Patent Application
20200290081
Described herein are methods of manufacturing an electrostatic chuck (ESC) in which at least a portion of the ESC is formed using spin coating or spraying techniques to deposit layers of the ESC on a handle.
With reference to
Conventional means for manufacturing an ESC having the configuration described above generally include using tape casting techniques to form the multiple layers of dielectric material on the handle. With reference to
Multiple issues arise out of the use of tape casting to manufacture portions of an ESC. The overall time required to manufacture an ESC is relatively long due to the slow nature of building up the chuck body using tape casting techniques. The tape casting process is also relatively complex. As such, the overall yield using these techniques is low, and the cost is relatively high.
Accordingly, a need exists for improved ESC manufacturing methods that resolve or mitigate some or all of the above described problems.
Described herein are various embodiments of a method for manufacturing electrostatic chucks. In some embodiments, the method includes depositing at least one layer of a first dielectric material on a handle using spin coating and/or direct spraying, depositing a functional electric layer on the at least one layer of first dielectric material, and depositing at least one layer of a second dielectric material on the functional electric layer using spin coating and/or direct spraying. Additional optional steps, such as depositing a mechanical dielectric layer on the at least one layer of second dielectric material and patterning the mechanical dielectric layer, may also be carried out. In some embodiments, the material of the handle is Al2O3, AlN or Y2O3. In some embodiments, the first dielectric material and the second dielectric material are the same dielectric material, and the dielectric material is a material having a high dielectric constant. In some embodiments, the material of the mechanical dielectric layer is the same material as the handle.
With reference to
In step 310, at least one layer of a first dielectric material is deposited on a handle using spin coating and/or direct spraying. Spin coating techniques generally call for a small amount of liquid dielectric material to be applied to the center of the handle, followed by rotating the handle at relatively high speeds in order to spread the liquid dielectric material by centrifugal force. Any apparatus known to be suitable for carrying out spin coating (e.g., a spin coater or a spinner) may be used. Similarly, any suitable rotating speed that causes the dielectric material to spread may be used. The amount of material applied to the center of the handle is not limited and is generally determined based on the desired thickness of the layer being formed on the handle. In the event multiple layers of first dielectric material are deposited on the handle, the first layer is deposited directly on the handle using spin coating, and subsequent layers are formed on the preceding layer of dielectric material using spin coating.
Direct spraying may generally be carried out using a spray gun. The spray gun is loaded with the liquid dielectric material and is then used to spray the liquid dielectric material directly onto the handle (or preceding layer of dielectric material when multiple layers are deposited). The direct spraying is generally carried out such that the layer of material deposited has a uniform thickness.
Regardless of whether spin coating or direct spraying is used, the deposited layer will generally be cured after deposition in order to harden the material. Any suitable curing technique and parameters may be used. In some embodiments, the deposited material is cured by heating the material at a temperature of 600° C. or higher.
When multiple layers of first dielectric material are deposited, the deposition method may be exclusively spin coating, exclusively direct spraying, or some layers may be deposited using spin coating while other layers are deposited using direct spraying.
The first dielectric material is generally not limited and may be any material known to be suitable for use as the chuck body of an ESC. In some embodiments, the first dielectric material is a dielectric material having a dielectric constant higher than 3. In some embodiments, the first dielectric material having a dielectric constant higher than 3 is a siloxane-based material. Such dielectric materials may further include a metal oxide component, such as Al2O3. However, a metal oxide component is not required. The high dielectric constant dielectric material can be made up of an oxide, nitride, boride, carbide or fluoride of any combination of yttrium, iridium, scandium, erbium, hafnium, silicon carbide, zirconium oxide, or any lanthanoid. However, such compounds are not required.
The handle (also sometimes referred to as a plate or base plate) on which the first layer of first dielectric material is deposited may be made of any material known to be suitable for use as a handle of an ESC. In some embodiments, the material of the handle is a ceramic material. Exemplary ceramic materials include, but are not limited to, Al2O3, AlN and Y2O3. Other suitable materials can be glass or silicon.
Step 310 is carried out until the desired thickness of the first portion of the ESC is obtained. The desired thickness can be reached by depositing a single layer of first dielectric material having the desired thickness or by depositing multiple layers of the first dielectric material such that the thickness of the individual layers adds up to the desired overall thickness.
After a desired thickness has been reached, step 320 is performed, in which a functional electric layer is deposited on the layer or layers of first dielectric material. Any material known to be suitable for use as a functional electric layer in an ESC can be used. In some embodiments, the material is a metal material. The thickness of the metal layer is generally not limited and can be selected based on the electrical component being formed. The manner of forming the electrical layer can be, for example, via known PVD methods or by screen printing. The electric layer can be patterned as desired using any known patterning techniques.
After the functional electric layer has been deposited on the layer or layers of first dielectric material, step 330 is performed, in which at least one layer of a second dielectric material is deposited on top of the functional electric layer. The at least one layer of second dielectric material is deposited on the functional electric layer using the same spin coating and/or direct spraying techniques as described above with respect to step 310. As with step 310, a single layer or multiple layers of second dielectric material can be deposited, so long as the desired thickness of the second portion of the chuck body is achieved. In some embodiments, the second dielectric material is the same as the first dielectric material.
In some embodiments, steps 310, 320 and 330 may be repeated more than once such that the ESC includes multiple functional electric layers sandwiched between dielectric layers.
Optional additional manufacturing steps can be carried out after completion of steps 310, 320 and 330. For example, in some embodiments, a mechanical dielectric layer is formed on top of the at least one layer of second dielectric material. This mechanical dielectric layer serves as a sort of cap to the ESC structure. Any manner of depositing the mechanical dielectric layer on the at least one layer of second dielectric material can be used, including deposition via plasma spray, PVD, or a bonding process using ultra thin material. The material of the mechanical dielectric layer is not limited. In some embodiments, the mechanical dielectric layer is the same material as the handle. Thus, for example, when the handle is made from Al2O3, AlN or Y2O3, the mechanical dielectric material can be made from the same Al2O3, AlN or Y2O3 material.
In embodiments where a mechanical dielectric layer is employed, the manufacturing method can further include a patterning step wherein the mechanical dielectric layer is patterned based on the desired application. Any suitable patterning techniques can be used, such as subtractive manufacturing. In a specific example, CNC grinding can be used to form helium channels, mesas, etc. on top of which the wafers can rest during use of the ESC.
With reference to
The ESC manufacturing methods described herein can provide numerous benefits over previously known ESC manufacturing methods. For example, the disclosed method utilizing spin coating and/or spraying reduces manufacturing costs as compared to methods that employ tape casting. Additionally, the ESC produced by manufacturing methods described herein may also have improved characteristics as compared to an ESC manufactured by previously known methods. For example, the ESC produced by the methods described herein may provide increased clamp force, reduced ESC voltage (which reduces electrostatic particle attraction), reduced electron mobility to improve chucking and dechucking performance at high temperatures, reduced or eliminated residual charging (which is also related to improved chucking and dechucking performance at high temperatures), increased operating temperatures, increased thermal response, and/or high heat flow.
From the foregoing, it will be appreciated that specific embodiments of the invention have been described herein for purposes of illustration, but that various modifications may be made without deviating from the scope of the invention. Accordingly, the invention is not limited except as by the appended claims.
This application claims the benefit of U.S. Provisional Application No. 62/816,687, entitled “METHODS OF MANUFACTURING ELECTROSTATIC CHUCKS,” filed on Mar. 11, 2019, which is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 62816687 | Mar 2019 | US |
