The present invention is generally directed to the field of optical coherence tomography (OCT) and Optical Coherence Domain Reflectometry (OCDR) systems. More specifically, it is directed to the use of micro-optics in the design/construction of low cost and/or compact OCT and OCDR systems.
There is a great need for compact, low cost Optical Coherence Tomography (OCT) and Optical Coherence Domain Reflectometry (OCDR) systems. An OCDR system measures optical scattering/reflectivity in a sample axially along an optical sampling beam, while an OCT system combines multiple such measurements along a direction orthogonal to the axial illumination to generate a cross-sectional image, or tomogram, of the sample. Typically, the sample is biological tissue, but may be other types of materials.
So far, there have been two primary approaches to achieving lower cost systems; redesign of classic “macroscopic” OCDR/OCT systems (e.g., bulk optic systems using discrete bulk optics and/or fiber optics) to reduce size and cost, and research into implementation of OCDR/OCT systems in semiconductor chips, so-called, “OCT-on-a-chip”. Redesign of the macroscopic OCDR/OCT systems, which generally consist of a set of components connected by fiber optics (e.g., light sources, splitters, etc.), has heretofore been unable to achieve the desired cost reduction goals because of the cost of the individual components and overall manufacturing cost of the system. “OCT-on-a-chip” systems, while having the potential to achieve the size and cost reduction goals, have prohibitively expensive non-recurring expenses (NRE), e.g., high initial investment costs, such as research and development into photonic integrated circuit (PIC) design and manufacturing, and investments into development and construction of large scale semiconductor chip (e.g., PIC) manufacturing facilities.
An alternative to photonic integrated circuits is the use of, so-called, micro optical benches or semiconductor optical benches. In a manner similar to a typical optical bench (or optical table or optical breadboard), which may be a straight rigid bar or base (typically marked with a scale) to which lenses, light sources, and other optical components can be attached, a micro optical bench is a substrate base (such as a ceramic bench or other base material) on which locations (e.g., cavities or pits) for receiving, or attaching, micro-optics are constructed.
The potential of micro optical benches in the construction of optical systems has been recognized. For example, light sources (e.g., swept source light sources) have been implemented on micro optical benches, and these light sources have been used in the construction of macroscopic (e.g., bulk-optic based) swept source OCT systems. In addition to providing swept source illumination light, micro optical benches have also been used to implement a k-clock interferometer which interferes a swept source light with itself with a small optical delay to generate a modulated signal that can be used either to trigger an OCT detection system, or to correct for non-linearities in the sweep rate of the swept source. An example of this implementation is described in Bart Johnson, Walid Atia, Seungbum Woo, Carlos Melendez, Mark Kuznetsov, Tim Ford, Nate Kemp, Joey Jabbour, Ed Mallon, Peter Whitney, “Tunable 1060 nm VCSEL co-packaged with pump and SOA for OCT and LiDAR,” Proc. SPIE 10867, Optical Coherence Tomography and Coherence Domain Optical Methods in Biomedicine XXIII, 1086706 (22 Feb. 2019); doi: 10.1117/12.2510395.
Semiconductor optical benches are constructed/grown on PIC-style substrates (e.g., single crystal silicon, or other semiconductor wafer). In addition to having openings on a surface (e.g., cavities or pits) for receiving discrete components, the semiconductor optical bench and may also include integrated circuits. Semiconductor optical benches have been employed in telecom applications (e.g., as optical transceivers). It is believed that the use of semiconductor optical benches may potentially enable reduced-size and cost-efficient LIDAR modules for autonomous vehicles. Nonetheless, to the best of the inventor's knowledge, semiconductor optical benches have not been used in the field of medical imaging or OCT.
It is an object of the present invention to reduce the cost and size of an OCT/OCDR system.
It is another object of the present invention to simplify the design and construction of an OCT/OCDR system, e.g., to minimize the use of fiber optics and maximize the use of micro-optics.
It is another object of the present invention to provide for parallelization of the OCT and integration of scanning into a compact design.
It is a further object of the present invention to simplify the calibration of OCT/OCDR systems.
The above objects are met in an OCT/OCDR system that identifies the advantages of constructing an OCT/OCDR system on a micro optical bench or semiconductor optical bench, and maximizes those advantages. The present invention achieves compact low-cost Optical Coherence Tomography (OCT) and Optical Coherence Domain Reflectometry (OCDR) systems using a micro or semiconductor optical bench. Both the micro optical bench and semiconductor optical bench may be described as a (typically stiff) base supporting and aligning (e.g., discrete) micro-optics, but the semiconductor optical bench is generally smaller than the micro optical bench and may differ in construction materials and manufacturing processes. A micro optical bench is typically a stiff carrier (such as a ceramic bench or other base material) that hosts several micro-optic elements, which are placed and often actively aligned by a robot. Typical lens diameters are in the range of 0.5 mm to 2.5 mm. A common package for housing a micro optical bench is the standard (e.g., 14-pin) butterfly package or a surface mount device (SMD) package (or other micro package/integrated circuit package). A semiconductor optical bench is typically smaller than the micro optical bench and consists of a (e.g., grown) substrate (e.g., a silicon wafer) having recessed openings (e.g., receptacles, cavities, or pits) on a surface, where the recessed openings are designed to receive and hold micro-optics, or other (e.g., discrete) components, at predefined (X, Y, Z) positions and orientations. This may eliminate (or reduce) the need for active alignment of the received components. Optionally in accord with the present invention, the semiconductor optical bench may also have integrated circuits (ICs) and/or photonic integrated optics, PICs, (e.g., integrated optical circuits) constructed/grown/built into/onto the semiconductor optical bench. Although the present application uses the term micro optical bench (or micro-bench) for the slightly larger, typically stiff-based and/or relaxed-alignment variant, as described above, to differentiate from the semiconductor optical bench, it is acknowledged that semiconductor optical benches have in the prior art sometimes been called micro-optic benches, as well.
Implementation of an OCT/OCDR on either a micro optical bench or semiconductor optical bench can replace the bulk optics and fiber optics of conventional, bulk optic (e.g., macroscopic) systems with micro-optics, greatly reducing cost. The semiconductor optical bench approach also eliminates the need for active alignment, much like the “OCT-on-a-chip” approach discussed above, and thus should be able to achieve costs similar to those expected of “OCT-on-a-chip”. Although the semiconductor optical bench concept may require more non-recurring expenses (NRE) than the micro optical bench approach, both approaches could be achieved with lower development effort from the current state of technology than the “OCT-on-a-chip” concepts, while still achieving greater cost reductions and reliability improvements as compared to the redesign of “macroscopic” OCDR/OCT systems. The micro optical bench approach also provides greater flexibility in the integration of components as the components do not need to be constructed from the chip material.
Some features/innovations of the present invention include implementation of an OCDR/OCT system on a micro optical bench or semiconductor optical bench with micro-components (e.g., micro-optics), and/or elimination of fiber optics. Bulk optic components (such as used for “macroscopic” or “bulk optic” OCDR/OCT systems) are expensive, and have additional significant costs associated with addressing issues of alignment between components. Fiber optics, while addressing many of the alignment challenges in bulk optic systems, reduce the stability of the system by adding temperature dependent and motion sensitive polarization effects, with variability in the fiber lengths complicating the design and manufacturing processes. The present approach (particularly using a semiconductor optical bench) permits the creation of reliable free space optics OCT/OCDR systems with minimal alignment/calibration issues.
Other objects and attainments together with a fuller understanding of the invention will become apparent and appreciated by referring to the following description and claims taken in conjunction with the accompanying drawings.
Several publications may be cited or referred to herein to facilitate the understanding of the present invention. All publications cited or referred to herein, are hereby incorporated herein in their entirety by reference.
The embodiments disclosed herein are only examples, and the scope of this disclosure is not limited to them. Any embodiment feature mentioned in one claim category, e.g. system, can be claimed in another claim category, e.g. method, as well. The dependencies or references back in the attached claims are chosen for formal reasons only. However, any subject matter resulting from a deliberate reference back to any previous claims can be claimed as well, so that any combination of claims and the features thereof are disclosed and can be claimed regardless of the dependencies chosen in the attached claims.
In the drawings wherein like reference symbols/characters refer to like parts:
An OCDR system measures optical scattering/reflectivity in a sample axially along an optical sampling beam, while an OCT system combines multiple such measurements along a direction orthogonal to the axial illumination to generate a cross-sectional image, or tomogram, of the sample. OCT angiography (OCTA) is an extension of OCT, and it identifies (e.g., renders in image format) blood flow in a tissue layer. OCTA may identify blood flow by identifying differences over time (e.g., contrast differences) in multiple OCT images of the same retinal region, and designating differences that meet predefined criteria as blood flow. Since OCDR, OCT, and OCTA are similar in construction and share many components, the present discussion focusses on OCT with the understanding that a person versed in the art would be able to apply the present discussion to OCDR and OCTA. It is to be understood that the present invention applies similarly to OCDR and OCTA, unless otherwise stated.
Generally, optical coherence tomography (OCT) uses low-coherence light to produce two-dimensional (2D) and three-dimensional (3D) internal views of biological tissue, or other sample. Examples of OCT systems are provided in U.S. Pat. Nos. 6,741,359 and 9,706,915, which are herein incorporated in their entirety by reference.
Irrespective of the type of beam used, light scattered from the sample (SctL) is collected. In the present example of
Reference light, RefL, derived from the same light source LtSrc1, travels with the sample light SLt until being split to a separate reference path (e.g., reference arm) by a light splitter LSpltr1, herein implemented as fiber coupler Cplr1. It is to be understood that different types of light splitters are known. The reference path involves optical fiber (Fbr2) and a retroreflector (RR1) with an adjustable optical delay. Those skilled in the art will recognize that a transmissive reference path can also be used and that the adjustable delay could be placed in the sample or reference arm of the interferometer. Collected light scattered from the sample (e.g., scattered light SctL returning from the sample arm) is combined with reference light RefL returning from the reference arm by a light combiner LCmbnr1, herein embodied by fiber coupler Cplr1. Again, it is to be understood that different types of light combining mechanisms are known in the art. The reference light RefL and scattered light SctL then travel together to OCT light detector Dtctr1 (e.g., photodetector array, digital camera, etc.), where interference between the reference light RefL and scattered light SctL generates the OCT signal, OS, which may be passed to an electronic processor Cmp1 (or computer system) that converts the observed interference into depth information of the sample. The depth information may be stored in a memory associated with the processor Cmp1 and/or displayed (e.g., as a scan image such as illustrated in
In the present example, the interference between reference light RefL and scattered light SctL occurs at the light combiner LCmbnr1 (implemented as fiber coupler Cplr1), but could also occur at an optical component between the light combiner LCmbnr1 and the detector Dtctr1. For example, if the reference light RefL and scattered light SctL had orthogonal polarization states when being combined by the light combiner LCmbnr1, then the interference could be generated by a polarizer (not shown) at forty-five degrees relative to the polarization states of RefL and SctL as described in U.S. Pat. No. 7,126,693B2, herein incorporated in its entirety by reference. For illustration purposes, the system 700b of U.S. Pat. No. 7,126,693B2 is herein reproduced as
Returning to
An example of a computing device (or computer system) is shown in
The sample and reference arms in the interferometer could consist of bulk-optics, fiber-optics, or hybrid bulk-optic systems and could have different architectures such as Michelson, Mach-Zehnder or common-path based designs as would be understood by those skilled in the art. Light beam as used herein may be any carefully directed light path. Instead of mechanically scanning the beam, a field of light can illuminate a one or two-dimensional area of the retina to generate the OCT data (see for example, U.S. Pat. No. 9,332,902; D. Hillmann et al, “Holoscopy—Holographic Optical Coherence Tomography,” Optics Letters, 36(13): 2390 2011; Y. Nakamura, et al, “High-Speed Three Dimensional Human Retinal Imaging by Line Field Spectral Domain Optical Coherence Tomography,” Optics Express, 15(12):7103 2007; Blazkiewicz et al, “Signal-To-Noise Ratio Study of Full-Field Fourier-Domain Optical Coherence Tomography,” Applied Optics, 44(36):7722 (2005)). In time-domain systems, the reference arm needs to have a tunable optical delay to generate interference. Typically, balanced detection systems are used in TD-OCT and SS-OCT systems, while spectrometers are used at the detection port for SD-OCT systems.
The present invention may be applied to any type of OCT/OCTA/OCDR system, such as those discussed above, but is herein fully or partially constructed onto a micro and/or semiconductor optical bench, or similar device having specially configured/shaped recesses, each designed to receive and hold a specific micro-optic device (or other (e.g., discrete) component) at a pre-specified position, and preferably at a pre-specified elevation and orientation. For ease of discussion, one or more features of the present invention are described as applied to a semiconductor optical bench with the understanding that the same feature(s) may apply to a micro optical bench, unless otherwise stated. Other fiducials common in lithographic processes could also be used for placement of the specific micro-optic devices at pre-specified positions. Various aspects of the invention could apply to any type of OCT/OCTA/OCDR system or other types of ophthalmic diagnostic systems and/or multiple ophthalmic diagnostic systems including but not limited to fundus imaging systems, visual field test devices, and scanning laser polarimeters.
In a SS-OCT system configuration using a light source with a long instantaneous coherence length, a variable delay (e.g., adjustment of the reference arm's optical path length in accordance with the depth/axial position of the sample region to be imaged, as described elsewhere herein) may not be necessary to position the sample within the (system's) depth imaging window. Instead, a large optical path length mismatch between reference and sample light may be tolerated. For example, a large imaging depth may be generated, large enough so that the sample would, in a typical imaging scenario, always be within the depth imaging window. The acquired image could then be cropped to only display a region of interest (e.g., a desired depth range). This region of interest may change dynamically during an acquisition for example to compensate for sample motion. This cropping approach however requires sufficiently fast digitization electronics (e.g., analog-to-digital converters) to resolve the high frequency interference signals corresponding to the maximum imaging depth, which can be difficult to achieve, particularly in a cost-effective manner, using stand-alone video cards, video capture cards, daughter boards, and other discrete components. However, high speed detection and/or digitizing electronics (circuitry) may be achievable by integrating the detection and/or digitizing electronics (circuitry) directly onto the same substrate/base as the semiconductor optical bench (or IC on the same substrate/base as the micro optical bench, e.g., in a manner similar to a system-on-chip, SOP, or integrated circuit board approach) on which the present OCT system is constructed. Higher operating speeds may be achieved at least in part due to the smaller traces (and optionally lower rail-to-rail voltage swings) associate with commonly integrated circuits, which avoid/mitigate the high frequency interference issues between long traces/lead lines/wires and the large capacitive loads, large signal propagation delays, and general timing issues associated with routing traces/lead lines/wires for interconnecting with external, discrete components.
Alternatively, one could downmix (or modulate or down-convert or frequency-mix or frequency-shift) the analog OCT signal with a frequency corresponding to one edge of the desired imaging window (either the minimum or maximum path length mismatch), thus creating a downmixed OCT signal with a spectral content corresponding to that obtained if one had adjusted the reference arm path length to this imaging depth. This downmixing would typically be achieved by frequency mixing of the OCT signal with the downmixing frequency to generate frequencies at the OCT signal plus or minus the downmixing frequency, and then filtering to remove (or select or isolate) the summed (or modulated or mixed or shifted) frequency. One may choose the downmixing frequency such that the zero frequency is slightly outside of the scan range of interest to avoid noise near zero frequency and/or to provide a buffer whereby the downmixing frequency can be adjusted if signal appears in this band near zero frequency; in a standard SS-OCT system, a similar effect may be accomplished by making the reference arm length slightly outside the sample depth range of interest. Downmixing the OCT signal in this manner can provide multiple benefits. Most relevant for the present optical bench (semiconductor optical bench or micro optical bench) designs, downmixing allows a significant mismatch in (optical) path length between the reference arm and sample arm, making it possible to integrate a short reference arm (e.g., shorter than the distance to the sample (e.g., retina) position) on the micro-bench (or semiconductor optical bench), which does not leave the micro package, and making the down mixing frequency adjustable can eliminate the need for mechanical or optical adjustment of the reference or sample arm path length.
To quickly find the appropriate downmixing frequency, one could initially sweep the source slowly to generate a large scan range at a relatively slow A-scan rate, and then once the desired scan depth has been identified, switch to a faster sweep rate and corresponding A-scan rate, with the appropriate downmixing frequency to set the scan depth correctly for the resulting more limited scan range.
Electronic adjustment of the downmixing frequency provides rapid adjustment of the depth (axial position) of the imaging window, making it possible to adjust the scan depth to follow (e.g., the curvature of) the sample (e.g., retina) during an acquisition, even shifting the scan depth to follow the sample between or during A-scans within a B-scan (e.g., adjust the path length during acquisition to follow the overall sample position, the sample surface, or a particular layer in the sample). Various methods could be used for following the surface or layer, where examples include adjusting the downmixing frequency based on the spectrum of the OCT signal, or based on identification of a particular layer or boundary in the OCT image found through signal processing of the OCT. For the case of imaging of the retina, a likely surface to follow would be the RPE, or one could track the retina as a whole. To track the retina as a whole, one might maintain the spectrum acquired by the OCT digitization near the midpoint of the bandwidth range supported by the digitization, while to track the RPE, one might maintain the peak spectral signal, likely corresponding to the RPE, at a fixed frequency.
The down-mixing approach to shifting the scan depth has the benefit of not adding a Doppler shift to the OCT signal, as would be generated by movement of the reference mirror to adjust the scan depth. This Doppler shift is undesirable as it affects the image, causing phase wash-out in SD-OCT systems and a displacement in axial position or an axial point spread function (PSF) broadening in swept source systems. The electronic adjustment of the downmixing frequency could be achieved through the use of a voltage controlled oscillator.
As an alternate to implementing the downmixing electronically, one could also achieve the same effect through shifting of the optical frequency of either the sample or reference light. To create a respective frequency shift, optical modulators, such as acousto-optic modulators or electro-optic modulators, can be used. In a hybrid micro-bench/PIC system, this modulation could be provided in the PIC.
One possible complication of changing the down-mixing frequency during acquisition could occur during angiographic imaging, where two OCT scans taken at slightly different times are compared, with the differences between the scans indicating motion, usually attributed to blood flow. If the down-mixing frequency is adjusted between two such scans, one may need to correct for this down-mixing frequency change prior to calculating the difference between the scans so as not to generate artifacts.
In some embodiments one may choose to use the above described down-mixing concepts to enable a large optical path length mismatch between sample arm and reference arm, but may choose to implement some optical path length adjustment optically for sample alignment in the axial direction. This can still be done inside a micro package and without the need for moving parts. For example, one could implement a scanning delay line using an electro optical deflector in combination with a grating and a mirror.
In a preferred embodiment, the above described OCT system is implemented on a semiconductor optical bench, i.e. a semiconductor into which slots (recesses) for the micro optics are etched and the micro-optics are placed without the need for an active alignment process. Such a system would be especially suitable to be produced in large volumes, as it profits from the scalability of semiconductor manufacturing processes. The slots for the micro-optics can be etched for hundreds or thousands of devices in parallel, by patterning entire semiconductor wafers using lithography. The micro-optics can then be assembled by a robot for an entire wafer at a time, followed by a wafer-level packaging step, where a lid wafer is bonded on top of the base layer creating a hermetic seal. Alternatively, another semiconductor optical bench may be used in place of a lid wafer. This “lid” semiconductor optical bench may be constructed with corresponding/complementary slots (or patterns) configured to receive the portions of the micro-optics that extend above the surface of the opposite, “base” semiconductor optical bench. In this configuration, the micro-optics are sandwiched between two semiconductor optical benches, and held in alignment by the two opposing semiconductor optical benches. The lid wafer does not necessarily have to be made of semiconductor material but could also be made of e.g., glass or ceramics without semiconducting properties. This can be beneficial in cases where an operating wavelength at which typical semiconductor materials, as e.g. silicon, are not transparent. Having at least one of a transparent bench wafer or transparent lid wafer is desirable, because the bench or lid typically serve as window through which light can be coupled out of and/or into the micro package. The hermetically sealed package may contain a vacuum to allow faster movement of elements inside the package, e.g. MEMS elements of vertical cavity surface emitting lasers (VCSEL) or MEMS based beam steering mirrors. Alternatively, it may contain specific gasses that prevent or reduce the degradation of active semiconductor optical materials, e.g., damage due to oxidation at the facets of gain chips.
Because the lithographic patterning of the semiconductor wafer creates slots and/or other alignment fiducials with nanometer precision, semiconductor optical benches are especially beneficial for applications where precise control of optical path lengths is required. These include for example multi-beam OCT systems, where the sample is scanned with multiple beams in parallel and a mismatch in imaging depth between the respective imaging channels is undesirable, or for example, for quadrature detectors, where the to be-detected interference signal is split and acquired with a relative phase shift of 90 degree in order to reconstruct the complex signal.
Another embodiment may not require external sample arm optics. Instead, the sample could be brought in contact with the micro package or be placed in close proximity to the micro optic package. All sample arm optics would in such an embodiment be part of the micro package. Focusing optics may for example be used to simultaneously serve as the exit/entrance window for the sample beam.
Since much of the cost in micro optical bench and/or semiconductor optical bench solutions is in the NRE and packaging, one can increase the complexity of the OCT solution without greatly increasing the overall cost, making more complex designs, such as the polarization sensitive (PS) OCT viable.
It may also be desirable to integrate other aspects of a clinical OCT system into the micro optical bench or semiconductor optical bench to further miniaturize and cost-reduce the system. Possible examples include:
Another benefit of implementing the OCT on a semiconductor optical bench (or micro optical bench) is that the OCT could then be packaged for example in a dual in-line package (DIP) or a surface mount device (SMD) (or other micro package or integrated circuit package) and soldered onto a printed circuit board along with other chips such as the processing electronics for the OCT signal.
In one or more of the above embodiments, a polarizing beam splitter PBS outputs its respective two beams to corresponding detectors, which may be integrated within (onto) the optical bench 13.
Non-linearity in the frequency sweep of the light source may be an issue in swept source OCT systems.
To avoid additional components for the spatial filtering, the active area of the photodiodes may serve as the spatial filter if their size is chosen accordingly. In this case, one would focus the collection light on to the detectors, and use small detectors, typically less than a few times the size of the focused beam.
The beam out of the micro-optics package may be coupled to additional optics depending on the application (e.g., mirror scanner, beam expander, relay optics to sample). To avoid reflections from these optical surfaces returning to the detectors in the interferometer, the quarter wave plate in the sample path (17 in
Reflections from various optical components in the system can lead to detector saturation, VCSEL or optical amplifier damage, and/or artifacts or ghost images in the OCT signal. These undesired reflections can be mitigated or eliminated in various ways including but not limited to: the use of pinholes and apertures, limiting the active area of detectors, gluing components to reduce the refractive index mismatch, anti-reflection coatings, tilted components, and polarization isolation.
The described OCT systems of
In conventional OCT systems, the light in the reference path is reflected back to the interferometer using a corner retroreflector. Corner retroreflectors direct incoming light over a wide range of incident angles, making it ideal for reliably redirecting the reference light in the presence of system tolerances and misalignment. However, corner retroreflectors are expensive and difficult to manufacture at scales less than 1 mm. They can also vary the polarization over the wavefront if the beam is directed at the center of the component. A major advantage of the described micro-optic system is the tight tolerance on optical component mounting, which likely allows use of a planar mirror in place of a retroreflector (20 in
As mentioned previously, the described system can be very low cost. The cost of SS-OCT systems is however typically driven by the cost of the tunable light source. It is therefore desirable to use particularly cheap light sources in order to enable an overall low system cost. Vertical cavity surface emitting lasers (VCSEL) are prevalent in many high-volume applications, such as data centers, optical computer mice, distance and proximity sensors, biometric face recognition etc., and are therefore typically very inexpensive. It has previously been shown that it is possible to tune their center wavelength by adjusting their laser drive current. Such a source or a combination of multiple such sources are therefore well-suited to be used in the presently described system. One issue with VCSELs, and particularly thermally driven VCSELs, is the limited wavelength range over which they can be swept. As the axial resolution of the OCT system is determined by the sweep bandwidth of the light, it may be desirable to combine multiple VCSELs with different central wavelengths to achieve an increased combined bandwidth and in some cases increased total optical output power.
With reference to
Alternatively, one could operate multiple VCSELs sequentially, and then detect the light from each VCSEL (e.g., two or more VCSELs) on the same detector. Operating the VCSELs sequentially could be beneficial for instance if the VCSELs have a limited duty cycle. The limited duty cycle could be a result of the need for the VCSEL to cool between thermally driven sweeps, or in the case of a MEMS VCSEL, for the MEMS to return to its initial position to start a next sweep.
Another issue with VCSELs is their limited optical output power. For high quality OCT imaging of biological samples they may therefore combined with a semiconductor optical amplifier. However, three aspects specific to the herein described OCT system enable the use of VCSELs for high quality OCT imaging of biological samples without optical amplifiers, which has otherwise not been demonstrated:
If only little reference power is required to overcome detector noise as the dominant noise source, relative intensity noise (RIN) of the light source is usually not a concern either. It is therefore possible to omit the balanced detection in such a system and still be shot noise limited. However, because the balanced detection not only suppresses RIN, but also common mode signals, such as auto-correlation signals, it is usually desirable to still use a balanced detection arrangement.
Another embodiment may add a partially transmissive element to the sample arm that generates a reflex which then interferes with the reference light. Since the above embodiments already have a number of optical surfaces in the sample arm, one may use a reflex from one of these optic surfaces instead of introducing an additional element. Because this reflex would in any case be closer than the sample, its interference signal would have a lower frequency than the OCT signal. It could therefore be separated from the OCT signal, for example, by splitting the signal and high-pass/low-pass filtering the two copies accordingly. For example, the low frequencies may be used for the reference interference signal and the high frequencies may be used for the OCT signal. The reference interference signal would then be digitized in parallel and used to correct the sweep's wavenumber non-linearity and to phase stabilize the OCT data. Alternatively, reference signal and OCT signal could be digitized together and separated in digital space. This would avoid the need for a second data acquisition channel.
The present invention also envisions other aspects of the OCT system either being implemented on the micro optical bench or semiconductor optical bench, or actually integrated into the semiconductor optical bench. For instance, a MEMS mirror scanning the OCT beam could be either implemented on the bench or integrated into the semiconductor-based bench through photolithography. This MEMS mirror could provide the complete transverse scanning capability for the OCT system, or be one component of the system. In particular, this MEMS mirror could provide rapid scanning over a limited field of view, with the more extended field of view provided by a secondary scanning system. Limiting the field of view of the MEMS scanning system integrated on the micro optical bench and/or semiconductor optical bench (e.g., to less than the desired/predefined/target full (or more extended) scanning FOV of the system, e.g., a wide field scanning system) has several benefits. First, the angular range of a MEMS mirror is typically on the order of +/−6 degrees, making it difficult to address the full field of view desired for a typical OCT system. In a classic (e.g., bulk optic) OCT system, one could use a relatively large MEMS mirror and image the MEMS to a de-magnified spot to increase the field of view, but this is more difficult with the limited space within a DIP (or other typical semiconductor package) for both the mirror and the OCT system. In addition, by limiting the size of the MEMS mirror, one can increase the speed of the scanning, but at the price of not being able to further de-magnify the beam to increase the field of view. Note that the scanning speed of the MEMS mirror could also be increased further through resonant scanning about one axis of scanning. Finally, the resulting scan behavior, with rapid scanning of a small region that is moved relatively slowly across the retina, is beneficial. The fact that the region of interest is moving relatively (or comparatively) slowly across the retina makes it possible to maintain optimum performance of the OCT system, adjusting the axial scan depth, focus, and or other aberrations such as astigmatism to match the properties of the retina at a given location.
One challenge in this configuration is relaying the beam from the scanner to the patient's pupil while maintaining large working distance and compact design of the OCT module. Introducing a converging beam onto the MEMS scanner provides flexibility in the design, including the possibility of relaying the scanner with a single lens positioned a distance slightly larger than the focal length of the lens. The vergence of the beam could also be adjusted by translating a lens before the scanner, providing a focusing element to the design. This configuration provides a compact design with minimal components for pupil relay and focusing.
Addressing the need for fast scanning using a mirror integrated on to the micro/semiconductor optical bench also means that the wide field scanning system can scan at a slower rate, providing greater flexibility in its design. Examples of options enabled by the reduced scan speed requirements include mirrors driven by either galvanometers or by electric motors, or actually moving the OCT system including the MEMS mirror across the field of view. The ultra-compact OCT interferometer design enabled by micro optical bench and semiconductor optical bench solutions makes moving the entire OCT interferometer much more feasible, but one could also use this combination of small field of view fast scanning (on a micro bench) plus wide field of view slower scanning in a more classic fiber optic based OCT system, where the OCT sample arm fiber tip, MEMS scanner, and small field of view optics are moved as a group across the full field of view.
If wide field imaging is provided by moving the OCT system or fiber tip, it is desirable for the system to move along a sphere (e.g., spherical surface/plane) centered at the pupil so as to maintain a fixed working distance relative to the pupil. In addition to the benefit of maintaining the working distance, one can design the mechanism for generating the motion on the sphere to have an element that remains parallel to the sphere surface as it moves along the sphere. One can then mount the OCT/optical imaging system to have an optical axis perpendicular to this element parallel to the sphere, thus ensuring that the imaging system remains pointed toward the center of the sphere, where the pupil resides, as the system is scanned across the field of view.
For several reasons, it may be desirable to have the center of the sphere somewhat displaced from the pupil during the scan. Possible reasons include, but are not limited to:
In the case that the center of the sphere is displaced relative to the pupil location, it may become important to have an additional angular alignment capability between the surface that remains parallel to the sphere, and the axis of the OCT imaging system, which must point towards the pupil during the scanning. To maintain this alignment to the pupil, it may also be desirable to have a pupil tracking component mounted with the OCT imaging system that monitors the axis of alignment of the OCT system relative to the pupil and adjusts the angular alignment system to maintain the pointing of the OCT system to the pupil.
If the alignment system were sufficiently calibrated, one could also mount the camera directly to a parallel surface and then use the feedback to align the OCT system without also affecting the camera system. In case of cataracts, or other opacities in portions of the pupil, such a system could also maintain alignment to a specific location on the pupil to optimize image quality. In the absence of such opacities, the system would most likely maintain alignment of the OCT system to the center of the pupil.
It may not be desirable for the pivot points to be at the same plane as the center of the sphere, where the pupil should reside. Since the face and body of the patient can also be in this plane, it can be difficult to put the pivot points at these locations without impinging on the human body. One solution, as mentioned earlier, is to move the sphere away from the body, moving both the pivot points and sphere center in front of the eye and body. If this is done, the OCT axis alignment system may need to correct for this offset, maintaining alignment to the pupil. This could be done either through a tracking system that causes the optical axis of the system to stay aligned to the pupil, or by putting an angle dependent offset on the alignment system that compensates for this displacement, or both. This capability to tilt and point the scan module is shown in
Alternatively, one can shift the effective pivot point mechanically. One such example of a mechanical shift to the pivot point is shown in
This approach, wherein a small FOV system is moved in an arc around the pupil while maintaining alignment to the pupil has an additional advantage in that it greatly reduces the need for placement of the pupil in a highly limited area, known as the “pupil box”, defined by the optics of the system.
Returning to
Although one could do any combination of radial and azimuthal motion to scan the eye, if the OCT system is parallelized such that there are multiple OCT scan beams entering the eye, and one is interested in OCT angiography, it may be desirable to take a series of radial scans with azimuthal rotation between them, as shown in
In some ways the approach described above is similar to montaging, where one manually takes a set of images with a limited field of view instrument, and then combines them to generate a wide field of view image. In such a manual approach, one typically asks the patient to look at a fixation target, and then takes the series of images with the fixation target at different locations. The eye is then looking in a different direction for each image, and thus the photos show different parts of the eye that can then be montaged. The approach described herein is different both in that the fixation target is not moved between collections of the subfields, and in that all of the subfields are acquired sequentially with no need for alignment steps between the acquisitions of the subfields.
One challenge for montaged images is that the fixation target is within the imaged field of view for the central image, but not for the peripheral images. This may lead to a need for two fixation target systems, one within the field of view of the optics, and one external to the optics. In the present system, this issue can be avoided, only requiring one fixation target system to cover both central and peripheral subfields. This can be accomplished by placing the fixation target 86 behind the spherical plane 70 that the imaging system (e.g., scan module or scan head) 87 transverses, as shown in
As the OCT typically uses near infrared light for the imaging, which does not significantly bother the patient, it is possible to acquire data over a significant period of time, up to 30 seconds or more. However, motion of the retina during the acquisition can become a challenge, creating distortions in the image and/or regions of the eye with missing OCT data. To address this, one often uses a second imaging system to track the retina, as is done in the Heidelberg Spectralis' and Zeiss Cirrus' OCT instruments. There has also been a relatively recent development in OCT known as OCT angiography, whereby the microvasculature in the eye is imaged by detecting the motion of the blood through repeat scans. It is herein proposed that these two capabilities can be combined with the present new scan approach by using the repeat scans to both detect the flow of blood in the eye, and to measure the overall motion of the retina. Historically, OCT angiography has been done by repeating single B-scans, each consisting of a long (10-60 degree) line scan across the retina, where each B-scan takes roughly 5 msec to acquire. When the retina moves, these acquisitions do not overlap, and information from the secondary tracking system is then used to correct the position of the OCT scan and retake the data. In the present case, by acquiring limited 2D (two dimensional) regions of the eye over these 5 msec periods rather than a 1D (one dimensional) line, the present system can detect the motion in 2D by identifying the A-scan in the 2D region that matches the repeat scan. As a simple example, if one has a 500 k A-scan/sec system, with a 5 msec delay between repeat scans, one can scan a 50×50 A-scan region, corresponding to roughly 50*20 um=1 mm×1 mm region, and thus be able to track motion up to 1 mm per 5 msec. Thus, the present scanning approach enables one to use the same repeat scans both for OCT angiography and retinal tracking, making retinal tracking without a secondary tracking system possible.
In certain cases, it may also be desirable to have a micro-optics-based OCT system without a transverse scan capability, where the transverse scanning would be provided by moving or rotating the micro-optics OCT. For example, one could configure a micro-optics OCT module without an onboard beam scanner, and instead one drags/moves the micro-optics OCT module (and its non-scanned OCT light beam(s)) across the surface of the skin in order to generate a B-scan of the skin tissue. Such a system could either include optics external to the micro or semiconductor optical bench for coupling the light to the sample, or could directly illuminate the sample, without any additional optics. Similarly, there are applications where the micro-optics system could be used without scanning in an optical coherence domain reflectometry mode. One example of such an application could be measurement of distance to a sample in a microscope so as to optimize the focus of the microscope.
A further aspect of an OCT system that can be integrated as part of the micro package is the focus adjustment. Tunable lenses, sometimes also called liquid lenses, have been demonstrated to provide very quick focus adjustment, but are typically limited in their clear aperture. The small beam diameters inside the micro package or in close proximity to the micro package are therefore a great match to such tunable lenses. In a preferred embodiment the focus tunable lens would be placed in a pupil conjugate plane.
Broader spectral tuning bandwidths can be achieved using MEMS tunable VCSELs. These devices are tuned by adjusting their cavity length with the help of a MEMS element. They exist in optically pumped and electrically pumped varieties. Optically pumped tunable MEMS VCSEL usually include at least a laser diode for optical pumping and the MEMS VCSEL. An electrically pumped tunable MEMS VCSEL usually include at least a MEMS VCSEL with an active gain section that is driven electrically. Both electrically and optically pumped VCSELs are often combined with an optical amplifier to increase the optical power. Optionally, MEMS tunable VCSEL may be co-packaged with the aligned optical amplifier. Silicon (e.g., semiconductor) optical benches may use different approaches for alignment. For example, a microscope and image recognition may be used, and/or a laser beam may be sent through the system and its position or intensity optimized. These components are typically either packaged separately and fiber coupled to each other or co-packaged on a micro bench inside a butterfly package. Their manufacturing process involves several active alignment steps and per device fiber coupling and packaging steps. To further lower the size and cost of these devices as well as to enable the manufacturing of larger volumes of these devices, it would be beneficial to build such devices on a silicon (semiconductor) optical bench relying on passive placement and alignment steps in order to profit from the scalability of wafer level manufacturing and packaging processes.
VCSELs, detectors, and pinholes can all be manufactured at the wafer level as arrays with sub-millimeter/micron spacing between the elements of the arrays. Therefore, a parallel micro or semiconductor optical bench OCT system may be configured where the VCSELs, detectors, and/or pinholes are arrays, and the array of light beams from the VCSELs propagate through the individual optics of the micro/silicon bench in parallel (multiple OCT optical beams passing through the same optical components, where each beam has at least one corresponding detector for generating OCT signal.) As an example, assuming a 3×3 array of VCSELs, with corresponding arrays of detectors and pinholes, one could go from one acquisition channel to 9, with all 9 channels sharing the same lenses and mirrors, and therefore no need for additional optics in the OCT interferometer. One could also do this with a 1D array of VCSELs, which might be a more natural pattern for scanning, but would be less efficient in terms of filling the lenses, which typically have a circular aperture for the optical beam(s) to pass through. It is desirable to pack as many beams as possible into a given size set of optics, with whatever pattern gives you the maximum packing. For instance, one might want a hexagonal packing with rows of 2, 3, 2=7 beams, or 3, 4, 5, 4, 3=19 beams. As mentioned above, the optimum arrangement of beams to pass through the optics might be different than the arrangement of beams desired for scanning. In such a case, one could change the arrangement of the beams between the OCT interferometer and the scanning mirror with one or more optics that deflect each beam appropriately.
With reference to
The VCSEL arrays will have a given pitch (spacing between VCSELs) and beam numerical aperture (e.g., a dimensionless number that characterizes the range of angles over which the system can accept or emit light). The numerical aperture times the pitch remains a conserved quantity when one images the VCSEL with single element optics.
The use of VCSEL arrays increases the total optical sample power of the device according to the number of VCSELs in the array. This allows each individual channel to use lower sample power than typical single beam OCT systems and still achieve equal or better image quality and/or imaging speed. In particular, it enables the use of VCSELs for high quality OCT imaging of biological samples without optical amplifiers, which has otherwise not been demonstrated.
Although omitting all fiber optics or other waveguiding optics was described as advantageous in several of the above embodiments, some micro-optic OCT systems may include waveguides, for example as part of edge emitting lasers, semiconductor optical amplifiers or optical modulators. Micro-optic OCT systems may further be an assembly of multiple planar waveguides and/or photonic integrated circuits (PIC) coupled together using micro-optics. For example, a semiconductor optical bench assembled using wafer level assembly and packaging steps, may represent a cost-effective way to combine and package multiple optical components made from different materials, in a miniature hermetically sealed package. This is especially desirable in cases, where different components cannot be integrated on a single PIC, due to incompatible materials, e.g. when combining lasers or amplifiers made of GaAs with passive silicon nitride PICs. A micro-optic OCT system may further lend itself to include electronics in the same package, discrete analog electronic components, but also electronic integrated circuits. Especially systems built on a silicon optical bench, i.e. a silicon wafer, can enable a particular deep electronic and optical integration, as the same silicon wafer may be processed to include electronic integrated circuits. Such a system can then include not only passive and active optical components, but also electronic integrated circuits for driving light sources, signal conditioning, analog to digital conversion, signal processing (e.g. image reconstruction), data transfer and data storage.
In hybrid PIC/micro optic devices the micro optics may not only take the role of coupling between waveguides and/or photonic integrated circuits as described above. In some systems it may be desirable to implement some functionality of the system using micro optics and others using photonic integrated circuits, which would then reside on a common substrate and be co-packaged.
Further cases where fiber optics may be desirable, include an external light source fiber-coupled to the micro-optics assembly or fibers collecting the light in the detection arm and directing it to external photodetectors. The fiber in these cases may for example be single mode fiber, polarization maintaining fiber, polarizing fiber, or dual cladded fiber.
Although the micro-optics described herein are illustrated as having light propagating only in a single plane, it may be desirable to direct at least one of the optical beams for example in a direction perpendicular to this plane. It may for example be desirable to have the sample arm or sample and reference arm exit through the lid of the package instead of its sidewalls. The lid would in such an instance be transparent at the operating wavelength or include a window or lens integrated in the lid.
In summary, some of the innovations/features provided in the present application include:
Hereinafter is provided a description of various hardware and architectures suitable for the present invention.
Optical Coherence Tomography Imaging System
As mentioned above,
In OCT Angiography, or Functional OCT, analysis algorithms may be applied to OCT data collected at the same, or approximately the same, sample locations on a sample at different times (e.g., a cluster scan) to analyze motion or flow (see for example US Patent Publication Nos. 2005/0171438, 2012/0307014, 2010/0027857, 2012/0277579 and U.S. Pat. No. 6,549,801, all of which are herein incorporated in their entirety by reference). An OCT system may use any one of a number of OCT angiography processing algorithms (e.g., motion contrast algorithms) to identify blood flow. For example, motion contrast algorithms can be applied to the intensity information derived from the image data (intensity-based algorithm), the phase information from the image data (phase-based algorithm), or the complex image data (complex-based algorithm). An en face image is a 2D projection of 3D OCT data (e.g., by averaging the intensity of each individual A-scan, such that each A-scan defines a pixel in the 2D projection). Similarly, an en face vasculature image is an image displaying motion contrast signal in which the data dimension corresponding to depth (e.g., z-direction along an A-scan) is displayed as a single representative value (e.g., a pixel in a 2D projection image), typically by summing or integrating all or an isolated portion of the data (see for example U.S. Pat. No. 7,301,644 herein incorporated in its entirety by reference). OCT systems that provide an angiography imaging functionality may be termed OCT angiography (OCTA) systems.
Computing Device/System
In some embodiments, the computer system may include a processor Cpnt1, memory Cpnt2, storage Cpnt3, an input/output (I/O) interface Cpnt4, a communication interface Cpnt5, and a bus Cpnt6. The computer system may optionally also include a display Cpnt7, such as a computer monitor or screen.
Processor Cpnt1 includes hardware for executing instructions, such as those making up a computer program. For example, processor Cpnt1 may be a central processing unit (CPU) or a general-purpose computing on graphics processing unit (GPGPU). Processor Cpnt1 may retrieve (or fetch) the instructions from an internal register, an internal cache, memory Cpnt2, or storage Cpnt3, decode and execute the instructions, and write one or more results to an internal register, an internal cache, memory Cpnt2, or storage Cpnt3. In particular embodiments, processor Cpnt1 may include one or more internal caches for data, instructions, or addresses. Processor Cpnt1 may include one or more instruction caches, one or more data caches, such as to hold data tables. Instructions in the instruction caches may be copies of instructions in memory Cpnt2 or storage Cpnt3, and the instruction caches may speed up retrieval of those instructions by processor Cpnt1. Processor Cpnt1 may include any suitable number of internal registers, and may include one or more arithmetic logic units (ALUs). Processor Cpnt1 may be a multi-core processor; or include one or more processors Cpnt1. Although this disclosure describes and illustrates a particular processor, this disclosure contemplates any suitable processor.
Memory Cpnt2 may include main memory for storing instructions for processor Cpnt1 to execute or to hold interim data during processing. For example, the computer system may load instructions or data (e.g., data tables) from storage Cpnt3 or from another source (such as another computer system) to memory Cpnt2. Processor Cpnt1 may load the instructions and data from memory Cpnt2 to one or more internal register or internal cache. To execute the instructions, processor Cpnt1 may retrieve and decode the instructions from the internal register or internal cache. During or after execution of the instructions, processor Cpnt1 may write one or more results (which may be intermediate or final results) to the internal register, internal cache, memory Cpnt2 or storage Cpnt3. Bus Cpnt6 may include one or more memory buses (which may each include an address bus and a data bus) and may couple processor Cpnt1 to memory Cpnt2 and/or storage Cpnt3. Optionally, one or more memory management unit (MMU) facilitate data transfers between processor Cpnt1 and memory Cpnt2. Memory Cpnt2 (which may be fast, volatile memory) may include random access memory (RAM), such as dynamic RAM (DRAM) or static RAM (SRAM). Storage Cpnt3 may include long-term or mass storage for data or instructions. Storage Cpnt3 may be internal or external to the computer system, and include one or more of a disk drive (e.g., hard-disk drive, HDD, or solid-state drive, SSD), flash memory, ROM, EPROM, optical disc, magneto-optical disc, magnetic tape, Universal Serial Bus (USB)-accessible drive, or other type of non-volatile memory.
I/O interface Cpnt4 may be software, hardware, or a combination of both, and include one or more interfaces (e.g., serial or parallel communication ports) for communication with I/O devices, which may enable communication with a person (e.g., user). For example, I/O devices may include a keyboard, keypad, microphone, monitor, mouse, printer, scanner, speaker, still camera, stylus, tablet, touch screen, trackball, video camera, another suitable I/O device, or a combination of two or more of these.
Communication interface Cpnt5 may provide network interfaces for communication with other systems or networks. Communication interface Cpnt5 may include a Bluetooth interface or other type of packet-based communication. For example, communication interface Cpnt5 may include a network interface controller (NIC) and/or a wireless NIC or a wireless adapter for communicating with a wireless network. Communication interface Cpnt5 may provide communication with a WI-FI network, an ad hoc network, a personal area network (PAN), a wireless PAN (e.g., a Bluetooth WPAN), a local area network (LAN), a wide area network (WAN), a metropolitan area network (MAN), a cellular telephone network (such as, for example, a Global System for Mobile Communications (GSM) network), the Internet, or a combination of two or more of these.
Bus Cpnt6 may provide a communication link between the above-mentioned components of the computing system. For example, bus Cpnt6 may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a front-side bus (FSB), a HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand bus, a low-pin-count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCIe) bus, a serial advanced technology attachment (SATA) bus, a Video Electronics Standards Association local (VLB) bus, or other suitable bus or a combination of two or more of these.
Although this disclosure describes and illustrates a particular computer system having a particular number of particular components in a particular arrangement, this disclosure contemplates any suitable computer system having any suitable number of any suitable components in any suitable arrangement.
Herein, a computer-readable non-transitory storage medium or media may include one or more semiconductor-based or other integrated circuits (ICs) (such, as for example, field-programmable gate arrays (FPGAs) or application-specific ICs (ASICs)), hard disk drives (HDDs), hybrid hard drives (HHDs), optical discs, optical disc drives (ODDs), magneto-optical discs, magneto-optical drives, floppy diskettes, floppy disk drives (FDDs), magnetic tapes, solid-state drives (SSDs), RAM-drives, SECURE DIGITAL cards or drives, any other suitable computer-readable non-transitory storage media, or any suitable combination of two or more of these, where appropriate. A computer-readable non-transitory storage medium may be volatile, non-volatile, or a combination of volatile and non-volatile, where appropriate.
While the invention has been described in conjunction with several specific embodiments, it is evident to those skilled in the art that many further alternatives, modifications, and variations will be apparent in light of the foregoing description. Thus, the invention described herein is intended to embrace all such alternatives, modifications, applications, and variations as may fall within the spirit and scope of the appended claims.
Filing Document | Filing Date | Country | Kind |
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PCT/EP2022/052220 | 1/31/2022 | WO |
Number | Date | Country | |
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63144376 | Feb 2021 | US | |
63230970 | Aug 2021 | US |