Methods of fabricating stacked magnetic cores having small footprints

Abstract

Stacked magnetic cores that can achieve high density with a small footprint, as well as methods of fabricating and using the same, are provided. A stacked magnetic core can be fabricated by depositing nanomagnetic films with control in composition and nanostructure via a continuous electroplating process. The magnetic films are interspersed with thin adhesive films (that can be insulating) in an automated roll-to-roll process. That is, the magnetic films and adhesive films are disposed in an alternating fashion. The adhesive films can keep the magnetic films completely electrically isolated from each other, while also adhering adjacent magnetic films to each other.

Description

BACKGROUND

Magnetic power components have a total addressable market of over $20 billion. They impact the progress in the multi-trillion dollar electronics industry because power delivery and efficiency limits the performance of future electronic systems. A key to advancing this massive market is the development of magnetic components with high power density and efficiency that can be fabricated with scalable processes at low cost.

BRIEF SUMMARY

Embodiments of the subject invention provide novel and advantageous stacked magnetic cores (e.g., for inductors and transformers) that can achieve high density with smaller lateral dimensions (or footprint), as well as methods of fabricating and using the same. A stacked magnetic core can be fabricated by depositing nanomagnetic films with control in composition and nanostructure via a continuous electroplating process. The magnetic films are interspersed with thin adhesive films (that can be insulating) in an automated roll-to-roll process to relieve both eddy currents and stresses that may otherwise be present in the magnetic films. That is, the magnetic films and adhesive films are disposed in an alternating fashion, with a first adhesive film disposed on a first magnetic film, a second magnetic film disposed on the first adhesive film, a second adhesive film (if present) disposed on the second magnetic film, and so on (for as many magnetic films and adhesive films as are present). The adhesive films can keep the magnetic films completely electrically isolated from each other, while also adhering adjacent magnetic films to each other.

In an embodiment, a method of fabricating a stacked magnetic core for an electrical component can comprise: performing an electroplating process under a magnetic field to form a first magnetic film on a plating carrier substrate; forming a first adhesive film on an upper surface of the first magnetic film; performing the electroplating process under the magnetic field to form a second magnetic film on the plating carrier substrate; forming a second adhesive film on an upper surface of the second magnetic film; removing the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on an interim substrate; and removing the second magnetic film with the second adhesive film thereon from the plating carrier substrate and disposing it on the first adhesive film, forming the stacked magnetic core comprising the first magnetic film, the first adhesive film on the first magnetic film, the second magnetic film on the first adhesive film, and the second adhesive film on the second magnetic film. The first magnetic film can be electrically insulated from the second magnetic film by the first adhesive film, and a footprint of the stacked magnetic core (measured in a first plane having the upper surface of the first magnetic film) can be, for example, 10 square millimeters (mm²) or less (e.g., 5 mm² or less, or 1 mm² or less). The method can further comprise removing the first magnetic film, the first adhesive film, the second magnetic film, and the second adhesive film from the interim substrate. The stacked magnetic core can have an inductance density of, for example, at least 5 nanohenries per square millimeter (nH/mm²) (e.g., at least 10 nH/mm²). The stacked magnetic core can have a coercivity of, for example, no more than 1 Oersted (Oe). The first magnetic film and the second magnetic film can each be, for example, an alloy of nickel, iron, and optionally cobalt (e.g., NiFe or CoNiFe). A thickness of the first adhesive film (measured in a first direction perpendicular to the upper surface of the first magnetic film) can be in a range of, for example, from 0.01 micrometers (μm) to 10 μm (or any subrange therein; e.g., from 0.05 μm to 5 μm, or from 0.1 μm to 1 μm), and a thickness of the second adhesive film (measured in the first direction) can be in a range of, for example, from 0.01 μm to 5 μm (or any subrange therein; e.g., from 0.05 μm to 5 μm, or from 0.1 μm to 1 μm). A thickness of the first magnetic film (measured in the first direction) can be in a range of, for example, from 0.01 micrometers (μm) to 10 μm (or any subrange therein; e.g., from 0.05 μm to 5 μm, or from 0.5 μm to 2 μm), and a thickness of the second magnetic film (measured in the first direction) can be in a range of, for example, from 0.01 μm to 10 μm (or any subrange therein; e.g., from 0.05 μm to 5 μm, or from 0.5 μm to 2 μm). Each of the first adhesive film and the second adhesive film can be, for example, a polymer adhesive film or a metal-polymer composite film. The performing of the electroplating process can comprise performing the electroplating process in an electroplating bath having a rectangular frame disposed around the electroplating bath; the rectangular frame comprising a first side, a second side perpendicular to the first side, a third side parallel to the first side, and a fourth side parallel to the second side; each of the first side and the third side being longer than each of the second side and the fourth side; the first side comprising a first hard magnet; the second side comprising a first soft magnet; the third side comprising a second hard magnet; and the fourth side comprising a second soft magnet. The first hard magnet and the second hard magnet can be disposed such that they have the same North-South orientation as each other. Each of the first soft magnet and the second soft magnet can be, for example, a soft stainless steel magnet. The removing of the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on an interim substrate can be performed before the performing of the electroplating process to form the second magnetic film on the plating carrier substrate. The performing of the electroplating process can comprise disposing a mask on the plating carrier substrate before forming the first magnetic film and before forming the second magnetic film, such that the respective magnetic film is formed on the plating carrier substrate only where the mask is absent, and the method can further comprise removing the mask before removing first magnetic film from the plating carrier substrate and removing the mask before removing second magnetic film from the plating carrier substrate (e.g., before disposing the first adhesive film on the first magnetic film and before disposing the second adhesive film on the second magnetic film, respectively).

In another embodiment, a method of fabricating a stacked magnetic core for an electrical component can comprise: a) forming a plurality of magnetic film-insulating film pairs, each magnetic film-adhesive film pair comprising an adhesive film disposed on an upper surface of a magnetic film, on a plating carrier substrate by performing an electroplating process under a magnetic field to form the respective magnetic film on the plating carrier substrate and then forming the respective adhesive film on an upper surface of the magnetic film; b) removing each magnetic film-adhesive film pair on its own, independently of the other magnetic film-adhesive film pairs; and c) disposing each magnetic film-adhesive film pair on an interim substrate to form the stacked magnetic core comprising a stacked structure of the plurality of magnetic film-adhesive film pairs. The magnetic film of each magnetic film-adhesive film pair can be electrically insulated from the magnetic film of each other magnetic film-adhesive film pair by its adhesive film and the adhesive film of the magnetic film-adhesive film pair with which it is in direct contact. A footprint of the stacked magnetic core (measured in a first plane having the upper surface of the first magnetic film) can be 10 mm² or less (e.g., 5 mm² or less, or 1 mm² or less). Steps a), b), and c) can be performed in an automated, roll-to-roll process or in a parallel process. The method can further comprise removing the plurality of magnetic film-adhesive film pairs from the interim substrate. A thickness of the adhesive film of each magnetic film-adhesive film pair (measured in a first direction perpendicular to the first plane) can be in a range of, for example, from 0.01 μm to 5 μm (or any subrange therein; e.g., from 0.05 μm to 5 μm, or from 0.1 μm to 1 μm). A thickness of the magnetic film of each magnetic film-adhesive film pair (measured in the first direction) can be, for example, from 0.01 μm to 5 μm (or any subrange therein; e.g., from 0.05 μm to 5 μm, or from 0.5 μm to 2 μm). The performing of the electroplating process in step a) can comprise performing the electroplating process in an electroplating bath having a rectangular frame disposed around the electroplating bath; the rectangular frame comprising a first side, a second side perpendicular to the first side, a third side parallel to the first side, and a fourth side parallel to the second side; each of the first side and the third side being longer than each of the second side and the fourth side; the first side comprising a first hard magnet; the second side comprising a first soft magnet; the third side comprising a second hard magnet; the fourth side comprising a second soft magnet; and the first hard magnet and the second hard magnet being disposed such that they have a same North-South orientation as each other. Each of the first soft magnet and the second soft magnet can be, for example, a soft stainless steel magnet. The performing of the electroplating process in step a) can further comprise disposing a mask on the plating carrier substrate before forming the respective magnetic film, such that the respective magnetic film is formed on the plating carrier substrate only where the mask is absent, and removing the mask before removing the respective magnetic film from the plating carrier substrate. The stacked magnetic core can have an inductance density of, for example, at least 5 nH/mm² (e.g., at least 10 nH/mm²). The stacked magnetic core can have a coercivity of, for example, no more than 1 Oe. The magnetic film of each magnetic film-adhesive film pair can be, for example, an alloy of nickel, iron, and optionally cobalt (e.g., NiFe or CoNiFe). The adhesive film of each magnetic film-adhesive film pair can be, for example, a polymer adhesive film or a metal-polymer composite film.

In another embodiment, a method of fabricating a stacked magnetic core for an electrical component can comprise: performing an electroplating process under a magnetic field to form a first magnetic film on a plating carrier substrate; forming a first adhesive film on an upper surface of an interim substrate; removing the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on the interim substrate; performing the electroplating process under the magnetic field to form a second magnetic film on the plating carrier substrate; forming a second adhesive film on an upper surface of the interim substrate; and removing the second magnetic film with the second adhesive film thereon from the plating carrier substrate and disposing it on the second adhesive film, forming the stacked magnetic core comprising the first magnetic film, the first adhesive film on the first magnetic film, the second magnetic film on the first adhesive film, and the second adhesive film on the second magnetic film. The first magnetic film can be electrically insulated from the second magnetic film by the first adhesive film.

In another embodiment, a method of fabricating a stacked magnetic core for an electrical component can comprise: performing an electroplating process under a magnetic field to form a first magnetic film on a plating carrier substrate; removing the first magnetic film from the plating carrier substrate forming a first adhesive film on both surfaces of the magnetic film; performing the electroplating process under the magnetic field to form a second magnetic film on the plating carrier substrate; removing the second magnetic film from the plating carrier substrate; forming a second adhesive film on both surfaces of the magnetic film; and forming the stacked magnetic core comprising the first magnetic film, the first adhesive film on the first magnetic film, the second magnetic film on the first adhesive film, and the second adhesive film on the second magnetic film. The first magnetic film can be electrically insulated from the second magnetic film by the first adhesive film.

In another embodiment, the films as described herein (e.g., magnetic films) can be plated on a carrier and then released from it to form individual free-standing films. Such films can then be appropriately clamped to a frame for easier handling and then coated with an adhesive resin. These films can thus be coated in parallel, and then stacked and laminated to form a multi-layered substrate. This approach has the advantage of higher throughput as multiple free-standing magnetic films can be coated simultaneously and laminated in a single step (see also FIGS. 38 and 39, which show these processes).

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 shows a schematic view of magnetic inductors integrated with integrated circuits (ICs) (left) and a scanning electron microscope image of a cross-section of magnetic inductors integrated with ICs (see also, e.g., Sturcken et al., Magnetic thin-film inductors for monolithic integration with CMOS, in 2015 IEEE International Electron Devices Meeting (IEDM), pp. 11.4.1-11.4.4, 2015; which is hereby incorporated by reference herein in its entirety).

FIG. 2 shows nanomagnetic films according to an embodiment of the subject invention.

FIG. 3 shows a process flow for fabricating inductor cores and inductors, according to an embodiment of the subject invention.

FIG. 4 shows example plating conductions and electrolyte composition for electrodeposition of cobalt nickel iron (CoNiFe) thin films, according to an embodiment of the subject invention (see also, e.g., Rasmussen et al., Electroplating and characterization of cobalt-nickel-iron and nickel-iron for magnetic microsy stems applications. Sensors and Actuators A: Physical, 92(1-3), 242-248, 2001; and Sverdlov et al., The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications, Microelectronic engineering 76.1-4: 258-265, 2004; both of which are hereby incorporated by reference herein in their entireties).

FIG. 5(a) shows an image of an electroplating setup for multilayer magnetic cores, according to an embodiment of the subject invention.

FIG. 5(b) shows an image of an electroplating setup for multilayer magnetic cores, according to an embodiment of the subject invention.

FIG. 5(c) shows a plot of magnetic flux (in milliTesla (mT)) versus time (in seconds (s)), for the electroplating pictured in FIG. 5(b).

FIG. 6 shows SEM images of CoNiFe magnetic thin films. The scale bar (image on left) is 1 micrometer (μm).

FIG. 7(a) shows a three-element plot of the composition of CoNiFe (see also Rasmussen et al., supra.).

FIG. 7(b) shows a plot of composition (atomic percentage) versus current density (in Amps per square decimeter (A/dm²)) (see also Rasmussen et al., supra.).

FIG. 8 shows a process flow of forming a multilayer magnetic core, according to an embodiment of the subject invention. Though certain materials are shown in FIG. 8, these are for exemplary purposes only and should not be construed as limiting.

FIG. 9 shows an image of an electroplating setup with a magnetic field.

FIG. 10 shows a spiral inductor with magnetic material on top and below, according to an embodiment of the subject invention. Though certain dimensions are shown in FIG. 10, these are for exemplary purposes only and should not be construed as limiting (though they were used in the example that references this figure).

FIG. 11 shows a plot of inductance (in nanohenries (nH)) versus frequency (in megahertz (MHz)) for different inductors, with the layout shown at the right of the figure. In the plot, the curves are for (from highest inductance values to lowest inductance values) 26-layer, 8-layer, 4-layer, 3-layer, 2-layer, and 1-layer.

FIG. 12 shows a table with values for incorporation of magnetic materials with anisotropic permeability into Ansys HFSS.

FIG. 13 shows a schematic view of a three-dimensional (3D) view of a substrate-embedded solenoid inductor.

FIG. 14(a) shows a plot of inductance density (in nH per square millimeter (nH/mm²)) versus frequency (in MHz), showing simulated inductance of air-core and magnetic-core inductors.

FIG. 14(b) shows inductance (in nH) versus frequency (in MHz), showing simulated inductance of air-core and magnetic-core inductors.

FIG. 15 shows a schematic view of a copper-magnetics-copper (CMC) inductor (top-left), an MCM inductor (top-right), a solenoid inductor (bottom-left, which is also CMC), and a spiral inductor (bottom-right, which is also MCM).

FIG. 16 shows a diagram with solenoid structures (left) and spiral structures (right). Though certain dimensions are shown in FIG. 16, these are for exemplary purposes only and should not be construed as limiting (though they were used in the example that references this figure).

FIGS. 17(a)-17(c) show 3D views of a one-turn magnetic core power inductor. Though certain dimensions are shown in FIGS. 17(a)-17(c), these are for exemplary purposes only and should not be construed as limiting (though they were used in the example that references this figure).

FIG. 18 shows an image of a one-turn spiral inductor.

FIG. 19(a) shows an image of a solenoid wrapped around a commercial magnetic material core with a closed loop using magnetic paste.

FIG. 19(b) shows an image of a spiral wrapped around a commercial magnetic material core with a closed loop using magnetic paste.

FIG. 20(a) shows an image of a set-up for inductance measurement at various frequencies.

FIG. 20(b) shows an image of spiral inductors that were measured.

FIG. 20(c) shows an image of a soldered device under test (DUT) directly on a SubMiniature version A (SMA) connector.

FIG. 21 shows an image of de-embedding structures with open, short, and load configurations.

FIG. 22 shows a diagram characterizing solenoid structures and their corresponding modified version (closed loop). Though certain dimensions are shown in FIG. 22, these are for exemplary purposes only and should not be construed as limiting (though they were used in the example that references this figure).

FIG. 23(a) shows a plot of inductance (in nH) versus frequency (in MHz) for structure 2 and structure 3 solenoids.

FIG. 23(b) shows a plot of inductance (in nH) versus frequency (in MHz) for structure 4 and structure 5 spirals.

FIG. 24 shows modified solenoid inductor structures 2a and 3a (closed loop with magnetic paste).

FIG. 25(a) shows a plot of inductance (in nH) versus frequency (in MHz) for structure 2a solenoids and an air-core solenoid.

FIG. 25(b) shows a plot of inductance (in nH) versus frequency (in MHz) for structure 3a solenoids and an air-core solenoid.

FIG. 26 shows a plot of inductance (in nH) versus frequency (in MHz), showing Ansys simulation inductance values using structure 3a solenoids at different currents. The curves are for (from highest inductance values to lowest inductance values) 4.5 A, 6.5 A, 8.5 A, and 10.5 A.

FIG. 27 shows a plot of saturation current to achieve 1.2 Tesla (T) (in Amps (A)) versus reluctance (Ig/1+Ic/mu) for different numbers of turns for toroid inductors.

FIG. 28 shows a plot of inductance to achieve 1.2 T (in nH) versus reluctance (Ig/1+Ic/mu) for different cross-sectional areas (footprints, from 500 square micrometers (μm²) to 1,000,000 μm²) for toroid inductors. A current-handling of 1 A per square millimeter (A/mm²) was achieved with a 2000 μm×500 μm (1,000,000 μm²) core cross-section.

FIG. 29 shows a plot of inductance (in nH) versus frequency (in MHz) for toroid inductors. The curves are for (from highest inductance at 10 MHz to lowest inductance at 10 MHz) 1 A, 1 A (airgap), 2 A (airgap), 3 A (airgap), 2 A, 3 A, and baseline. FIG. 29 also shows an air-core design (inset), a toroid design with an airgap (top-right), another image of the toroid design (middle-right), and a schematic of a toroid design (bottom-right). Though certain dimensions are shown in FIG. 29, these are for exemplary purposes only and should not be construed as limiting (though they were used in the example that references this figure). The airgap and filled airgap to manage reluctance are also illustrated in FIG. 29.

FIG. 30 shows a table of performance metrics of magnetic materials and a magnetic core according to an embodiment of the subject invention (in the column labeled “Future”).

FIG. 31 shows a table of plated and layered magnetic composite structures and their measured BH curves.

FIG. 32 shows a table of plated and layered magnetic composite structures and their measured BH curves.

FIG. 33 shows a table of parameters for solenoid inductors (open flux path) (top portion of table) and solenoid inductors (closed flux path) (bottom portion of table).

FIG. 34 shows a table of parameters for spiral inductors.

FIG. 35 shows a table of parameters for spiral inductors.

FIG. 36 shows a table of parameters for toroid inductors.

FIG. 37 shows a table of parameters for solenoid inductors (open flux path) (top portion of table) and solenoid inductors (closed flux path) (bottom portion of table).

FIG. 38 shows a process flow of a scalable manufacturing approach with a sequential layering process where the magnetic films are transferred onto an adhesive coating that is deposited on the interim substrate or final substrate.

FIG. 39 shows a process flow of a scalable manufacturing approach with a parallel layering process where magnetic films are released from the plating carrier and independently coated with adhesive films while free-standing. Such films with double-side coating can then be stacked and laminated to form the stacked core.

DETAILED DESCRIPTION

Embodiments of the subject invention provide novel and advantageous stacked magnetic cores (e.g., for inductors and transformers) that can achieve high density with smaller lateral dimensions (or footprint), as well as methods of fabricating and using the same. A stacked magnetic core can be fabricated by depositing nanomagnetic films with control in composition and nanostructure via a continuous electroplating process. The magnetic films are interspersed with thin adhesive films (that can be insulating) in an automated roll-to-roll process to relieve both eddy currents and stresses that may otherwise be present in the magnetic films. That is, the magnetic films and adhesive films are disposed in an alternating fashion, with a first adhesive film disposed on a first magnetic film, a second magnetic film disposed on the first adhesive film, a second adhesive film (if present) disposed on the second magnetic film, and so on (for as many magnetic films and adhesive films as are present). The adhesive films can keep the magnetic films completely electrically isolated from each other, while also adhering adjacent magnetic films to each other. The adhesive films can be polymer films or metal-polymer composite films (though embodiments are not limited thereto) and can suppress the eddy currents and coupling between the magnetic films that would increase the coercivity (if the adhesive films were not present). By interspersing with thin adhesive films, a permeability of 800-1000 with a coercivity of less than 1 Oersted (Oe) can be achieved with a frequency stability of 100 megahertz (MHz) and beyond, and alternating current (AC) losses of less than 1%.

Each magnetic film can have a thickness of, for example, 0.01 μm to 10 μm (or any subrange therein; e.g., from 0.1 μm to 5 μm, or from 0.5 μm to 2 μm), and each adhesive film can have a thickness of, for example, 0.01 micrometers (μm) to 10 μm (or any subrange therein; e.g., from 0.05 μm to 5 μm, or from 0.1 μm to 1 μm). The footprint of the stacked magnetic core (i.e., the lateral area taken in a plane perpendicular to the thickness direction) can be, for example, less than 10 square millimeters (mm²) (e.g., less than 5 mm², less than 3 mm², less than 2 mm², or less than 1 mm²). The, or each, magnetic film can be, for example, CoNiFe, though embodiments are not limited thereto. An electrical component (e.g., an inductor or a transformer) can comprise the stacked magnet core as its core, and such an electrical component can further comprise a coil, one or more backing layers, one or more vias, or other elements necessary to complete the electrical component. The electrical component can be configured to have a closed flux path.

The fabrication methods of embodiments of the subject invention can be based on electroplated nanocrystalline films on carrier substrates. Nanomagnetic films can be deposited with control in composition and nanostructures by a continuous electroplating process. A core having a single, monolithic magnetic film would quickly run into losses from eddy currents, process issues from stresses, and delamination and other reliability challenges. Embodiments of the subject invention address these problems by alternating the magnetic films with thin adhesive films (e.g., in an automated roll-to-roll process, or a sequential layering process from prefabricated films on carrier substrates, or coating the adhesive film directly on free-standing magnetic films) to relieve both the eddy currents and stresses. The insulating layers can suppress the eddy currents and can also prevent or inhibit coupling between the magnetic layers that would otherwise increase the coercivity of the core. By interspersing with thin insulating layers, a permeability of 800-1000 with a coercivity of less than 1 Oe can be achieved, as can a frequency stability of 100 MHz and above, and AC losses of less than 1%.

Wafer- or substrate-integrated nanomagnetic films with electroplated nanocrystalline films that have precise control in composition and nanostructures are provided, and these magnetic films are multilayered with thin insulating layers. This can be done on a substrate (e.g., on a carrier substrate), and the fabrication methods can provide scalability to adequate thickness, low eddy current losses, low stress, mechanical flexibility, and high reliability.

Magnetic properties such as coercivity, eddy current losses, and magnetostriction can degrade the performance of an electrical component unless the structure (e.g., the nanostructure) and composition meet the exchange coupling criteria. Controlling the nanostructure with electrochemical processes to achieve low coercivity and high permeability is an important goal. This is met at least in part by magnetic alloy design with dopants and the design of bath chemistry to achieve the composition. Also, magnetic annealing can be used to create anisotropic properties.

Plated films can be continuously released in an electroplating process, and the plated films can be transferred to a different substrate (i.e., a substrate different from what may be used in the electroplating process) with thin adhesive films (e.g., in a roll-to-roll process, such as an automated roll-to-roll process, or a sequential layering process from prefabricated films on carrier substrates, or coating the adhesive film directly on free-standing magnetic films). The films can be deposited onto a (relatively) thick carrier substrate via direct in situ patterning, and this can be done with or without any subsequent dry-etching or laser ablation steps to pattern the films (that is, such steps are not necessarily required but may be performed in certain embodiments). The micropatterned films can be transferred onto a different substrate (e.g., a laminate substrate) as insulating layer-isolated nanomagnetic layers. A roll-to-roll or continuous batch process, which combines plating with in situ patterning, film-transfer, and layering, can be used for high throughput and low cost. Such processes can be used in standard package integration processes to form electrical components (e.g., solenoid, spiral, and/or toroid inductors and/or transformers).

Embodiments of the subject invention provide plated magnetic composite films that achieve high Ms, high permeability, and low coercivity. Thin films (e.g., in a range of 0.1 μm to 10 μm (such as 2 μm or about 2 μm)) can be electroplated and easily released from a carrier substrate to form a layered composite structure by utilizing thin insulating layers. The films can be deposited onto a thick carrier substrate with a direct in situ patterning without the need for any subsequent lithographic steps to pattern them. These micropatterned films can be transferred onto a different substrate (e.g., a laminate substrate) as electrically-isolated nanomagnetic layers. A high throughput batch process with low cost was achieved.

An electroplating of nanostructured magnetic films (e.g., metals and/or metal alloy films) with easy release can be achieved. For example, the magnetic films can be an alloy of nickel (Ni), iron (Fe), and/or cobalt (Co) (e.g., NiFe, CoNiFe, or an alloy thereof). Plating can be performed with a stable plating bath that can yield more than 1 micrometer/minute (μm/min) of plating. The bath can be, for example, a sulphate bath (which can be utilized because of its easy scalability). In the case of the film being an alloy of Ni, Fe, and/or Co, the ratio of Fe(II)/Co(II) in the bath determines the final alloy composition. CoFe is usually activation-controlled at the cathode surface and not mass-transport-controlled. It is critical to stabilize the bath to prevent or inhibit the oxidation of Fe′ to Fe′ and prevent or inhibit the precipitation of hydroxide, and also suppress the evolution of hydrogen at the cathode. By depositing under a magnetic field, the film coercivity in the hard axis is substantially reduced while also enhancing the current-handling. A uniform unidirectional direct current (DC) magnetic field (e.g., of at least 500 Gauss, such as 1000 Gauss or about 1000 Gauss) can be applied to the working electrode (cathode). This can help create in situ magnetic orientation to achieve high field anisotropy and low coercivity in the hard axis. Both these attributes are extremely important in achieving high power density with high efficiencies. The permanent field can be created by surrounding the plating carrier with a frame (e.g., a rectangular frame) including hard magnets and soft magnets. Two parallel sides (e.g., the longer sides of the frame) can have hard magnets with the same North-South orientation as each other. The other two sides (e.g., the shorter sides of the frame), which can be parallel to each and perpendicular to the sides with the hard magnets, can comprise (or be made of) soft magnets (e.g., soft stainless steel magnets). This process is very effective in creating a uniform magnetic field around the working sample. This approach will directly pattern the films, in situ, without the need for additional plating steps.

By masking the plating carrier with a nonconducting film, plating can be prevented or inhibited in certain regions; the other regions (with no mask) are patterned in the desired designs. This is an important aspect that sidesteps several manufacturing constraints, such as patterning with laser ablation or etching (e.g., wet acid/dry plasma etching). It also can achieve layered metal-adhesive film composites without any extra process burden. Such patterning can only otherwise be achieved with screen-printing or micro-assembly of magnetic flake or particle composites, both of which constrain either the properties or the process cost. Embodiments of the subject invention can include in situ patterning.

The plated films can be released from the carrier substrate or plating carrier and transferred onto an interim carrier substrate. This is essentially based on the delamination of the films from the plating carrier and adhesion to the interim carrier. An important aspect for the success of this step is to engineer the adhesion strength between different layers. The plated film should have a poor adhesion to the plating carrier (e.g., 5 megapascals (MPa) or less). The plating stress can be controlled such that the delamination is easily accomplished. The plated films should strongly adhere to the interim carrier (e.g., with an adhesion strength of at least 30 MPa or at least 40 MPa). The adhesive films can serve two functions: provide strong adhesion to the plated film so that it can be pulled out of the plating carrier to help with the layering step on the interim carrier; and act as a strong adhesive and interlayer dielectric that electrically isolates the plated magnetic films in the final multilayered stacked magnetic core.

FIG. 3 shows a schematic of a fabrication process according to an embodiment of the subject invention. Though FIG. 3 lists certain materials and types of lasers, these are for exemplary purposes only and should not be construed as limiting. Referring to FIG. 3, a mask (e.g., a tape such as a mylar tape) can be disposed on a conductive plating carrier (e.g., a titanium substrate, optionally pretreated). Then, electroplating of the first magnetic film can be performed to form the magnetic film in the area without the mask. The mask can be removed, and the first adhesive film can be formed on the first magnetic film. The magnetic film with the first adhesive film thereon can be peeled from the plating carrier (e.g., after curing) and then transferred to an interim substrate. These steps can be repeated, with each magnetic film/adhesive film pair being peeled and disposed on the previous pair on the interim substrate, sequentially layering the magnetic film/adhesive film pairs and giving the stacked magnetic core. The magnetic film/adhesive film pairs can be removed from the interim substrate if desired (e.g., depending on the material of the interim substrate) and can be used as a core for an electrical component (the steps below “sequential layering” in FIG. 3). The electroplating can be performed under a magnetic field as disclosed herein (e.g., with the frame of hard magnets and soft magnets).

Referring to FIG. 38, in another embodiment, the adhesive film can be formed on the interim carrier substrate or the final substrate. The magnetic film on the carrier substrate can then be released and transferred to the interim substrate by bonding it to the adhesive film. This is different from the embodiments where the adhesive film is first disposed onto the plating carrier and then released. This process can be repeated to achieve the required number of layers to form the magnetic core.

Referring to FIG. 39, in another embodiment, the magnetic film can be released from the plating carrier substrate to form free-standing magnetic films. Adhesive films can then be formed on the free-standing magnetic films. The films with double-side adhesive films/layers can then be stacked and laminated to form the magnetic core. This is different from the embodiment where the adhesive film is first disposed onto free-standing magnetic films. The magnetic films with adhesive films can be stacked and hot-pressed or laminated to form the magnetic core.

Embodiments can provide ultra-thin electrical components (e.g., inductors or transformers) with a permeability of, for example, 300-400 at a frequency of 10 megahertz (MHz). An inductance density of, for example 8 nH/mm² or more can be achieved with, e.g., 5-10 milliohms (me) of resistance at a frequency of 1 MHz to 10 MHz. Current handling of at least 1 A/mm² can be achieved.

Advanced composite magnetic structures with high permeability, low coercivity, high resistivity, and good frequency stability are needed to achieve the best inductor performance metrics. A key metric is L/R_dc (an inductance density of 8 nH/mm² or more (e.g., 8-15 nH/mm²) with 10 mΩ direct current (DC) resistance at about 10 MHz). In addition, thickness scalability with innovative inductor topologies is important for handling adequate power at low cost. These attributes come at the expense of each other, and existing approaches face fundamental limitations either in terms of performance, scalability to high power, or cost. Ferrites have been widely used as the magnetic cores for low frequency applications such as transformers. Ferrites have low saturation magnetization and are not suitable for high-current handling and high-frequency applications (due to high-frequency instability above 3 MHz). The ceramic properties of ferrites provide high resistivity (>1 Ohms-meters (Ω-m)) resulting in low eddy current loss for thicker cores. However, the low field anisotropy (Hk) of ferrites limits them to low-frequency applications (about 1 MHz). Ferrites also have low saturation magnetization (about 0.5 T or less) and low permeability (μ), which lead to low inductance volumetric density and low current handling when used as the inductor cores.

Nanocrystalline magnetic ribbon alloys (e.g., Metglas® from Hitachi®) show good soft magnetic properties such as low coercivity, low core loss, and high permeability. The good soft magnetic properties are the results of absence of grain boundaries and crystal magnetic anisotropy in amorphous alloys. Another example is VITROPERM®, an iron-based nanocrystalline material with soft-magnetic properties of high saturation flux density (greater than or equal to 1.2 T), a permeability that can be adjusted in the range of from 400 to 800,000, excellent thermal stability over a wide temperature range, low core losses and low coercivity, and low or zero saturation magnetostriction. VITROPERM products are available as ribbon in thicknesses from 14 μm to 20 μm and widths from 2 millimeters (mm) to 66 mm. Because of their high eddy currents, they are more suitable for lower frequencies as transformer cores and common mode chokes. The magnetic fields of a toroid are directed within the plane of the core, and the eddy currents are orthogonal to the plane, so aligned magnetic flakes can be used as magnetic materials.

High permeability and softness (low coercivity) with frequency stability (high resistivity for low eddy currents and high ferromagnetic resonance (FMR)) requires nanostructured cobalt and iron alloys (less than 5 nanometers (nm)) with interspersed oxides (less than 5 nm) to enable exchange coupling and electrical isolation. Such “metastable” structures can be deposited with sputtering techniques, but these are unfortunately limited to lower film thickness and low-throughput processes (see also, e.g., Gardner et al., Integrated on-chip inductors using magnetic material (invited), Journal of Applied Physics, vol. 103, p. 07E927, 2008; which is hereby incorporated by reference herein in its entirety). Magnetic thin-film inductors can be integrated into integrated circuits (ICs), as depicted in FIG. 1. Composite processing with advanced flakes can achieve structures like sputtering, but the resulting devices are limited to permeabilities of less than 150-200 and lower Ms. Embodiments of the subject invention can achieve a nanostructure with a scalable and thick film package-compatible process, providing unparalleled opportunities for enhancing the efficiency and current-handling at the same time. FIG. 2 shows a scalable fabrication approach for nanomagnetic films, according to an embodiment of the subject invention. Such a scalable approach to achieve metastable nanostructures can achieve 10× improvement in properties and performance compared to polymer composite films and air-core inductors, which are the primary related art options for package-compatible inductors. Unlike polymer composite inductors with magnetic particles, the nanomagnetic films do not undergo demagnetization that can degrade permeability and coercivity.

Embodiments provide plated magnetic composite films to achieve both high Ms, high permeability, and low coercivity. Nanomagnetic films can be deposited with precise control in composition and nanostructure by a continuous electroplating process. CoNiFe alloys (e.g., doped CoNiFe alloys) can achieve Ms of at least 2.0 T. Monolithic magnetic films will quickly run into losses from eddy currents, process issues from stresses, and delamination and other reliability challenges. A key innovation is to intersperse the magnetic films with thin insulating and/or adhesive layers (e.g., polymers) in an automated process to relieve both the eddy currents and stresses. The insulating layers can suppress the eddy currents and coupling between the layers that could otherwise increase the coercivity. Thin films (e.g., 2 μm or less) can be electroplated and then easily released from the carrier to form a layered composite structure by utilizing thin insulating adhesives. By interspersing with thin insulators, a permeability of 800-1000 with a coercivity of less than 1 Oersted (Oe) can be achieved with frequency stability of 100 MHz and beyond, and alternative current (AC) losses of less than 1%. The films can be deposited onto thick carriers with direct in situ patterning without the need for any subsequent lithographic steps to pattern them. That is, the fabrication method can explicitly exclude such subsequent lithographic steps. These micropatterned films can be transferred onto laminates as adhesive-isolated nanomagnetic layers. A high throughput batch process can be used for high throughput and low cost. Standard package processes can be utilized to form solenoid and/or spiral inductors after fabricating the multilayer magnetic cores. Solenoids can provide high current handling, and spiral inductors can provide low DC resistance. FIG. 3 shows a process flow for inductor integration. These powder inductors can achieve high inductance and high saturation current while retaining a small size. The low thickness profile enables them to be embedded into substrates and provide high power densities. The table in FIG. 30 shows properties of inductors of embodiments of the subject invention (in the column labeled “future”), compared to inductors using other types of magnetic materials.

A CoNiFe alloy can be used as the base magnetic material because of its high saturation magnetization (greater than 2.0 T). CoNiFe layers can be electroplated with a predetermined (e.g., designed) composition and nanostructure. Suitable additives can be used to help achieve nanostructure and lower the coercivity, while increasing the alloy resistivity. Alloying with additives allows retention of the amorphous structure with low magnetostriction. Example additives are silicon (Si), aluminum (Al), zirconium (Zr), tantalum (Ta), and hafnium (Hf), which unfortunately have reduction potential. Plating these additives is not possible under standard aqueous acid plating conditions. In this scenario, a soft magnetic material like CoNiFe is a very promising material for magnetic microsystems. Thus, embodiments can exclude any such additives, which may diminish the magnetic material's properties, and instead just use a soft magnetic material like CoNiFe.

The transitional term “comprising,” “comprises,” or “comprise” is inclusive or open-ended and does not exclude additional, unrecited elements or method steps. By contrast, the transitional phrase “consisting of” excludes any element, step, or ingredient not specified in the claim. The phrases “consisting” or “consists essentially of” indicate that the claim encompasses embodiments containing the specified materials or steps and those that do not materially affect the basic and novel characteristic(s) of the claim. Use of the term “comprising” contemplates other embodiments that “consist” or “consisting essentially of” the recited component(s).

When ranges are used herein, such as for dose ranges, combinations and subcombinations of ranges (e.g., subranges within the disclosed range), specific embodiments therein are intended to be explicitly included. When the term “about” is used herein, in conjunction with a numerical value, it is understood that the value can be in a range of 95% of the value to 105% of the value, i.e. the value can be +/−5% of the stated value. For example, “about 1 kg” means from 0.95 kg to 1.05 kg.

A greater understanding of the embodiments of the subject invention and of their many advantages may be had from the following examples, given by way of illustration. The following examples are illustrative of some of the methods, applications, embodiments, and variants of the present invention. They are, of course, not to be considered as limiting the invention. Numerous changes and modifications can be made with respect to embodiments of the invention.

Example 1

A stable plating bath that can yield the desired films can be used for fabricating a multilayered inductor core. The concentration of metal ions in the bath determines the final alloy composition. It is critical to stabilize the bath to prevent or inhibit the oxidation of Fe′ to Fe′ and prevent or inhibit hydroxide precipitation and suppress the evolution of hydrogen at the cathode. FIG. 4 shows plating conditions and electrolyte composition for the electrodeposition of CoNiFe thin films. By depositing under magnetic field, the film coercivity in the hard axis can be substantially reduced while also enhancing the current-handling. A uniform unidirectional magnetic field can be applied to the working electrode (cathode), as shown in FIGS. 5(a) and 5(b). This creates in situ magnetic orientation to achieve high field anisotropy and low coercivity in the hard axis. Both these attributes are extremely important in achieving high power density with high efficiencies. FIG. 5(c) shows a plot of magnetic flux (in milliTesla (mT)) versus time. The permanent field can be created by surrounding the plating carrier with a frame (e.g., a rectangular frame) comprising hard magnets and soft magnets. Two parallel sides (e.g., the long sides or the vertical sides) can have hard magnets with the same N-S orientation. The other two sides (e.g., the short sides or the horizontal sides) can be made of soft magnets (e.g., stainless steel magnets). This approach is highly effective in creating a uniform magnetic field around the working sample.

The current density can be optimized. The electroplating process was optimized such that when apply 35 milliamps per square centimeter (mA/cm²) was applied for about 4 minutes and 30 seconds, a film with a thickness of 2 μm (or about 2 μm) was achieved. The thickness of the film was confirmed using a profilometer. FIG. 6 shows scanning electron microscope (SEM) images of the CoNiFe layers, revealing that more uniform electroplating and direction of grains was obtained by electroplating the sample under the unidirectional magnetic field and using a current density of 35 mA/cm². Higher current density promotes higher deposition of Fe instead of Ni.

FIGS. 7(a) and 7(b) show three element plots of the composition of the CoNiFe layers as a function of current density. FIG. 6 relates to FIGS. 7(a) and 7(b) due to the strong dependence of the composition of the CoNiFe alloy on current density during the electroplating process. With controlled composition of Co, Fe, and Ni the desired nanocrystalline films can be achieved with high permeability. The Co content does not change much (40%-65%) as a function of current density. However, it plays an important role in deciding the content of Fe and Ni in the film. When the current density is enhanced, Fe content increases with a corresponding decrease in Ni content. Similarly, with high Fe content as compared to Ni content (low), saturation flux density (Bs) can be enhanced. In FIG. 7(a), the three-element plot shows how it is attempted to move from position B towards A. Position B had a saturation magnetization flux around 1.5 T while position A had a saturation flux of 1.8 T or more.

Example 2

Interlayered CoNiFe films and dielectric layers were fabricated to create a structure that can be placed around, above, and below the inductors. FIG. 8 shows a process flow for the fabrication process. At first, a conductive laminate of titanium (Ti) was used as the plating carrier. This laminate was pre-treated in a 3-minute bath of sulfuric acid (5%). In the second step, masking of the plating carrier was done with a non-conductive film so that the electroplating was prevented in certain regions and only achieved in required regions. Uncovered regions allow patterning of the metal in any desired design that could be later delaminated. Such patterning might also be achieved with screen-printing or micro assembly, but both of these constrain either the properties or process cost.

Before going to the next step, the sample was placed in the electroplating bath and connected to the DC supply as shown in FIG. 9. Some of the implementations done to this setup was to include three-dimensional (3D)-printed holders to secure the samples with more reliability. Then, the anode (+ probe) was assigned to be CoNiFe (e.g., KOVAR®, a commercial source of CoNiFe). The pre-treated Ti laminate covered with non-conductive film was placed in the cathode (− probe).

In the third step, the predetermined desired layer was electroplated on the uncovered region. Then, the covered regions with non-conductive film were removed in the fourth step. In the fifth step, the use of a temporary carrier and adhesive was implemented to delaminate the plated films from the Ti. Ideally the temporary carrier should be as thin as possible. The plated films have a poor adhesion to the Ti, and so it is easier to delaminate and transfer onto a temporary carrier. After the sixth step of delamination, the process goes in for the sequence layering. The key in this last step is to engineer the adhesion strength between different layers. This is achieved by using an encapsulating gel (e.g., DOWSIL® encapsulating gel), which can be diluted (e.g., diluted in a ratio of 3 to 1 with Xylene).

The adhesive serves two functions, first providing strong adhesion to the electroplated CoNiFe film so that it can be easily delaminate out of the Ti and second acting as an interlayer dielectric that isolates the plated magnetic films in the final multilayered core. The adhesive is durable, fast-curing, requires no primer, and has good mechanical strength. The curing time was just 2-3 min at 100° C. In order to spread the adhesive properly, a spin coating technique or dip-coating was used. The thickness control of the adhesive was also optimized in the spin coating. A uniform spread of almost 1 μm thickness of adhesive was obtained between the two layers of film. After curing, the adhesion strength was adequate for subsequent film-transfer steps. This is how layer after layer was built using adhesive, and any number of layers can be built that is desired.

The permeability measurements were performed with a BH looper, with the sample oriented in the parallel and transverse directions. Various inductor test structures were fabricated and tested, with the results shown in the tables in FIGS. 31 and 32.

Example 3

Ansys is an engineering simulation and 3D design software that was used to model various inductor topologies and magnetic properties of the composites. A 3D model for each type of inductor topology was designed keeping the area constraints within 15 mm² (i.e., the total footprint was 15 mm² or less). Two topologies were analyzed—spiral and solenoids.

First, a 1-turn spiral inductor with magnetic material above and below was considered. Because of the required low DC resistance, a spiral inductor with only one copper winding turn was designed, as shown in FIG. 10. Planar inductors such as spiral inductors only require one metal layer and the magnetic cores do not need to be patterned. These attributes simplify the fabrication process and make it an ideal choice of interest to reduce footprint. However, the results for this structure did not meet a 10× (10 times) enhancement in inductance when compared to its baseline of an air-core inductor.

The second structure considered included the same spiral inductor but this time by assuming a perfect wrapping of the copper trace with a magnetic composite. Initial models and simulation results, shown in FIG. 11, indicate that the magnetic-core inductors with permeability of about 140 can provide up to about 11× enhancement in inductance as compared to air-core inductors with a baseline of about 10 nanohenries (nH). One of the main challenges of this structure remains its manufacturability. The implementation of a perfect closed-loop system is obscured by small gaps that create a leakage of the magnetic flux, and inductance is highly disturbed.

For this design, copper traces were built using the design tool in Ansys to create volumetric designs. A magnetic material was wrapped around the copper traces with the appropriate thickness and airgap to simulate a closed loop magnetic flux.

The next step was the application of material models and boundary conditions. The excitations are required to be defined and this determined the input current at which the simulation will run. A key step is to define the input currents by selecting the faces of the object into which the current will flow. ANSYS allows input of three different types of relative permeability depending on the application. There are three options available: simple permeability; anisotropic; and nonlinear. Nonlinear panel allows uploading of the BH loop of the material into the system and running of the simulation with it. However, the nonlinear option assumes that the BH loop is the same for each direction of the structure. An anisotropic permeability was worked with by uploading the BH curve in the direction in which the magnetic material was placed. For example, each copper trace from the spiral design is being covered in-plane and out-of-plane direction with magnetic material. Thus, T(1,1), T(2,2), T(3,3) in FIG. 12 were assigned with the corresponding BH loop obtained from the BH looper experiment.

Solenoid designs were considered in this paper because of their high current-handling capacity (see also, e.g., Mathuna et al., Power Supply on Chip for High Frequency Integrated Voltage Regulation, in IEEE APEC Charlotte, N.C., 2015; which is hereby incorporated herein by reference in its entirety). Various solenoid designs were modeled and designed to achieve high-current handling and high inductance density. The aforementioned high-permeability metal-polymer composites were used as the cores for all inductor designs. The 3D view of a designed solenoid inductor is shown in FIG. 13. The electrical performance of the designed solenoid inductors was optimized by changing the winding width, length, and via pitch (distance from one winding to the same spot on the next). The total component thickness was limited to 600 μm or less to enable the integration of power inductors into substrates to implement integrated voltage regulators (IVRs).

FIGS. 14(a) and 14(b) show the simulated inductance density as a function of frequency. The optimized inductors show a stable inductance density of about 7.2 nH/mm² at a frequency in a range of 1 MHz to 10 MHz, with a DC resistance of 14 mat. As compared to an air-core inductor with the same structure and dimensions, the designed solenoid inductor showed about 4× improvement in inductance density, as indicated by FIGS. 14(a) and 14(b).

Example 4

High inductance-density inductors with magnetic cores tend to be saturated at low current. Therefore, current handling capacity become another critical parameter to judge the performance of power inductors. Saturation of the magnetic cores can be avoided by innovative inductor topologies. Different topologies have their own pros and cons. For example, solenoid inductors have low L/Itbc but high-current handling, whereas spiral inductors have high L/Itric but low-current handling. Because the topologies of inductors play an important role in determining the performance of inductors, inductor topologies can be considered as follows. Based on how the magnetic cores and copper windings are integrated, the topology can be: a) CMC (copper-magnetic-copper) inductors include magnetic cores enclosed within the copper windings (e.g., solenoid inductors); or b) MCM (magnetic-copper-magnetic) inductors include two magnetic layers sandwiching copper windings therebetween (e.g., spiral inductors). These are also shown in FIG. 15, with CMC on the left and MCM on the right.

Solenoids designs can be sub-categorized into: solenoids with open flux path; and solenoids with closed flux path. This is depicted in FIG. 16, left section of the chart. Solenoids with closed flux path have windings on a core, and the periphery is enclosed with extra layers of material for creating a closed magnetic circuit.

The energy stored in power inductors as the magnetic field is given by the following equation.

$\begin{array}{cc}E=\frac{1}{2}{\mathrm{LI}}^2& \left(1\right)\end{array}$ where L is the inductance of the inductor and I is the current through the inductor

Equation (1) plainly shows that inductors with high inductance can store more energy. Hence, a goal is to increase the inductance of the inductor for high energy electromagnetics devices. The self-inductance of an inductor depends upon the characteristics of its construction. Optimizing these factors is crucial for the success of increasing the inductance. At first, these factors can be deduced from the fundamental equations of electromagnetism. Self-inductance of a coil is defined as the magnetic flux linkage (Nφ) divided by the current.

$\begin{array}{cc}L=N\frac{\phi }{I}& \left(2\right)\end{array}$ where φ=magnetic flux and N=number of turns. Further, magnetic flux produced in a coil is given by:φ=BA  (3)where B=flux density and A=area. Also, the magnetic flux density within the core of a long solenoid is given by:B=nμI  (4)where, n=number of turns per unit length and μ=permeability of the core material. Using the above formula, an approximation of inductance for any coil can be calculated.

$\begin{array}{cc}\mathrm{or},L=N\frac{\phi }{I}& \left[\mathrm{From}\mathrm{equation}\left(2\right)\right]\end{array}$ $\begin{array}{cc}\mathrm{or},L=N\frac{\mathrm{BA}}{I}& \left[\mathrm{From}\mathrm{equation}\left(3\right)\right]\end{array}$ $\begin{array}{cc}\mathrm{or},L=N\frac{n\mu \mathrm{IA}}{I}=\mathrm{Nn}\mu A& \left[\mathrm{From}\mathrm{equation}\left(4\right)\right]\end{array}$ $\begin{array}{cc}\mathrm{or},L=\frac{\mu N^{2}A}{l}\left[\mathrm{Since}n-\frac{N}{l}\right]& \end{array}$ $\begin{array}{cc}L=\frac{\mu N^{2}A}{l}& \left(5\right)\end{array}$

Factors like size and length are already optimized in the electromagnetics devices and so there is very little room available here for further improvement of the inductance. Therefore, the possibility of attaining very high coefficients of self-induction reduces to just two factors: permeability of the core; and number of turns. Inductors that are designed to have a large number of copper turns result in high DC resistance and DC loss, which leads to low efficiency. Therefore, inductance per DC resistance (L/R_DC) becomes an important factor in describing the efficiency of inductors. In order to increase the L/R_DC value, high-permeability magnetic materials can be used as the cores of inductors (enhancing the inductance).

Without suitable designs, inductors cannot utilize the benefits brought by the magnetic materials with superior properties. Each inductor topology has its own advantages and disadvantages. Therefore, suitable inductor designs are needed to achieve high inductance, high current handling, and low DC resistance.

FIGS. 17(a)-17(c) shows a 3D view of a designed one-turn magnetic-core power inductor with a spiral design. Referring to FIGS. 17(a)-17(c), photolithography was performed on a copper clad with 18 μm of copper on both sides and a 200 μm substrate. Then, a piece of liquid crystal polymer (LCP) substrate was patterned with a cavity in order to hold the magnetic composite placing it above and below the copper winding.

Another design was a four-side structure as seen in FIG. 18, where the magnetic loop was attempted to be closed. This was necessary due to magnetic leakage on the sides of the structure in FIGS. 17(a)-17(c). The process starts by using a milling machine to remove one of the copper layers of the copper clad. Then, this copper clad is patterned using an ultraviolet (UV) laser with a resolution of 30 μm. The sample is shown in FIG. 18.

The next step is to implement the magnetic composite. Small pieces of magnetic core were cut and placed manually around the one-turn copper trace. However, one of the main challenges remained that in simulations the inductance density requirement was achieved assuming this is a perfect closed-loop magnetic flux structure. Also, it is not as cost effective to place the side cores if it actually was manufactured on a large scale. During testing, the inductance density was not met mainly due to small separations between the core pieces, which created magnetic flux leakage.

In order to build solenoids, an 18 μm copper tape was used that could be patterned using a laser. Thin strips (0.25 mm) were cut and wrapped around the two types of magnetic composites. One of the main challenges is to meet the DC resistance, which can be optimized with via filling or photolithography for the copper windings. In addition to this, a new magnetic structure was required to surpass the inductance density and meet current handling requirements. This was performed in hand with the implementation of a magnetic paste.

FIG. 19(a) shows an image of a solenoid structure wrapped around a core with a closed loop (with a magnetic paste). FIG. 19(b) shows a spiral structure with a magnetic core with a magnetic paste. The paste was synthesized by using Novamet's permalloy flakes. This was chosen due to its lower coercivity of 10 Oe compared to nickel and stainless steel flakes that show values in the range of 62 Oe to 123 Oe. The magnetic saturation was equal to 42×10⁻³ electromagnetic units (emu), and its remanent magnetization was 7×10⁻³ emu. This was combined with EC-9519 encapsulant by Engineered Materials Systems; EC-9519 is a UV curable surface mount device encapsulant with a viscosity of 4000 centipoise (cps) with a cure of 450 Joules per square centimeter (J/cm²) and a resistance of more than 1000 megaOhms (MΩ). 3.2 grams (g) of magnetic powder and 0.72 g of epoxy were mixed to achieve a 40% magnetic powder solution (volume/volume (v/v)). The magnetic powder density was 8 grams per cubic centimeter (g/cc), and the epoxy density was 1.2 g/cc.

The purpose of this mixture was to act as a magnetic filler to eliminate airgaps and close the magnetic loop, seal magnetic layers, and reduce power losses at high frequencies. The cross-sectional area of the flakes can reduce eddy current losses. Results on inductance performance over frequency showed enhancement in inductance. In FIG. 19(a), the paste was placed on the edges of the upper and lower core, while in the spiral (FIG. 19(b)), the paste was spread all over between the copper trace and bottom magnetic layer to allow adhesion between the two magnetic layers.

Inductance as a function of frequency was characterized for the inductors using a vector network analyzer (VNA). The characterization set-up is shown in FIG. 20(b). The set-up included three parts: sample; connection; and signal generator. The signal generator, which is the VNA, generates AC signals with frequencies ranging from 0.1 MHz to 10 MHz. The two inductor pads are connected to the ground and signal ports of the SubMiniature version A (SMA) connectors using long connection wires. Later, the long thin wires and solder device under test (DUT) was moved directly on the SMA connector. The AC signal travels from the signal port to the inductor and returns from ground port to the VNA.

In order to measure the accurate inductance of the DUT, the inductance of the two connection wires also need to be measured by the VNA with de-embedding structures. These de-embedding structures are necessary for accurate measurements. De-embedding structures have three parts, known as open, short, and load. The function of the three de-embedding structures is to remove the effect of the parasitic from the two connecting wires and allow the VNA to solely measure the inductance from inductor. FIG. 21 shows the de-embedding structures with open, short, and load. This is applied when samples are attached to the wires.

However, when directly connected to the SMAs, the calibration process is performed with probes.

With the de-embedding structures, the inductance for inductors can be calculated after subtracting the inductance from connection wires. Without using the de-embedding structures, the measured inductance is sum of the inductance from connection wires and the inductance from inductors (L_inductor=L_load−L_short). Using this formula, L_inductor is calculated for all the different structures (structure 1, structure 2, structure 3, and so on . . . ). For the comparison between different structures, the ‘X’ factor is calculated that represent how many more times the inductance is higher than its baseline (L_{inductor(Air core)}), which is structure 1 for the solenoid topology.

$L_{\mathrm{inductor}\left(\mathrm{structure}1\right)}=L_{\mathrm{load}1}-L_{\mathrm{Shor}1}$ $L_{\mathrm{inductor}\left(\mathrm{structure}2\right)}=L_{\mathrm{load}2}-L_{\mathrm{Short}2}$ $L_{\mathrm{inductor}\left(\mathrm{structure}3\right)}=L_{\mathrm{load}3}-L_{\mathrm{Short}3}$ $X_{21}=\frac{L_{\mathrm{inductor}\left(\mathrm{structure}2\right)}}{L_{\mathrm{inductor}\left(\mathrm{structure}1\right)}}$ where X₂₁=number of times inductance of structure ‘2’ is higher than its baseline (Air core, structure ‘1’).

$X_{31}=\frac{L_{\mathrm{inductor}\left(\mathrm{structure}3\right)}}{L_{\mathrm{inductor}\left(\mathrm{structure}1\right)}}$

where X₃₁=number of times inductance of structure ‘3’ is higher than its baseline (Air core, structure ‘1’). FIG. 22 provides an overview of the solenoid open-flux path structures and the information is summarized in the table in FIG. 33 (top portion is for solenoids with an open flux path and bottom portion is for solenoids with a closed flux path).

Four different design structures were used for spirals. The use of magnetic paste was implemented in two of the spiral structures to enhance the permeability of the core. Further information can be seen in FIG. 16 (right side). The table in FIG. 34 (for spirals) also shows information on the spiral structures.

FIG. 23(a) shows a plot of inductance (in nH) versus frequency (in MHz) for solenoid structures 2 and 3; and FIG. 23(b) show a plot of inductance (in nH) versus frequency (in MHz) for spiral structures 4 and 5. These graphs show how the inductance performs over the frequency range from 0.1 MHz-10 MHz for these structures.

FIG. 24 shows modified solenoid structures 2a (modified version of structure 2) and 3a (modified version of structure 3). The modified solenoids structures with closed magnetic circuit showed high inductance (more than ×10) as compared to their corresponding solenoids with open flux path. In terms of current handling, up to 3 A there is a negligible decrease in inductance for both structures, as shown in the plots in FIGS. 25(a) (for 2a) and 25(b) (for 3a). One of the desired requirements is to meet the 10 A within an area of 10-15 mm² or lower (1 A/mm²). Simulations using Ansys Maxwell confirm this requirement is met, as shown in FIG. 26 for structure 3a. The current and inductance density requirements are met. One possibility to consider is to decrease the size of the sample in order to use the same setup from FIGS. 20(a)-20(c). This is due to the capabilities using a bias tee that can be used up to 3 A. Thus, by decreasing the sample to 3 mm² and inputting 10 A, it can be confirmed that the magnetic structure can sustain 3 A with an area of no more than 3 mm², or 1 A/mm².

Example 5

Toroid inductors have the lowest reluctance because of the closed magnetic loop. With a few turns, enough inductance can be created with this low reluctance. However, the flux can easily saturate the magnetic core. In order to inhibit or prevent the saturation, airgaps can be introduced. In equations TR1-TR5 below, i_sat is saturation current; Nis number of turns; R is the reluctance, R_g is the reluctance from airgap, R_m is the reluctance from the magnetic core, and a is defined as effective reluctance enhancement factor with air-gap. Even though the reluctance is defined as Amp/(Henry×Amp) or (1/Henry), it is represented here as (α×length parameter/permeability of air). For simplicity, effective reluctance or simply reluctance is considered as just the length parameter in microns (μm) as the dimensionless permeability is considered. The reluctance can be tuned from 5 μm to hundreds of μm to achieve the target current-handling and inductance density. The saturation current is calculated as

$\begin{array}{cc}{i}_{\mathrm{sat}}=\frac{\mathrm{\Phi ℛ}}{N}=\frac{B_{\mathrm{sat}}{A}_g\left({ℛ}_m+{ℛ}_g\right)}{N}=\frac{B_{\mathrm{sat}}\alpha \left(L_g\right)}{{\mu }_{g}N}& \left(\mathrm{Equation}:\mathrm{TR1}\right)\end{array}$ $\begin{array}{cc}\mathrm{Reluctance}={ℛ}_m+{ℛ}_g=\frac{\left(L_c\right)}{{\mu }_c}+\frac{\left(L_g\right)}{{\mu }_g}=\frac{\alpha \left(L_g\right)}{{\mu }_g}& \left(\mathrm{Equation}:\mathrm{TR2}\right)\end{array}$ $\begin{array}{cc}{i}_{\mathrm{sat}}=\frac{1.5e12\frac{\mathrm{HA}}{{\mathrm{micron}}^2}\mathrm{width}\times t\alpha \left(l\mathrm{microns}\right)}{\begin{array}{ccc}N& 1.256e12\frac{H}{\mathrm{micron}}& \mathrm{width}\times t\end{array}}& \left(\mathrm{Equation}:\mathrm{TR3}\right)\end{array}$ $\begin{array}{cc}{i}_{\mathrm{sat}}=\frac{\begin{array}{cc}1.5e12& \alpha \left(l\mathrm{microns}\right)\end{array}}{\begin{array}{cc}N& 1.256e12\frac{H}{\mathrm{micron}}\end{array}}& \left(\mathrm{Equation}:\mathrm{TR4}\right)\end{array}$ $\begin{array}{cc}{i}_{\mathrm{sat}}=\frac{\begin{array}{ccc}1.2& \alpha & l\left(\mathrm{microns}\right)\end{array}}{N}& \left(\mathrm{Equation}:\mathrm{TR5}\right)\end{array}$

For a toroid of core length of about 9 mm of permeability 300 and airgap of 100 the reluctance is 80 microns from Equation TR2. FIG. 27 shows the saturation current for different reluctance values. Assuming a target of 10 A for 3 turns, the reluctance has to be 20 microns for the complete saturation of the core. This is when the whole core saturates and the permeability almost drops to 1. However, for 20% droop in inductance, it is estimated that the reluctance has to be 4 times higher. This leads to a reluctance target of 80 microns.

After the reluctance is known, the inductance can be estimated from Equation (TR6). The inductance is estimated to be 100 nH for 3 turns, when the cross-sectional area is 2000 microns×500 microns, as shown in FIG. 26. For three turns, estimating the copper length is 8 mm for a copper tape of 500 microns width and 50 micron thickness, the resistance is within the target of 5-10 mΩ. This coil design and toroid core thus meet all the requirements. The designs were then validated with measurements. A commercial magnetic core was cut into a 3 mm square core with a 1 mm cavity inside the core. Copper tape of 500 microns×50 microns was then wound around the toroid as shown in FIG. 29. Initial measurements showed the validation of this geometry as also shown in FIG. 29, thus validating the measurements.

$\begin{array}{cc}L=\frac{\mathrm{N\Phi }}{i}=\frac{N^2}{ℛ}=\frac{N^2}{\left({ℛ}_m+{ℛ}_g\right)}\sim \frac{A_g{\mu }_g{N}^2}{\alpha \left(L_g\right)}& \left(\mathrm{Equation}:\mathrm{TR6}\right)\end{array}$ $\begin{array}{cc}L=\frac{A_g{N}^2}{\mathrm{Effective}\mathrm{Reluctance}}& \left(\mathrm{Equation}:\mathrm{TR6}\right)\end{array}$

Example 6

Inductance enhancement (X) factor for different structures of inductors were calculated and are summarized in the table in FIGS. 35 (spirals), 36 (toroids), and 37 (solenoids with open flux path in the top portion and solenoids with closed flux path in the lower portion). Inductance densities of at least 8 nH/mm² and current densities of at least 1 A/mm² were achieved with stacked solenoid inductors of closed loop (bottom of the table in FIG. 37).

It should be understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application.

All patents, patent applications, provisional applications, and publications referred to or cited herein are incorporated by reference in their entirety, including all figures and tables, to the extent they are not inconsistent with the explicit teachings of this specification.

Claims

1. A method of fabricating a stacked magnetic core for an electrical component, the method comprising: performing an electroplating process under a magnetic field to form a first magnetic film on a plating carrier substrate;forming a first adhesive film on an upper surface of the first magnetic film;performing the electroplating process under the magnetic field to form a second magnetic film on the plating carrier substrate;forming a second adhesive film on an upper surface of the second magnetic film;removing the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on an interim substrate; andremoving the second magnetic film with the second adhesive film thereon from the plating carrier substrate and disposing it on the first adhesive film, forming the stacked magnetic core comprising the first magnetic film, the first adhesive film on the first magnetic film, the second magnetic film on the first adhesive film, and the second adhesive film on the second magnetic film,the first magnetic film being electrically insulated from the second magnetic film by the first adhesive film,the performing of the electroplating process comprising performing the electroplating process in an electroplating bath having a rectangular frame disposed around the electroplating bath,the rectangular frame comprising a first side, a second side perpendicular to the first side, a third side parallel to the first side, and a fourth side parallel to the second side,each of the first side and the third side being longer than each of the second side and the fourth side,the first side comprising a first hard magnet,the second side comprising a first soft magnet,the third side comprising a second hard magnet,the fourth side comprising a second soft magnet.

2. The method according to claim 1, further comprising removing the first magnetic film, the first adhesive film, the second magnetic film, and the second adhesive film from the interim substrate.

3. The method according to claim 1, a footprint of the stacked magnetic core being 10 mm2 or less.

4. The method according to claim 1, the stacked magnetic core being configured to be used in an inductor having an inductance density of at least 5 nanohenries per square millimeter (nH/mm2).

5. The method according to claim 1, the stacked magnetic core having a coercivity of no more than 1 Oersted (Oe).

6. The method according to claim 1, the first magnetic film and the second magnetic film each being an alloy of nickel, iron, and optionally cobalt.

7. The method according to claim 1, a thickness of the first adhesive film, measured in a first direction perpendicular to the upper surface of the first magnetic film, being in a range of from 0.05 micrometers (μm) to 5 μm, and a thickness of the second adhesive film, measured in the first direction, being in a range of from 0.05 μm to 5 μm.

8. The method according to claim 7, the thickness of the first adhesive film, being in a range of from 0.1 μm to 1 μm, and the thickness of the second adhesive film, being in a range of from 0.1 μm to 1 μm.

9. The method according to claim 1, a thickness of the first magnetic film, measured in a first direction perpendicular to the upper surface of the first magnetic film, being in a range of from 0.05 μm to 5 μm, and a thickness of the second magnetic film, measured in the first direction, being in a range of from 0.05 μm to 5 μm.

10. The method according to claim 9, the thickness of the first magnetic film, being in a range of from 0.5 μm to 2 μm, and the thickness of the second magnetic film, being in a range of from 0.5 μm to 2 μm.

11. The method according to claim 1, the first hard magnet and the second hard magnet being disposed such that they have a same North-South orientation as each other.

12. The method according to claim 1, each of the first soft magnet and the second soft magnet being a soft stainless steel magnet.

13. The method according to claim 1, the removing of the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on an interim substrate being performed before the performing of the electroplating process to form the second magnetic film on the plating carrier substrate.

14. The method according to claim 1, the performing of the electroplating process comprising disposing a mask on the plating carrier substrate before forming the first magnetic film and before forming the second magnetic film, such that the respective magnetic film is formed on the plating carrier substrate only where the mask is absent, and the method further comprising removing the mask before removing first magnetic film from the plating carrier substrate and removing the mask before removing second magnetic film from the plating carrier substrate.

15. A method of fabricating a stacked magnetic core for an electrical component, the method comprising: a) forming a plurality of magnetic film-insulating film pairs, each magnetic film-adhesive film pair comprising an adhesive film disposed on an upper surface of a magnetic film, on a plating carrier substrate by performing an electroplating process under a magnetic field to form the respective magnetic film on the plating carrier substrate and then forming the respective adhesive film on an upper surface of the magnetic film;b) removing each magnetic film-adhesive film pair on its own, independently of the other magnetic film-adhesive film pairs; andc) disposing each magnetic film-adhesive film pair on an interim substrate to form the stacked magnetic core comprising a stacked structure of the plurality of magnetic film-adhesive film pairs,the magnetic film of each magnetic film-adhesive film pair being electrically insulated from the magnetic film of each other magnetic film-adhesive film pair by its adhesive film and the adhesive film of the magnetic film-adhesive film pair with which it is in direct contact,a footprint of the stacked magnetic core, measured in a first plane having the upper surface of the magnetic film of each magnetic film-adhesive film pair, being 10 square millimeters (mm2) or less,steps a), b), and c) being performed in an automated, roll-to-roll process,the performing of the electroplating process in step a) comprising performing the electroplating process in an electroplating bath having a rectangular frame disposed around the electroplating bath,the rectangular frame comprising a first side, a second side perpendicular to the first side, a third side parallel to the first side, and a fourth side parallel to the second side,each of the first side and the third side being longer than each of the second side and the fourth side,the first side comprising a first hard magnet,the second side comprising a first soft magnet,the third side comprising a second hard magnet,the fourth side comprising a second soft magnet,the first hard magnet and the second hard magnet being disposed such that they have a same North-South orientation as each other.

16. The method according to claim 15, further comprising removing the plurality of magnetic film-adhesive film pairs from the interim substrate, a thickness of the adhesive film of each magnetic film-adhesive film pair, measured in a first direction perpendicular to the upper surface of the magnetic film of the magnetic film-adhesive film pair, being in a range of from 0.05 micrometers (μm) to 5 μm, anda thickness of the magnetic film of each magnetic film-adhesive film pair, measured in the first direction, being in a range of from 0.05 μm to 5 μm.

17. A method of fabricating a stacked magnetic core for an electrical component, the method comprising: a) forming a plurality of magnetic film-insulating film pairs, each magnetic film-adhesive film pair comprising an adhesive film disposed on an upper surface of a magnetic film, on a plating carrier substrate by performing an electroplating process under a magnetic field to form the respective magnetic film on the plating carrier substrate and then forming the respective adhesive film on an upper surface of the magnetic film;b) removing each magnetic film-adhesive film pair on its own, independently of the other magnetic film-adhesive film pairs;c) disposing each magnetic film-adhesive film pair on an interim substrate to form the stacked magnetic core comprising a stacked structure of the plurality of magnetic film-adhesive film pairs; andd) removing the plurality of magnetic film-adhesive film pairs from the interim substrate,the magnetic film of each magnetic film-adhesive film pair being electrically insulated from the magnetic film of each other magnetic film-adhesive film pair by its adhesive film and the adhesive film of the magnetic film-adhesive film pair with which it is in direct contact,a footprint of the stacked magnetic core, measured in a first plane having the upper surface of the magnetic film of each magnetic film-adhesive film pair, being 1 square millimeters (mm2) or less, andsteps a), b), and c) being performed in an automated, roll-to-roll process or in a parallel process,a thickness of the adhesive film of each magnetic film-adhesive film pair, measured in a first direction perpendicular to the first plane, being in a range of from 0.1 micrometers (μm) to 1 μm, anda thickness of the magnetic film of each magnetic film-adhesive film pair, measured in the first direction, being in a range of from 0.5 μm to 2 μm,the performing of the electroplating process in step a) comprising performing the electroplating process in an electroplating bath having a rectangular frame disposed around the electroplating bath,the rectangular frame comprising a first side, a second side perpendicular to the first side, a third side parallel to the first side, and a fourth side parallel to the second side,each of the first side and the third side being longer than each of the second side and the fourth side,the first side comprising a first hard magnet,the second side comprising a first soft magnet,the third side comprising a second hard magnet,the fourth side comprising a second soft magnet,the first hard magnet and the second hard magnet being disposed such that they have a same North-South orientation as each other,each of the first soft magnet and the second soft magnet being a soft stainless steel magnet,the performing of the electroplating process in step a) further comprising disposing a mask on the plating carrier substrate before forming the respective magnetic film, such that the respective magnetic film is formed on the plating carrier substrate only where the mask is absent, and removing the mask before removing the respective magnetic film from the plating carrier substrate,the stacked magnetic core bring configured to be used in an inductor having an inductance density of at least 10 nanohenries per square millimeter (nH/mm2),the stacked magnetic core having a coercivity of no more than 1 Oersted (Oe),the magnetic film of each magnetic film-adhesive film pair being an alloy of nickel, iron, and optionally cobalt, andthe adhesive film of each magnetic film-adhesive film pair being a polymer adhesive film or a metal-polymer composite film.

18. A method of fabricating a stacked magnetic core for an electrical component, the method comprising: performing an electroplating process under a magnetic field to form a first magnetic film on a plating carrier substrate;forming a first adhesive film on an upper surface of the first magnetic film;performing the electroplating process under the magnetic field to form a second magnetic film on the plating carrier substrate;forming a second adhesive film on an upper surface of the second magnetic film;removing the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on an interim substrate; andremoving the second magnetic film with the second adhesive film thereon from the plating carrier substrate and disposing it on the first adhesive film, forming the stacked magnetic core comprising the first magnetic film, the first adhesive film on the first magnetic film, the second magnetic film on the first adhesive film, and the second adhesive film on the second magnetic film,the first magnetic film being electrically insulated from the second magnetic film by the first adhesive film, andeach of the first adhesive film and the second adhesive film being a polymer adhesive film or a metal-polymer composite film.