Claims
- 1. A method of making an electrical switching device comprising forming an electrically non-conductive material into a substantially planar, relatively rigid body surrounding a stiff but relatively flexible portion protruding to one side of the plane of said body and having a thickness less than that of said body; forming an opening in said flexible portion; filling said opening with a module of uncured, heat curable, electrically non-conductive resin having a plurality of electrically conductive particles dispersed therein; and heating said module to a temperature and for a period of time sufficient to cure said resin and form an electrically conductive member supported by said flexible portion.
- 2. The method according to claim 1 wherein said module is compacted while heated to an extent to render it electrically conductive.
- 3. The method according to claim 1 wherein the heating of said module is effected by passing an electric current therethrough.
- 4. The method according to claim 1 wherein the heating of said module is effected by inducing an electric current in said particles.
- 5. The method according to claim 4 wherein the induced current is of radio frequency.
- 6. The method according to claim 1 wherein the material forming said flexible portion has a liquification temperature and wherein said module is heated to a temperature at least as great as the liquification temperature of the material forming said flexible portion.
- 7. The method according to claim 1 wherein said resin is elastomeric.
- 8. The method according to claim 1 wherein said conductive member is resilient.
- 9. The method according to claim 1 wherein said module protrudes beyond both ends of said opening.
- 10. The method according to claim 1 wherein said flexible portion is substantially coniform and wherein said opening is formed at the apex of said coniform portion.
- 11. A method of making an electrical switching device comprising forming electrically non-conductive material into a non-conductive switch plate having a substantially planar body provided with a plurality of spaced apart, flexible protrusions deformed outwardly from the plane of said body and having a thickness less than that of said body; forming an opening in each of said protrusions; filling each of said openings with a module comprising an uncured, heat curable, non-conductive resin having a plurality of electrically conductive particles dispersed therein; and heating each of said modules to a temperature and for a period of time sufficient to cure said resin and form an electrically conductive member supported by its associated protrusion.
- 12. The method according to claim 11 wherein each of said modules is compacted while being heated to an extent to render it electrically conductive.
- 13. The method according to claim 11 wherein the heating of each of said modules is effected by passing an electric current therethrough.
- 14. The method according to claim 11 wherein the heating of each of said modules is effected by inducing an electric current in said particles.
- 15. The method according to claim 14 wherein the induced current is of radio frequency.
- 16. The method according to claim 11 wherein the material forming said protrusions has a liquification temperature and wherein each of said modules is heated to a temperature at least as great as the liquification temperature of said material.
- 17. A method of applying an electrically conductive member to a non-conductive support comprising forming an opening in said support; filling said opening with a module comprising an uncured, heat curable resin having a plurality of electrically conductive particles dispersed therein, said module projecting beyond at least one end of said opening; heating said resin at least to its curing temperature by inducing an electric current in said particles; and maintaining said current for a sufficient period of time to cure said resin.
- 18. The method according to claim 17 including subjecting said module to compressive force sufficient to render said module conductive as said resin is heated.
- 19. The method according to claim 17 wherein said support has a liquification temperature and including heating said resin to a temperature at least as great as said liquification temperature.
- 20. The method according to claim 17 wherein the induced current is of radio frequency.
RELATED APPLICATION
This application is a continuation in part of application Ser. No. 411,345, filed October 31, 1973, now U.S. Pat. No. 3,876,586 granted Apr. 22, 1975.
US Referenced Citations (8)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
411345 |
Oct 1973 |
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