Claims
- 1. A 3-dimensional microfabricated device wherein edges of a lipid bi-layer are anchored by alknethiol derivitized inner edges of Au layers in an etched region of insulator and wherein a bottom of the device is lined with an insulator layer.
- 2. The 3-dimensional microfabricated device of claim 1 having a hole in said bottom for minimizing osmotic effects.
- 3. The 3-dimensional microfabricated device of claim 1 having a multiple well array.
- 4. A method for microfabricating recessed disk microelectrodes comprising:
growing a silicon dioxide film on a silicon wafer by thermal oxidation;
spin-coating said silicon wafer with positive photoresist; exposing said silicon wafer to ultra violet light through a photolithographic mask; developing said photoresist and leaving a pattern of parallel lines, which are contact leads and microdisk electrodes; depositing a chromium filled adhesion layer on said photo resist by thermal evaporation; sonicating said wafer in acetone to dissolve the photoresist and to cause lift-off of said metal on top of said wafer; drying said wafer; spin-coating said wafer with polyimide; polymerizing said polyimide by exposure to ultraviolet light and curing said polyimide to cross-link a polymer thereby formed; depositing a second chromium layer on top of said polyimide by thermal evaporation; spin coating said wafer with positive photoresist; patterning said photoresist by exposure to ultraviolet light through a second photolithographic mask; simultaneously etching the second gold layer and the second chromium layer with aqua regia; stripping a remainder of photoresist with acetone; drying said wafer; leaving a covering of gold and chromium covering electrode lines with an area over an end of lines left open for contact purposes; and forming a hole through said second layer of golden chromium, and through said polyimide layer to expose said first layer of gold and chromium.
- 5. A microfabricated recessed disk microelectrode produced by the process of claim 4.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent application Ser. No. 09/946,259, filed on Sep. 4, 2001, which is a continuation-in-part of U.S. patent application Ser. No. 09/775,937, filed Feb. 2, 2001, which is a continuation-in-part of U.S. patent application Ser. No. 09/255,950, filed Feb. 23, 1999, which claims priority to U.S. provisional application Serial No. 60/075,955, filed Feb. 23, 1998. This application claims priority to U.S. provisional application Serial No. 60/055,527, filed Aug. 8, 1997. This application is also a continuation to U.S. patent application Ser. No. 09/071,356, filed Apr. 30, 1998, which claims priority to U.S. provisional application Serial No. 60/042,100, filed Apr. 30, 1997. Each of these applications are hereby incorporated by reference.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60075955 |
Feb 1998 |
US |
|
60042100 |
Apr 1997 |
US |
Continuation in Parts (4)
|
Number |
Date |
Country |
| Parent |
09946259 |
Sep 2001 |
US |
| Child |
10104756 |
Mar 2002 |
US |
| Parent |
09775937 |
Feb 2001 |
US |
| Child |
09946259 |
Sep 2001 |
US |
| Parent |
09255950 |
Feb 1999 |
US |
| Child |
09775937 |
Feb 2001 |
US |
| Parent |
09071356 |
Apr 1998 |
US |
| Child |
10104756 |
Mar 2002 |
US |