Claims
- 1. A method of fabricating a microfluidic device, comprising:
providing a first substrate having at least a first surface and a second substrate having at least a first surface, wherein at least one of the first surface of the first substrate or the first surface of the second substrate comprises a textured surface; and mating and bonding the first surface of the first substrate to the first surface of the second substrate.
- 2. The method of claim 1, wherein the textured surface comprises a plurality of raised ridges on the textured surface.
- 3. The method of claim 1, wherein the textured surface comprises a plurality of microscale posts on the textured surface.
- 4. The method of claim 1, wherein the step of mating and bonding comprises applying heat and pressure to the first and second substrates to thermally bond the first surface of the first surface to the first surface of the second substrate.
- 5. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that is no greater than 50% of a depth of the grooves.
- 6. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that is between about 1% and about 50% of a depth of the grooves.
- 7. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that is between about 1% and about 30% of a depth of the grooves.
- 8. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that is between about 1% and about 10% of a depth of the grooves.
- 9. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that from about 0.25 μm to about 50 μm high.
- 10. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that from about 0.25 μm to about 30 μm high.
- 11. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that from about 0.25 μm to about 10 μm high.
- 12. The method of claim 1, wherein at least one of the first surface of the first substrate and the first surface of the second substrate comprises a plurality of grooves fabricated therein, the grooves defining an integrated channel network when the first and second substrates are mated and bonded, and wherein features of the textured surface have a height that from about 0.5 μm to about 2 μm high.
- 13. The method of claim 1, wherein the step of mating and bonding comprises ultrasonically welding the first surface of the first substrate to the first surface of the second substrate.
- 14. The method of claim 1, wherein the step of mating and bonding comprises thermally bonding the first surface of the first substrate to the first surface of the second substrate.
- 15. The method of claim 1, wherein the step of mating and bonding comprises sonically bonding the first surface of the first substrate to the first surface of the second substrate.
- 16. A method of fabricating a microfluidic device, comprising:
providing first substrate having a first planar surface, and a second substrate layer having a first planar surface, wherein the first planar surface of the second substrate has a lower transition temperature than the first surface of the first substrate thermally bonding the first surface of the first substrate to the first surface of the second substrate, whereby the first surface of the second substrate does not substantially project into the plurality of channels.
- 17. The method of claim 16 wherein the first surface of the second substrate projects into the plurality of channels less than 10% of a total cross-sectional area of an unobstructed channel.
- 18. The method of claim 16, wherein the first surface of the second substrate projects into the plurality of channels less than 5% of a total cross-sectional area of an unobstructed channel.
- 19. The method of claim 16, wherein the first surface of the second substrate projects into the plurality of channels less than 2% of a total cross-sectional area of an unobstructed channel.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a division of U.S. patent application Ser. No. 09/590,661, filed Jun. 7, 2000, which is a division of U.S. patent application Ser. No. 09/073,710, filed May 6, 1998, now U.S. Pat. No. 6,123,798.
Divisions (2)
|
Number |
Date |
Country |
Parent |
09590661 |
Jun 2000 |
US |
Child |
10359959 |
Feb 2003 |
US |
Parent |
09073710 |
May 1998 |
US |
Child |
09590661 |
Jun 2000 |
US |