Microfabricated multifunction strain-temperature gauge

Information

  • Patent Grant
  • 5979243
  • Patent Number
    5,979,243
  • Date Filed
    Friday, May 29, 1998
    26 years ago
  • Date Issued
    Tuesday, November 9, 1999
    25 years ago
Abstract
The instant invention is for a microfabricated sensor system that can measure temperature, principle strain level, and its relative strain orientation simultaneously. It is a multifunctional, small size, low mass, and space saving gauge.
Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to the field of high temperature measurement of strain magnitude, temperature, and principle strain angle simultaneously, while at the same time minimizing the size, space, weight, and mass of the sensor.
2. Description of the Related Art
Currently the field of sensor applications for aeropropulsion systems does not have a combination strain gauge and temperature sensor. There are presently urgent needs in aeronautic and aerospace research where stress and temperature gradients are high and aerodynamic effects need to be minimized for sensors which are minimally intrusive.
SUMMARY OF THE INVENTION
The proposed sensor system can measure temperature (T), principle strain level (.epsilon..sub.M), and its relative orientation (.theta.) simultaneously. This invention has small size and low mass, i.e. using thin film process, the size of the sensor is much smaller than the conventional wire sensor and since the thin film sensor is only about a micron thick, it has negligable mass.





BRIEF DESCRIPTION OF THE DRAWING FIGURES
FIG. 1 shows the main components of the sensor system.
FIG. 2 shows the E-T electrical circuit.
FIG. 3 shows the gauge mask design.





INCORPORATION OF PUBLICATION CONCERNING ART
The article entitled "ADVANCES IN THIN FILM SENSOR TECHNOLOGIES FOR ENGINE APPLICATIONS" by Jih-Fen Lei, June 1997, is incorporated herein and is an integral part of this application.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The proposed sensor 10 system can measure temperature(T), principle strain level (.epsilon..sub.M) and its relative orientation (.theta.) simultaneously. The benefit of this proposed sensor is its:
(1) multifunction--measure three parameters simultaneously from one single source.
(2) small size--using this film process, the size of the sensor can be much smaller than the more conventional wire sensor.
(3) low mass--thin film sensor is only microns thick, therefore it has negligible mass.
(4) space/cost saving--instead of having two separate sensor systems measuring temperature and strain independently, only one single sensor is used, this saves a lot of space and cost for sensor instrumentation.
Sensor Configuration:
Referring to FIG. 1, it is seen that the sensor system 10 has a triangular shape composed of three gauge elements. G1 between points 1 and 2, G2 between points 2 and 3, and G3 between points 3 and 4. The length and size (and therefore the electrical resistance) of the three gauge elements should be the same. The angles between these gauge elements should all be 60 degrees. The sensor system 10 can be made of various materials; however, precious metals such as Pt and Pd-Cr are the materials of choice for high temperature applications. This is due to their excellent oxidation resistance, high melting temperature and good adhesion to high temperature test components.
There should be six wires attached to the sensor system, two for the current source 20 attached to points 1 and 4, and four wires for the voltage drop measurements (V.sub.12, V.sub.23, and V.sub.34) of the three gauge elements, one of each between points 1 and 2, 2 and 3, and 3 and 4.
OPERATING PRINCIPLE:
When there is a strain (with its principle strain level .epsilon..sub.M oriented at an angle .theta. relative to the gauge element G.sub.1) applied to the gaged test article at temperatures, the strain levels that the three gauge elements (G.sub.1, G.sub.2, G.sub.3) of the sensor system experience can be expressed as follows: ##EQU1## where .epsilon..sub.app is the apparent strain or the thermally induced strain.
Since the three gauge elements are made of the same material, and because the size of the sensor system is small enough that the three gauge elements should experience the same temperature changes, we can therefore assume that all three gauge elements have the same apparent strain .epsilon..sub.app. This is possible when one utilizes thin film microfabrication techniques.
Rearrange equations 1-3 into a matrix as: ##EQU2## Reverse the matrix as: ##EQU3## then, ##EQU4## Since, by definition, ##EQU5## (.DELTA.R: Change in resistance from R.sub.0) (GF is the gauge factor or the strain sensitivity of the gauge element), and a constant current source 20 is used in the measurement circuit, then ##EQU6## We can now rewrite equations 4-6 as ##EQU7## Knowing the gauge factor (GF) of the gauge element, and by measuring the voltage drops across the gauge elements G1(.DELTA.V.sub.12), G2(.DELTA.V.sub.23) and G3(.DELTA.V.sub.34), we can determine .epsilon..sub.M cos.theta., .epsilon..sub.M sin.theta., and .epsilon..sub.app, and therefore the .epsilon..sub.M (The principle strain level) and (orientation). This is because ##EQU8## Also, since by definition ##EQU9## where .alpha.=TCR+(.beta..sub.s -.beta..sub.g) X GF. TCR is the temperature coefficient of resistance of the gauge element, and .beta..sub.s and .beta..sub.g are the thermal coefficient of expansion of the substrate and gauge element, respectively. .DELTA. T is the change in temperature. Then, ##EQU10## Knowing .alpha. which is the property of the gauge and substrate materials, and by measuring the voltage drops across the gauge element, one can therefore determine the temperature change.
This measurement can easily be done with a simple digital voltmeter or can be implemented with an analog circuit as shown in the attached FIGS. 2A and 2B. The circuit can be a separate unit in the control room or can be fabricated as an ASIC directly on the test article next to the sensor system 10.
Claims
  • 1. A high temperature, low mass, microfabricated sensor system comprising:
  • a triangular shaped combination temperature sensor, strain sensor and principle strain angle sensor wherein said temperature, said strain, and said principle strain angle are measured simultaneously;
  • a first, a second, and a third gauge element arranged in a triangular fashion;
  • wherein said gauge elements are positioned at 60 degrees to each other thereby forming an equilateral triangle with a first point, a second point, a third point, and a fourth point created at said first point by electrically insulating said first and said fourth point from each other wherein a current source can be connected thereto to said first and said fourth points.
  • 2. The sensor system of claim 1, wherein said first gauge element lies between said first point and said second point, wherein said second gauge element lies between said second and said third point, and said third gauge element lies between said third and said fourth point.
  • 3. The sensor system of claim 1, wherein said first, said second, and said third gauge element comprise thin film precious metals such as Platinum, and Paladium-Chromium alloys.
  • 4. The sensor system of claim 3 wherein the temperature change (.DELTA.t) relates to the temperature coefficient of resistance of said gauge elements (TCR ) and the thermal coefficient of expansion of the substrate (.beta..sub.s) and said gauge elements (.beta..sub.g) and gauge factor (GF) of said gauge elements by the equation ##EQU11## wherein .alpha.=TCR+(.beta..sub.s -.beta..sub.g)X GF, and V.sub.34, V.sub.23, V.sub.12 are the respective voltages across said points on said sensor, when said sensor system is connected to a constant current power source.
US Referenced Citations (5)
Number Name Date Kind
3956927 Pearson May 1976
5056374 McMennamy et al. Oct 1991
5375474 Moore Sr. Dec 1994
5734110 Kosmal Mar 1998
5780746 Brady Jul 1998
Non-Patent Literature Citations (1)
Entry
Advances in Thin Film Sensor Technologies for Engine Applications, Jih-Fenei, Army Research Laboratory, NASA Lewis Center, Lisa C. Martin and Herbert A. Will, NASA Lewis Research Center 6 p., Jun. 1997.