Claims
- 1. An electrically conducting polycrystalline microcomposite comprised of a continuous interconnecting phase of a boride of a metal selected from the group consisting of hafnium, niobium, tantalum, titanium, vanadium, zirconium and mixtures thereof and a phase comprised of ceramic particles, said continuous metal boride phase encapsulating at least about 20% by volume of said phase of ceramic particles and encapsulating or being intermixed with the balance of said ceramic particles, said metal boride phase having an average grain size of less than about 15 microns, said ceramic particles having an average particle size of less than about 15 microns and being comprised of ceramic grains and clusters of grains, said encapsulating metal boride phase encapsulating individual ceramic grains and/or individual clusters of grains, said microcomposite having a density greater than 95% of the theoretical density for said microcomposite, said continuous metal boride phase ranging from about 20% by volume to about 80% by volume of said microcomposite.
- 2. The polycrystalline microcomposite according to claim 1 wherein said continuous metal boride phase is hafnium diboride.
- 3. The polycrystalline microcomposite according to claim 1 wherein said continuous metal boride phase is niobium boride.
- 4. The polycrystalline microcomposite according to claim 1 wherein said continuous metal boride phase is tantalum boride.
- 5. The polycrystalline microcomposite according to claim 1 wherein said continuous metal boride phase is titanium diboride.
- 6. The polycrystalline microcomposite according to claim 1 wherein said continuous metal boride phase is vanadium boride.
- 7. The polycrystalline microcomposite according to claim 1 wherein said continuous metal boride phase is zirconium diboride.
- 8. The polycrystalline microcomposite according to claim 1 wherein said metal boride phase ranges from about 20% by volume to about 30% by volume of said microcomposite and encapsulates more than about 90% by volume of said ceramic particles.
- 9. An electrically conducting polycrystalline microcomposite comprised of a continuous phase of titanium diboride and a phase comprised of ceramic particles, said continuous titanium diboride phase encapsulating at least about 20% by volume of said phase of ceramic particles and encapsulating or being intermixed with the balance of said ceramic particles, said titanium diboride phase having an average particle size of less than about 5 microns, said ceramic particles having an average particle size of less than about 5 microns and being comprised of ceramic grains and clusters of grains, said encapsulating titanium diboride phase encapsulating individual ceramic grains and/or individual clusters of grains, said microcomposite having a density greater than 98% of the theoretical density for said microcomposite, said continuous titanium diboride phase ranging from about 20% by volume to about 30% by volume of said microcomposite.
- 10. The microcomposite according to claim 9 wherein said ceramic particles are boron carbide.
- 11. An electrically conducting polycrystalline microcomposite comprised of a continuous interconnecting phase of a boride of a metal selected from the group consisting of hafnium, niobium, tantalum, titanium, vanadium, zirconium and mixtures thereof and a phase comprised of ceramic particles, said continuous metal boride phase encapsulating more than about 90% by volume of said phase of ceramic particles and encapsulating or being intermixed with the balance of said ceramic particles, said metal boride phase having an average grain size of less than about 5 microns, said ceramic particles having an average particle size of less than about 5 microns and being comprised of ceramic grains and clusters of grains, said encapsulating metal boride phase encapsulating individual ceramic grains and/or individual clusters of grains, said microcomposite having a density greater than 98% of the theoretical density for said microcomposite, said phase of ceramic particles ranging from about 45% by volume to about 80% by volume of said microcomposite.
Parent Case Info
This application is a division of application Ser. No. 529,784 filed Sept. 6, 1983, now U.S. Pat. No. 4,512,946.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
529784 |
Sep 1983 |
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