Patent Application
20190030537
The present invention is related to microfluidic devices for performing droplet manipulation operations, such as active matrix electro wetting on dielectric (AM-EWOD) digital microfluidic devices, and more particularly to the controlling of electrical potential of droplets input to the array to improve device performance and reliability.
Electro-wetting on dielectric (EWOD) is a well-known technique for manipulating droplets of fluid by application of an electric field. The structure of a conventional EWOD device is illustrated in the cross-section diagram of
A conductive material is formed on the lower substrate 30 and patterned to form a plurality of individually addressable lower electrodes 38, as depicted in
An insulator layer 20 is formed on the lower substrate 30 over the lower electrodes 38 and a lower hydrophobic coating 16 is formed over the insulator layer. The hydrophobic coating is formed from a hydrophobic material. The hydrophobic material is commonly, but not necessarily, a fluoropolymer. A conductive material is formed on the upper (top) substrate 36 and acts as a common reference electrode 28. An upper hydrophobic coating 26 is formed over the common reference electrode 28. Optionally, a further insulator layer (not shown) may be interposed between the common reference electrode 28 and the upper hydrophobic coating 26.
The fluid gap is filled with a non-polar filler fluid 34, such as oil, and liquid droplets 4. The liquid droplet 4, commonly an aqueous and/or ionic fluid, includes a polar material and is in contact with both the lower hydrophobic coating 16 and the upper hydrophobic coating 26. The interface between the liquid droplet 4 and filler fluid 34 forms a contact angle Θ 6 with the surface of the lower hydrophobic coating 16.
In operation, voltage signals are applied to the lower electrodes 38 and common reference electrode 28 so as to actuate the liquid droplet 4 to move within the fluid gap 35 by the EWOD technique. Typically, the lower electrodes 38 are patterned to form an array, or matrix, with each element of the array comprising a single individually addressable lower electrode 38. A plurality of droplets may therefore be controlled to move independently within the fluid gap 35 of the EWOD device. Exemplary EWOD devices are illustrated in the following:
U.S. Pat. No. 6,565,727 (Shenderov, issued May 20, 2003) discloses an EWOD device with a passive type array for moving droplets.
U.S. Pat. No. 6,911,132 (Pamula et al., issued Jun. 28, 2005) discloses an EWOD device with a two-dimensional array to control the position and movement of droplets in two dimensions.
U.S. Pat. No. 8,815,070 (Wang et al., issued Aug. 26, 2014) describes an EWOD device in which multiple micro-electrodes are used to control the position and movement of a droplet.
U.S. Pat. No. 8,173,000 (Hadwen et al, issued May 8, 2012) discloses an EWOD device with improved reliability by means of application of an AC voltage signal to the common reference electrode.
Active Matrix EWOD (AM-EWOD) refers to implementation of EWOD in an active matrix array incorporating transistors within each element of the array. The transistors may be, for example, thin film transistors (TFTs), and form an electronic circuit within each array element to control the voltage signals applied to the lower electrodes.
U.S. Pat. No. 7,163,612 (Sterling et al., issued Jan. 16, 2007) describes how TFT based thin film electronics may be used to control the addressing of voltage pulses to an EWOD array by using circuit arrangements very similar to those employed in active matrix display technologies.
U.S. Pat. No. 8,653,832 (Hadwen et al, issued Feb. 18, 2014) discloses an AM-EWOD device in which each element in the array includes circuitry to both control the voltage signals applied to the lower electrode and to sense the presence of a liquid droplet above the electrode.
As to certain particular aspects of EWOD device operation, U.S. Pat. No. 8,702,938 (Srinivasan et al., issued Apr. 22, 2014) describes an EWOD cartridge where fluid is input through a hole in the top substrate. U.S. Pat. No. 9,238,222 (Delattre et al., issued Jan. 19, 2016) describes reducing bubble formation adjacent the droplet by maintaining substantially consistent contact between the droplet and an electrical ground during droplet operations to prevent such bubble formation. U.S. Pat. No. 9,011,662 (Wang et al., issued Apr. 21, 2015) similarly teaches that it is preferred that droplets remain in continuous contact or frequent contact with a ground or reference electrode.
The droplet potential, electro-wetting potential, and potential across the top substrate insulator formed by the hydrophobic coating can be electrically modeled. In the region of a liquid droplet, the potential difference across the top hydrophobic coating layer is related to the voltages applied to the corresponding element electrodes, the voltage applied to a second common reference electrode, and the capacitance of the capacitors formed within each element of the array of elements in the device. Such potential difference is affected by a DC offset referred to herein as “V0”, corresponding to an initial potential of the liquid droplet when the droplet is inputted into the device.
The electrical potential V0 depends on how the droplet is input into the device. The droplet input, for example, may be performed by a user (e.g. by pipette), from a fluidic chamber, from another microfluidic device, or the like. In the absence of specific measures to control V0, this potential across the top hydrophobic layer is subject to variability, and in particular, for example, may depend on the nature of the non-conductive structures used to put the droplet into the input well, user pipetting technique, and/or the external electrostatic environment (including factors such atmospheric humidity, and the like).
If the level of the DC offset voltage V0 assumes an unwanted value, this can have various deleterious effects. For example, such an unwanted V0 value may result in an unwanted DC offset potential between the droplet and the top substrate electrode, which can cause damage (e.g. bubbles, breakdown) of the top substrate insulator or hydrophobic layer. An unwanted V0 value further may result in a large DC offset potential between the droplet and the bottom substrate electrode, which can cause damage by dielectric breakdown of the insulating layers, causing catastrophic device failure. Such an unwanted V0 value further can offset the DC potential between the droplet and the TFT substrates electrode, to a reduced value from which the device is designed to operate. This in turn may reduce performance by reducing the electro-wetting actuation force, which for example can result in poor or unreliable splitting/dispensing of droplets and/or lower move speed of droplets. This may occur, for example, if the DC voltage is between the top electrode and TFT electrode potential. The present invention solves these problems by being configured and operated to avoid an unwanted value of the DC offset voltage V0.
The present invention pertains to enhanced configurations for an EWOD device, and AM-EWOD devices in particular, that avoid an unwanted value of the DC offset voltage V0. As referenced above, the EWOD device of the present invention is configured and operated to avoid an unwanted value of the DC offset voltage V0.
To accomplish such result, an input fluid reservoir from which droplets are formed is pre-charged to have a specified or preset DC potential (V0) at a point of entry of the aqueous liquid reservoir into the EWOD device cartridge. The specified or preset DC potential is preferably selected to minimize an average voltage across the top substrate layer. Accordingly, an EWOD device is configured to incorporate a pre-charging fluid input structure at one or more fluid inputs. In an EWOD device in which the lower and upper hydrophobic coatings are high quality and thus substantially electrically insulating, without the control of the present invention the DC potential of the reservoir in the fluid gap could assume an undesirable arbitrary value. This is disadvantageous, for an inappropriate DC potential may lead to a reduced potential difference between the lower substrate electrode and the droplet, thereby reducing the electro-wetting potential and the ability of the device to drive droplets, and an unwanted DC offset potential between the droplet and the top substrate electrode which may compromise device reliability. The inventors have realized that these potential disadvantages can be negated by pre-charging the fluid reservoir from which droplets are generated to a preset DC potential on input.
With such a configuration, the present invention solves the problems above provided the DC droplet potential V0 is well chosen. In exemplary embodiments, a suitable value of V0 may be selected such that the resultant potential of the top substrate electrode typically ensures that the DC potential between the top substrate electrode and liquid reservoir is zero, or close to zero, and the electro-wetting voltage is maximized. In the conventional configurations described in the background section above (see, e.g., particularly U.S. Pat. Nos. 9,238,22 and 9,011,662), it is taught to improve performance specifically by having the droplets remain in continuous contact or frequent contact with a ground or reference electrode. The present invention operates differently, whereby the device is configured such that the droplets generated from the initial fluid reservoir have no electrical connection to a DC potential when in the gap defined by the substrates and away from the input. The present invention further has a configuration that sets the DC potential at a specified or preset initialization state when the fluid reservoir is in the fluid input structure. V0 is thus set at a chosen suitable initial potential. Once the fluid reservoir or a droplet drawn therefrom is detached from the fluid input structure, such as for example by moving a droplet away or by dispensing/splitting a droplet out of the fluid input structure, the droplet is at a floating DC potential.
An aspect of the invention, therefore, is an electrowetting on dielectric (EWOD) device having a pre-charging structure for pre-charging a fluid reservoir. In exemplary embodiments, the EWOD device includes a first substrate and an opposing second substrate defining a gap between the first and second substrates, each substrate including an insulating surface facing the gap; an array of elements comprising a plurality of individual elements that are actuatable for manipulation of a liquid droplet within the gap, each individual element including a plurality of electrode elements to which actuation voltages are applied; and a pre-charging structure that includes a channel in fluid communication with the gap and that is configured to receive a fluid reservoir for generation of the liquid droplet, and the pre-charging structure includes an electrical element electrically exposed to the channel. The electrical element pre-charges the fluid reservoir within the channel, and a portion of the gap containing the liquid droplet spaced apart from the channel is electrically isolated from the electrical element such that the liquid droplet is at a floating electrical potential when located within said portion of the gap.
The pre-charging structure may comprise an input structure defining an input channel in fluid communication with the gap, wherein the input channel is the channel that is configured to receive the input of the fluid reservoir, and the electrical element comprises an electrode portion of the plurality of electrode elements that is exposed to the input channel.
Another aspect of the invention is an enhanced method of operating an electro-wetting on dielectric (EWOD) device. The method may include the steps of inputting a fluid reservoir into the EWOD device via a channel defined by the EWOD device; pre-charging the fluid reservoir with an electrical element while the input fluid reservoir is within the channel; and applying an actuation voltage to the EWOD device to generate a liquid droplet from the fluid reservoir and moving the liquid droplet into a gap defined by the EWOD device, wherein the droplet is moved to a portion of the gap that is electrically isolated from the electrical element such that the liquid droplet is at a floating electrical potential when located within said portion of the gap.
In one exemplary embodiment, during pre-charging an electrical potential of the fluid reservoir is initialized at an electrical potential of the reference electrode, wherein upon AC signal transition of the actuation voltage a potential difference between the liquid droplet and reference electrode is zero during a first phase of the AC signal transition and negatively offset during a second phase of the AC signal transition. In another exemplary embodiment, during pre-charging an electrical potential of the fluid reservoir is initialized at an electrical potential that is offset relative to that of the reference electrode, wherein upon AC signal transition of the actuation voltage a potential difference between the liquid droplet and reference electrode has a positive offset value during a first phase of the AC signal transition and a negative offset value during a second phase of the AC signal transition.
To the accomplishment of the foregoing and related ends, the invention, then, comprises the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative embodiments of the invention. These embodiments are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Other objects, advantages and novel features of the invention will become apparent from the following detailed description of the invention when considered in conjunction with the drawings.
The inventors have realized that the potential disadvantages of conventional configurations above can be negated by pre-charging the input fluid reservoir to a DC potential V0 on input. A suitable value of V0 may be selected such that the resultant potential of the top substrate electrode typically ensures that the DC potential between the top substrate electrode and liquid fluid reservoir is zero, or close to zero, and the electro-wetting voltage is maximized. The device further is configured such that the droplets have no electrical connection to the DC potential when in the fluid gap away from the input fluid reservoir. By pre-charging the input fluid reservoir to a suitable V0, deviations of the DC offset of the droplets from a desirable are minimized, and thus the actuation voltage is optimized, which avoids the deleterious effects described above.
In the annexed drawings, like references indicate like parts or features:
Embodiments of the present invention will now be described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. It will be understood that the figures are not necessarily to scale.
The structure of an exemplary EWOD device 200 is shown in
The fluid gap is filled with a filler fluid 234 and liquid droplets 204 that may be manipulated within the EWOD device. The EWOD device 200 may include an array of elements 290, such as elements 292A-292F. Each element 292A-F of the array of elements 290 may include an element electrode 239 from the set of element electrodes 238, and a portion of the second common reference electrode 228. A liquid droplet 204 may occupy the fluid gap corresponding to a subset of elements 292A-F in the array of elements, for example elements 292B to 292E in the example case of
The first substrate 230 and second substrate 236 may be made of a transparent insulating material, such as glass. The conductive material used to form the element electrodes 239 of the set of element electrodes 238 and second electrode common reference electrode 228 may be a transparent conductor such as Indium Tin Oxide (ITO). The insulator layer 220 may be an inorganic insulator such as silicon nitride or silicon dioxide. Layers and structures may be formed on the substrates using standard manufacturing techniques, such as photolithography, common in for example, the LCD industry. The hydrophobic material of hydrophobic layers 216 and 226 may be a fluoropolymer. The filler fluid 234 may be a non-polar material such as oil. The liquid droplet 204 may be an aqueous and/or ionic fluid. The conductivity of the liquid droplet 204 may be substantially higher than that of the filler fluid 234.
As shown in
In exemplary embodiments, the hardware controller unit 310 optionally also may include a droplet position detector 314 to detect the position, size and shape of liquid droplets 204 on the array of elements 290. In a preferred embodiment, circuits within each element 292 of the array of elements 290 of the EWOD device 200 may be used to measure the capacitance between an element electrode 239 and the second common reference electrode 228. Such circuits are well-known, for example as described in U.S. Pat. No. 8,653,832 (Hadwen et al, issued Feb. 18, 2014). In such an arrangement, the droplet position detector 314 may generate the signals to control the operation of said sensing circuit and process the signals generated by the sensing circuit to produce a map of the position, size and shape of the liquid droplets 204 across the array of elements. Alternatively, as is known in the art, the droplet position detector 314 may directly measure the capacitance of each element in the array of elements. Alternatively, as is known in the art, the droplet position detector 314 may be an optical imaging system and include an image processor to produce a map of the liquid droplet positions across the array of elements.
The processing unit 320 includes a pattern generator unit 322, a sensor data analysis unit 324, a memory unit 326 (i.e., a non-transitory computer readable medium) and an operation scheduler 328. The pattern generator unit 322 generates a map of elements in the array to be actuated, the actuation pattern, during one particular cycle of operation of the EWOD device. The pattern generator unit 322 is in communication with the signal generator unit 312 which converts the actuation pattern into voltage signals as described above. In embodiments including the position detector 314, the sensor data analysis unit 324 is in communication with the droplet position detector 314 and processes the map produced by the droplet position detector in order to identify and track individual liquid droplets 204 on the EWOD device 200. The memory unit 326 stores sequences of actuation patterns that define how to perform fluid operations, i.e. manipulations of the liquid droplets 204 on the EWOD device 200 to achieve a desired effect. The memory unit 326 further stores said actuation patterns for a range of distinct fluid operations in a library of fluid operations. Further still, the memory unit 326 also stores a predefined set of fluid operations to be performed on the EWOD device in order to perform a desired fluid protocol. The operation scheduler 328 executes the desired fluid protocol by monitoring the state of the sensor droplet analysis unit 324, and controlling pattern generator unit 322 to generate actuation patterns based on the sequences of actuation patterns, the library of fluid operations and the set of fluid operations stored in the memory unit 326.
Electrical modeling of an exemplary EWOD device is described in detail in Applicant's co-pending application Ser. No. 15/478,752 filed on Apr. 4, 2017, which is incorporated here by reference in its entirely. Details of such electrical modeling include the following.
a resistor RE2 405 representing the resistance of the second common reference electrode 280;
a capacitor CHC2 410 representing the capacitance of the second hydrophobic coating layer 226 (or the second hydrophobic layer 226 in series with the additional insulator 999, in the case where the latter is present);
a capacitor CHC1 425 representing the capacitance of the first hydrophobic coating layer 216;
a capacitor CINS 430 representing the capacitance of the insulator layer 220; and
a resistor RE1 435 representing the resistance of an element electrode 239.
Those elements in the subset of elements corresponding to the location of the liquid droplet 204 additionally comprise a resistor RLD 417 and a capacitor CLD 422 representing the resistance and capacitance of the liquid droplet 204 respectively. The number of elements in the subset of elements corresponding to the location of the liquid droplet 204 is denoted by n. Those elements not corresponding to the location of a liquid droplet additionally comprise a resistor RFF 415 and a capacitor CFF 420 representing the resistance and capacitance of the filler fluid 234 respectively. The voltage of the liquid droplet at the surface of the first hydrophobic coating layer is denoted by VLD1. The voltage of the liquid droplet at the surface of the second hydrophobic coating layer is denoted by VLD2. Under typical operating conditions, the conductivity of the droplet is such that the voltages VLD1 and VLD2 may be assumed to be equal and denoted by VLD. The actuation voltage, VACT, is defined as the potential difference between the liquid droplet 204 and an element electrode 239, i.e. VACT=VLD−VE1(n). For droplet actuation using the electrowetting technique, the magnitude of the electrowetting actuation voltage (abbreviated in what follows as the electrowetting voltage) must be greater than the magnitude of the electrowetting threshold voltage, VEW, i.e. |VACT|>|VEW|.
In the region of a liquid droplet 204, the potential difference across the second hydrophobic coating layer 226 (or series combination of the second hydrophobic layer and additional insulator 999, in the case where the latter is present), ΔVHC2 is related to the voltages applied to the corresponding element electrodes 239, the voltage applied to the second common reference electrode 228, and the capacitance of the capacitors formed within each element 292 of the array of elements 290. ΔVHC2 is characterized by the set of equations given in
It is the object of this invention to provide a device configuration and control methods to set the DC offset or initial droplet potential, V0, of the input fluid reservoir to a suitable predetermined amount. In exemplary embodiments, the DC offset of the liquid reservoir, V0, is preset essentially such that the potential difference across the second hydrophobic coating layer, ΔVHC2 is essentially zero. This situation is characterized in
In conventional devices, the quality of the hydrophobic coatings 16 and 26 can often be inferior. In such situations, there can be electrical “leakage” particularly between the top hydrophobic coating 26 and the reference electrode 28. Such leakage may be variable and can undermine the actuation voltage, rendering the droplet manipulations variable, less effective and harder to perform reliably and reproducibly. In addition, there may be defective points in which electrical discharge releases the actuation potential, resulting in areas on the device of sticking or pinning of the droplets in which droplet manipulations can no longer be performed. This electrical discharge can also form bubbles which further undermines device performance.
Accordingly, it is highly desirable to use high quality hydrophobic coatings 16 and 26. In such case, however, the hydrophobic coatings are essentially fully insulative layers, and thus act as pure capacitors with no electrical connection (i.e., no leakage) relative to the top electrode 28. In conventional configurations using high quality hydrophobic coatings, the potential of the liquid droplet VLD tends to “float”, and thus can vary arbitrarily. As referenced above, generally VACT [=(VEW−VLD)]. Accordingly, if the floating VLD moves closer to the electrowetting voltage VEW applied to the electrodes 38A than is desirable, the actuation voltage decreases and droplet manipulations are undermined. If, on the other hand, VLD moves father from the electrowetting voltage VEW applied to the electrodes 38A than is desirable, an excessive actuation voltage results which can damage the device layers. A catastrophic device failure can even occur and has been observed by the inventors. Similar deficiencies can occur by the floating VLD affecting the potential difference across the second hydrophobic coating layer, ΔVHC2. It is desirable that ΔVHC2 be small and preferably zero, and if the floating VLD results in a non-zero ΔVHC2, sluggish droplet manipulations can occur particularly on input of the droplet. If this occurs, the droplets can fail to dispense properly.
The top plate hydrophobic coating functions substantially as an insulator layer (when made to a high quality). Accordingly, electrically this top plate hydrophobic coating layer can be modelled as a capacitor in parallel with a resistance. The capacitance per unit area is a function of the thickness and the electrical permittivity of the material. The resistance is principally determined by the quality of the layer and may be in the range 106-1012 ohms or higher if the layer is well constructed. In the option where an additional insulator layer is included between the top plate hydrophobic coating and the top plate electrode, the combination of this insulator and the hydrophobic coating will have an impedance that is even more like a pure capacitor, with a very low DC conductivity.
For the time constants of concern for device operation, this resistance may be effectively modeled as infinite, and thus for practical purposes the top plate hydrophobic coating layer functions as a pure capacitor. This being the case, the droplet is therefore at a floating potential in the device.
In view of the above, it is therefore desirable to configure the device to preset the DC offset voltage V0 of the initial fluid reservoir from which droplets are generated (or the fluid reservoir in its entirely may be manipulated as a droplet itself) to meet the criteria of (1) VACT [=(VEW−VLD)] is approximately VEW, and (2) ΔVHC2 is approximately 0V. To accomplish such a result, an input reservoir used to form the droplets (or that subsequently is manipulated as the droplet) is pre-charged to have a specified or preset DC potential (V0) at a point of entry of the aqueous liquid into the EWOD device cartridge. In particular, a generalized feature of the various embodiments is that the input fluid reservoir is pre-charged by exposing the input fluid reservoir to a portion of the electrode arrangement upon entry into the input structure of the EWOD device. The specified or preset DC potential is preferably selected to minimize an average voltage across the top substrate layer. The inventors have realized that the potential disadvantages of conventional configurations can be negated by pre-grounding or pre-charging the fluid reservoir to a DC potential on input. Upon splitting droplets from the input reservoir, or moving the input reservoir from the input structure to form the droplet, the droplet then is removed from contact with the electrode portion and allowed to be at a floating potential. Because the input reservoir has been pre-charged, the floating potential away from the input structure tends to remain within a desirable range.
With such a configuration, the present invention solves the problems above provided the DC droplet potential V0 is well chosen. In exemplary embodiments, a suitable value of V0 may be selected such that the resultant potential of the top substrate electrode typically ensures that the DC potential between the top substrate electrode and liquid droplet is zero, or close to zero, and the electro-wetting voltage is maximized. In the conventional configurations described in the background section above (see, e.g., particularly U.S. Pat. Nos. 9,238,22 and 9,011,662), it is taught to improve performance specifically by having the droplets remain in continuous contact or frequent contact with a ground or reference electrode. The present invention operates differently, whereby the device is configured such that the droplets have no electrical connection to a DC potential when in the fluid gap, as is generally preferable for reasons previously explained. The present invention further has a configuration that sets the DC potential at a specified or preset initialization state when the fluid reservoir is in a fluid input structure. V0 is thus set at a chosen suitable initial potential. Once the droplet is detached from the fluid input structure, such as for example by moving a droplet away from the fluid input structure by dispensing/splitting a droplet out of the input fluid reservoir, the droplet is at a floating DC potential.
In accordance with such features, an electrowetting on dielectric (EWOD) device includes a first (e.g., top) substrate and an opposing second (e.g., bottom) substrate defining a gap between the first and second substrates, each substrate including an insulating surface facing the gap. The EWOD device includes an array of elements having a plurality of individual elements that are actuatable for manipulation of a liquid droplet within the gap, each individual element including a plurality of electrode elements to which actuation voltages are applied. A pre-charging structure includes a channel in fluid communication with the gap and that is configured to receive a fluid reservoir for generation of the liquid droplet, and the pre-charging structure includes an electrical element electrically exposed to the channel. The electrical element pre-charges the fluid reservoir within the channel, and a portion of the gap containing the liquid droplet spaced apart from the channel is electrically isolated from the electrical element such that the liquid droplet is at a floating electrical potential when located within said portion of the gap. The pre-charging structure may be configured as an input structure defining an input channel in fluid communication with the gap, wherein the input channel is the channel that is configured to receive the input of the fluid reservoir, and the electrical element comprises an electrode portion of the plurality of electrode elements that is exposed to the input channel.
In general, the fluid input structure 40 includes an electrode portion 46, which in this embodiment is a portion of the reference electrode 28. The electrode portion 46 is exposed to the input channel 42, i.e., there is no layer or component between the electrode portion 46 and the input channel 42. In the region of the exposed electrode portion 46 and input channel 42, the hydrophobic coating 26 may be removed to create a stepped configuration relative to the electrode 28, in which the electrode portion 46 includes a first surface 48 and a second surface 50 that are exposed to the input channel 42. The hydrophobic coating 26 may be removed from the second surface 50 of the electrode 28, for example, by means of lithographic patterning, such as an etch process or lift off process. Alternatively, a method of manufacturing may prevent the hydrophobic coating 26 from attaching to the electrode 28 at the second surface 50 in this region, for example by means of a mechanical barrier which is then removed.
With the configuration of
The configuration of
An advantage of the configuration described by this embodiment is that the offset setting structures 52 may be located slightly displaced from the reservoir 4A (=position of the opening in the top substrate 36). This may be convenient for manufacturing reasons; depending on the manufacturing process used to make the opening in the top substrate 36 it may not be so convenient to remove the hydrophobic coating 26 immediately adjacent to the opening and is therefore preferable to separate the offset setting structure 52 slightly from the reservoir 4A. A further advantage of the configuration of
In the configuration of
In the example of
A variant of this embodiment is shown in
As referenced above, a generalized feature of the various embodiments is that the input reservoir 4A is pre-charged by exposing the input reservoir to a portion of the electrode arrangement upon entry into the EWOD device. To achieve this with a coplanar or inline electrode arrangement, an input channel 72 into the fluid gap 35 is formed extending through the bottom hydrophobic layer 16 and insulating layer 20 to at least a portion of the electrode layer 38B. In the example of
For pre-charging the fluid reservoir 4A, the input structure 80 includes a pre-charging element 86. For example, the pre-charging element 86 may be an externally connected grounding structure, such as a grounding wire, that is in contact with the liquid reservoir 4A within the input channel 82. The externally connected grounding structure could be an external structure integrated into a plastic housing surrounding and otherwise housing the EWOD device. In another example configuration, the pre-charging element may be a conductive structure (wire) extending into the input channel 82 that is connected to the same electrical supply that is connected to the top reference electrode 28. In another example configuration, the pre-charging element may be external to the EWOD device and part of the electronic controller elements (see
A method of operating an electro-wetting on dielectric (EWOD) device may be employed to pre-charge the input fluid reservoir. The operating method may include the steps of inputting a fluid reservoir input into the EWOD device via an input channel defined by the EWOD device; pre-charging the fluid reservoir with an electrical element while the input fluid reservoir is within the input channel; and applying an actuation voltage to the EWOD device to generate a liquid droplet from the input fluid reservoir and moving the fluid droplet into a gap defined by the EWOD device, wherein the droplet is moved to a portion of the gap that is electrically isolated from the electrical element such that the liquid droplet is at a floating electrical potential when located within said portion of the gap.
Accordingly, in this embodiment, the potential difference between the droplet and the top substrate electrode is essentially zero at a first phase, Phase A, but is negatively offset at a second phase, Phase B, of the AC voltage signal.
An enhanced method of applying driving voltages in combination with pre-charging the liquid droplet reservoir driving is shown in
In particular,
An aspect of the invention, therefore, is an electrowetting on dielectric (EWOD) device having a pre-charging structure for pre-charging a fluid reservoir. In exemplary embodiments, the EWOD device includes a first substrate and an opposing second substrate defining a gap between the first and second substrates, each substrate including an insulating surface facing the gap; an array of elements comprising a plurality of individual elements that are actuatable for manipulation of a liquid droplet within the gap, each individual element including a plurality of electrode elements to which actuation voltages are applied; and a pre-charging structure that includes a channel in fluid communication with the gap and that is configured to receive a fluid reservoir for generation of the liquid droplet, and the pre-charging structure includes an electrical element electrically exposed to the channel. The electrical element pre-charges the fluid reservoir within the channel, and a portion of the gap containing the liquid droplet spaced apart from the channel is electrically isolated from the electrical element such that the liquid droplet is at a floating electrical potential when located within said portion of the gap. The EWOD device may include one or more of the following features, either individually or in combination.
In an exemplary embodiment of the EWOD device, the pre-charging structure comprises an input structure defining an input channel in fluid communication with the gap wherein the input channel is the channel that is configured to receive the input of the fluid reservoir, and the electrical element comprises an electrode portion of the plurality of electrode elements that is exposed to the input channel.
In an exemplary embodiment of the EWOD device, the plurality of electrode elements comprises an actuation electrode on the second substrate and a reference electrode on the first substrate, wherein the electrical element is a portion of the reference electrode that is exposed to the input channel.
In an exemplary embodiment of the EWOD device, the electrode portion and the insulating layer of the first substrate have a stepped configuration at the input channel such that multiple surfaces of the electrode portion are exposed to the input channel.
In an exemplary embodiment of the EWOD device, the electrode portion and the insulating layer of the first substrate have a straight configuration at the input channel such that only a single surface of the electrode portion is exposed to the input channel.
In an exemplary embodiment of the EWOD device, the plurality of electrode elements comprises a plurality of electrode elements that are positioned in a coplanar configuration on the second substrate; the input channel is cut from the gap through the insulating layer on the second substrate to at least a portion of at least one of the electrode elements to expose such portion of the electrode element to the input channel; and the electrical element is the portion of the electrode element that is exposed to the input channel.
In an exemplary embodiment of the EWOD device, the electrical element spans multiple electrode elements.
In an exemplary embodiment of the EWOD device, the electrical element comprises an externally connected pre-charging element that is inserted into the channel.
In an exemplary embodiment of the EWOD device, the pre-charging element comprises an electrical conductor connected to ground.
In an exemplary embodiment of the EWOD device, the plurality of electrode elements includes a reference electrode on the first substrate, and the pre-charging element comprises an electrical conductor that is connected to a same electrical supply that is connected to the reference electrode.
In an exemplary embodiment of the EWOD device, the channel comprises an input channel is defined by an extension of the insulating layer on the first substrate such that no portion of the electrode elements is exposed to the input channel.
In an exemplary embodiment of the EWOD device, the channel comprises an opening cut away through the top substrate to the gap.
In an exemplary embodiment of the EWOD device, the channel comprises a side opening between the first and second substrates that is in fluid communication with the gap.
In an exemplary embodiment of the EWOD device, the EWOD device further includes a side support that defines a portion of the input channel leading to the side opening.
In an exemplary embodiment of the EWOD device, the side support is electrically conductive.
In an exemplary embodiment of the EWOD device, the EWOD device further includes a plurality of offset setting structures in which an electrical element is in electrical connection with the gap, wherein at least one of the offset setting structures is spaced apart from an input structure for inputting the fluid reservoir.
Another aspect of the invention is an enhanced method of operating an electro-wetting on dielectric (EWOD) device. The method may include the steps of inputting a fluid reservoir into the EWOD device via a channel defined by the EWOD device; pre-charging the fluid reservoir with an electrical element while the input fluid reservoir is within the channel; and applying an actuation voltage to the EWOD device to generate a liquid droplet from the fluid reservoir and moving the liquid droplet into a gap defined by the EWOD device, wherein the droplet is moved to a portion of the gap that is electrically isolated from the electrical element such that the liquid droplet is at a floating electrical potential when located within said portion of the gap.
In one exemplary embodiment of the method, during pre-charging an electrical potential of the fluid reservoir is initialized at an electrical potential of the reference electrode, wherein upon AC signal transition of the actuation voltage a potential difference between the liquid droplet and reference electrode is zero during a first phase of the AC signal transition and negatively offset during a second phase of the AC signal transition.
In another exemplary embodiment of the method, during pre-charging an electrical potential of the fluid reservoir is initialized at an electrical potential that is offset relative to that of the reference electrode, wherein upon AC signal transition of the actuation voltage a potential difference between the liquid droplet and reference electrode has a positive offset value during a first phase of the AC signal transition and a negative offset value during a second phase of the AC signal transition. An average DC potential difference between the reference electrode and the liquid droplet over multiple cycles of the AC signal transition is approximately zero.
Although the invention has been shown and described with respect to a certain embodiment or embodiments, it is obvious that equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In particular regard to the various functions performed by the above described elements (components, assemblies, devices, compositions, etc.), the terms (including a reference to a “means”) used to describe such elements are intended to correspond, unless otherwise indicated, to any element which performs the specified function of the described element (i.e., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary embodiment or embodiments of the invention. In addition, while a particular feature of the invention may have been described above with respect to only one or more of several illustrated embodiments, such feature may be combined with one or more other features of the other embodiments, as may be desired and advantageous for any given or particular application.
The present invention finds application as a configuration of an enhanced microfluidic device. Such devices may be used to perform chemical or biological reactions, tests or the like. Applications may include healthcare diagnostic testing, material testing, chemical or biochemical material synthesis, proteomics, tools for research in life sciences and forensic science.
