Claims
- 1. A process for preparing a molded article comprising:
(a) bringing a moldable material and an open molding tool comprising a molding surface into line contact with each other to imprint a microfluid processing architecture pattern onto said moldable material and thereby form a molded article; and (b) separating said molded article from said molding surface.
- 2. A process according to claim 1 wherein said moldable material comprises an embossable polymeric substrate.
- 3. A process according to claim 2 wherein said embossable polymeric substrate further comprises a microelectronic element.
- 4. A process according to claim 2 wherein said embossable polymeric substrate further comprises a microoptical element.
- 5. A process according to claim 2 wherein said embossable polymeric substrate further comprises a micromechanical element.
- 6. A process according to claim 1 wherein said moldable material comprises a flowable resin composition.
- 7. A process according to claim 6 wherein said flowable resin composition comprises a curable resin composition, said process comprising exposing said composition to thermal or actinic radiation prior to separating said molded article from said molding surface to cure said composition.
- 8. A process according to claim 6 wherein said curable resin composition comprises a photopolymerizable composition, said process comprising exposing said composition to actinic radiation prior to separating said molded article from said molding surface to cure said composition.
- 9. A process according to claim 6 wherein said flowable resin composition comprises a molten thermoplastic composition, said process comprising cooling said composition prior to separating said molded article from said molding surface.
- 10. A process according to claim 6 comprising introducing said flowable resin composition onto a major surface of a polymeric substrate, and relatively moving said polymeric substrate and said molding tool to bring said tool and said flowable resin composition into line contact with each other.
- 11. A process according to claim 10 wherein said polymeric substrate further comprises a microelectronic element.
- 12. A process according to claim 10 wherein said polymeric substrate further comprises a microoptical element.
- 13. A process according to claim 10 wherein said polymeric substrate further comprises a micromechanical element.
- 14. A process according to claim 6 comprising introducing said flowable resin composition onto said molding surface.
- 15. A process according to claim 14 further comprising bonding said flowable resin composition to a polymeric substrate.
- 16. A process according to claim 15 wherein said polymeric substrate comprises a microelectronic element.
- 17. A process according to claim 15 wherein said polymeric substrate comprises a microoptical element.
- 18. A process according to claim 15 wherein said polymeric substrate comprises a micromechanical element.
- 19. A process according to claim 1 further comprising bonding a polymeric substrate comprising a microelectronic element to said molded article.
- 20. A process according to claim 1 further comprising bonding a polymeric substrate comprising a microoptical element to said molded article.
- 21. A process according to claim 1 further comprising bonding a polymeric substrate comprising a micromechanical element to said molded article.
- 22. A process according to claim 1 further comprising bonding a substrate to said molded article to form a cover layer overlying said microfluid processing architecture.
- 23. A process according to claim 22 wherein said substrate comprises a polymeric substrate.
- 24. A process according to claim 22 wherein said substrate further comprises a microelectronic element.
- 25. A process according to claim 24 wherein said substrate comprises a polymeric substrate.
- 26. A process according to claim 22 wherein said substrate further comprises a microoptical element.
- 27. A process according to claim 22 wherein said substrate further comprises a micromechanical element.
- 28. A process according to claim 1 comprising continuously introducing mold able material into a molding zone defined by said molding tool and continuously bringing said molding tool into line contact with said moldable material to create a plurality of microfluid processing architectures.
- 29. A process according to claim 28 comprising producing said article in the form of a roll comprising a plurality of microfluid processing architectures.
- 30. A process according to claim 28 further comprising continuously bonding a polymeric substrate comprising a microelectronic element to said molded article.
- 31. A process according to claim 28 further comprising continuously bonding a polymeric substrate comprising a microoptical element to said molded article.
- 32. A process according to claim 28 further comprising continuously bonding a polymeric substrate comprising a micromechanical element to said molded article.
- 33. A process according to claim 28 further comprising continuously bonding a polymeric substrate to said molded article to form a cover layer overlying said microfluid processing architectures.
- 34. A process according to claim 33 wherein said polymeric substrate further comprises a microelectronic element.
- 35. A process according to claim 33 wherein said polymeric substrate further comprises a microoptical element.
- 36. A process according to claim 33 wherein said polymeric substrate further comprises a micromechanical element.
- 37. An article comprising:
(a) a first non-elastic, polymeric substrate comprising (i) a first major surface that includes a microfluid processing architecture, and (ii) a second major surface; and (b) a second polymeric substrate that is integrally bonded to said second major surface of said first substrate, said second substrate being capable of forming a free-standing substrate in the absence of said first substrate.
- 38. An article according to claim 37 further comprising a cover layer overlying said microfluid processing architecture.
- 39. An article according to claim 38 wherein said cover layer comprises a polymeric cover layer.
- 40. An article according to claim 38 wherein said cover layer is bonded to said first major surface of said first substrate.
- 41. An article according to claim 37 wherein said microfluid processing architecture includes structures selected from the group consisting of microchannels, fluid reservoirs, sample handling regions, and combinations thereof.
- 42. An article according to claim 37 wherein said article further comprises a microelectronic element.
- 43. An article according to claim 37 wherein said article further comprises a microoptical element.
- 44. An article according to claim 37 wherein said article further comprises a micromechanical element.
- 45. An article comprising a first polymeric substrate comprising (i) a first major surface that includes a plurality of microfluid processing architectures and (ii) a second major surface,
wherein said article is in the form of a roll.
- 46. An article according to claim 45 wherein said article further comprises a second polymeric substrate integrally bonded to said second major surface of said first substrate,
said second substrate being capable of forming a free-standing substrate in the absence of said first substrate.
- 47. An article according to claim 45 further comprising a polymeric cover layer bonded to the first major surface of said first substrate.
- 48. An article according to claim 45 wherein said microfluid processing architectures include structures selected from the group consisting of microchannels, fluid reservoirs, sample handling regions, and combinations thereof.
- 49. An article according to claim 45 wherein said article further comprises a microelectronic element.
- 50. An article according to claim 45 wherein said article further comprises a microoptical element.
- 51. An article according to claim 45 wherein said article further comprises a micromechanical element.
- 52. An article comprising:
(a) a first polymeric substrate comprising (i) a first major surface that includes a microfluid processing architecture, and (ii) a second major surface; and (b) a second polymeric substrate comprising (i) a first major surface that is integrally bonded to said second major surface of said first substrate and (ii) a second major surface that comprises a microelectronic element and a via extending between said first and second major surfaces of said second substrate, said second substrate being capable of forming a free-standing substrate in the absence of said first substrate.
- 53. An article comprising:
a first polymeric substrate comprising (i) a first major surface that includes a microfluid processing architecture, and (ii) a second major surface that comprises a microelectronic element and a via extending between said first and second major surfaces of said substrate.
- 54. An article comprising:
(a) a first polymeric substrate comprising (i) a first major surface that includes a microfluid processing architecture, and (ii) a second major surface; and (b) a polymeric cover layer comprising (i) a first major surface overlying said microfluid processing architecture, and (ii) a second major surface that comprises a microelectronic element and a via extending between said first and second major surfaces of said cover layer.
- 55. A method for processing a microfluid sample comprising:
(a) providing an article in the form of a roll comprising a first polymeric substrate comprising (i) a first major surface that includes a plurality of microfluid processing architectures and (ii) a second major surface; (b) introducing a microfluid sample into one of said microfluid processing architectures; and (c) processing said sample.
Parent Case Info
[0001] This application is a divisional application of U.S. Ser. No. 09/099,562, filed Jun. 18, 1998.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09099562 |
Jun 1998 |
US |
Child |
10108069 |
Mar 2002 |
US |