Patent Grant
9236673
The subject matter herein relates generally to mezzanine header connectors.
Known mezzanine connectors mechanically and electrically interconnect a pair of circuit boards in a parallel arrangement. Typically, the mezzanine connector will engage both circuit boards to interconnect the circuit boards. For example, the mezzanine connector will be mounted to one of the circuit boards and will engage the other circuit board at a separable mating interface. The mezzanine connector typically uses deflectable spring beams at the separable mating interface. However, such interfaces require a significant amount of real estate and space because the spring beams require long beam lengths to achieve the required spring force and deformation range. Contact density of such mezzanine connectors is limited because of the separable mating interface. At least some known mezzanine connector systems utilize two mezzanine connectors, each mounted to a different circuit board and then mated together. Such systems can be complex and difficult to manufacture. For example, such mezzanine connectors have many contacts individually loaded into a housing, which may be difficult and time consuming to assemble. Furthermore, known mezzanine connectors suffer from signal performance limits due to the tight spacing of the contacts in the mezzanine connectors.
Thus, a need exists for a mezzanine connector assembly that provides a cost effective and reliable connection between circuit boards.
In one embodiment, a mezzanine header connector is provided including a plurality of header modules stacked side-by-side. The plurality of header modules include a plurality of contact assemblies and a plurality of housing frames holding corresponding contact assemblies. Each contact assembly includes a plurality of header contacts held by at least one dielectric holder. The header contacts have mating segments being exposed at a mating end of the dielectric holder for termination to corresponding receptacle contacts of a mezzanine receptacle connector. The header contacts have terminating segments extending from a mounting end of the dielectric holder for termination to a circuit board. Each of the header contacts extend along a linear path between the corresponding mating segment and the corresponding terminating segment. Each housing frame has walls defining pockets receiving corresponding header contacts of the contact assembly. The housing frame is conductive and provides shielding around the associated header contacts of the contact assemblies. The header contacts face associated walls with air separating the header contacts and the walls along a majority of the header contacts.
In another embodiment, a mezzanine header connector is provided including a plurality of header modules stacked side-by-side in a header module stack. The plurality of header modules include a plurality of contact assemblies and a plurality of housing frames holding corresponding contact assemblies. Each contact assembly includes a plurality of header contacts held by at least one dielectric holder. The header contacts have mating segments being exposed at a mating end of the dielectric holder for termination to corresponding receptacle contacts of a mezzanine receptacle connector and terminating segments extending from the mounting end of the dielectric holder for termination to a circuit board. Each of the header contacts extend along a linear path between the corresponding mating segment and the corresponding terminating segment. Each housing frame has walls defining pockets receiving corresponding header contacts of the contact assembly. The housing frame is conductive and provides shielding around the associated header contacts of the contact assemblies. A ground lattice is provided at an end of the header module stack. The ground lattice includes header ground shields discrete from the housing frames of the header modules. The header ground shields are mechanically and electrically coupled to associated housing frames. The header ground shields provide electrical shielding for the header contacts.
In a further embodiment, a mezzanine header connector is provided that includes a plurality of header modules stacked side-by-side each having a contact assembly and a housing frame holding the corresponding contact assembly. The contact assembly includes a pair of contact modules arranged back-to-back each having a dielectric holder holding a plurality of header contacts. The header contacts are arranged on opposite sides of the contact assembly to form differential pairs of header contacts. The dielectric holder extends between a mating end and a mounting end opposite the mating end. The dielectric holder has an inner side and an outer side. The header contacts have mating segments being exposed along the outer side at the mating end for termination to corresponding receptacle contacts of a mezzanine receptacle connector and terminating segments extending from the mounting end of the dielectric holder for termination to a circuit board. Each of the header contacts extend along a linear path between the corresponding mating segment and the corresponding terminating segment. The inner sides of the dielectric holders of the pair of contact modules abut against each other such that the header contacts face away from each other. The housing frame has a first side and a second side with a first chamber at the first side and a second chamber at the second side. The contact assemblies are positioned between housing frames of adjacent header modules such that a portion of each contact assembly is received in the first chamber of one housing frame and another portion of each contact assembly is received in the second chamber of the adjacent housing frame. The housing frames are conductive and provide shielding around the pairs of header contacts.
The circuit boards 106, 108 are interconnected by the header and receptacle connectors 102, 104 so that the circuit boards 106, 108 are substantially parallel to one another. The first and second circuit boards 106, 108 include conductors that communicate data signals and/or electric power between the header and receptacle connectors 102, 104 and one or more electric components (not shown) that are electrically connected to the circuit boards 106, 108. The conductors may be embodied in electric pads or traces deposited on one or more layers of the circuit boards 106, 108, in plated vias, or in other conductive pathways, contacts, and the like.
The mezzanine header and receptacle connectors 102, 104 separate the first and second circuit boards 106, 108 by a stack height 110, which is the combined height of the header and receptacle connectors 102, 104 when mated. In an exemplary embodiment, the mezzanine header connector 102 is scalable to adjust or change the stack height 110. For example, the stack height 110 may be varied by utilizing different mezzanine header connectors 102 having different heights. Differently sized header connectors 102 may be provided, defining a family of mezzanine header connectors 102. The different members of the family have different heights so the appropriate or desired stack height 110 may be achieved. The interfaces of the mezzanine header connectors 102 with the mezzanine receptacle connector 104 may be identical for all members of the family. Similarly, the interfaces of the mezzanine header connectors 102 with the first circuit board 106 may be identical for all members of the family such that only the mezzanine header connector 102 needs to be replaced to change the stack height 110, while the mezzanine receptacle connector 104 and circuit boards 106, 108 may be the same.
In an exemplary embodiment, the mezzanine header connector 102 is modular in design, having any number of modules or units stacked together to vary the number of conductors within the mezzanine header connector 102. The various modules or units may have different characteristics. For example, the modules or units may communicate data signals, may communicate electric power, or may communicate both data and power. Different modules or units may have different features that change the impedance of the signal conductors within such module or unit. For example, some or all of the modules or units may be designed for operation at 100 ohms. Some or all of the modules or unites may be designed for operation at 85 ohms. Some or all of the modules or units may be designed to operate at different impedance levels, such as 92 ohms.
The header modules 200, 202, 204 hold contact assemblies 210 each having a plurality of header contacts 212. The header modules 200, 202, 204 are stacked adjacent each other in abutting contact with each other to provide electrical shielding for the header contacts 212. In an exemplary embodiment, the header contacts 212 are arranged in pairs that carry differential signals. The header modules 200, 202, 204 surround the individual pairs of header contacts 212 and provide electrical shielding around each of the pairs of header contacts 212. In alternative embodiments, the header contacts 212 may carry single ended signals rather than differential signals. In other alternative embodiments, the header contacts 212 may carry power rather than data signals.
The header contacts 212 extend between a front 214 of the mezzanine header connector 102 and a rear 216 of the mezzanine header connector 102. The front 214 is configured to be mated with the mezzanine receptacle connector 104 (shown in
The mezzanine header connector 102 includes a plurality of front header ground shields 220 at the front 214 and a plurality of rear header ground shields 222 at the rear 216. The header ground shields 220, 222 may be inserted into the header modules 200, 202, 204 such that the header ground shields 220, 222 provide electrical shielding for the header contacts 212. The header ground shields 220, 222 may be electrically connected to one or more conductive surfaces of the header modules 200, 202, 204. The header ground shields 220, 222 are configured to be electrically connected to the mezzanine receptacle connector 104 and the first circuit board 106, respectively.
In an exemplary embodiment, the front header ground shields 220 define a front ground lattice 224 to provide shielding around multiple sides of each pair of header contacts 212. For example, the front header ground shields 220 may include both longitudinal components and lateral components that provide shielding between rows and columns of the header contacts 212, as explained in further detail below. The rear header ground shields 222 define a rear ground lattice 226 to provide shielding around multiple sides of each pair of header contacts 212. For example, the rear header ground shields 222 may include both longitudinal components and lateral components that provide shielding between rows and columns of the header contacts 212, as explained in further detail below.
In an exemplary embodiment, the mezzanine header connector 102 includes a pin organizer 230. The pin organizer 230 is configured to be coupled to the rear 216 of the mezzanine header connector 102. The pin organizer 230 includes a plurality of openings therethrough that receive corresponding pins of the header contacts 212 and/or the rear header ground shields 222. The pin organizer 230 holds the relative positions of the header contacts 212 and/or rear header ground shields 222 for mounting to the first circuit board 106 (shown in
Each contact module 240 includes a dielectric holder 242 that holds a plurality of the header contacts 212. In an exemplary embodiment, the dielectric holder 242 is overmolded over and/or around a leadframe 243 (shown in
Each dielectric holder 242 extends between a mating end 244 and a mounting end 246 opposite the mating end 244. The mating end 244 is configured to be mated with the mezzanine receptacle connector 104 (shown in
Each dielectric holder 242 has an inner side 248 and an outer side 250. The inner sides 248 of the pair of dielectric holders 242 abut against each other when the contact modules 240 are coupled together. The inner sides 248 may be generally flat allowing the inner sides 248 of the pair of dielectric holders 242 to sit flush with one another.
Each dielectric holder 242 includes posts 252 extending from the inner side 248 and openings 254 formed in the inner side 248. When the contact modules 240 are coupled together, the posts 252 are aligned with corresponding openings 254 in the other dielectric holder 242 and pressed into the openings 254 to securely couple the contact modules 240 together. For example, the posts 252 may be held in corresponding openings 254 by an interference fit. Other securing features may be used in alternative embodiments, such as fasteners, clips, latches, adhesives, and the like. In alternative embodiments, rather than both dielectric holders 242 including posts 252 and openings 254, one of the dielectric holders 242 may include the posts 252 while the other dielectric holder 242 may include the openings 254.
Each dielectric holder 242 may include pockets 256 open along the inner side 248. The pockets 256 may be filled with air. The pockets 256 may be aligned with the header contacts 212 to affect electrical characteristics, such as the impedance, of the signal or transmission lines defined by the header contacts 212. The length and proximity of the pockets 256 to the header contacts 212 may be selected to affect the impedance or other electrical characteristics.
Each dielectric holder 242 includes a plurality of rails 260 separated by gaps 262. Each rail 260 holds a corresponding header contact 212. The rails 260 are connected by connecting segments 264 that hold the positions of the rails 260 relative to one another. In an exemplary embodiment, the dielectric holder 242 is molded and the connecting segments 264 are formed by portions of the mold that allow the dielectric material to flow between the various rails 260. Any number of rails 260 may be provided depending on the particular application and the number header contacts 212 associated with the contact module 240. In the illustrated embodiment, four rails 260 are provided to support the four header contacts 212. The rails 260 extend along generally linear paths between the mating end 244 and the mounting end 246. At the mating end 244, the rails 260 define front support beams 266 that are cantilevered forward of the connecting segments 264. The front support beams 266 support portions of the header contacts 212. The front support beams 266 have ramped lead-ins 268 that lead to the header contacts 212. The lead-ins 268 prevent stubbing when the contact assembly 210 is mated with the mezzanine receptacle connector 104 (shown in
In an exemplary embodiment, the header contacts 212 are exposed along the outer side 250 of the dielectric holder 242. For example, the dielectric holder 242 is overmolded around the header contacts 212 such that side surfaces 270 of the header contacts 212 are flush with and exposed at the outer side 250.
In an alternative embodiment, rather than having two dielectric holders 242 arranged back-to-back, the contact assembly 210 may include a single dielectric holder 242. The single dielectric holder 242 may have header contacts 212 arranged along both sides, or alternatively along only one side.
With additional reference back to
The mating segments 272 are exposed along the outer side 250 at the mating end 244 for termination to corresponding receptacle contacts (not shown) of the mezzanine receptacle connector 104 (shown in
The terminating segments 274 extend from the mounting end 246 beyond a rear edge 278 of the dielectric holder 242 for termination to the first circuit board 106 (shown in
In the illustrated embodiment, the dielectric holder 242 includes caps 280 that extend over portions of the intermediate segments 276 to secure the header contacts 212 in the dielectric holder 242. Optionally, the caps 280 may be aligned with the connecting segments 264. The caps 280 may cover opposite ends of the intermediate segments 276, such as at the intersections of the intermediate segments 276 with the mating segments 272 and with the terminating segments 274. The caps 280 may be positioned proximate to the areas of the header contacts 212 that are trimmed or cut from the carrier 271 of the leadframe that initially holds the header contacts 212 together prior to overmolding.
With additional reference back to
In an exemplary embodiment, a length of the contact module 240 between the mating end 244 and mounting end 246 of the dielectric holder 242 is scalable to change a height of the mezzanine header connector 102 (shown in
In an exemplary embodiment, the dielectric material of the dielectric holder 242 may be selectable to change an impedance of the contact assembly 210. For example, for a given spacing between the header contacts 212, changing the dielectric material of the dielectric holder 242 may change the impedance of the transmission lines of the header contacts 212. For example, in a first embodiment, a first dielectric material having a dielectric constant of approximately 3.5 may be used to achieve a target impedance of approximately 100 ohms. In a second embodiment, a second and different dielectric material having a dielectric constant of approximately 5.1 may be selected to achieve a target impedance of approximately 85 ohms. The impedance may be changed without changing the geometry of the header contacts 212, but rather merely changing the dielectric material of the dielectric holder 242. Using a material having a higher dielectric constant lowers the impedance of the transmission lines of the header contacts 212. Different target impedance values may be achieved without any tooling change to the headers contacts 212 or the mold used to form the dielectric holder 242.
The middle header module 200 includes a housing frame 300 that receives and supports the contact assembly 210.
In an exemplary embodiment, the housing frame 300 includes a first chamber 314 (
In an exemplary embodiment, the first chamber 314 is divided into discrete pockets 318 by tabs 320 that extend into the first chamber 314. The tabs 320 are configured to be received in corresponding gaps 262 between the rails 260 of at least one of the contact modules 240. The tabs 320 provide electrical shielding between the header contacts 212 associated with the rails 260 received in the pockets 318 on opposite sides of the tabs 320. The tabs 320 define walls that are positioned between header contacts 212 of different pairs of the header contacts 212. The housing frame 300 includes interior walls 322 positioned at the interior of the first chamber 314. The interior walls 322 and associated tabs 320 surround the differential pairs of header contacts 212 to provide electrical shielding for the differential pairs of header contacts 212. The second chamber 316 may include similar tabs 320 and pockets 318.
The front header ground shields 220 are configured to be coupled to the front end 302 of the housing frame 300. For example, the housing frame 300 may include a slot or channel that receives the front header ground shields 220. Alternatively, at least some of the front header ground shields 220 may be embedded in the housing frame 300, such as by being overmolded by the housing frame 300. The rear header ground shields 222 are provided at the rear end 304 of the housing frame 300. Optionally, the rear header ground shield 222 may be molded into the rear end 304 such that portions of the housing frames 300 surround the rear header ground shield 222. Alternatively, the rear header ground shields 222 may be separate from the housing frame 300 and inserted into the housing frame 300. Mounting pins of the rear header ground shield 222 may extend beyond the rear end 304 for termination to the first circuit board 106 (shown in
The end header module 202 includes the housing frame 300 having the first chamber 314 at the first side 306; however the housing frame 300 of the end header module 202 does not include a second chamber at the second side 308. When the contact assembly 210 is loaded into the first chamber 314, a portion of the contact assembly 210 extends beyond the first side 306. Such portion of the contact assembly 210 is configured to be received in a middle header module 200 that is positioned adjacent to the end header module 202 (see, for example,
The end header module 204 includes the second chamber 316 at the second side 308; however, the end header module 204 does not include a first chamber at the first side 306. In contrast, the first side 306 defines an exterior of the mezzanine header connector 102 (shown in
The housing frames 300 of the middle header module 200 and the end header module 204 provide electrical shielding around each of the differential pairs of header contacts 212. Each of the pairs of the header contacts 212 is entirely circumferentially surrounded by conductive material of the housing frames 300 to provide 360° shielding along substantially the entire length of the header contacts 212. The contact assembly 210 is arranged in the housing frames 300 such that the side surfaces 270 of the header contacts 212 face the interior walls 322 of the housing frames 300 of the middle header module 200 and the end header module 204. The header contacts 212 are separated from the interior walls 322 by air gaps in the pockets 318.
In an exemplary embodiment, the pockets 318 have shoulders 330 at the corners between the tabs 320 and the interior walls 322. The dielectric holders 242 may abut against the shoulders 330 to locate the contact assembly 210 in the pockets 318. In an exemplary embodiment, the only dielectric material between the header contacts 212 and the housing frames 300 is air. Electrical characteristics of the transmission lines defined by the header contacts 212 may be adjusted by changing the spacing between the header contacts 212 in the interior walls 322. As noted above, electrical characteristics of the transmission lines of the header contacts 212 may be modified by selecting an appropriate dielectric material for the dielectric holders 242 between the header contacts 212. Changing the dielectric material allows the impedance of the header connector 102 to be tuned, such as for matching the impedance to a particular target value, such as 100 ohms, 85 ohms, 92 ohms, or another value.
In an exemplary embodiment, the contact assemblies 210 may be different from one another, such as having dielectric holders 242 that are made from different materials such that transmission lines of the header contacts 212 of different contact assemblies 210 may operate at different impedance levels. For example, the mezzanine header connector 102 may include a first set of contact assemblies 210, general identified at reference 340, and a second set of contact assemblies 210, generally identified at reference 342. The first set of contact assemblies 340 operate at a first impedance, while the second set of contact assemblies 342 operate at a second impedance. For example, the dielectric holders 242 of the first set of contact assemblies 340 are manufactured from a first material, while the dielectric holders 242 of the second set of contact assemblies 342 are manufactured from a second material different from the first material. The second material may have a dielectric constant less than a dielectric constant of the first material. In an exemplary embodiment, the shapes of the dielectric holders 242 of the first and second sets of contact assemblies 340, 342 are identical and the orientations of the header contacts 212 of the first and second sets of contact assemblies 340, 342 are identical. The only difference between the first and second sets of contact assemblies 340, 342 is that the material of the dielectric holders 242 is different, which changes the impedance of the transmission lines. In one particular example, the first set of contact assemblies 340 may be designed to operate at 85 ohms while the second set of contact assemblies 342 are designed to operate at 100 ohms. Optionally, approximately half of the contact assemblies 210 are within the first set of contact assemblies 340 and approximately half of the contact assemblies 210 are within the second set of contact assemblies 342. The impedance of the mezzanine header connector 102 may be approximately 92 ohms when the first set of contact assemblies 340 operates at 85 ohms and when the second set of contact assemblies 342 operates at 100 ohms. The mezzanine receptacle connector 104 may be designed to operate at 92 ohms, or may be split to operate at different impedance levels similar to the mezzanine header connector 102.
The mezzanine header connector 352 includes a first set of contact assemblies 210 identified generally by reference 356, a second set of contact assemblies 210 identified generally by reference 358; and a third set of contact assemblies 210 identified generally by reference 360. The first set of contact assemblies 356 includes header contacts 212a arranged in pairs and configured to carry differential pair data signals. The second set of contact assemblies 358 includes header contacts 212b that are configured to carry single ended data signals. The header contacts 212b of the second set of contact assemblies 358 may be arranged along both sides of the corresponding dielectric holder 242, or alternatively may be arranged on a single side of the dielectric holder 242. The header contacts 212c of the third set of contact assemblies 360 define power contacts 212c configured to carry power. The power contacts 212c may be sized and shaped differently than the signal contacts 212a, 212b of the first and second sets of contact assemblies 356, 358.
With reference back to
The sizes, shapes, and positions of the header ground shields 220, 222 may take many different forms in different embodiments. Examples of the header ground shields 220, 222 are described below with reference to
In an exemplary embodiment, the mezzanine header connector 102 includes both longitudinal header ground shields and lateral header ground shields that extend along columns and rows of the ground lattices 224, 226 between the pairs of header contacts 212 to provide electrical shielding for the header contacts 212.
A plurality of the lateral header ground shields 400 are arranged together as part of a common lateral header ground shield strip 402. The lateral header ground shield strip 402 may include any number of the lateral header ground shields 400. The lateral header ground shield strip 402 includes bridges 404 extending between adjacent lateral header ground shields 400. The widths of the bridges 404 control the lateral spacing of the lateral header ground shields 400. The lateral header ground shields 400 each include a mating end 406 and a frame end 408 opposite the mating end 406. The mating end 406 is configured to be mechanically and electrically coupled to a corresponding receptacle ground shield (not shown) of the mezzanine receptacle connector 104 (shown in
In the illustrated embodiment, the mating end 406 includes a blade 410 that is generally planar. The blade 410 is configured to be plugged into the mezzanine receptacle connector 104 during mating for electrical connection to the corresponding receptacle ground shield. In an exemplary embodiment, the lateral header ground shields 400 include fingers 412 extending from corresponding blades 410. The fingers 412 may be bent and angled out of the plane of the blade 410. The fingers 412 may be used to guide mating with the receptacle ground shields. Optionally, each blade 410 may include multiple fingers 412. Optionally, the fingers 412 may be angled in opposite directions, which may balance mating forces during mating. In an exemplary embodiment, the fingers 412 have different lengths such that the tips of the fingers 412 are at different distances from the blade 410. Having different length fingers 412 staggers the mating interfaces of the fingers 412 with the receptacle ground shields, which reduces the mating force for mating the mezzanine header connector 102 with the mezzanine receptacle connector 104.
The frame end 408 includes a tab 420 that is configured to be received in the corresponding housing frame 300 (shown in
A plurality of the longitudinal header ground shields 430 are arranged together as part of a common longitudinal header ground shield strip 432. The longitudinal header ground shield strip 432 may include any number of the longitudinal header ground shields 430. The longitudinal header ground shield strip 432 includes bridges 434 extending between adjacent longitudinal header ground shields 430. The widths of the bridges 434 control the longitudinal spacing of the longitudinal header ground shields 430. The longitudinal header ground shields 430 each include a mating end 436 and a frame end 438 opposite the mating end 436. The mating end 436 is configured to be mechanically and electrically coupled to a corresponding receptacle ground shield (not shown) of the mezzanine receptacle connector 104 (shown in
In the illustrated embodiment, the mating end 436 includes a blade 440 that is generally planar. The blade 440 is configured to be plugged into the mezzanine receptacle connector 104 during mating for electrical connection to the corresponding receptacle ground shield. In an exemplary embodiment, the longitudinal header ground shields 430 include fingers 442 extending from corresponding blades 440. The fingers 442 may be bent and angled out of the plane of the blade 440. The fingers 442 may be used to guide mating with the receptacle ground shields. Optionally, each blade 440 may include multiple fingers 442. Optionally, the fingers 442 may be angled in opposite directions, which may balance mating forces during mating. In an exemplary embodiment, the fingers 442 have different lengths such that the tips of the fingers 442 are at different distances from the blade 440. Having different length fingers 442 staggers the mating interfaces of the fingers 442 with the receptacle ground shields, which reduces the mating force for mating the mezzanine header connector 102 with the mezzanine receptacle connector 104.
The frame end 438 includes at least one tab 450 (two are shown for each longitudinal header ground shield 430 in the illustrated embodiment) that is configured to be received in the corresponding housing frame 300. The tabs 450 include projections 452 extending from the sides of the tabs 450. The projections 452 may dig into the housing frame 300 to hold the longitudinal header ground shield 430 in the housing frame 300 by an interference fit. The tabs 450 and/or the blade 440 may include interference bumps 454. The interference bumps 454 are configure to engage the housing frame 300 to hold the longitudinal header ground shield 430 in the housing frame 300 by an interference fit.
The longitudinal header ground shields 430 include channels 460 defined between adjacent longitudinal header ground shields 430. The longitudinal header ground shields 430 have beams 462 extending into the channels 460. The channels 460 are configured to receive corresponding lateral header ground shields 400 (shown in
The longitudinal header ground shield strips 432 are mechanically and electrically connected to each of the lateral header ground shield strips 402. Similarly, the lateral header ground shield strips 402 are mechanically and electrically connected to each of the longitudinal header ground shield strips 432. During assembly, when the longitudinal header ground shield strips 432 are loaded into the mezzanine header connector 102, the channels 460 receive portions of the lateral header ground shield strips 402. The longitudinal header ground strips 432 are loaded into the mezzanine header connector 102 until the longitudinal header ground shields 430 bottom out against the lateral header ground shields 400 and/or the housing frames 300.
In an exemplary embodiment, the longitudinal header ground shield strips 432 are used to absorb any mechanical tolerances of the stacked housing frames 300. For example, because the spacing between the channels 460 can be tightly controlled by stamping the longitudinal header ground shield strips 432, the reception of the lateral header ground shield strips 402 in the channels 460 properly spaces each of the lateral header ground shield strips 402 relative to the longitudinal header ground shield strips 432. As such, the housing frames 300, and thus the contact assemblies 210 held by the housing frames 300, are properly positioned. Optionally, the beams 462 may be deflectable to absorb tolerances and accommodate slight variations in the positions of the lateral header ground shield strips 402.
A plurality of the lateral header ground shields 500 are arranged together as part of a common lateral header ground shield strip 502. The lateral header ground shield strip 502 may include any number of the lateral header ground shields 500. The lateral header ground shield strip 502 includes bridges 504 extending between adjacent lateral header ground shields 500. The widths of the bridges 504 control the lateral spacing of the lateral header ground shields 500. The lateral header ground shields 500 each include a mating end 506 and a frame end 508 opposite the mating end 506. The mating end 506 is configured to be mechanically and electrically coupled to the circuit board 106 (shown in
In the illustrated embodiment, the mating end 506 includes a base 510 that is generally planar. The base 510 is configured to be, at least partially, received in the corresponding housing frame 300 (shown in
The frame end 508 includes at least one tab 520 defining part of, or extending from, the base 510. The tab 520 is configured to be received in the corresponding housing frame 300. The tab 520 includes at least one opening 522 extending therethrough. Portions of the corresponding housing frame 300 may be received in the opening 522 to secure the lateral header ground shields 500 in the housing frames 300. For example, when the housing frames 300 are overmolded over the lateral header ground shields 500, the material of the corresponding housing frame 300 may be molded into the opening 522. Optionally, channels 524 may be provided between tabs 520. The channels 524 may be aligned with the bridges 504.
A plurality of the longitudinal header ground shields 530 are arranged together as part of a common longitudinal header ground shield strip 532. The longitudinal header ground shield strip 532 may include any number of the longitudinal header ground shields 530. The longitudinal header ground shield strip 532 includes bridges 534 extending between adjacent longitudinal header ground shields 530. The widths of the bridges 534 control the longitudinal spacing of the longitudinal header ground shields 530. The longitudinal header ground shields 530 each include a mating end 536 and a frame end 538 opposite the mating end 536. The mating end 536 is configured to be mechanically and electrically coupled to the circuit board 106 (shown in
In the illustrated embodiment, the mating end 536 includes a base 540 that is generally planar. In an exemplary embodiment, the longitudinal header ground shields 530 include compliant pins 542 extending from corresponding bases 540. The compliant pins 542 may be eye-of-the-needle pins. The compliant pins 542 may be received in plated vias in the circuit board 106 to mechanically and electrically couple the longitudinal header ground shield strip 532 to the circuit board 106. Optionally, each base 540 may include multiple compliant pins 542.
The frame end 538 includes at least one tab 550 (two are shown for each longitudinal header ground shield 530 in the illustrated embodiment) that is configured to be received in the corresponding housing frame 300. The tabs 550 and/or the base 540 may include interference bumps 554. The interference bumps 554 are configured to engage the housing frame 300 to hold the longitudinal header ground shield 530 in the housing frame 300 by an interference fit.
The longitudinal header ground shields 530 include channels 560 with beams 562 extending into or along the channels 560. The channels 560 are configured to receive portions of corresponding lateral header ground shields 500 (shown in
The longitudinal header ground shield strips 532 are mechanically and electrically connected to each of the lateral header ground shield strips 502. Similarly, the lateral header ground shield strips 502 are mechanically and electrically connected to each of the longitudinal header ground shield strips 532. During assembly, when the longitudinal header ground shield strips 532 are loaded into the mezzanine header connector 102, the channels 560 receive portions of the lateral header ground shield strips 502. Similarly, the channels 524 (shown in
In an exemplary embodiment, the longitudinal header ground shield strips 532 are used to absorb any mechanical tolerances of the stacked housing frames 300. For example, because the spacing between the channels 560 can be tightly controlled by stamping the longitudinal header ground shield strips 532, the reception of the lateral header ground shield strips 502 in the channels 560 properly spaces each of the lateral header ground shield strips 502 relative to the longitudinal header ground shield strips 532. As such, the housing frames 300, and thus the contact assemblies 210 held by the housing frames 300, are properly positioned. Optionally, the beams 562 are deflectable to absorb tolerances and accommodate for slight variations in the positions of the lateral header ground shield strips 502.
The lateral header ground shields 500 and longitudinal header ground shields 530 making up the rear ground lattice 226 are mechanically and electrically connected to each other and to the housing frames 300. When the longitudinal header ground shield strips 532 are loaded into the mezzanine header connector 102, the channels 560 receive portions of the lateral header ground shield strips 502. The beams 562 (shown in
In an exemplary embodiment, each pair of header contacts 212 is entirely peripherally surrounded by corresponding lateral header ground shields 500 and longitudinal header ground shields 530. Each pair of header contacts 212 are electrically shielded from each other pair of header contacts 212 by the lateral header ground shields 500 and/or the longitudinal header ground shields 530. In the illustrated embodiment, the lateral header ground shields 500 and the longitudinal header ground shields 530 form a box around each pair of header contacts 212. Each box may be defined by two longitudinal header ground shields 530 on opposite sides of the box and two lateral header ground shields 500 on opposite sides of the box that are generally perpendicular to the longitudinal header ground shields 530. The rear ground lattice 226 is provided at the rear 216 of the mezzanine header connector 102 such that the rear header ground shields 222 provide peripheral electrical shielding for the terminating segments 274 of corresponding header contacts 212.
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. §112(f), unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
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