Claims
- 1. An on-wafer electroplating control circuit for controlling the formation of an electroplated structure, the on-wafer electroplating control circuit comprising:an on-wafer resistor having a first port and a second port; and an on-wafer current driver having a first port coupled to the second port of the on-wafer resistor and a second port coupled to a plating pad, the on-wafer current driver configured to provide a predefined current to the plating pad responsive to the application of an enable voltage at the first port of the on-wafer resistor.
- 2. The on-wafer electroplating control circuit of claim 1, wherein the on-wafer resistor comprises a polysilicon resistor and wherein the current driver comprises a two FET current mirror.
- 3. An on-wafer electroplating control circuit for controlling the formation of an electroplated structure, the on-wafer electroplating control circuit comprising:an on-wafer resistor having a first port and a second port; an on-wafer current driver having a first port coupled to the second port of the on-wafer resistor and a second port coupled to a plating pad, the on-wafer current driver configured to provide a predefined current to the plating pad responsive to the application of an enable voltage at the first port of the on-wafer resistor a second on-wafer resistor having a first port coupled to the first port of the on-wafer resistor and a second port; and a second on-wafer current driver having a first port coupled to the second port of the second on-wafer resistor and a second port coupled to a second plating pad, the second on-wafer current driver configured to provide a predefined current to the second plating pad responsive to the application of the enable voltage at the first port of the on-wafer resistor.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuing (divisional) application of U.S. Ser. No. 09/501,798 filed Feb. 8, 2000 by A. Wilson, now U.S. Pat. No. 6,384,610, which claims benefit of U.S. Provisional Application No. 60/119,166, entitled “Micro Electro-Mechanical Systems Adhesive Bond Degradation Sensors,” filed Feb. 8, 1999, the contents of which are herein incorporated by reference in its entirety for all purposes.
US Referenced Citations (9)
Foreign Referenced Citations (6)
Number |
Date |
Country |
8706256 |
Aug 1987 |
DE |
4239495 |
May 1994 |
DE |
19707788 |
Jul 1998 |
DE |
2423776 |
Dec 1979 |
FR |
2 732 465 |
Oct 1996 |
FR |
0046593 |
Aug 2000 |
WO |
Non-Patent Literature Citations (4)
Entry |
Database Derwent #002306158, WPI Acc.No. 1980-B2590C/198006, citing French Patent No. 2423776 published Dec. 21, 1979 (item D). |
Database Derwent #009909585, WPI Acc. No. 1994-177291/199422, citing German Patent No. 4239495 published May 26, 1994 (item E). |
Database Derwent #011946881, WPI Acc. No. 1998-363791/199832, citing German Patent No. 19707788 published Jul. 2, 1998 (item G). |
Database Derwent, WPI Acc. No. 1996-457773/199646, citing French Patent No. 2 732 465, published Oct. 4, 1996 (see item F). |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/119166 |
Feb 1999 |
US |