The invention relates to an apparatus for cooling a heat producing device in general, and specifically, to a fluid-air heat exchanger used in fluid cooling applications.
Cooling of high performance integrated circuits with high heat dissipation is presenting significant challenge in the electronics cooling arena. Conventional cooling with heat pipes and fan mounted heat sinks are not adequate for cooling chips with ever increasing wattage requirements.
A particular problem with cooling integrated circuits within electronic devices is that more numerous and powerful integrated circuits are configured within the same size or smaller chassis. As more powerful integrated circuits are developed, each with an increasing density of heat generating transistors, the heat generated by each individual integrated circuit continues to increase. Further, more and more integrated circuits, such as graphics processing units, microprocessors, and multiple-chip sets, are being added to electronic devices, such as electronics servers and personal computers. Still further, the more powerful and more plentiful integrated circuits are being added to the same, or smaller size chassis, thereby increasing the per unit heat generated for these devices. In such configurations, conventional chassis' provide limited dimensions within which to provide an adequate cooling solution. Conventionally, the integrated circuits are cooled using a heat sink and a large fan that blows air over the heat sink, or simply by blowing air directly over the circuit boards containing the integrated circuits. However, considering the limited free space within the device chassis, the amount of air available for cooling the integrated circuits and the space available for conventional cooling equipment, such as heat sinks and fans, is limited.
Closed loop liquid cooling presents alternative methodologies for conventional cooling solutions. Closed loop liquid cooling solutions more efficiently reject heat to the ambient than air cooling solutions. A closed loop cooling system includes a cold plate to receive heat from a heat source, a radiator with fan cooling for heat rejection, and a pump to drive liquid through the closed loop. The design of each component is often complex and requires detailed analysis and optimization for specific applications.
As in the first conventional radiator 2, the airflow is provided to the second conventional radiator 4 in a direction that is perpendicular to a fluid flow direction of the fluid flowing through the fluid channels 24, 25. In this configuration, each of the fluid channels 24, 25 is exposed to the same temperature airflow. However, the fluid flowing through the second set of fluid channels 25 is cooler relative to the fluid flowing through the first set of fluid channels 24. Since the air temperature of the airflow intersecting each of the fluid channels 24, 25 is the same, there is a greater temperature difference between the airflow and the fluid flowing through the first set of channels 24 then the temperature difference between the airflow and the fluid flowing through the second set of fluid channels 25. Therefore, the cooling efficiency of the radiator 4 is non-uniform.
The performance of the radiator depends on an air flow rate over the cooling fins, a fluid flow rate through the fluid channels, a surface area of the cooling fins, and the difference in temperature between the air and the fluid.
What is needed is a more efficient cooling methodology for cooling integrated circuits within electronic devices. What is also needed is a cooling methodology that increases cooling performance within a given space constraint.
A counter flow radiator is air cooled and is applicable for fluid cooling in electronic systems. Heated fluid, such as heated liquid or two-phase fluid, enters the counter flow radiator and travels through a fluid path including multiple micro-conduits, such as micro-tubes, micro-channels, or micro-ports, while rejecting the heat from the fluid into fin assemblies coupled to the micro-conduits. Airflow is directed over the surface of the fin assemblies to remove heat from the fin assemblies to the air. The counter flow radiator is configured with multiple cooling cores. Each cooling core includes at least one layer of micro-conduits and at least one layer of cooling fin assemblies alternatively stacked on top of each other. The cooling cores are coupled together in series along a first direction. The airflow is also directed along the first direction. The fins are aligned in the direction of air flow. The heated fluid enters the counter flow radiator through one or more inlet points in a first header. The one or more inlet points are positioned on an air exhaust side of the counter flow radiator. The heated fluid follows a serpentine-like path that passes though the multiple cooling cores, crossing the air flow path multiple times, and leaves the counter flow radiator through one or more outlet points in a second header. The one or more outlet points are positioned on an air intake side of the counter flow radiator. One or both of the headers, depending on the number of cooling cores, include a divider or dividers that selectively separates the multiple cooling cores and facilitate the serpentine-like fluid path. The counter flow radiator configuration improves the thermal efficiency of the radiator by flowing fluid in an opposite direction of airflow, thereby exposing the hottest temperature fluid to the hottest temperature air and the coldest temperature fluid to the coldest temperature air. In some embodiments of the counter flow radiator, a constant temperature differential exists in the direction of air flow, across the width of the heat sink
In one aspect, a fluid-air heat exchanger includes a plurality of fluid-air cooling cores, a first fluid header, and a second fluid header. Each cooling core includes at least one layer of one or more thermally conductive fluid conduits and at least one layer of thermally conductive cooling fins coupled to at least one fluid conduit layer, wherein each fluid conduit is configured along a first direction from a first end of the cooling core to a second end of the cooling core, further wherein the plurality of cooling cores are stacked side by side along a second direction perpendicular to the first direction such that the fluid conduits of the plurality of cooling cores are configured in parallel. The first fluid header is coupled to the first end of each cooling core, wherein the first header includes an inlet port configured to receive an input fluid. The second header is coupled to the second end of each cooling core, wherein the first header and the second header are configured to direct fluid flow in series from a first cooling core closest to the inlet port of the first header to each successively stacked cooling core along the second direction.
A second cooling core is positioned furthest from the first cooling core within the plurality of stacked cooling cores. In some embodiments, the second cooling core is configured to receive an intake airflow into the fluid-air heat exchanger along the second direction and the first cooling core is configured to exhaust the airflow from the fluid-air heat exchanger. If a number of cooling cores is even, then the first fluid header includes an outlet port configured to output fluid received from the second cooling core. In this configuration, the first header includes at least one divider to separate the inlet port from the outlet port. If a number of cooling cores is odd, then the second fluid header includes an outlet port configured to output fluid received from the second cooling core. In this configuration, the first header and the second header cumulatively include at least one fluid divider configured to direct fluid flow from the inlet port to the outlet port via the plurality of cooling cores. The fluid flows between the first header, the second header, and from cooling core to cooling core in a serpentine-like manner. In some embodiments, a temperature of the input fluid is greater than a temperature of the fluid output from the outlet port. In this case, a hot-to-cold fluid temperature gradient is formed along the second direction from the first cooling core to the second cooling core. In some embodiments, a temperature of the intake airflow is colder than a temperature of the exhaust airflow. In this case, a hot-to-cold air temperature gradient is formed along the second direction from the first cooling core to the second cooling core.
In some embodiments, a temperature of the input fluid is less than a temperature of the fluid output from the outlet port, and a temperature of the intake airflow is greater than a temperature of the exhaust airflow. In this case, a cold-to-hot fluid temperature gradient is formed along the second direction from the first cooling core to the second cooling core, and a cold-to-hot air temperature gradient is formed along the second direction from the first cooling core to the second cooling core. Each cooling core is exposed to a different temperature airflow.
In some embodiments, the inlet port is positioned proximate a first end of the first fluid header, and the first cooling core is positioned proximate the first end of the first fluid header and a first end of the second fluid header. The second cooling core is positioned proximate a second end of the first fluid header and a second end of the second fluid header. Each layer of fluid conduits can include a plurality of individual thermally conductive micro-tubes, wherein each micro-tube is configured such that fluid flow therethrough is isolated from each other micro-tube. Alternatively, each layer of fluid conduits can include a plurality of individual thermally conductive micro-tubes, wherein each micro-tube includes one or more common openings with an adjacent micro-tube such that fluid flow therethrough is intermixed between adjacent micro-tubes. Each cooling fin is configured along the second direction. In some embodiments, each cooling core includes a plurality of core layers, each layer including at least one layer of cooling fins and a layer of at least one fluid conduit, further wherein each core layer within a given cooling core is stacked along a third direction that is perpendicular to the first direction and perpendicular to the second direction.
In another aspect, the fluid-air heat exchanger is included within a fluid-based cooling system. The fluid based cooling system includes the fluid-air heat exchanger, one or more air movers configured to provide the intake airflow to the fluid-air heat exchanger, and a fluid-based cooling loop coupled to the fluid-air heat exchanger, wherein the cooling loop is configured to provide heated fluid to inlet port of the first fluid header.
In yet another aspect, the fluid-air heat exchanger has a concurrent flow configuration in which the fluid inlet is on the same side of the heat exchanger as the air flow intake side.
Other features and advantages of the present invention will become apparent after reviewing the detailed description of the embodiments set forth below.
The present invention is described relative to the several views of the drawings. Where appropriate and only where identical elements are disclosed and shown in more than one drawing, the same reference numeral will be used to represent such identical elements.
Embodiments of the present invention are directed to a counter flow fluid-air heat exchanger included within a fluid-based cooling system, where the cooling system removes heat generated by one or more heat generating devices within an electronics device or system. The heat generating devices include, but are not limited to, one or more central processing units (CPU), a chipset used to manage the input/output of one or more CPUs, one or more graphics processing units (GPUs), and/or one or more physics processing units (PPUs), mounted on a motherboard, a daughter card, and/or a PC expansion card. The cooling system can also be used to cool power electronics, such as mosfets, switches, and other high-power electronics requiring cooling. In general, the cooling system described herein can be applied to any electronics sub-system that includes a heat generating device to be cooled.
In some embodiments, the counter flow fluid-air heat exchanger is a radiator. As described herein, reference to a radiator is used. It is understood that reference to a radiator is representative of any type of fluid-air heat exchanging system unless specific characteristics of the radiator are explicitly referenced.
Heat generated from a heat generating device is received by a heat exchanger. In some embodiments, the heat exchanger is configured with fluid channels through which fluid in the cooling loop passes. As the fluid passes through the heat exchanger, heat is passed to the fluid, and heated fluid is output from the heat exchanger and directed to the counter flow radiator. One or more air movers, such as fans, are coupled to the counter flow radiator. The heated fluid is input to the counter flow radiator. Airflow provided by the air mover is directed over and through the counter flow radiator, thereby cooling the fluid passing therethrough. Cooled fluid is output from the counter flow radiator.
The heat exchanger 92 is coupled to a heat generating device 102. Any conventional coupling means can be used to couple the heat exchanger 92 to the heat generating device 102. A removable coupling means is used to enable the heat exchanger to be removed and reused. Alternatively, a non-removable coupling means is used. Heat generated by the heat generating device 102 is transferred to fluid flowing through the heat exchanger 92. The heated fluid is output from the heat exchanger 92 and input to the counter flow radiator 30. Although the cooling loop includes a single heat exchanger 92, the cooling loop can include more than one heat exchanger coupled in series or parallel to the heat exchanger 92. In this manner, the cooling loop can be used to cool multiple heat generating devices, where the multiple heat generating devices are all coupled to a single circuit board or are distributed on multiple circuit boards.
The counter flow radiator includes multiple layered cooling cores configured in series along a first direction that is opposite the direction of airflow used to cool fluid flowing through the counter flow radiator. Heated fluid inputs the counter flow radiator at a first end and flows through each cooling core in a serpentine-like path to a second end of the counter flow radiator, effectively progressing in a direction opposite that of the airflow. As described herein, reference is made to a counter flow radiator that includes two layered cooling cores, although the counter flow radiator can include more than two layered cooling cores.
Each cooling core is aligned in series along a first direction, indicated as the x-axis in
The aligned cooling cores 50, 52 form an intake side 31 and an exhaust side 33. One or more fluid inlets 40 are positioned proximate the exhaust side 33 of the first fluid header 32. If the counter flow radiator includes an even number of cooling cores, as is the case of the counter flow radiator 30 in
The first fluid header 32 is configured to direct fluid entering from the fluid inlet 40 into the first end of the micro-conduits 46 of the cooling core 50, and to direct fluid exiting from the first end of the micro-conduits 46 of the cooling core 52 into the fluid outlet 42 (
The second fluid header 34 (
If additional cooling cores are added to the counter flow radiator, a corresponding number of flow dividers are also added. For example, if a third cooling core is coupled in series to the cooling core 52, then a flow divider is added to the second fluid header between the second cooling core 52 and the third cooling core so as to prevent fluid exiting the second end of the micro-conduits 46 in the cooling core 50 from bypassing the second ends of the micro-conduits 46 in the cooling core 52. In this example, another flow divider is not added to the first fluid header. Instead, the portion of the first fluid header that receives fluid exiting from the micro-conduits 46 in the second cooling core 52 is extended to couple with the first ends of the micro-conduits 46 in the third cooling core, thereby enabling fluid to flow from the first ends of the micro-conduits 46 in the second cooling core 52 into the first ends of the micro-conduits 46 in the third cooling core. In this exemplary case, the first fluid header is not configured with the fluid outlet 42. Instead, the fluid outlet is configured on the second fluid header. Each of the fluid headers is adapted in a similar manner for each additional cooling core added to the counter flow radiator. In general, a flow divider provides a means for preventing fluid flow. As such, the flow divider can be implemented as a wall within the header, or the header itself can be comprised of multiple separate header components coupled together, where an interface between two adjoining header components forms a flow divider.
Airflow directed at the counter flow radiator 30 is input at the intake side 31 and output at the exhaust side 33. In this manner, airflow is directed through the cooling cores 50, 52 opposite the first direction, that is the negative x-direction. As the air passes over the cooling fin assemblies 36, heat is transferred from the cooling fin assembles 36 to the air. Therefore, the further the air passes through the counter flow radiator 30, the hotter the air becomes. The coldest air is the air at the intake side 31 of the counter flow radiator 30, and the hottest air is the air output at the exhaust side 33 of the counter flow radiator. The fluid at the intake side is exposed to cooler air than the fluid at the exhaust side because the air at the exhaust side has been heated from fluid it has passed while passing from the intake side to the exhaust side.
Each fluid conduit 38 includes a plurality of micro-conduits 46. In some embodiments, each of the micro-conduits 46 are isolated from each other and fluid flowing through each micro-conduit 46 does not intermix with fluid flowing within each of the other micro-conduits 46.
As there are fluid and air temperature gradients from the intake side of the counter flow radiator to the exhaust side, there are also fluid and air temperature gradients within the fluid conduit 38 of each cooling core. Fluid flowing in the micro-conduits located closer to the exhaust side of the counter flow radiator interact act with hotter air than fluid flowing in the micro-conduits closer to the intake side of the counter flow radiator. If the fluid conduit 38 is configured with isolated micro-conduits 46, as in the configuration shown in
A disadvantage of the single channel configuration is a reduction in the thermal transfer rate between the fluid and the fluid conduit relative to the micro-conduit configuration. The surface area of the micro-conduits 46 enhance the heat transfer rate, as compared to the single channel configuration, because of the larger heat transfer surface area of all the micro-conduits 46.
In an alternative configuration, each micro-conduit is configured with side openings that match side openings of adjacent micro-conduits, thereby enabling intermixing of fluid between micro-conduits as the fluid flows through the fluid conduit.
The micro-conduits with openings configuration reduces the fluid temperature gradient within the fluid conduit relative to the isolated micro-conduit configuration. However, if the number of micro-conduits is the same in both the isolated micro-conduit configuration and the micro-conduits with openings configuration, then there is a reduction in micro-conduit surface area in the micro-conduits with openings configuration relative to the isolated micro-conduit configuration. A reduction in surface area reduces the thermal transfer rate between the fluid and the micro-conduits. To increase the surface area, the fluid conduit can be configured with a greater number of micro-conduits. A fluid conduit including micro-conduits with openings can be configured with the same surface area as a corresponding fluid conduit with isolated micro-conduits be increasing the number of micro-conduits with openings. In general, the surface area used to perform thermal transfer can be adjusted in this manner, whether the micro-conduits are configured as isolated micro-conduits or micro-conduits with openings.
In general, the thermal efficiency of the counter flow radiator is constrained by the system temperature difference between the input fluid temperature at the exhaust side and the input air temperature at the intake side. There are diminishing returns for each added cooling core. As more cooling cores are added, the cooling core temperature difference (the difference between the fluid temperature and the air temperature input to the cooling core) is diminished for each cooling core in the system. So even though the overall total efficiency of the counter flow radiator is increased (to a maximum value limited by the system temperature difference), the efficiency of each cooling core is diminished with each added cooling core.
The thermal efficiency of the counter flow radiator can be adjusted by adjusting the fluid flow rate through counter flow radiator. The slower the flow rate provides a greater fluid temperature difference between the input fluid temperature and the output fluid temperature because there is a longer time period for the fluid to be exposed to the thermal transfer occurring within the counter flow radiator. However, the fluid flow rate must also be determined and balanced against the flow rate conditions necessary to optimize the heat transfer occurring within the heat exchanger, where heat is transferred to the fluid from the heat generating device. In general, the fluid flow rate can be optimized to achieve the desired system thermal performance and/or desired cooling core temperature difference for each cooling core.
The counter flow radiator is described above in terms of cooling a heated fluid. Specifically, the counter flow radiator receives a heated fluid as input, cools the heated fluid within the radiator, and outputs a cooled fluid. The heated fluid is cooled using a fluid-to air cooling method in which an input air flow passes through the radiator, and heat from the fluid flowing within the radiator passes from the fluid, to the radiator material, and to the air passing over the radiator material. As such, air flow out of the radiator is hotter than the air flow input to the radiator. In an alternative embodiment, the counter flow radiator is configured to cool heated air. In this alternative embodiment, a cold fluid, such as a refrigerant, is input into the counter flow radiator and input air passes through the radiator. Heat is transferred from the input air to the cold fluid flowing through the radiator. As such, air flow out of the radiator is cooler than the air flow input to the radiator. Fluid output from the radiator is hotter than the fluid input into the radiator.
The counter flow radiator is described above in terms of a “counter flow” configuration in which the air intake side of the radiator is opposite that of the fluid inlet. In an alternative embodiment, the radiator is configured as concurrent flow, or “co-flow”, in which either the fluid flow direction through the radiator is reversed or the air flow direction through the radiator is reversed in comparison to the counter flow radiator. Specifically, in this alternative embodiment, the fluid inlet and the air flow intake side are on the same side of the radiator, and the fluid outlet and the air flow exhaust side are on the same side of the radiator.
Similarly to the counter flow radiator of
The present invention has been described in terms of specific embodiments incorporating details to facilitate the understanding of the principles of construction and operation of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that modifications may be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention.
This Patent Application claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Ser. No. 60/927,424, filed May 2, 2007, and entitled “MICRO-TUBE/MULTI-PORT COUNTER FLOW RADIATOR DESIGN FOR ELECTRONIC COOLING APPLICATIONS”. The Provisional Patent Application Ser. No. 60/927,424, filed May 2, 2007, and entitled “MICRO-TUBE/MULTI-PORT COUNTER FLOW RADIATOR DESIGN FOR ELECTRONIC COOLING APPLICATIONS” is also hereby incorporated by reference.
Number | Date | Country | |
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60927424 | May 2007 | US |