This application is the U.S. national phase of International Application No. PCT/IB2019/050875 filed Feb. 4, 2019 which designated the U.S. and claims priority to European Application No. 18155609.3 filed Feb. 7, 2018, the entire contents of each of which are hereby incorporated by reference.
The present invention relates, in a first aspect, to a micro-mechanical timepiece part cut out in a plate-shaped silicon substrate and the cut edges of which comprise portions provided to serve as contact surfaces arranged to slide against corresponding contact zones of another micro-mechanical part in a timepiece, the cut edges of the part having a ribbed surface comprising an alternation of ribs and furrows, these ribs and these furrows being straight. This first aspect of the invention relates in particular to a micro-mechanical timepiece part which conforms to the definition given above and is part of a lever escapement.
In a second aspect, the present invention relates to a method of manufacturing a micro-mechanical timepiece part which conforms to the first aspect of the invention, the method comprising the steps of:
The production of micro-mechanical timepiece parts and in particular such parts forming part of a lever escapement by micro-machining of a monocrystalline or polycrystalline silicon wafer is known. EP 0 732 635 in particular describes the production of an escapement lever from silicon. The micro-machining of the silicon consists in large part of etching operations. Etching resists are generally used in order to give the parts the desired shape, these resists having previously been deposited and structured on the horizontal surface of the silicon substrate. The most widely used etching technique is called deep reactive-ion etching, DRIE. U.S. Pat. No. 5,501,893 in the name of Robert Bosch GmbH, in particular, proposes etching profiles with quasi-vertical flanks in a silicon substrate by applying a procedure which alternates the steps of depositing an inert passivation layer and plasma etching. The steps of depositing the passivation layer and the etching steps all make use of fluorine compounds, so that they take place within a single chemical context. Each step lasts a few seconds, the passivation layer is formed over the whole surface of the substrate so that this substrate is protected from any subsequent etching. However, during the following etching step, bombardment by ions which are accelerated vertically causes disintegration of the part of the passivation layer at the bottom of the profiles (but not that which covers the flanks thereof). The bottom of the profiles is thus very quickly exposed to the reactive etching. U.S. Pat. No. 5,501,893 is incorporated by reference.
The sequence formed by an etching step followed by a step of depositing a passivation layer is repeated many times. For example, between 100 and 1000 times in order to etch a groove which passes vertically from one side of a substrate 500 microns thick to the other. The alternating succession of depositing steps and etching steps does not produce perfectly straight flanks but rather flanks which are finely undulating and which have an alternation of regularly spaced reliefs and hollows. The amplitude of the undulation is dependent on the frequency with which the depositing and etching steps alternate.
The manufacture of micro-mechanical timepiece parts by micro-machining of a silicon wafer by DRIE technology gives good results. However, it is not uncommon for the vertical flanks of a micro-mechanical part to be intended to serve as contact surfaces provided to slide against at least one contact zone of another micro-mechanical part. It proves to be the case that these vertical contact surfaces are not entirely satisfactory from a tribological point of view.
A number of ideas have been advanced to attempt to overcome this problem. Firstly, attempts have been made to make the flanks of the micro-mechanical parts as straight as possible by shortening the duration of the individual etching steps. This procedure makes it possible to obtain almost perfectly smooth flanks. However, this is at the cost of a significant reduction in the speed of execution of the etching process. Another solution is described in patent EP 3 109 200. This document actually proposes producing micro-mechanical parts with peripheral walls which sub-divide into two levels. An upper level having a surface which is substantially vertical, and a lower level with a surface orientated obliquely in the manner of chamfer. Since the peripheral wall of the second level is inclined relative to the vertical, it does not come into contact with the contact zone of the other micro-mechanical part. The actual area of contact is thus reduced compared with a part with vertical flanks.
One aim of the present invention is to overcome the disadvantages of the prior art which have just been described. The present invention achieves this aim and others by providing a micro-mechanical timepiece part according to claim 1 as attached, and two manufacturing methods according to claims 13 and 14 as attached, respectively.
In accordance with the invention, the ribs and furrows form a spaced-apart pattern with first intervals in which the spacing separating the ribs from each other is equal to a first distance, and at least one second interval in which the spacing between the ribs is equal to a second distance different from the first distance. Tests carried out by the applicant have shown that the presence of a spaced-apart pattern having the above-mentioned features improves tribological properties by reducing friction during contact.
According to certain embodiments of the invention, the ribs and furrows are each contained within a plane parallel to the plate.
According to other embodiments of the invention, the ribs and furrows are perpendicular to the main faces of the plate.
According to a first embodiment of the invention, the furrows belonging to the first intervals are preferably all of the same first depth. This depth is between 10 nm and 2 μm.
According to a second embodiment of the invention, the second distance is preferably greater than the first distance.
According to a third embodiment of the invention, the spaced-apart pattern comprises a plurality of second intervals, and the second distance is between 200 nm and 50 μm, and preferably between 800 nm and 10 μm.
According to an advantageous variant of the third embodiment, the furrows belonging to the second intervals are all of the same depth. This depth is between 10 nm and 10 μm.
According to an advantageous variant of the second embodiment, the spaced-apart pattern comprises a single second interval comprising a single furrow, and the second distance is between 200 nm and ⅔ of the total height of the part, and preferably between ⅓ and ½ the total height of the part. Furthermore, the depth of the single furrow of the second interval is preferably between 10 nm and 50 μm.
Other features and advantages of the present invention will become clear upon reading the following description, given solely by way of non-limiting example, and given with reference to the attached drawings in which:
The invention will be described hereinunder in the context of a Swiss lever escapement. However, it will be understood that the invention is not limited to this restricted area of application but that, on the contrary, it relates to all micro-mechanical timepiece devices in which two components are caused to slide and thus to rub against each other.
The pattern on the ribbed surface of the cut edge of the part illustrated in
The pattern on the ribbed surface of the cut edge of the part illustrated in
The present invention also relates to a method permitting manufacture of micro-mechanical timepiece parts such as those illustrated in the appended
The method of the invention comprises a first step consisting of obtaining a silicon substrate in the form of a plate. Of course, it would be possible for the substrate not to be entirely formed of silicon or even to be formed of doped silicon. The substrate could be formed of silicon on insulator (SOI). As a person skilled in the art will know, such a substrate with a sandwich structure comprises two layers of silicon connected by an intermediate layer of silicon dioxide. The substrate could alternatively be formed of a layer of silicon attached to another type of base such as e.g. metal.
The following step of the method consists of depositing and structuring an openwork etching resist on a horizontal surface of the substrate. The etching resist is formed on one of the two main faces of the substrate in the form of a plate. Reference to
The method continues by means of a step consisting of etching by reactive-ion etching the exposed surface of the substrate through the openings in the resist so as to hollow out the substrate to a depth equal to a first distance. Reactive-ion etching is known per se to a person skilled in the art. The gas most commonly used for the etching step is SF6, and the main parameters permitting optimisation of the etching are the flow of SF6 which is advantageously between 200 and 780 sccm, preferably between 350 and 600 sccm; the radio frequency power serving to excite the plasma which is advantageously between 1000 and 3000 Watts at 2.45 GHz, and preferably between 1500 and 2600 Watts at 2.45 GHz; and the duration of an etching step which is advantageously between 0.8 seconds and 35 seconds and preferably between 1.5 and 7 seconds. The parameters are selected so that, at the end of the step, the ion etching has hollowed out the silicon substrate to a depth equal to a predefined first distance (e.g. 2 microns in the case of the example of
The following step of the method consists of depositing a chemically inert passivation layer on the surfaces exposed by the etching during the preceding step. The gas most commonly used for the passivation step is C4F8, and the main parameters permitting optimisation of the deposition of the passivation layer are the flow of C4F8 which is advantageously between 10 and 780 sccm, preferably between 50 and 400 sccm; the radio frequency power serving to excite the plasma which is advantageously between 1000 and 3000 Watts at 2.45 GHz, and preferably between 1500 and 2600 Watts at 2.45 GHz; and the duration of a passivation step which is advantageously between 0.8 seconds and 20 seconds and preferably between 1 and 4 seconds.
The method sequence comprising the etching step and the passivation step just described is then repeated. This first iterative sequence is executed consecutively a predetermined first number (n) of times, or in an equivalent manner, the first iterative sequence is carried out as many times as there are furrows in a first interval (in other words, twice in the example shown in
In order to etch deeper furrows while retaining the same furrow width it is possible to adapt the parameters of the etching process. For example, it is possible to vary the flow of reactive gas and the duration of an etching step simultaneously. In fact, by increasing the flow of active gas, the etching is accelerated. However, this also increases the density of the molecules of reactive gas, which renders the etching more isotropic, and thus makes the furrows deeper. In order to influence the depth of the furrows, the gas flow factor is thus more important than the duration of the etching step.
When the method has terminated the etching of a first interval as above, the following step of the method consists of etching by reactive-ion etching the exposed surface of the substrate through the openings in the resist so as to hollow out the substrate to a depth equal to a second distance different from the first distance. The etching parameters are selected so that, at the end of the step, the ion etching has hollowed out the silicon substrate to a depth equal to a predefined second distance (e.g. 8 microns in the case of the example of
The sequence of the method comprising the etching step and the passivation step just described is then repeated. This second iterative sequence is executed consecutively a predetermined second number (m) of times, or in an equivalent manner, the second iterative sequence is carried out as many times as there are furrows in a second interval (in other words, once in each of the examples illustrated in
The method sequence consisting of first etching a first interval and then a second interval can itself be repeated. This third iterative sequence is executed a specific third number (v) of times, or in an equivalent manner, the third iterative sequence is carried out once for each second interval on the ribbed surface of the cut edge of the part.
The micro-mechanical timepiece part is then freed of its resist before, preferably, being covered with a silicon dioxide layer before it is finally released from the substrate.
It has been shown that, in accordance with the invention, the surface of the cut edges of the micro-mechanical timepiece part is ribbed and comprises an alternation of straight ribs and furrows. According to both embodiments described thus far, these ribs and these furrows were horizontal or, in other words, each contained within a plane parallel to the plate. The partial schematic plan view of
In order to produce a batch of micro-mechanical timepiece parts which conform to the invention and comprise vertically textured surfaces it is possible to use a method of manufacturing a micro-mechanical part of mono-crystalline or poly-crystalline silicon comprising the following steps:
It will also be understood that various modifications and/or improvements obvious to a person skilled in the art can be made to the embodiments being described in the present description without departing from the scope of the present invention defined by the accompanying claims. In particular, although the invention has been described in relation to an escapement wheel and a lever it is clear that the invention does not relate only to the components of escapements but that it relates in a completely general way to all micro-mechanical timepiece parts.
Number | Date | Country | Kind |
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18155609 | Feb 2018 | EP | regional |
Filing Document | Filing Date | Country | Kind |
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PCT/IB2019/050875 | 2/4/2019 | WO |
Publishing Document | Publishing Date | Country | Kind |
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WO2019/155347 | 8/15/2019 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5501893 | Laermer et al. | Mar 1996 | A |
20120051192 | Steinmuller | Mar 2012 | A1 |
20160376147 | Gandelhman | Dec 2016 | A1 |
Number | Date | Country |
---|---|---|
710 846 | Sep 2016 | CH |
0 732 635 | Sep 1996 | EP |
3 109 200 | Dec 2016 | EP |
3 141 520 | Mar 2017 | EP |
2011-158050 | Aug 2011 | JP |
2011158050 | Aug 2011 | JP |
2017-053855 | Mar 2017 | JP |
WO-2015125081 | Aug 2015 | WO |
Entry |
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International Search Report for PCT/IB2019/050875 dated May 23, 2019, 5 pages. |
Number | Date | Country | |
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20210034015 A1 | Feb 2021 | US |