The present invention relates to an apparatus for cooling and a method thereof. In particular, the present invention is directed to a frit based pump or electroosmotic pump with on-frit electrode and method of manufacturing thereof.
High density integrated circuits have evolved in recent years including increasing transistor density and clock speed. The result of this trend is an increase in the power density of modern microprocessors and an emerging need for new cooling technologies. At Stanford, research into 2-phase liquid cooling began in 1998, with a demonstration of closed-loop systems capable of 130 W heat removal. One key element of this system is an electrokinetic pump, which was capable of fluid flow on the order of ten of ml/min against a pressure head of more than one atmosphere with an operating voltage of 100V.
This demonstration was carried out with liquid-vapor mixtures in the microchannel heat exchangers, because there was insufficient liquid flow to capture all the generated heat without boiling the liquid. Conversion of some fraction of the liquid to vapor imposes a need for high-pressure operation, and increases the operational pressure requirements for the pump. Furthermore, two phase flow is less stable during the operation of a cooling device and can lead to transient fluctuations and difficulties in controlling the chip temperature.
In such small electrokinetic pumps, the position as well as the distance of the electrodes in relation to the porous structure is very important. Inconsistency in the distances between electrodes on each side of the porous structure pump result in variations in the electric field across the porous structure. These variations in the electric field affect the flow rate of the fluid through the pump and cause the pump to operate inefficiently. In prior art electroosmotic pumps 10 as shown in
Periodically spaced electrodes 12,14 along the surfaces 18,20 of the pump 10 can create a non-uniform electric field across the porous structure 10. As shown in
What is needed is an electrokinetic or electroosmotic pumping element that provides a relatively large flow and pressure within a compact structure and offers better uniformity in pumping characteristics across the pumping element.
In one aspect of the invention, an electroosmotic pump comprises at least one porous structure which pumps fluid therethrough. The porous structure preferably has a first roughened side and a second roughened side. The porous structure has a first continuous layer of electrically conductive material with an appropriate first thickness disposed on the first side as well as a second continuous layer of electrically conductive material with a second thickness disposed on the second side. The first and second thicknesses is within the range between and including 200 Angstroms and 10,000 Angstroms. At least a portion of the first layer and the second layer allows fluid to flow therethrough. The pump also includes means for providing electrical voltage to the first layer and the second layer, thereby producing an electrical field therebetween. The providing means is coupled to the first layer and the second layer. The pump also includes an external means for generating power that is sufficient to pump fluid through the porous structure at a desired rate. The means for generating is coupled to the means for providing.
In another aspect of the invention, an electroosmotic porous structure is adapted to pump fluid therethrough. The porous structure preferably includes a first rough side and a second rough side and a plurality of fluid channels therethrough. The first side has a first continuous layer of electrically conductive material that is deposited thereon. The second side has a second continuous layer of electrically conductive material that is deposited thereon. The first layer and the second layer are coupled to an external power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate.
In yet another aspect of the invention, a method of manufacturing electroosmotic pump comprises the steps of forming at least one porous structure which preferably has a first rough side and a second rough side and a plurality of fluid channels therethrough. The method includes the step of depositing a first continuous layer of electrically conductive material of appropriate thickness to the first side which is adapted to pass fluid through at least a portion of the first layer. The method also includes the step of depositing a second continuous layer of electrically conductive material of appropriate thickness to the second side adapted to pass fluid through at least a portion of the second layer. The method further comprises the steps of coupling a power source to the first continuous layer and the second continuous layer and applying an appropriate amount of voltage to generate a substantially uniform electric field across the porous structure.
In one embodiment, the electrically conductive material is disposed as a thin film electrode. Alternatively, the electrically conductive material is disposed as a screen mesh which has an appropriate electrically conductivity. Each individual fiber in the screen mesh is separated by a distance that is smaller or larger than a cross-sectional width of the porous structure. Alternatively, the electrically conductive material includes a plurality of conductive beads which have a first diameter and are in contact with one another to pass electrical current therebetween. In an alternative embodiment, at least one of the plurality of beads has a second diameter that is larger than the first diameter beads. Alternatively, a predetermined portion of the continuous layer of electrically conductive material has a third thickness, whereby the predetermined portion of the continuous layer is disposed on the surface of the porous structure in one or more patterns. In an alternative embodiment, at least a portion of an non-porous outer region of the porous structure is made of borosilicate glass, Quartz, Silicon Dioxide, or porous substrates with other doping materials. The electrically conductive material is preferably made of Platinum, but is alternatively made of other materials. In one embodiment, the first layer and the second layer are made of the same electrically conductive material. In another embodiment, the first layer and the second layer are made of different electrically conductive materials. The electrically conductive material is applied by variety of methods, including but not limited to: evaporation; vapor deposition; screen printing; spraying; sputtering; dispensing; dipping; spinning; using a conductive ink; patterning; and shadow masking.
Other features and advantages of the present invention will become apparent after reviewing the detailed description of the preferred embodiments set forth below.
Reference will now be made in detail to the preferred and alternative embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the preferred embodiments, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which are included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it should be noted that the present invention is able to be practiced without these specific details. In other instances, well known methods, procedures, components, and circuits have not been described in detail as not to unnecessarily obscure aspects of the present invention.
The basic performance of an electrokinetic or electro-osmotic pump is modeled by the following relationships:
As shown in equations (1) and (2), Q is the flow rate of the liquid flowing through the pump and ΔP is the pressure drop across the pump and the variable a is the diameter of the pore aperture. In addition, the variable ψ is the porosity of the pore apertures, ζ is the zeta potential, ε is the permittivity of the liquid, V is the voltage across the pore apertures, A is the total Area of the pump, τ is the tortuosity, μ is the viscosity and L is the thickness of the pumping element. The terms in the parenthesis shown in equations (1) and (2) are corrections for the case in which the pore diameters approach the size of the charged layer, called the Debye Layer, λD, which is only a few nanometers. For pore apertures having a diameter in the 0.1 micrometer to 0.1 mm range, these expressions simplify to be approximately:
As shown in equations (3) and (4). The amount of flow and pressure are proportional to the amount of voltage potential that is present. However, other parameters are present that affect the performance of the pump. For example, the tortuosity (τ) describes the length of a channel relative to the thickness of the pumping element and can be large for pumps with convoluted, non-parallel channel paths. The length (L) is the thickness of the pumping element. As shown in equations (3) and (4), the tortuosity τ and thickness L of the pumping element are inversely proportional to the flow equation (4) without appearing at all in the pressure equation (4). The square of the diameter a of the pore apertures is inversely proportional to the pressure equation (4) without appearing at all in the flow equation (3).
As shown in
The support structures 106 are attached to the pumping element 102 at predetermined locations of the bottom surface 114 of the pumping element 102. These predetermined locations are dependent on the required strength of the pump 100 in relation to the pressure differential and flow rate of the liquid passing through the pumping element 102. In between each support structure 106 is a support aperture 108, whereby the liquid passes from the support apertures 108 into the pore apertures 110 in the bottom surface 114 of the pumping element 102. The liquid then flows from the bottom pore apertures 110 through the channels of each pore apertures and exits through the pore apertures 110 opening in the top surface 112 of the pumping element 102. Though the flow is described as liquid moving from the bottom surface 114 to the top surface 112 of the pumping element 102, it will be apparent that reversing the voltage will reverse the flow of the liquid in the other direction.
The liquid passes through the pumping element 102 under the process of electo-osmosis, whereby an electrical field is applied to the pumping element 102 in the form of a voltage differential. As shown in
In one embodiment, at least one of the conduits 304 has a uniform diameter between the pore apertures 314, 316. In another embodiment, at least one of the conduits 304 has a varying diameter between the pore apertures 314, 316. In another embodiment, two or more conduits 305 in the pump body 302 are cross connected, as shown in
A layer of the electrode 510 is disposed upon the bottom side 506 of the body 502. In addition, a layer of the electrode 512 is applied to the top side of the body 502. The pump 500 is coupled to an external power source 514 and an external control circuit 516 by a pair of wires 518A and 518B. Alternatively, any other known methods of coupling the power source 514 and circuit 516 to the pump 500 are contemplated. The power source is any AC or DC power unit which supplies the appropriate current and voltage to the pump 500. The control circuit 516 is coupled to the power source 514 and variably controls the amount of current and voltage applied to the pump 500 to operate the pump at a desired flowrate.
The electrode layer 510 on the top surface 508 is a cathode electrode and the electrode layer 512 on the bottom surface 506 is an anode electrode. The electrode layers 510, 512 are made of a material which is highly conductive and has porous characteristics to allow fluid to travel therethrough. The porosity of the electrode layers 510, 512 are dependent on the type of material used. The electrode layers 510, 512 also have a sufficient thickness which generate the desired electrical field across the pump 500. In addition, the thickness and composition of material in the electrode layers 510, 512 allow the electrode layers 510, 512 to be applied to the pump body surfaces 506,508 which have a particular roughness. Alternatively, the pump body surfaces 506, 508 are smooth, whereby the electrode layers 510, 512 are applied to the smooth surfaces 506, 508. The electrode layers 510, 512 preferably provide a uniform surface along both sides of the pump body 502 to generate a uniform electric field across the pump 500.
The electrode layers 510, 512 are disposed on the surfaces 506, 508 of the pump body 502 as a thin film, as shown in
As shown in
Alternatively, the pump body 502 is configured with multiple layers of electrodes 618, 620 as shown in
The pump 600 includes a thin film electrode 612 disposed on the top surface 608 as well as another thin film electrode 610 disposed on the bottom surface 606. In addition, as shown in
The multi-layer electrodes 618, 620 are disposed at predetermined locations along the top and bottom surfaces 610,612 of the pump 600. As shown in
As shown in
In one embodiment, the additional electrode layer is disposed on the surface of the pump as a circular ring with respect to the center. Alternatively, the additional electrode layer is disposed along the surface of the pump 700 in any other configuration, including, but not limited to, cross-hatches, straight line patterns and parallel line patterns. In another embodiment, the pump 600 alternatively has the multi layer electrodes 618, 620 which cover a substantial area of the pump surface 606, 608, whereby the thin film electrodes 610, 612 form notches or indents into the multi layer electrode surfaces 618, 620. Thus, a smaller electrical field is present proximal to the locations of the notches, whereas a larger electrical field is present elsewhere across the pump body 600.
In comparison to the thin film electrodes 610, 612, the multilayer electrodes 618 are capable of distributing larger total currents without generating large voltage drops. In some cases, these currents are as large as 500 mA, whereby the total resistance of the electrode is less than 10 ohms. The multilayer electrodes 618 provide a number of very low-resistance current paths from one edge of the pumping element to other locations on the surface of the pumping element. The thicker electrodes in this design will block a portion of the pores within the pump body, thereby preventing fluid to flow through the pump at those pore locations. It should be noted that all of the pores are not blocked, however. In one embodiment, the thicker electrode regions occupy no more than 20% of the total area of the pumping element. Therefore, at least 80% of the pores in the pumping element are not blocked and are available to pump the fluid therethrough.
The beads 711 are made of an electrically conductive material and are in contact with one another along the entire surface of the pump body 702. Alternatively, the beaded electrode layer 711 is disposed partially on the surface of the pump body 702. The beads 711 allow electrical current to pass along the top and bottom surface 712, 710 of the pump body 702 to form a voltage potential across the pump 700. The beads 711 are spherical and have a diameter range in between and including 1 micron and 500 microns. In one embodiment, the diameter of the beads 711 is 100 microns such that the beads do not block the pores in the pumping element while providing uniform distribution of the electric field and current which is larger than 1 millimeter in area. The beads 711 in the electrode layers 710, 712 are in contact with the corresponding top and bottom surfaces 708, 706 of the pump body 702. Due to the spherical shape of the beads 711, small gaps or openings are formed in between the beads 711 when placed in contact with one another. Fluid is thereby able to flow through the pump body 702 by flowing through the gaps in between the beads 711 in the bottom and top electrode layers 710, 712. It is preferred that the beads 711 are securely attached to the top and bottom surfaces 706, 708 of the pump body 702 and do not detach from the pump body 702 due to the force from the fluid being pumped therethrough. However, it is understood that the beads 711 are alternatively placed in any other appropriate location with respect to the pump body 702. For instance, the beads 711 are not attached to surfaces 706, 708, but are alternatively packed tightly within an enclosure (not shown), such as a glass pump housing, which houses the pump body 702.
Alternatively, the beaded electrode layer 711 is configured to have a predetermined number of larger diameter beads 713 among the smaller diameter beads in the beaded electrode layer 711. The larger beads 713 are within the range and including 100 microns and 500 microns, whereas the smaller beads (not shown) are within the range and including 1 micron and 25 microns. With respect to the surface of the pump body, the larger diameter beads 713 will present a thicker electrode layer than the smaller diameter beads. As with the multi-layer electrodes 618, 620 (
In the above figures, the cathode electrode 512 and anode electrodes 510 are charged by supplying voltage from the power source 514 to the electrodes 510, 512. As shown in
The fused glass portion 622 of the pump 600 provides one or more rigid non-porous surfaces to attach the pump 600 to a pump housing (not shown) or other enclosure. The fused glass portion 622 is attached to one or more desired surfaces by soldering, thereby avoiding the use of solder wicking through the frit and shorting out the pump 600. It is apparent to one skilled in the art that other methods of attaching the fused glass portion 622 to the desired surfaces are contemplated. The fused glass is preferably made of borosilicate glass. Alternatively, other glasses or ceramics are used in the outer perimeter of the pump including, but not limited to Quartz, pure Silicon Dioxide and insulating ceramics. In one embodiment, the pump 600 includes the fused glass portion 622 along the entire outer perimeter. In another embodiment, the pump 600 includes the fused glass portion 622 along one side of the pump body 602. In addition, it is contemplated that the fused glass portion 622 is not limited to the embodiment in
It is apparent to one skilled in the art that other electrode layer configurations are contemplated in accordance with the present invention. For instance, as shown in
The method of manufacturing the pump of the present invention will now be discussed. The pumping structure is formed initially by any appropriate method, as in step 200 in
Once the pumping element is formed by any of the above processes, the electrodes are formed onto the pump. Referring to
In the preferred embodiment, the electrode layer 312 is formed on the top surface 308 of the pumping element body 302 as in step 202. In addition, the electrode layer 314 is formed on the bottom surface 306 of the pumping element body 302 as in step 204. Some application methods of the electrode layer onto the pump include but are not limited to: sputtering, evaporating, screen printing, spraying, dispensing, dipping, spinning, conductive ink printing, chemical vapor deposition (CVD), plasma vapor deposition (PVD) or other patterning processes.
The multi-layer electrodes described in relation to
In relation to
Relating back to
The present invention has been described in terms of specific embodiments incorporating details to facilitate the understanding of the principles of construction and operation of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that modifications may be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention.
This Patent Application is a continuation-in-part of U.S. patent application Ser. No. 10/366,121, filed Feb. 12, 2003 now U.S. Pat. No. 6,881,039 which claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Ser. No. 60/413,194 filed Sep. 23, 2002, and entitled “MICRO-FABRICATED ELECTROKINETIC PUMP”. In addition, this Patent Application claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Ser. No. 60/442,383, filed Jan. 24, 2003, and entitled “OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING”. The co-pending patent application Ser. No. 10/366,211 as well as the two co-pending Provisional Patent Applications, Ser. No. 60/413,194 and 60/422,383 are also hereby incorporated by reference.
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---|---|---|---|
20040101421 A1 | May 2004 | US |
Number | Date | Country | |
---|---|---|---|
60413194 | Sep 2002 | US | |
60442383 | Jan 2003 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10366121 | Feb 2003 | US |
Child | 10669495 | US |