The present disclosure relates to the art of speakers, particularly to a micro-speaker used in an electronic device.
A related speaker includes a frame, a vibrating unit and a magnetic circuit unit accommodating in the frame. The vibrating unit includes a diaphragm and a voice coil driving the diaphragm. The voice coil includes two terminals extending from two ends thereof for transferring electrical signals.
The frame further includes two contacts partially exposed outside for connecting the two terminals to an external circuit. The two contacts are disposed at a same side of the frame, which helps the operators solder the terminals easily. However, considering the two terminals of the voice coil arranged at two sides of the frame, a third contact is provided within the frame for soldering one of the terminals and a conductive wire is used to electrically connect the third contact to one of the contacts.
The magnetic circuit unit assembled in the speaker is usually designed as large as possible for getting a good acoustic performance. However, the inner space of the speaker is limited, so the conductive wire is easy to be pressed and broken up while the diaphragm vibrates or the speaker falls off.
Therefore, it is desirable to provide an improved micro-speaker which can overcome the above-mentioned problems.
Many aspects of the embodiment can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Referring to
The frame 3 includes a first wall 31 and a second wall 32 opposite to the first wall 31. The contacts include a first contact 51 and a second contact 52 disposed at the first wall 31, and a third contact 53 disposed at the second wall 32. The first contact 51 includes a first soldering pad 511 disposed within the receiving space and a connecting portion 512 extending outwards from the first wall 31. The second contact 52 includes a second soldering pad 521 disposed within the receiving space and a second connecting portion 522 extending outwards from the first wall 31. The third contact 53 includes a third soldering pad 531 and a third connecting portion 532 disposed within the receiving space. The first connecting portion 512 and the second connecting portion 522 are both exposed outside of the frame for electrically connecting to an external circuit.
The first terminal 41 of the voice coil 4 is disposed on the first wall 31 of the frame 3 while the second terminal 42 is disposed on the second wall 32. The first terminal 41 is soldered to an upper surface of the first soldering pad 511. The second terminal 42 of the voice coil 4 is soldered to an upper surface of the third soldering pad 531 of the third contact 53.
Referring to
It will be understood that the above-mentioned particular embodiment is shown and described by way of illustration only. The principles and the features of the present disclosure may be employed in various and numerous embodiments thereof without departing from the scope of the disclosure as claimed. The above-described embodiment illustrates the scope of the disclosure but do not restrict the scope of the disclosure.
Number | Date | Country | Kind |
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2012 2 0262324 U | Jun 2012 | CN | national |
Number | Name | Date | Kind |
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8081790 | Lin | Dec 2011 | B2 |
8189848 | Lim | May 2012 | B2 |
Number | Date | Country | |
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20130322679 A1 | Dec 2013 | US |