material that extends beyond the electrically conductive material along a single edge. Further, the gaps may be formed such that fusible elements extend between longitudinally adjacent segments of electrically conductive material within each of the plurality of continuous shield structures.
Regardless of the number of layers incorporated into a shield structure, a shield structure may be formed with a wide variety of suitable gap configurations and/or arrangements of fusible elements.
Turning to
Additionally, although
In certain embodiments, a shield structure may be formed with gaps that result in a plurality of longitudinally spaced segments of electrically conductive material with one or more fusible elements spanning across each longitudinal distance between segments formed by the gaps in order to provide electrical continuity between the spaced segments. As desired, a gap may be formed at any suitable angle between two spaced segments.
As shown in
In certain embodiments, a shield structure may include one or more fusible elements that extend between spaced segments in a direction that includes at least one curve or are. In other words, gaps including at least one curve or arc may be formed through the electrically conductive material to result in fusible elements having at least one corresponding curve or arc.
As set forth above, one or more benefits may be provided as a length of a fusible element is increased. It will be appreciated that a wide variety of different fusible elements may be formed between two spaced segments that include a length longer than the longitudinal length (or width in a longitudinal direction) of one or more gaps formed between the segments. These fusible elements may include any number of curves, bends, angles, and/or other direction variations that result in a longer length. For example,
A wide variety of other gap and/or fusible element configurations may be utilized as desired in a shield structure. These configurations may include any number of gaps and/or fusible elements that extend in a wide variety of suitable directions. Further, a shield structure may be formed that incorporates any suitable combination of the gap and/or fusible element configurations described above with reference to
Example Method for Forming Continuous Shield Structures
At block 1402, one or more base layers of dielectric material may be provided. For example, a base layer of dielectric material may be fed from a spool, bin, or other suitable source. A wide variety of suitable types of dielectric material may be provided as desired, such as a suitable plastic material or a suitable polymeric material. At bock 1404, one or more additional layers of material may optionally be provided. For example, one or more additional layers of dielectric material may be provided at block 1406, such as a “sandwiching” layer of dielectric material. As another example, one or more strength members, such as one or more strength yarns, may be provided at block 1408.
At block 1410, electrically conductive material may be formed on the base dielectric layer. A wide variety of suitable methods or techniques may be utilized to form electrically conductive material on the base dielectric layer. For example, at block 1412, one or more preformed electrically conductive layers, such as a metallic foil or a metal braid, may be provided. In certain embodiments, electrically conductive material may be supplied from one or more suitable spools, bins, or other sources. At block 1414, supplied electrically conductive material may optionally be cut or slit into a plurality of electrically conductive strips of material. The electrically conductive material or strips may then be adhered to, bonded to, or otherwise attached (e.g., attached with mechanical fasteners, etc.) to the base dielectric layer at block 1416. As desired, the electrically conductive material or strips may be “sandwiched” between two layers of dielectric material. As an alternative to forming an electrically conductive layer or strips from preformed electrically conductive material, an electrically conductive layer or electrically conductive strips may be deposited on the base dielectric layer at block 1418. For example, electrically conductive material may be sprayed, painted, extruded, or otherwise deposited on the base dielectric layer.
At block 1420, a plurality of longitudinally spaced gaps, holes, or openings may be formed through at least the electrically conductive layer and the base dielectric layer. In the event that a plurality of strips of electrically conductive material are provided, a respective plurality of longitudinally spaced gaps may be formed for each of the strips. A wide variety of suitable gap formation devices, components, and/or systems may be utilized to form gaps or openings as desired. For example, at block 1422, gaps may be formed with one or more suitable punches or cutting tools. As another example, at block 1424, gaps may be formed with one or more suitable lasers. As described in greater detail above, gaps may be formed with a wide variety of suitable dimensions, at a wide variety of angles, and/or with a wide variety of suitable configurations. Additionally, any suitable longitudinal spacing may be provided between any two of the gaps. According to an aspect of the disclosure, each gap may extend partially across a widthwise dimension of the electrically conductive material. As a result, the gap(s) formed at each spaced location may define a set of longitudinally adjacent segments of electrically conductive material with one or more fusible elements extending between the adjacent segments.
Following the formation of gaps, operations may continue at block 1426. At block 1426, one or more additional layers of material may optionally be provided. For example, at block 1428, one or more additional dielectric layers, such as a “sandwiching” dielectric layer may be provided. In this regard, a “sandwiching” layer may be provided that does not include gaps, thereby providing additional support to the shield structure. As another example, at block 1430, one or more additional shield structures, such as one or more additional shield tape structures may be provided. In certain embodiments, an additional shield structure may include an electrically conductive layer and one or more layers of dielectric material, and longitudinally spaced gaps may be formed through at least the electrically conductive layer and a base dielectric layer. An additional shield structure may be formed in a similar manner as that described above with reference to blocks 1402-1424. Additionally, in certain embodiments, when an additional shield structure is provided and joined with the original shield structure, the gaps formed in each of the structures may be longitudinally offset from one another.
At block 1432, a shield structure may optionally be cut or slit in order to form a plurality of separate or individual shield structures. For example, if a plurality of strips of electrically conductive material are formed on a base dielectric layer, the base dielectric layer (and any other dielectric layers) may be slit at one or more lines that longitudinally extend between the strips in a widthwise dimension.
Finally, at block 1434, one or more finishing operations may be performed. In certain embodiments, one or more manufactured shield structures may be taken up or collected at block 1436 for subsequent use. Alternatively, at block 1438, one or more shield structures may be incorporated into a cable. For example, a shield structure may be provided to a cable assembly process or system in a continuous or in-line manner, and the shield structure may be incorporated into the cable. In yet other embodiments, at block 1440, one or more shield structures may be formed into one or more suitable cable components, such as a separator configured to be positioned between two or more twisted pairs in a cable. The method 1400 may end following block 1434.
As desired in various embodiments, the method 400 may include more or less operations than those described above with reference to
Example Cable Constructions
The continuous shield structures discussed herein may be incorporated into a wide variety of suitable types of cables, such as twisted pair communication cables, hybrid or composite cables (e.g., cables that include a combination of twisted pairs and other transmission media, etc.) riser cables, plenum cables, horizontal cables, vertical cables, flexible cables, equipment cords, cross-connect cables, etc. Additionally, the shield structures may be utilized to form a wide variety of suitable cable components, such as a twisted pair separator or a shield layer.
With reference to
A jacket 1515 may enclose the internal components of the cable 1500, seal the cable 1500 from the environment, and/or provide strength and structural support. The jacket 1515 may be formed from a wide variety of suitable materials and/or combinations of materials, such as one or more polymeric materials, one or more polyolefins (e.g., polyethylene, polypropylene, etc.), polyvinyl chloride (“PVC”), one or more flame retardant olefins, a low smoke zero halogen (“LSZH”) material, etc. The jacket 1515 may be formed as a single layer or, alternatively, as multiple layers.
With continued reference to
A wide variety of suitable methods or techniques may be utilized as desired to incorporate a shield structure into the cable 1500 as a shield layer. For example, one or more cable components (e.g., the twisted pairs 1505A-D, etc.) may be positioned adjacent to the shield structure. The shield structure may then be folded at one or both edges such that it is circumferentially wrapped around the desired cable components. In certain embodiments, the shield structure may be passed through one or more suitable dies that function to wrap the shield structure into a shield layer.
With continued reference to
A wide variety of suitable methods or techniques may be utilized as desired to form a shield structure into a separator. For the example separator 1510 illustrated in
In contrast to the cable of
With continued reference to
The separator 1710 illustrated in
Additionally, any number of shield layers may be utilized to provide shielding for the twisted pairs 1705A-D. For example, a first shield layer 1720 may be wrapped or otherwise formed around two of the twisted pairs, such as the twisted pairs 1705A, 1705B disposed in the first channel. A second shield layer 1725 may be wrapped or otherwise formed around other twisted pairs, such as twisted pairs 1705C, 1705D disposed in the second channel. In other words, shield layers may be provided for various groups of twisted pairs disposed within the cable core. In certain embodiments, the one or more of the shield layers 1720, 1725 may be formed from a continuous shield structure manufactured or otherwise provided in accordance with the disclosure set forth herein.
With continued reference to
As desired in various embodiments, a wide variety of other materials may be incorporated into a cable, such as any of the cables 1500, 1600, 1700 illustrated in
Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments could include, while other embodiments do not include, certain features, elements, and/or operations. Thus, such conditional language is not generally intended to imply that features, elements, and/or operations are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements, and/or operations are included or are to be performed in any particular embodiment.
Many modifications and other embodiments of the disclosure set forth herein will be apparent having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the disclosure is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
This application is a continuation-in-part of pending U.S. patent application Ser. No. 14/879,367, filed Oct. 9, 2015 and entitled “Methods for Manufacturing Discontinuous Shield Structures for Use in Communication Cables”. Additionally, this application is a continuation-in-part of pending U.S. patent application Ser. No. 16/106,258, filed Aug. 21, 2018 and entitled “Fusible Continuous Shields for Use in Communication Cables”. This application is also related to U.S. patent application Ser. No. 14/879,393, filed Oct. 9, 2015 and entitled “Discontinuous Shield Structures for Use in Communication Cables”. The entire contents of each of these matters are incorporated by reference herein.
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