NSF Award
9260036
We propose to interconnect multichip modules using vertical- cavity surface-emitting lasers VCSELs as optoelectronic interconnects and to design a microelectronic information processing system (MIPS). Our emphasis is on: (1) physically realizable computing systems and methods for their design, and (2) corresponding hardware such as : optoelectronic devices/components, integrated optics, optical switching devices and optical interconnections. The goals of this program are to(1) demonstrate the interconnection of vertically stacked planes using electrically addressed VCSELs, microoptics, and detectors; (2) using these results design a 3D MIPS comprising optoelectronically interconnected multichip modules (MCMs); and (3) develop a phase II follow-up proposal to construct a prototype MIPS to prove the feasibility of near tera operation/sec (e.g. teraflop/sec) performance. Numerous schemes for the interconnection of MCMs or wafers have been proposed and are under development. The first approach, pioneered by Hughes, attempts to interconnect several vertically stacked wafers with metallic air-bridge interconnects. However, recently the advent of optoelectronic components has revealed a much more promising and powerful alternative to all-electronic interconnects known as optoelectronic interconnects. Our revolutionary VCSEL approach to optoelectronic interconnection of MCMs is unrivaled (by e.g. optical modulators) for speed, functionality, integrability and manufacturability. Implementation of the proposed program goals will also further the emergence of the globally enabling VCSEL technology which is projected by U.S., European and Pacific Rim groups to have numerous commercial applications.
