Embodiments are directed to micro-optical benches and methods of fabricating micro-optical benches. More particularly, embodiments are directed to passive alignment optical micro-benches for out-of-plane optics and methods of fabricating such a micro-optical bench.
Micro-optical benches, i.e., optical motherboards, may be used to precisely align optical fibers and/or other components, e.g., lenses, detectors, lasers, etc. More particularly, e.g., micro-optical benches may be used for passive alignment of out-of-plane optical components and/or alignment of optical fiber waveguides. Micro-optical benches are generally formed using dry etching and/or wet etching techniques. For example, a silicon optical bench (SiOB) may be formed by anisotropically wet-etching silicon substrates, with various crystal orientations, in accordance with a desired sidewall angle.
The use of, e.g., silicon substrates and/or wet etching methods may, however, be limiting. For example, silicon substrates, which are opaque and do not transmit light, may not be useful in visible light applications. Also, e.g., wet etching methods, which progress along crystal planes of a substrate, generally only enable certain sidewall angles to be formed due to an orientation of the crystal planes with respect to a crystal growth axis thereof. Additionally, wet etching methods of silicon substrates may be limited to one or two different aspect ratios due to the relatively large topography of the remaining substrate. Therefore, the positional orientation of optical components on the SiOB may be limited by the crystallographic orientation of the substrate.
In some cases, dry etching methods have been employed to form optical benches, e.g., anisotropically dry etching polycrystalline substrates to form optical benches. However, forming sidewalls, e.g., wells, for positioning of micro-optics on the substrate may involve deep etches, e.g., greater than about 50 μm, may be difficult using lithographic techniques. Further, due to the nature of dry-etching processes, surface quality at, e.g., a bottom surface of the well may be poor, e.g., rough. As a result of such roughness, an optical element to be positioned at least partially within the well may not be positioned properly, and thus, alignment of the optical element with respect to the substrate and/or other elements on the optical bench may not be proper.
Embodiments are therefore directed to optical benches for out-of-plane optical component(s) and methods of forming optical benches for out-of-plane optical component(s), which substantially overcome one or more of the problems due to the limitations and disadvantages of the related art. More particularly, embodiments are therefore directed to micro-optical benches for out-of-plane optical element(s) and methods of forming micro-optical benches for out-of-plane optical element(s), which substantially overcome one or more of the problems due to the limitations and disadvantages of the related art.
It is therefore a feature of an embodiment of the present invention to provide a micro-optical bench that is free of positional orientation restrictions.
It is therefore a separate feature of an embodiment of the present invention to provide a method of forming a micro-optical bench that is free of positional orientation restrictions.
It is therefore a separate feature of an embodiment of the present invention to provide a micro-optical bench including a transmissive substrate.
It is therefore a separate feature of an embodiment of the present invention to provide a method of forming a micro-optical bench including a transmissive substrate.
It is therefore a separate feature of an embodiment of the present invention to provide a method of forming a micro-optical bench without requiring etching of the substrate thereof.
It is therefore a separate feature of an embodiment of the present invention to provide a micro-optical bench including positioning projections on a surface thereof for passively aligning optical components with the positioning projections.
It is therefore a separate feature of an embodiment of the present invention to provide a method of forming a micro-optical bench including positioning projections on a surface thereof for passively aligning optical components with the positioning projections.
At least one of the above and other features and advantages of the present invention may be realized by providing a micro-optical bench, including a substrate having a substantially planar surface on which an optical element is to be mounted, and two lithographs protruding above the substantially planar surface adapted to position and restrain movement of the optical element.
The two lithographs may define a footprint for the optical element.
When the optical element is on the substrate, each of the lithographs may abut the optical element. Each of the lithographs may abut opposing faces of the optical element. Each of the lithographs may abut adjacent faces of the optical element.
The two lithographs may include a plurality of lithographs, each lithograph may abut a different face of the optical element adjacent the substrate. Two lithographs of the plurality of lithographs may abut each different face of the optical element adjacent the substrate.
The two lithographs may allow the optical element to be positioned in at least two rotational positions. Each lithograph may be adjacent to one side of the optical element at each rotational position. The two lithographs may be made of a polymer or a polymerizing vitreous material. The two lithographs may be integral with the substrate. The substrate may be transparent to wavelengths of interest.
The optical element may be optically connected through the substrate. The substrate may include a plurality of substantially planar surfaces on which corresponding optical elements are to be mounted, and the two lithographs may include two lithographs adjacent each of the corresponding optical elements. The plurality of substantially planar surfaces may form a continuous substantially planar surface.
At least one of the lithographs may have one of a circular cross-sectional shape, an oval cross-sectional shape and a polygonal cross-sectional shape. An adhesive layer may be arranged between the substrate and the optical element.
The micro-optical element may include a second substrate overlapping at least a portion of the substrate and spaced apart from the substrate by a predetermined distance corresponding to a height of bonding spacers arranged between the substrate and the second substrate, wherein the second substrate may include a substantially planar surface on which an optical element is to be mounted.
The two lithographs may include a plurality of lithographs and at least one of the plurality of lithographs may project a further distance away from the substrate than others of the plurality of lithographs.
At least one of the above and other features and advantages of the present invention may be separately realized by providing a method of manufacturing an optical bench, including cleaning a surface of a substrate, priming the cleaned surface of substrate for photopolymer application, coating the primed surface of the substrate with a photopolymer layer, exposing a portion of the photopolymer layer based on a position of at least two positioning projections to be formed on the substrate, the positioning projections being positioned so as to define a predetermined space on the optical bench where an optical element is to be mounted, curing and developing the photopolymer layer to form the at least two positioning projections, and thermally treating the at least two positioning projections.
The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:
Embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.
In the drawings, the thickness of layers and regions may be exaggerated for clarity. It will also be understood that when a layer is referred to as being “on” another layer or substrate, it may be directly on the other layer or substrate, or intervening layers may also be present. Further, it will be understood that when a layer is referred to as being “under” another layer, it may be directly under, or one or more intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or one or more intervening layers may also be present. Like numbers refer to like elements throughout the specification.
Referring to
The substrate 100 may include, e.g., transmissive material(s), and may be transparent to at least certain wavelengths of interest, i.e., predetermined wavelengths. More particularly, e.g., in some embodiments of the invention, the substrate 100 may be or may include, e.g., glass, e.g., fused quartz, fused silica, optical glass, Pyrex. However, embodiments of the invention are not limited to substrates 100 that are transmissive. For example, in some embodiments of the invention the substrate 100 may include opaque material(s), e.g., may be a silicon wafer. That is, the substrate 100 may include any material(s) on which the positioning projections 110 may be arranged and which is capable of supporting the optical element(s) thereon.
The substrate 100 may have a planar and/or substantially planar surface 101, and the positioning projections 110 may be arranged on the planar and/or substantially planar surface 101. Although a single planar and/or substantially planar surface 101 is shown in
The positioning projections 110 may project from the planar and/or substantially planar surface 101 of the substrate 100. In some embodiments, e.g., all of the positioning projections 110 may project a same distance relative to the planar or substantially planar surface 101 of the substrate 100. In other embodiments, some or each of the positioning projections 110 may project a different distance from the planar or substantially planar surface 101 of the substrate 100. A distance that each positioning projection 110 extends away from the substrate 100, i.e., a height of the positioning projection 110 along the z-direction relative to the substrate 100, may be based on, e.g., a size, height and/or weight of the optical element being arranged on the substrate 100 in relation thereto, a number of the positioning projections 110 associated with one of the optical elements and/or a position of the positioning projection 110, i.e., characteristics of the respective portion of the optical element that the positioning projection 110 is to help position. That is, the positioning projections 110 may each be respectively sized to be at least thick enough, e.g., along the x-y plane, and tall enough, along the z-direction, to serve as a positioning structure for the respective optical element and/or to withstand any pressure that may be subjected thereon by the respective optical element.
In some embodiments of the invention, one or some of the positioning members 110 may be arranged on other ones of the positioning members 110. The positioning projections 110 may have various cross-sectional shapes along the x-y plane. For example, the positioning projections 110 may have a L-shaped, concave-shaped, convex-shaped, round, oval, polygonal, e.g., square, rectangular, triangular, octagonal, etc., cross-sectional shape along the x-y plane.
Referring to
As shown in
Referring to
Although the first exemplary embodiment is illustrated with the micro-prism 105 having a specific shape, embodiments of the invention are not limited to a micro-prism and/or a micro-prism having the shape shown in
Further, although eight positioning projections 110 are illustrated in the exemplary embodiment of
Referring to
As shown in
The arrows shown in
Like the substrate 100 of the first exemplary embodiment, in some embodiments of the invention, the substrate 200 may be or may include opaque and/or transmissive material(s). For example, the substrate 200 may include, e.g., glass, e.g., fused quartz, fused silica, optical glass, Pyrex.
Referring to
Four positioning members 210 may be arranged on the substrate 200 to define a predetermined space for the ball lens 235. More particularly, the optical bench 20 may include positioning projections 210 and second positioning projections 210a. The second positioning projections 210a may project from the positioning projections 210 arranged on the substrate 200. In such cases, the positioning projections 210 corresponding to the ball lens 235 may serve as a stage-like or propping-type positioning projection so as to enable the ball lens 235 to be aligned along the path 250 of light. That is, in some embodiments, e.g., when optical elements of different overall sizes are employed, the positioning projections, e.g., 210, 210a, may be stacked on each other or may project different distances from the substrate 200 to enable the respective optical element(s) to be aligned in accordance with the design standards of the optical bench 20.
Referring again to
In embodiments of the invention, as discussed above, the arrangement, shape, size, height, etc., of each of the positioning projections 210 may depend on the design requirements of the optical bench, the shape of the respective optical element(s), the size of the respective optical element(s), etc. For example, a height H1 of at least one of the positioning projections 110 associated with the prism 215 may be based on a height H2 of the prism 215. The height H1 of at least one of the positioning projections 110 associated with the prism 215 may be an order of magnitude shorter than the height H2 of the prism 215. More particularly, e.g., referring to
The second optical bench 25 may include a substrate 300 with a plurality of positioning projections 310, and a plurality of optical elements, e.g., a beamsplitting cube 315 and a prism 325, arranged on, e.g., a substantially planar or planar surface 300 thereof. The prism may be coated with a reflectively, e.g., metallic, layer 326. A diffractive optical element 270 may be etched in the substrate 300. In cases in which the substrate 300 is a transmissive substrate, light may be transmitted from the optical bench 20 up toward the optical elements 315, 325 on the second optical bench 30.
As shown in
More particularly,
As discussed above, the positioning projections 410, 410′, 420 may have various cross sectional shapes along the x-y plane. For example, the first positioning projections 410, 410′ may have circular cross sectional shapes along the x-y plane, and the second positioning projections 420 may have an octagonal cross sectional shape along the x-y plane.
With regard to the second positioning projections 420 and the second optical element 425, the second positioning projections 420 may allow the second optical element 425 to be arranged at least at two different positions relative to the substrate 400. More particularly, the octagonal cross sectional shape of the second positioning projections 420 may ensure more precise positioning of the second optical element relative to the second positioning projections 420 and the substrate 400. Different arrangements of the second optical member 425 may be achieved while the second positioning projections 20 are at the same positions relative to the substrate 400.
The positioning projections may be made of any material having sufficient material strength and chemical resistance, and may be made by any process capable of realizing both the aspect ratio and the absolute dimensions thereof. For example, the positional projections may be a polymer or a polymeric vitreous material, e.g., a photopolymer that may be patterned using photolithography, as discussed below with respect to
Referring to
Next, during step S530, the primed surface may be coated with a photopolymer, e.g., a negative-tone photoresist such as SU-8, to form the positioning projections using lithographic techniques. A thickness of the photopolymer on the substrate may be based on a height of the positioning projections, e.g., 110, 210, 210a, 310, 410, 410′, 420, to be formed on the substrate, i.e., in accordance with design requirements of the optical bench, e.g., 10, 20, 25, 30.
Next, during step S540, portion(s) of the deposited photopolymer may be exposed using, e.g., UV light, based on the desired positions of the positioning projections.
Next, during step S550, the patterned photopolymer may be subjected to a cross-linking process and may be developed to form the positioning projections.
Next, during step S560, the formed positioning projections may be subjected to a heating process. The heating process may help ensure that the formed positioning projections are permanently shaped and fixed to the substrate.
Next, during step S570, optical elements may be arranged on the substrate in relation to the respective positioning projections formed on the substrate. The process may end in step S580.
In some embodiments, prior to depositing a material for forming the projecting portions, e.g., photopolymer, and more particularly, e.g., SU8, an adhesion promoter may be applied on the substrate, e.g., glass, silicon wafer, to aid in the adhesion of the material to the substrate. For example, in embodiments in which the photopolymer is, e.g., SU8, and the substrate is glass or a silicon wafer, hexamethyldisilazane (HMDS) may be deposited therebetween as an adhesion promoter for promoting adhesion between the SU8 and the glass or silicon wafer.
Exemplary embodiments of the present invention have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.