Number | Name | Date | Kind |
---|---|---|---|
3540956 | Arnold et al. | Nov 1970 | |
3547718 | Gordon | Dec 1970 | |
3612744 | Thomas | Oct 1971 | |
3673982 | Rutledge et al. | Jul 1972 | |
3757029 | Marshall | Sep 1973 | |
3794522 | Mueller et al. | Feb 1974 | |
3802974 | Emmel | Apr 1974 | |
3833755 | Soelberg | Sep 1974 | |
3951713 | Emmel | Apr 1976 | |
4000348 | Harlow | Dec 1976 | |
4090902 | Ferrentino et al. | May 1978 | |
4096010 | Parham et al. | Jun 1978 | |
4097324 | Emmel | Jun 1978 | |
4098628 | Walton | Jul 1978 | |
4150929 | Brandt | Apr 1979 | |
4165559 | Lang et al. | Aug 1979 | |
4190319 | Eggleston | Feb 1980 | |
4288916 | Verma | Sep 1981 | |
4310365 | Elliott et al. | Jan 1982 | |
4364788 | Bloodworth, Jr. | Dec 1982 | |
4367585 | Elliott et al. | Jan 1983 | |
4406915 | Lang | Sep 1983 | |
4407298 | Lentz et al. | Oct 1983 | |
4417886 | Frankhouser et al. | Nov 1983 | |
4423282 | Suzuki et al. | Dec 1983 | |
4443657 | Hill et al. | Apr 1984 | |
4460427 | Haney et al. | Jul 1984 | |
4468089 | Brorein | Aug 1984 | |
4484586 | McMickle et al. | Nov 1984 | |
4515592 | Frankhouser | May 1985 | |
4581291 | Bongianni | Apr 1986 | |
4600805 | Glynn et al. | Jul 1986 | |
4626298 | Allard | Dec 1986 | |
4692566 | Kauffman | Sep 1987 | |
4744631 | Eichenbaum et al. | May 1988 | |
4761519 | Olson et al. | Aug 1988 | |
4815471 | Stobie | May 1989 | |
4834710 | Fleck | May 1989 | |
4861945 | Buck et al. | Aug 1989 |
Number | Date | Country |
---|---|---|
46-38225 | Oct 1971 | JPX |
1090754 | May 1984 | SUX |
Entry |
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Rima, "Basics of Tape Automated Bonding," Hybrid Circuit Technology, Nov. 1984, Describes General Information on Integrated Circuit Bonding. |
Feindel, "Approach to Product Assembly," Connection Technology, Mar. 1986, Describes General Information on Integrated Circuit Bonding. |
Schwartz, "Chip-on-Board: Shrinking Surface Mount," Assembly Engineering, Mar. 1987, Describes General Information on Integrated Circuit Bonding. |